Circuit board integrated with semiconductor refrigeration module and electric appliance
By integrating a semiconductor cooling module and a heat pipe module on the PCB board, the Peltier effect is utilized for efficient heat dissipation, which solves the shortcomings of existing PCB board heat dissipation methods and achieves efficient and flexible heat dissipation and a thin design.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- GREE ELECTRIC APPLIANCE INC OF ZHUHAI
- Filing Date
- 2025-04-25
- Publication Date
- 2026-04-17
AI Technical Summary
Existing PCB board heat dissipation methods suffer from high cost, high noise, low efficiency, and are not suitable for high-density integration. Furthermore, existing semiconductor cooling modules cannot be flexibly configured, increasing the thickness of the PCB board.
A semiconductor cooling module is integrated on the PCB board, which utilizes the Peltier effect for cooling/heating. Combined with heat pipe modules and heat sink fins, the semiconductor particle group forms a closed loop. The cooling capacity is precisely adjusted by the control unit and can be flexibly set according to the position of electronic components.
It achieves efficient heat dissipation with no noise, high reliability, fast start-up speed, and environmental protection and energy saving, adapts to high-density integration, reduces PCB board thickness, and facilitates mass production.
Smart Images
Figure CN224139197U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of circuit board technology, specifically to a circuit board and electrical appliance that integrates a semiconductor cooling module. Background Technology
[0002] In recent years, electronic technology has developed rapidly, and the integration of electronic components has become increasingly sophisticated. This has brought about the challenge of heat dissipation for high-power components (such as CPUs and GPUs). Currently, commonly used PCB heat dissipation technologies include heat sinks and heat pipes. These methods can only achieve localized heat dissipation and are costly. Alternatively, air cooling or water cooling methods may be used, but these require numerous components and a large space, making them unsuitable for high-density integration. They also generate noise during operation, severely impacting user experience. Furthermore, their cooling capacity is inaccurate and power consumption is high. In addition, non-contact PCB heat dissipation methods are inefficient, with cooling capacity being lost during transmission.
[0003] Currently, some patents address thermal management of electronic components based on the PCB's own structure. For example, there is a type of PCB with heat dissipation function that uses thermal connection elements to make the heat distribution on the PCB more uniform, but its heat dissipation capacity is very weak and cannot be used for high-heat-generating devices. Another type of PCB with heat dissipation function connects heat-generating devices and heat dissipation devices through PCB vias to reduce thermal resistance, but it still inevitably uses heat sinks, heat pipes, heat sinks, etc., only the heat dissipation devices are placed on the bottom surface of the PCB.
[0004] Therefore, PCBs require more efficient heat dissipation methods, and semiconductor cooling is a new type of cooling method. It is based on the Peltier effect to cool / heat the target and has advantages such as no noise, high reliability, fast start-up speed, environmental protection and energy saving.
[0005] A current electronic device heat sink cools the heat-generating chip by placing a thermoelectric cooler on it. A heat-conducting plate and a semiconductor thermoelectric generator are located at the hot end of the thermoelectric cooler to convert heat energy into electrical energy using the temperature difference. However, in this solution, the thermoelectric cooler is a commercially available standard component. When applied to a PCB board, its placement cannot be optimized based on the location of the heat-generating element. Furthermore, the overall thickness of the component is relatively large, increasing the overall thickness of the PCB board. Additionally, while the heat-conducting plate is located at the hot end of the thermoelectric cooler to conduct heat, its thermal conductivity is poor. Without heat dissipation fins, the heat at the hot end of the thermoelectric cooler may not dissipate, resulting in ineffective cooling of the heat-generating chip. Utility Model Content
[0006] The primary objective of this invention is to provide a circuit board with an integrated semiconductor cooling module that uses the Peltier effect for cooling / heating. This module offers advantages such as noiselessness, high reliability, fast start-up speed, and energy efficiency, making it well-suited for the heat dissipation needs of PCB boards. Furthermore, the semiconductor cooling module can be integrated with the PCB board at high density, and this contact-type heat dissipation structure has high heat dissipation efficiency.
[0007] The second objective of this invention is to provide an electrical appliance that uses the aforementioned circuit board.
