Electronic equipment

Abstract

The embodiment of the utility model provides electronic equipment. The electronic equipment comprises a shell, a mainboard support and a first sealing piece. Wherein the shell is provided with a cavity; the mainboard bracket is arranged in the cavity and is connected with the shell; the shell is provided with a first channel, and the mainboard support is provided with a second channel. The first channel communicates with the second channel, the end, away from the second channel, of the first channel communicates with the outside, and the end, away from the first channel, of the second channel communicates with the cavity. The first sealing piece covers the end, away from the first channel, of the second channel. According to the embodiment of the invention, under the condition that the first sealing element covers one end of the second channel in the main board bracket, the position design flexibility of the first sealing element is improved, so that the influence of limitation on the design of the area size of the first sealing element due to the arrangement position of the first sealing element is reduced, and the area design flexibility of the first sealing element is improved.

Description

Technical Field

[0001] This application belongs to the field of electronic equipment technology, and specifically relates to an electronic device. Background Technology

[0002] Electronic devices with higher protection levels have better sealing performance and are more susceptible to fluctuations in internal air pressure caused by factors such as internal and external ambient temperature. These fluctuations not only affect the performance of the device but also the stability of its structure. Installing an air pressure balancing valve inside the electronic device can effectively solve the problem of internal air pressure balance.

[0003] In pressure balancing valves, the seals allow gas to pass freely while effectively preventing liquid from entering the electronic device. However, in current electronic devices, the design of the seal's position is influenced by the internal layout of the device, which limits the size of the seal. Utility Model Content

[0004] This application aims to provide an electronic device that solves the problem that the limited design of the sealing element's location in the prior art leads to a limitation on its area size.

[0005] To solve the above-mentioned technical problems, this application is implemented as follows:

[0006] This application discloses an electronic device, which includes: a housing, a motherboard bracket, and a first sealing element; wherein the housing has a cavity;

[0007] The motherboard bracket is disposed within the cavity and connected to the housing;

[0008] The housing is provided with a first channel, and the motherboard bracket is provided with a second channel;

[0009] The first channel is connected to the second channel, the end of the first channel away from the second channel is connected to the outside, and the end of the second channel away from the first channel is connected to the cavity.

[0010] The first seal is placed on the end of the second channel away from the first channel.

[0011] In this embodiment, the housing has a first channel that communicates with the outside. The motherboard bracket is disposed within the cavity of the housing and connected to it, and has a second channel that communicates with the first channel. The end of the second channel away from the first channel communicates with the cavity formed by the housing. A first seal is placed on the end of the second channel away from the first channel. Since the motherboard bracket in electronic devices typically has a large area, placing the first seal on one end of the second channel in the motherboard bracket in this embodiment increases the flexibility of the first seal's position design, thereby reducing the limitation on the size of the first seal due to its placement position and improving the flexibility of the first seal's area design.

[0012] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0013] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0014] Figure 1 This is a schematic diagram of the appearance of the electronic device in the embodiments of this application;

[0015] Figure 2 This is an exploded schematic diagram of the electronic device in the embodiments of this application;

[0016] Figure 3 This is an exploded view of the electronic device from another angle in an embodiment of this application;

[0017] Figure 4 This is a cross-sectional view of the electronic device in the embodiments of this application;

[0018] Figure 5 yes Figure 4 Enlarged diagram of section A in the middle;

[0019] Figure 6 This is a schematic diagram of the internal structure of the electronic device in an embodiment of this application;

[0020] Figure 7 yes Figure 6 A sectional view;

[0021] Figure 8 yes Figure 7 Enlarged diagram of section B;

[0022] Figure 9 This is a partial cross-sectional view in the first optional embodiment of this application;

[0023] Figure 10 This is a partial cross-sectional view in the second optional embodiment of this application;

[0024] Figure 11 This is a partial cross-sectional view in the third optional embodiment of this application;

[0025] Figure 12 This is a partial cross-sectional view in the fourth optional embodiment of this application;

[0026] Figure 13 This is a schematic diagram of the structure of the second sealing element in the embodiments of this application.

[0027] Reference numerals: 10 - Housing, 101 - Cavity, 102 - Frame, 103 - Cover plate, 1031 - Cover plate adhesive, 11 - First channel, 111 - Third channel segment, 112 - Fourth channel segment, 113 - Second opening, 20 - Mainboard bracket, 201 - Connecting part, 202 - Supporting part, 2021 - Recessed part, 21 - Second channel, 211 - First channel segment, 212 - Second channel segment, 213 - First opening, 30 - First seal, 40 - Mainboard, 41 - Second through hole, 50 - Second seal, 51 - First through hole, 52 - First sealing part, 53 - Second sealing part, 60 - Third seal, 70 - Display screen, 71 - Display screen adhesive, 80 - Camera module. Detailed Implementation

[0028] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0029] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0030] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0031] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0032] In the design and manufacturing of modern electronic devices, with the continuous enrichment of product functions and the increasing integration, the need for internal air pressure balance in electronic devices is becoming increasingly significant. During operation, internal electronic components generate heat, causing the internal air to expand and create positive pressure; conversely, when the device cools down or the ambient air pressure changes abruptly, negative pressure may be generated. This fluctuation in air pressure not only affects the performance stability of the device but may also damage its sealing structure, mechanical parts, and internal electronic components, such as causing casing deformation, loose connectors, and electronic component failure.

[0033] To effectively address the issue of internal air pressure balance in electronic devices, air pressure balancing valves are widely used as a key component. Among these valves, breathable seals play a crucial role as a core component. These seals possess a unique microporous structure that allows gas to pass freely while effectively preventing the intrusion of liquids (such as water and oil), ensuring the equipment functions normally even in harsh environments (such as humid, rainy, or underwater conditions).

[0034] However, the sealing elements used in the internal pressure balancing valves of electronic devices currently on the market generally suffer from limited area design. For example, common sealing elements are located on the frame or battery cover. In this configuration, the area of ​​the sealing element is limited by the structure of the frame and battery cover, which affects the flexibility of the sealing element area design. Furthermore, the area of ​​the sealing element restricts the speed and efficiency of pressure balancing. Specifically, a smaller sealing element area means a limited passage for gas. When there is a large pressure difference between the inside and outside of the device, it takes longer for the gas to pass through the sealing element to achieve pressure balance. This not only causes a significant lag in the pressure balancing process, affecting the device's response speed and performance stability, but may also increase the risk of damage to the device in environments with fluctuating pressure. Especially in dual-speaker electronic devices, the speed of pressure balancing affects the stability of the electronic device's sound quality, impacting the user experience and also affecting the lifespan of the speakers.

[0035] In view of the above problems, this application provides an electronic device. The electronic device provided in this application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0036] like Figures 1 to 3 As shown, in this embodiment of the application, the electronic device may include: a housing 10, a motherboard bracket 20, and a first sealing member 30; wherein, the housing 10 has a cavity 101, and the motherboard bracket 20 is disposed within the cavity 101 and connected to the housing 10; as Figures 4-8 As shown, the housing 10 is provided with a first channel 11 that communicates with the outside, and the motherboard bracket 20 is provided with a second channel 21. One end of the second channel 21 is connected to the first channel 11, and the other end is connected to the cavity 101 of the housing 10. A first sealing member 30 is provided on the end of the second channel 21 in the motherboard bracket 20 that is away from the first channel 11, so as to realize the function of gas exchange between the cavity 101 of the housing 10 and the outside through the first sealing member 30, thereby regulating the air pressure inside the cavity 101.

[0037] Specifically, the housing 10 is provided with a first channel 11, and the motherboard bracket 20 is provided with a second channel 21. The motherboard bracket 20 is connected to the housing 10 so that the first channel 11 and the second channel 21 are interconnected and form an airflow channel. The motherboard bracket 20 is provided with a first opening 213, which is located at the end of the second channel 21 away from the first channel 11 and is connected to the second channel 21. The housing 10 is also provided with a second opening 113, which is located at the end of the first channel 11 away from the second channel 21 and is connected to the first channel 11. The airflow channel is connected to the outside through the second opening 113 and to the inside of the cavity 101 through the first opening 213, thereby enabling gas exchange and regulating the air pressure inside the electronic device cavity 101. Figure 9As shown in the figure, the dashed lines represent the airflow channels for the exchange of gas between the outside atmosphere and the cavity 101. The first sealing element 30 is installed at the first opening 213, and while allowing gas to pass freely, it effectively blocks the intrusion of liquids (such as water, oil, etc.), ensuring that the equipment can still work normally in harsh environments (such as humid, rainy, underwater, etc.). In practical applications, the first sealing element 30 may include a support layer, a waterproof and breathable layer, and an adhesive layer. For example, the support layer may be made of polymer materials such as polyester (PET) or polypropylene (PP) to provide mechanical strength for the first sealing element 30 and protect the internal structure from physical damage; the waterproof and breathable layer may be made of materials such as expanded polytetrafluoroethylene (ePTFE) or polyurethane (TPU), with microporous structures on the material, and waterproof and breathable properties are achieved through the microporous structures; the inner adhesive layer may be made of materials such as hot melt adhesive or pressure-sensitive adhesive, so that the first sealing element 30 can be bonded to the motherboard bracket 20, ensuring connection strength and sealing performance.