[0008] To achieve the aforementioned first objective, this utility model provides a circuit board with an integrated semiconductor cooling module, comprising a board body on which electronic components are disposed; a semiconductor cooling module disposed on the side of the board body away from the electronic components, the semiconductor cooling module including a hot-end electrode, a cold-end electrode, a semiconductor particle assembly, and a cooling module PCB board, the cold-end electrode being disposed on the board body, the hot-end electrode being disposed on the cooling module PCB board, and the semiconductor particle assembly being connected between the cold-end electrode and the hot-end electrode; and a heat dissipation assembly disposed on the side of the cooling module PCB board away from the board body.
[0009] As can be seen from the above solution, the circuit board of this utility model directly integrates the semiconductor cooling module onto the main body of the PCB board. Based on the Peltier effect for cooling / heating, it offers advantages such as noiselessness, high reliability, fast start-up speed, and energy efficiency, making it highly suitable for the heat dissipation requirements of PCB boards. Furthermore, the semiconductor cooling module can be integrated with the PCB board at high density, and this contact-type heat dissipation structure has high heat dissipation efficiency. Simultaneously, because the semiconductor cooling module is directly integrated onto the PCB board, some components can be omitted, thereby reducing the thickness of the PCB board. In addition, the position of the semiconductor particle group can be flexibly set according to the location of electronic components on the PCB board, thereby achieving better cooling effects. The semiconductor electrode structure can be manufactured using mature PCB technology, facilitating large-scale production.
[0010] A preferred embodiment is that the heat dissipation component includes a heat pipe module; the heat pipe module includes a heat pipe evaporation section, a heat pipe insulation section and a heat pipe condensation section connected in sequence, and the main surface of the heat pipe evaporation section is bonded to the PCB board of the cooling module.
[0011] As can be seen, after the heat pipe evaporation section is bonded to the refrigeration module PCB board, the positions of the heat pipe insulation section and the heat pipe condensation section can be flexibly set without being installed on the board body. Therefore, the thickness of the heat pipe evaporation section is very small and will not increase the thickness of the PCB board.
[0012] A further solution is to connect the heat pipe evaporation section to the refrigeration module PCB board using solder paste or thermally conductive adhesive.
[0013] A further option is to include heat dissipation fins in the heat dissipation assembly, which are disposed on the condensation section of the heat pipe.
[0014] Therefore, the heat dissipation fins are used to cool the condenser section of the heat pipe to improve the heat exchange efficiency.
[0015] In a preferred embodiment, each semiconductor particle group is connected in series via a corresponding cold-end electrode; each semiconductor particle group includes a P-type semiconductor and an N-type semiconductor; the P-type semiconductor and the N-type semiconductor in the same semiconductor particle group are electrically connected via a hot-end electrode; in two adjacent semiconductor particle groups, the P-type semiconductor of the first semiconductor particle group and the N-type semiconductor of the second semiconductor particle group are arranged close to each other and electrically connected via a cold-end electrode.
[0016] A further scheme is that the hot-end electrodes are arranged in M rows and N columns; the cold-end electrodes are divided into a first group of electrodes, a second group of electrodes, a third group of electrodes, and a fourth group of electrodes; each cold-end electrode in the first group is a first cold-end electrode, arranged in M rows and N-1 columns, and each first cold-end electrode extends along the length of the plate body; the second group of electrodes is located on the first side of the length of the plate body, each cold-end electrode in the second group is a second cold-end electrode, extending along the width of the plate body and spaced apart along the width of the plate body, each second cold-end electrode is opposite to two rows of first cold-end electrodes, and the number of second cold-end electrodes is equal to half the number of rows of first cold-end electrodes; the third group of electrodes is located on the second side of the length of the plate body, the third group... Each cold-end electrode in the electrode is a third cold-end electrode. Each third cold-end electrode extends along the width direction of the plate body and is arranged at intervals along the width direction of the plate body. Each third cold-end electrode is opposite to two rows of first cold-end electrodes. The relationship between the number of third cold-end electrodes X and the number of rows of first cold-end electrodes Y is: X = (Y-2) / 2. The fourth group of electrodes includes two fourth cold-end electrodes that both extend along the length direction of the plate body. The two fourth cold-end electrodes are respectively arranged on both sides of the third group of electrodes along the width direction of the plate body and are opposite to the first cold-end electrodes of the first row and the Mth row, respectively. Both fourth cold-end electrodes are provided with semiconductor mounting parts and electrical connection parts arranged along the length direction of the plate body. The semiconductor mounting parts are arranged closer to the first cold-end electrodes than the electrical connection parts.
[0017] As can be seen, by arranging them in the above manner, the semiconductor particles in the semiconductor cooling module can form a neatly arranged closed loop, resulting in a compact structure.
[0018] A further option is that the circuit board also includes a control unit, the semiconductor cooling module is electrically connected to the control unit, and the electrical connection part is provided with a via, through which the control unit is electrically connected to the cold end electrode.
[0019] This demonstrates that the cooling capacity of a semiconductor cooling module can be precisely adjusted by the control unit.
[0020] A further design is that the length of both the cold-end electrode and the hot-end electrode is L, and the width of both is W. The length and width of each P-type semiconductor are both a, and the length and width of each N-type semiconductor are both a. Among these, L>2W, the value of Wa is in the range of 0.2mm to 1mm, and L-3a>0.
[0021] A further embodiment is that a is in the range of 1 mm to 2 mm; and / or the height of each P-type semiconductor and each N-type semiconductor is h, and h is in the range of 1 mm to 3 mm; and / or in the width direction of the cold end electrode, the width of both sides of each P-type semiconductor and the width of both sides of the corresponding cold end electrode are in the range of 0.1 mm to 0.5 mm.
[0022] Therefore, the aforementioned size limitation ensures stable connection between each electrode and the semiconductor particles while achieving optimal performance.
[0023] A preferred embodiment is that the control unit and electronic components are located on the same side of the board body, relative to the semiconductor cooling module.
[0024] Therefore, it is important to avoid the control unit being placed far away from electronic components, as this could cause interference with the semiconductor cooling module and affect its use.
[0025] A preferred embodiment is that the semiconductor particle assembly is connected to the hot-end electrode via conductive silver paste or solder paste; and / or the semiconductor particle assembly is connected to the cold-end electrode via conductive silver paste or solder paste.
[0026] To achieve the second objective mentioned above, this utility model provides an electrical appliance that includes a circuit board with the aforementioned integrated semiconductor cooling module. Attached Figure Description
[0027] Figure 1 This is a schematic diagram of the circuit board embodiment of this utility model.
[0028] Figure 2 This is a partial cross-sectional view of the board body and the semiconductor cooling module in an embodiment of the circuit board of this utility model.
[0029] Figure 3 This is a front view of the main body of the circuit board and the semiconductor cooling module in an embodiment of the circuit board of this utility model.
[0030] Figure 4 yes Figure 3 A magnified view of a portion of point A in the middle.
[0031] Figure 5This is a diagram showing the positional relationship between the board body and the cold end electrode in an embodiment of the circuit board of this utility model.
[0032] Figure 6 yes Figure 5 A magnified view of a section at point B.
[0033] Figure 7 This is a diagram showing the positional relationship between the board body, cold-end electrode, and semiconductor particle group in an embodiment of the circuit board of this utility model.
[0034] Figure 8 yes Figure 7 A magnified view of a section at point C.
[0035] Figure 9 This is a diagram showing the positional relationship between the refrigeration module PCB board and the hot-end electrode in an embodiment of the circuit board of this utility model.
[0036] The present invention will be further described below with reference to the accompanying drawings and embodiments. Detailed Implementation
[0037] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. The descriptions of the exemplary embodiments are merely illustrative and are in no way intended to limit the present invention or its application or use. The present invention can be implemented in many different forms and is not limited to the embodiments described herein. These embodiments are provided to make the present invention thorough and complete, and to fully express the scope of the present invention to those skilled in the art. It should be noted that, unless otherwise specifically stated, the relative arrangement of components and steps, the composition of materials, numerical expressions, and values set forth in these embodiments should be interpreted as merely exemplary and not as limiting.
[0038] The terms "first," "second," and similar words used in this invention do not indicate any order, quantity, or importance, but are merely used to distinguish different parts. Words such as "including" or "comprising" mean that the element preceding the word encompasses the element listed after it, and do not exclude the possibility of encompassing other elements as well. Terms such as "upper," "lower," "left," and "right" are only used to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.
[0039] In this invention, when a specific device is described as being located between a first device and a second device, an intermediary device may or may not exist between the specific device and the first or second device. When a specific device is described as being connected to other devices, the specific device may be directly connected to the other devices without an intermediary device, or it may not be directly connected to the other devices but may have an intermediary device.
[0040] All terms used in this invention (including technical or scientific terms) have the same meaning as understood by one of ordinary skill in the art, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries should be interpreted as having the meaning consistent with their meaning in the context of the relevant art, and not as having an idealized or highly formalized meaning, unless expressly defined herein.