[0038] The housing 10 serves as the external structure of the electronic device, which has the function of accommodating, protecting and supporting its internal electronic components and circuit boards, reducing the impact of external environmental impurities such as dust and moisture on the internal electronic components. The cavity 101 can be used to arrange components such as the motherboard 40, camera module 80, and battery (not shown in the figure).

[0039] The motherboard bracket 20, as a key structure for fixing and supporting the motherboard 40, is connected to the housing 10 and the motherboard 40. The motherboard bracket 20 securely installs the motherboard 40 inside the electronic device through screw holes, clips, or pins, preventing the motherboard from loosening due to vibration or impact.

[0040] It should be noted that, due to the complex structure of the motherboard 40, which requires the installation of components and wiring, the motherboard bracket 20 typically has a large area adapted to the motherboard 40 to ensure its support and fixation. Furthermore, the motherboard bracket 20 has significant spatial expandability in the XY plane, where the XY plane refers to the plane formed by the length and width directions of the electronic device. When the airflow channel connects to the interior of the electronic device through the first opening 213 of the second channel 21 provided on the motherboard bracket 20, the large area of ​​the motherboard bracket 20 allows for a larger first opening 213. Consequently, the area of ​​the first sealing member 30, connected to the motherboard bracket 20 and used to seal the first opening 213, is also larger. This increased area of ​​the first sealing member 30 increases the channel area for gas passage, ensuring the speed and efficiency of gas pressure balance through the first sealing member 30 when there is a large pressure difference between the inside and outside of the device.

[0041] In some embodiments of this application, the housing 10 includes a frame 102 and a cover plate 103, the cover plate 103 is connected to the frame 102 and surrounds the cavity 101; the motherboard bracket 20 includes a support portion 202 and a connecting portion 201, the connecting portion 201 is connected to the frame 102; a first channel 11 is disposed in the frame 102; a second channel 21 passes through the connecting portion 201 and the support portion 202, the second channel 21 includes a first end and a second end, the first end is disposed in the connecting portion 201 and communicates with the first channel 11, the second end is disposed in the support portion 202 and communicates with the cavity 101 towards the cover plate 103, and a first sealing member 30 is disposed on the second end.

[0042] The electronic device also includes a display screen 70. The frame 102 includes two sides facing away from each other along the thickness direction of the electronic device. The cover plate 103 is connected to one side of the frame 102 by cover plate adhesive 1031, and the display screen 70 is connected to the other side of the frame 102 by display screen adhesive 71. The display screen 70 is arranged parallel to the cover plate 103. The support part 202 is arranged parallel to the cover plate 103, the display screen 70, and other structures. In this embodiment, the connecting part 201 is connected to the side of the support part 202 away from the cover plate 103 along the thickness direction of the electronic device and is set at an angle to the support part 202. This increases the area in the motherboard bracket 20 used for connecting with the frame 102 and ensures the connection effect between the two. Furthermore, the support portion 202 and the cover plate 103 are spaced apart. After the gas flows out of the second channel 21 from the first seal 30, the gas enters the cavity 101 and can continue to flow along the gap between the support portion 202 and the cover plate 103. The connecting portion 201 and the support portion 202 are arranged at an angle so that the motherboard bracket 20 can be connected to the frame 102 provided on the side of the electronic device.