[0041] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.
[0042] The electrical appliance in this embodiment includes a circuit board with an integrated semiconductor cooling module.
[0043] See Figures 1 to 9 The circuit board in this embodiment includes a board body 1, a semiconductor cooling module 2, a heat dissipation component 3, and a control unit 4.
[0044] Electronic components 5 are provided on the main board 1. The semiconductor cooling module 2 is located on the side of the main board 1 away from the electronic components 5. The control unit 4 is located on the side of the main board 1 facing the electronic components 5. The semiconductor cooling module 2 and the control unit 4 are electrically connected.
[0045] The semiconductor cooling module 2 includes a hot-end electrode 21, a cold-end electrode, a semiconductor particle assembly 23, and a cooling module PCB board 24. The cold-end electrode is disposed on the main body 1, the hot-end electrode 21 is disposed on the cooling module PCB board 24, and the semiconductor particle assembly 23 is connected between the cold-end electrode and the hot-end electrode 21. The semiconductor particle assembly 23 is connected to the hot-end electrode 21 through conductive silver paste or solder paste, and the semiconductor particle assembly 23 is also connected to the cold-end electrode through conductive silver paste or solder paste.
[0046] The heat dissipation component 3 is located on the side of the refrigeration module PCB board 24 away from the main board 1. The heat dissipation component 3 includes a heat pipe module 31 and heat dissipation fins 32. The heat pipe module 31 includes a heat pipe evaporation section 311, a heat pipe insulation section 312, and a heat pipe condensation section 313 connected in sequence. The main surface of the heat pipe evaporation section 311 is attached to the refrigeration module PCB board 24, and the heat pipe evaporation section 311 and the refrigeration module PCB board 24 are connected by solder paste or thermally conductive adhesive.
[0047] After the heat pipe evaporation section 311 is attached to the refrigeration module PCB board 24, the positions of the heat pipe insulation section 312 and the heat pipe condensation section 313 can be flexibly set without being installed on the board body 1. Therefore, the thickness of the heat pipe evaporation section 311 is very small and will not increase the thickness of the PCB board.
[0048] Heat dissipation fins 32 are disposed on the heat pipe condensation section 313. The heat dissipation fins 32 are disposed to cool the heat pipe condensation section 313 to improve the heat exchange effect.
[0049] Each semiconductor particle group 23 is connected in series via a corresponding cold-end electrode. Each semiconductor particle group 23 includes a P-type semiconductor 231 and an N-type semiconductor 232. The P-type semiconductor 231 and the N-type semiconductor 232 in the same semiconductor particle group 23 are electrically connected via a hot-end electrode 21. In two adjacent semiconductor particle groups 23, the P-type semiconductor 231 of the first semiconductor particle group 23 and the N-type semiconductor 232 of the second semiconductor particle group 23 are arranged close to each other and electrically connected via a cold-end electrode.
[0050] See Figure 5 and Figure 9 Each hot-end electrode 21 is arranged in M rows and N columns. In this embodiment, each hot-end electrode 21 is arranged in a matrix of 10 rows and 11 columns. Each cold-end electrode includes a first group of electrodes 6, a second group of electrodes 7, a third group of electrodes 8, and a fourth group of electrodes 9.
[0051] Each cold-end electrode in the first group of electrodes 6 is a first cold-end electrode 61. Each first cold-end electrode 61 is arranged in M rows and N-1 columns. In this embodiment, each first cold-end electrode 61 is arranged in a matrix of 10 rows and 10 columns. Each first cold-end electrode 61 extends along the length direction of the plate body 1.
[0052] The second group of electrodes 7 is located on the first side of the length direction of the plate body 1. Each cold end electrode in the second group of electrodes 7 is a second cold end electrode 71. Each second cold end electrode 71 extends along the width direction of the plate body 1 and is arranged at intervals along the width direction of the plate body 1. Each second cold end electrode 71 is arranged opposite to two rows of first cold end electrodes 61. The number of second cold end electrodes 71 is equal to half the number of rows of first cold end electrodes 61. In this embodiment, the number of second cold end electrodes 71 is 5.
[0053] The third group of electrodes 8 is located on the second side of the length direction of the plate body 1. Each cold end electrode in the third group of electrodes 8 is a third cold end electrode 81. Each third cold end electrode 81 extends along the width direction of the plate body 1 and is arranged at intervals along the width direction of the plate body 1. Each third cold end electrode 81 is arranged opposite to two rows of first cold end electrodes 61. The relationship between the number X of the third cold end electrodes 81 and the number Y of the first cold end electrodes 61 is: X = (Y-2) / 2. In this embodiment, the number of third cold end electrodes 81 is 4.
[0054] The fourth group of electrodes 9 includes two fourth cold end electrodes 91 that extend along the length of the plate body 1. The two fourth cold end electrodes 91 are respectively disposed on both sides of the third group of electrodes along the width of the plate body 1 and are respectively disposed opposite to the first cold end electrodes 61 in the first row and the Mth row. Each of the two fourth cold end electrodes 91 is provided with a semiconductor mounting part 911 and an electrical connection part 912 arranged along the length of the plate body 1. The semiconductor mounting part 911 is disposed closer to the first cold end electrode 61 than the electrical connection part 912. The electrical connection part 912 is provided with a through hole 913. The control unit 4 is electrically connected to the cold end electrode through the through hole 913.
[0055] By arranging them in the above manner, the semiconductor particles in the semiconductor cooling module 2 can form a neatly arranged closed loop, resulting in a compact structure. The cooling capacity of the semiconductor cooling module 2 can be precisely adjusted by the control unit 4.
[0056] Both the cold-end electrode and the hot-end electrode 21 have a length of L and a width of W. Each P-type semiconductor 231 has a length and a width of a, and each N-type semiconductor 232 has a length and a width of a. Where L > 2W, Wa is within the range of 0.2 mm to 1 mm, and L - 3a > 0. a is within the range of 1 mm to 2 mm. The height of each P-type semiconductor 231 and each N-type semiconductor 232 is h, and h is within the range of 1 mm to 3 mm. In the width direction of the cold-end electrode, the width w1 between the two sides of each P-type semiconductor 231 and the two sides of the corresponding cold-end electrode is within the range of 0.1 mm to 0.5 mm.
[0057] The semiconductor cooling module 2 is positioned below the electronic components 5, which act as heat-generating elements, and can be adjusted according to the location of these elements. The control unit 4 on the PCB is electrically connected to the bottom electrode of the PCB via a via 913. It has a temperature detection function; when it detects that the temperature of some electronic components 5 is too high, it drives current to flow through the semiconductor cooling circuit. Due to the Peltier effect, the semiconductor cooling module 2 generates hot and cold ends. The cold end is used to cool the PCB, while the hot end is connected to the heat pipe evaporation section 311 to transfer heat to the heat pipe condensation section 313 for dissipation. The heat pipe condensation section 313 has a finned structure, thus providing excellent heat dissipation performance. The cooling capacity of the semiconductor cooling module 2 can be precisely adjusted via the input current.
[0058] As can be seen from the above, the circuit board of this utility model directly integrates the semiconductor cooling module onto the main body of the PCB board. Based on the Peltier effect for cooling / heating, it offers advantages such as noiselessness, high reliability, fast start-up speed, and energy efficiency, making it highly suitable for the heat dissipation requirements of PCB boards. Furthermore, the semiconductor cooling module can be integrated with the PCB board at high density, and this contact-type heat dissipation structure has high heat dissipation efficiency. Simultaneously, because the semiconductor cooling module is directly integrated onto the PCB board, some components can be omitted, thereby reducing the thickness of the PCB board. In addition, the position of the semiconductor particle group can be flexibly set according to the location of electronic components on the PCB board, thereby achieving better cooling effects. The semiconductor electrode structure can be fabricated using mature PCB technology, facilitating large-scale production.
[0059] Finally, it should be emphasized that the above are only preferred embodiments of the present utility model and are not intended to limit the present utility model. For those skilled in the art, the present utility model can have various changes and modifications. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A circuit board integrating a semiconductor cooling module, comprising: The board body, on which electronic components are disposed; The circuit board is characterized in that it further includes: A semiconductor cooling module is disposed on the side of the board body away from the electronic components. The semiconductor cooling module includes a hot end electrode, a cold end electrode, a semiconductor particle group, and a cooling module PCB board. The cold end electrode is disposed on the board body, the hot end electrode is disposed on the cooling module PCB board, and the semiconductor particle group is connected between the cold end electrode and the hot end electrode. A heat dissipation component is disposed on the side of the refrigeration module PCB board away from the main body of the board.