[0043] It should be noted that the frame 102, as the main support structure of the electronic device, is provided with a first channel 11, which allows the first channel 11 to communicate with the outside. At the same time, the second channel 21 passes through the connecting part 201 and the support part 202. When the motherboard bracket 20 includes the connecting part 201 and the support part 202, the support part 202, as the main structure supporting the motherboard 40, has its thickness limited by the spatial layout of the electronic device. The connecting part 201, which is connected to the support part 202, is located on the side of the support part 202 away from the cover plate 103 and is connected to the frame 102. Its structural design can have better flexibility. When the dimension of the connecting part 201 along the thickness direction of the electronic device is designed to be large, the connection area between it and the frame 102 can be increased. This not only facilitates the sealing between the frame 102 and the motherboard bracket 20, but also helps to increase the cross-sectional area of ​​the second channel 21 to improve the airflow speed.

[0044] Since the first seal 30 is connected to the support portion 202 of the motherboard bracket 20 and spaced apart from the cover plate 103, if the first seal 30 fails and needs repair or replacement, it can be repaired by simply removing the cover plate 103. This reduces the difficulty of repairing the first seal 30 and lowers the subsequent maintenance costs of the electronic equipment. Furthermore, this structure makes it easier for the first seal 30 to connect to the motherboard bracket 20, making performance testing of the first seal 30 more convenient, improving testing efficiency, and reducing testing costs.

[0045] Optionally, the electronic device also includes a second seal 50, which has a first through hole 51. The second seal 50 is connected between the connecting part 201 and the frame 102. The first through hole 51 connects the first channel 11 and the second channel 21. The second seal 50 ensures the sealing effect between the frame 102 and the motherboard bracket 20.

[0046] Specifically, a second sealing element 50 is provided between the connecting part 201 of the motherboard bracket 20 and the inner side of the frame 102. The first through hole 51 is located at the center of the second sealing element 50. The first through hole 51 connects the first channel 11 and the second channel 21. The structure of the second sealing element 50 around the first through hole 51 is used to seal the gap between the frame 102 and the motherboard bracket 20, thereby ensuring the airtightness of the airflow channel, preventing gas from spreading randomly inside the electronic device, and thus improving the gas exchange efficiency.

[0047] like Figure 13As shown, the second sealing member 50 includes a first sealing part 52 and a second sealing part 53. A third sealing member 60 is connected between the first sealing part 52 and the second sealing part 53. Both the first sealing part 52 and the second sealing part 53 are circumferentially continuous with a central hole. The first sealing part 52 and the second sealing part 53 are stacked and connected so that the central holes of the two are interconnected, forming the aforementioned first through hole 51. The first sealing part 52 is used to connect with one of the frame 102 and the motherboard bracket 20, and the second sealing part 53 is used to connect with the other of the frame 102 and the motherboard bracket 20. The first sealing part 52 is circumferentially arranged around one of the first channel 11 and the second channel 21 near the other port, and the second sealing part 53 is circumferentially arranged around the other of the first channel 11 and the second channel 21 near the other port. The first through hole 51 connects the first channel 11 and the second channel 21. In practical applications, the first sealing part 52 can be an adhesive layer, using materials such as hot melt adhesive, pressure-sensitive adhesive, and double-sided adhesive. While ensuring the reliability of the connection between the second sealing part 50 and the frame 102 or the motherboard bracket 20, it also ensures the sealing performance between the frame 102 and the motherboard bracket 20, thereby ensuring the airtightness between the first channel 11 and the second channel 21. The second sealing part 53 can be made of a material with a certain degree of elasticity, such as silicone or rubber, and is pressed from the other side of the second sealing part 50 onto the other side of the frame 102 and the motherboard bracket 20. The cooperation between the first sealing part 52 and the second sealing part 53 can effectively eliminate the gap between the motherboard bracket 20 and the frame 102, prevent gas from diffusing randomly, and ensure that the gas can flow along a preset path, thereby improving the speed of air pressure balance adjustment and ensuring the performance of electronic devices.

[0048] In some alternative embodiments, a third seal 60 is provided in the first through hole 51. The third seal 60 can serve as a buffer structure to slow down the water flow rate from the first channel 11 into the second channel 21, and prevent the water flow rate into the second channel 21 from being too fast, which could cause the first seal 30 to fail.

[0049] It should be noted that at least a portion of the third seal 60 is located between the first channel 11 and the second channel 21. During the process of water flowing into the first channel 11 and flowing into the second channel 21, the third seal 60 located between the first channel 11 and the second channel 21 can slow down the water flow speed, thereby buffering the water flow from the first channel 11 into the second channel 21 and further improving the waterproof rating of the electronic device.

[0050] In practical applications, the third seal 60 can be made of metal materials such as stainless steel or aluminum alloy, or it can be made of non-metallic materials such as polycarbonate mesh (PC) or polyethylene terephthalate mesh (PET). Alternatively, the third seal 60 can be made of a composite material of metal and plastic. This application does not specifically limit the material of the third seal 60.

[0051] Furthermore, the third seal 60 has a mesh structure.

[0052] It should be noted that, since the third seal 60 is located between the first channel 11 and the second channel 21, the third seal 60 serves two purposes: firstly, it reduces the water flow velocity within the second channel 21; secondly, it must not impede gas exchange between the external environment and the internal structure of the electronic device. When the third seal 60 is configured with a mesh structure, it can deform in multiple directions when impacted by water flow, and the honeycomb structure disperses stress. Furthermore, this mesh structure of the third seal 60 improves the heat dissipation efficiency of the electronic device. When the internal temperature of the electronic device rises, its internal air pressure increases, and the gas inside the device needs to be discharged through the second channel 21 and the first channel 11. After the gas passes through the first seal 30, the mesh structure of the third seal 60 does not impede the continued flow of gas to the first channel 11, thereby quickly reducing the internal air pressure of the electronic device while ensuring the rapid dissipation of heat. In practical applications, the size and shape of the mesh can be flexibly adjusted to adapt to different performance requirements of the electronic device.

[0053] The third sealing element 60 may include, but is not limited to, at least one of waterproof and breathable membrane, metal fiber felt, ceramic fiber felt, and rubber-based breathable membrane. This application may not specifically limit the type of the third sealing element 60.

[0054] Optionally, the electronic device also includes a motherboard 40, which is disposed between the frame 102 and the motherboard bracket 20. The motherboard 40 is provided with a second through hole 41, which connects the first channel 11 and the second channel 21.

[0055] like Figure 12As shown, the motherboard 40 is connected between the frame 102 and the motherboard bracket 20. The motherboard 40 has a through hole, with its two ends facing the ports of the first channel 11 and the second channel 21, respectively. This through hole forms a second through hole 41, whose two ends communicate with the first channel 11 and the second channel 21, forming the aforementioned gas flow channel together. When the gas pressure within the cavity 101 fluctuates, gas can flow between the first channel 11, the second through hole 41, and the second channel 21, thereby achieving pressure balance regulation. To ensure the airtightness of the airflow channel, second sealing elements 50 are provided between the motherboard 40 and the frame 102, and between the motherboard 40 and the motherboard bracket 20. It is understandable that by setting a second through hole 41 on the motherboard 40, the airflow channel can be formed by the frame 102, the motherboard 40 and the motherboard bracket 20, rather than being limited to the frame 102 and the motherboard bracket 20 enclosing the airflow channel, thereby improving the diversity and flexibility of the air pressure balance valve structure design.

[0056] Optionally, in the second channel 21, the cross-sectional area of ​​the second end is larger than that of the first end, thereby ensuring the area of ​​the airflow channel and the cavity 101 used for gas exchange, and also reducing the space occupied by the second channel 21 in the internal layout of the electronic device.

[0057] For example, in some optional embodiments, the second channel 21 is a variable-diameter channel and includes a first end and a second end disposed opposite to each other. The first end is the end of the first channel segment 211 close to the first channel 11, and the second end is the end of the second channel segment 212 away from the first channel segment 211. The first end is connected to the first channel 11, and a first opening 213 is disposed at the second end. The cross-sectional area of ​​the second end is larger than that of the first end. In this way, the area of ​​the first sealing member 30 used to seal the first opening 213 can be increased accordingly, thereby improving the speed and efficiency of gas pressure balance through the first sealing member 30. In addition, the cross-sectional area of ​​the first end is smaller, thereby saving space occupied inside the electronic device and improving the utilization rate of the internal space of the electronic device.