2. The circuit board according to claim 1, characterized in that: The heat dissipation component includes a heat pipe module; The heat pipe module includes a heat pipe evaporation section, a heat pipe insulation section, and a heat pipe condensation section connected in sequence, and the main surface of the heat pipe evaporation section is bonded to the PCB board of the refrigeration module.
3. The circuit board according to claim 2, characterized in that: The heat pipe evaporation section is connected to the refrigeration module PCB board via solder paste or thermally conductive adhesive.
4. The circuit board according to claim 2, characterized in that: The heat dissipation assembly also includes heat dissipation fins, which are disposed on the condensation section of the heat pipe.
5. The circuit board according to any one of claims 1 to 4, characterized in that: Each semiconductor particle group is connected in series via its corresponding cold-end electrode. Each of the semiconductor particle groups comprises a P-type semiconductor and an N-type semiconductor; P-type and N-type semiconductors in the same semiconductor particle group are electrically connected via a hot-end electrode. In two adjacent semiconductor particle groups, the P-type semiconductor of the first semiconductor particle group and the N-type semiconductor of the second semiconductor particle group are arranged close to each other and electrically connected by a cold-end electrode.
6. The circuit board according to claim 4, characterized in that: The hot-end electrodes are arranged in M rows and N columns; Each of the aforementioned cold-end electrodes is divided into a first group of electrodes, a second group of electrodes, a third group of electrodes, and a fourth group of electrodes; Each cold-end electrode in the first group of electrodes is a first cold-end electrode, and each first cold-end electrode is arranged in M rows and N-1 columns. Each first cold-end electrode extends along the length direction of the plate body. The second group of electrodes is located on the first side of the length direction of the plate body. Each cold end electrode in the second group of electrodes is a second cold end electrode. Each second cold end electrode extends along the width direction of the plate body and is arranged at intervals along the width direction of the plate body. Each second cold end electrode is arranged opposite to two rows of first cold end electrodes. The number of second cold end electrodes is equal to half the number of rows of first cold end electrodes. The third group of electrodes is located on the second side of the length direction of the plate body. Each cold end electrode in the third group of electrodes is a third cold end electrode. Each third cold end electrode extends along the width direction of the plate body and is arranged at intervals along the width direction of the plate body. Each third cold end electrode is arranged opposite to two rows of first cold end electrodes. The relationship between the number of third cold end electrodes X and the number of rows of first cold end electrodes Y is: X = (Y-2) / 2. The fourth group of electrodes includes two fourth cold-end electrodes that both extend along the length direction of the main body of the plate. The two fourth cold-end electrodes are respectively disposed on both sides of the third group of electrodes along the width direction of the main body of the plate and are respectively disposed opposite to the first cold-end electrodes of the first row and the Mth row. Each of the two fourth cold-end electrodes is provided with a semiconductor mounting portion and an electrical connection portion arranged along the length direction of the main body of the plate. The semiconductor mounting portion is disposed closer to the first cold-end electrode than the electrical connection portion.
7. The circuit board according to claim 6, characterized in that: The circuit board also includes a control unit, and the semiconductor cooling module is electrically connected to the control unit; The electrical connection portion is provided with a through hole, and the control unit is electrically connected to the cold end electrode through the through hole.
8. The circuit board according to claim 6, characterized in that: The cold end electrode and the hot end electrode are both L in length and W in width. The length and width of each P-type semiconductor are both a, and the length and width of each N-type semiconductor are both a. Wherein, L>2W, Wa is in the range of 0.2mm to 1mm, and L-3a>0.
9. The circuit board according to claim 8, characterized in that: a is in the range of 1mm to 2mm; and / or The height of each P-type semiconductor and each N-type semiconductor is h, and h is in the range of 1 mm to 3 mm; and / or In the width direction of the cold end electrode, the width of both sides of each P-type semiconductor and the width of the corresponding sides of the cold end electrode are both in the range of 0.1 mm to 0.5 mm.
10. The circuit board according to claim 7, characterized in that: The control unit and the electronic components are located on the same side of the main body of the board, relative to the semiconductor cooling module.
11. The circuit board according to any one of claims 1 to 4, characterized in that: The semiconductor particle group is connected to the hot-end electrode via conductive silver paste or solder paste; and / or The semiconductor particle group is connected to the cold end electrode by conductive silver paste or solder paste.
12. An electrical appliance, characterized in that, The circuit board includes the integrated semiconductor cooling module as described in any one of claims 1 to 11.