[0058] Optionally, the diameter of the first end is equal to the diameter of the port of the first channel 11 near the second channel 21, allowing the second channel 21 to be seamlessly connected to the first channel 11, ensuring that airflow can smoothly flow from the first channel 11 into the second channel 21. The second channel 21 can have a uniformly variable diameter or a non-uniformly variable diameter. In practical applications, the diameter of the second channel 21 can be designed according to the specific structure of the motherboard bracket 20, and this application does not impose specific limitations on this. Preferably, along the gas flow direction, the cross-sectional area of ​​the second channel 21 gradually increases from the first end to the second end. It should be noted that as the cross-sectional area of ​​the second channel 21 gradually increases from the first end to the second end, the airflow velocity gradually decreases, reducing collisions between gas molecules and thus reducing energy loss during gas flow. Furthermore, this gradually increasing cross-sectional area design makes the pressure change within the airflow channel smoother, reducing the impact risk of the airflow on the first seal 30 and ensuring the structural reliability of the first seal 30.

[0059] In some alternative embodiments, the second channel 21 includes a first channel segment 211 and a second channel segment 212 that are interconnected, wherein the first channel segment 211 is at least partially disposed in the connecting part 201 and communicates with the first channel 11, and the second channel segment 212 is disposed in the supporting part 202 and communicates with the cavity 101.

[0060] like Figures 9-11 As shown, the connecting portion 201 and the supporting portion 202 are at least partially angled. The second channel segment 212 does not penetrate the supporting portion 202 along the thickness direction of the electronic device. The first channel segment 211 is partially disposed in the connecting portion 201 and communicates with the first channel 11. The end of the first channel segment 211 away from the first channel 11 extends to the supporting portion 202 and communicates with the second channel segment 212 disposed in the supporting portion 202. Along the thickness direction of the electronic device, the cross-sectional area of ​​the second channel segment 212 is larger than that of the first channel segment 211. This allows for a corresponding increase in the area of ​​the first sealing element 30 used to seal the first opening 213, improving the flexibility of the design of the first sealing element 30 area and increasing the speed and efficiency of gas pressure balance through the first sealing element 30. Furthermore, the smaller cross-sectional area of ​​the first channel segment 211 saves the volume of the motherboard bracket 20 at the first channel segment 211, reducing the space occupied inside the electronic device and improving the utilization rate of the internal space.

[0061] like Figures 9-11As shown, in the motherboard bracket 20, the first channel segment 211 is a first equal-diameter segment, and the second channel segment 212 is a second equal-diameter segment. The first and second equal-diameter segments are interconnected and have different cross-sectional areas. One end of the first equal-diameter segment is connected to the first channel 11, and the other end of the first equal-diameter segment is connected to the second equal-diameter segment. Along the thickness direction of the electronic device, the cross-sectional area of ​​the second equal-diameter segment is larger than that of the first equal-diameter segment. When gas flows from the first equal-diameter segment into the second equal-diameter segment, the gas can diffuse radially along the second equal-diameter segment, thereby increasing the area of ​​the airflow channel. The first opening 213 is located in the second equal-diameter segment. Therefore, the size of the first opening 213 can be designed to be larger to match the size of the second equal-diameter segment. Thus, the area of ​​the first sealing member 30 used to seal the first opening 213 also needs to be increased accordingly, thereby increasing the channel area for gas passage.

[0062] Optionally, the axis of the first channel segment 211 is set at an angle to the axis of the second channel segment 212.

[0063] like Figures 9-11 As shown, the axis of the first channel segment 211 is inclined to the thickness direction of the electronic device, and the axis of the second channel segment 212 extends along the thickness direction of the electronic device. The motherboard bracket 20 includes a support portion 202 and a connecting portion. The support portion 202 is arranged parallel to the cover plate 103, the display screen 70 and other structures, and the support portion 202 and the cover plate 103 are spaced apart to form an internal sealed cavity of the electronic device. The second channel segment 212 is disposed on the support portion 202, and the connecting portion is arranged at an angle to the support portion 202 so that the motherboard bracket 20 can be connected to the frame 102 disposed on the side of the electronic device. Since the motherboard bracket 20 needs to be connected to the frame 102 so that the second channel 21 and the first channel 11 can communicate with each other to form an airflow channel, and the second opening 113 of the frame 102 needs to be set on the side of the electronic device, when the second opening 113 is set on the side of the frame 102, under this cooperative structure of the motherboard bracket 20 and the frame 102, the axis of the second channel segment 212 extends along the thickness direction of the support part 202 of the motherboard bracket 20, and the axes of the first channel segment 211 and the second channel segment 212 are set at an angle, which can facilitate the communication between the first channel segment 211 and the first channel 11, so that the airflow channel can have a gentler angle change in the overall length direction, thereby reducing the collision of gas when flowing in the airflow channel, improving the uniformity of gas flow, ensuring the smoothness of airflow, and thus improving the speed of air pressure balance adjustment.

[0064] Optionally, the support portion 202 is provided with a recessed portion 2021, and the second end communicates with the recessed portion 2021. The first sealing member 30 is at least partially disposed in the recessed portion 2021 to reduce the space occupied by the first sealing member 30 in the cavity 101.

[0065] Specifically, the motherboard bracket 20 includes a first surface on the connecting portion 201 and a second surface on the supporting portion 202. The first surface is used to connect with the frame 102, and the second surface and the cover plate 103 are spaced apart along the thickness direction of the electronic device. The recessed portion 2021 is recessed in the second surface. After the gas flows out of the second channel 21 through the first seal 30, it continues to flow into the cavity 101 along the gap between the cover plate 103 and the supporting portion 202. Therefore, with the recessed portion 2021 on the second surface, the first seal 30 can be prevented from protruding from the supporting portion 202 of the motherboard bracket 20, ensuring that there is a sufficient gap between the supporting portion 202 of the motherboard bracket 20 and the cover plate 103, so that the gas used to regulate the gas pressure balance can flow smoothly between the motherboard bracket 20 and the cover plate 103. Similarly, when the gas pressure in the cavity 101 increases, it can also be ensured that the gas can flow smoothly to the outside through the above-mentioned airflow channel, ensuring the gas exchange speed and efficiency.

[0066] Optionally, the first channel 11 includes a third channel segment 111 and a fourth channel segment 112 that are interconnected, with the third channel segment 111 and the fourth channel segment 112 arranged at an angle. Specifically, the third channel segment 111 is connected to the outside, and the fourth channel segment 112 is connected to the second channel 21; wherein the axis of the third channel segment 111 is arranged at an angle to the axis of the fourth channel segment 112.

[0067] like Figure 9 As shown, the third channel segment 111 is arranged along the length direction of the electronic device, and the fourth channel segment 112 is arranged at an angle to the length direction of the electronic device; as Figure 10 As shown, both the third channel segment 111 and the fourth channel segment 112 are inclined along the length of the electronic device, forming a V-shaped first channel 11. It should be noted that when the first channel 11 consists only of a straight channel segment, since the housing 10 has a second opening 113, water can enter the first channel 11 through the second opening 113 and continue to move into the second channel 21. Under conditions of high water pressure and high water flow velocity, the water entering the second channel 21 may affect the reliability of the first seal 30 connected to the first opening 213 of the second channel 21, or even cause the first seal 30 to fail. In this embodiment, since the first channel 11 includes a third channel segment 111 and a fourth channel segment 112 that are interconnected and set at an angle, after the water flows into the third channel segment 111 through the second opening 113, the fourth channel segment 112 and the third channel segment 111 are set at an angle, which can buffer the water flow inside, reduce the water flow speed entering the second channel 21, reduce the risk of damage and failure of the first seal 30 caused by the excessive water flow speed in the second channel 21, and further improve the waterproof rating of the electronic device.

[0068] It should be noted that the second opening 113 of the frame 102 can also be set on the left and right sides of the electronic device. In this setting, the extension direction of the first channel 11 is roughly along the width direction of the electronic device. This application does not specifically limit the position of the second opening 113 and the first channel 11 on the frame 102.

[0069] Furthermore, the third channel segment 111 includes a third end located near the fourth channel segment 112, and the fourth channel segment 112 includes a fourth end located near the third channel segment 111. The third end of the third channel segment 111 and the fourth end of the fourth channel segment 112 are interconnected, and the cross-sections of the third end and the fourth end are at least partially misaligned.

[0070] like Figure 11 As shown, arrow Z indicates the thickness direction of the electronic device. One end of the third channel segment 111 is provided with a second opening 113. The end of the third channel segment 111 near the fourth channel segment 112 is the third end. The fourth channel segment 112 is connected to the third channel segment 111, and the end of the fourth channel segment 112 connected to the third channel segment 111 is the fourth end. The third end of the third channel segment 111 and the fourth end of the fourth channel segment 112 are at least partially misaligned in the thickness direction of the electronic device. This allows the water flow velocity to be reduced as it flows from the third channel segment 111 to the fourth channel segment 112 when water enters through the second opening 113. The misalignment between the third end and the fourth end forms a buffer space, which can temporarily accommodate the water flow. This further buffers the water flow entering the first channel 11, reducing the impact of the water flow on the first seal 30 and protecting the safety and reliability of the first seal 30. The at least partial misalignment between the cross-section of the third end and the cross-section of the fourth end ensures the connection between the third channel segment 111 and the fourth channel segment 112. In practical applications, the misalignment direction of the third and fourth end sections is not limited to the misalignment method along the thickness direction of the electronic device in the embodiments of this application. This application does not specifically limit the misalignment direction of the third and fourth end sections.

[0071] In summary, the electronic device provided in this application embodiment may include at least the following advantages:

[0072] In this embodiment, the housing has a first channel that communicates with the outside. The motherboard bracket is disposed within the cavity of the housing and connected to it, and has a second channel that communicates with the first channel. The end of the second channel away from the first channel communicates with the cavity formed by the housing. A first seal is placed on the end of the second channel away from the first channel. Since the motherboard bracket in electronic devices typically has a large area, placing the first seal on one end of the second channel in the motherboard bracket in this embodiment increases the flexibility of the first seal's position design, thereby reducing the limitation on the size of the first seal due to its placement position and improving the flexibility of the first seal's area design.

[0073] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0074] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. An electronic device, comprising: The electronic device includes: a housing, a motherboard bracket, and a first sealing element; wherein the housing has a cavity; The motherboard bracket is disposed within the cavity and connected to the housing; The housing is provided with a first channel, and the motherboard bracket is provided with a second channel; The first channel is connected to the second channel, the end of the first channel away from the second channel is connected to the outside, and the end of the second channel away from the first channel is connected to the cavity. The first seal is placed on the end of the second channel away from the first channel.

2. The electronic device of claim 1, wherein, The housing includes a frame and a cover plate, the cover plate being connected to the frame and enclosing the cavity; The motherboard bracket includes a connecting part and a supporting part, and the connecting part is connected to the frame. The first channel is disposed in the frame; The second channel passes through the connecting part and the supporting part. The second channel includes a first end and a second end. The first end is located at the connecting part and communicates with the first channel. The second end is located at the supporting part and communicates with the cavity towards the cover plate. The first sealing member is located at the second end.

3. The electronic device of claim 2, wherein, The electronic device further includes a second seal having a first through hole; The second seal is connected between the connecting part and the frame, and the first through hole connects the first channel and the second channel.

4. The electronic device of claim 3, wherein, A third sealing element is provided inside the first through hole, and the third sealing element is a mesh structure.

5. The electronic device of claim 2, wherein, The electronic device also includes a motherboard, which is disposed between the frame and the motherboard bracket; The motherboard is provided with a second through hole, which connects the first channel and the second channel.

6. The electronic device of claim 2, wherein, In the second channel, the cross-sectional area of ​​the second end is larger than that of the first end.

7. The electronic device according to claim 2, characterized in that, The second channel includes a first channel segment and a second channel segment that are interconnected; wherein, The first channel segment is at least partially disposed in the connecting part and communicates with the first channel, the second channel segment is disposed in the supporting part and communicates with the cavity, and the cross-sectional area of ​​the second channel segment is larger than the cross-sectional area of ​​the first channel segment.

8. The electronic device of claim 2, wherein, The support portion is provided with a recessed portion, the second end is connected to the recessed portion, and the first sealing member is at least partially disposed within the recessed portion.

9. The electronic device of claim 1, wherein, The first channel includes a third channel segment and a fourth channel segment, wherein the third channel segment and the fourth channel segment are arranged at an angle.

10. The electronic device of claim 9, wherein, The third channel segment includes a third end adjacent to the fourth channel segment, and the fourth channel segment includes a fourth end adjacent to the third channel segment; The third end and the fourth end are interconnected, and the cross-section of the third end and the cross-section of the fourth end are at least partially misaligned.

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