Conductive and heat-conducting adhesive tape structure

By combining the middle and outer layers of the composite conductive and thermally conductive tape with carbon nanotubes and modified acrylic pressure-sensitive adhesive, the problem of heat influence during the conduction process of conductive double-sided tape is solved, achieving high conductivity and thermal conductivity, meeting the heat dissipation and shielding requirements of electronic devices, and extending their service life.

CN224139314UActive Publication Date: 2026-04-17JIANGSU SHUANGLIAN NEW ENERGY MATERIAL TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
JIANGSU SHUANGLIAN NEW ENERGY MATERIAL TECH CO LTD
Filing Date
2025-03-25
Publication Date
2026-04-17

AI Technical Summary

Technical Problem

Existing conductive double-sided adhesive tapes generate heat during the conduction process, affecting adhesion and reducing service life, and cannot simultaneously meet the requirements of shielding and heat dissipation.

Method used

The tape employs a composite structure consisting of an intermediate conductive layer and an outer conductive layer. The intermediate layer is made of a metal foil base coated with conductive and thermally conductive adhesive, while the outer layer is made of conductive cloth or non-woven fabric coated with conductive and thermally conductive adhesive. Combined with carbon nanotubes and modified acrylic pressure-sensitive adhesive, it forms a highly conductive and thermally conductive tape that provides conductive and thermally conductive pathways in the XY and Z directions.

Benefits of technology

It achieves higher overall thermal conductivity and lower contact resistance, provides better grounding and shielding performance, extends service life and simplifies the design and assembly process of electronic devices.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a conductive and heat-conducting adhesive tape structure which comprises a middle conductive layer and an outer conductive layer, the middle conductive layer is formed by coating conductive and heat-conducting glue on two sides of a middle conductive material, and the outer conductive layer is formed by coating conductive and heat-conducting glue on two sides of an outer conductive material. The middle conductive layer and the outer conductive layers wrapping the two sides of the middle conductive layer are compounded to form a conductive and heat-conducting adhesive tape structure, the middle conductive material and the outer conductive materials are different materials, and the outer conductive materials are the same materials. According to the utility model, higher overall heat conductivity and lower X-Y contact resistance and Z-direction contact resistance are realized, better grounding and shielding performances are provided, a more effective heat conduction channel is provided, and an effective material solution is provided for simplified design and assembly process of electronic devices of consumer electronics.
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Description

Technical Field

[0001] This utility model relates to the field of composite tape technology, and in particular to a conductive and thermally conductive tape structure. Background Technology

[0002] With the development of consumer electronics, more electronic devices need to meet the requirements of shielding, grounding and heat dissipation at the same time. In the existing technology, conductive double-sided tape has both adhesive and conductive functions. However, conductive double-sided tape often generates heat during the conductive process, which will affect the adhesiveness of the conductive double-sided tape and reduce its service life. Utility Model Content

[0003] To address the aforementioned technical problems, a conductive and thermally conductive tape structure is provided. This conductive and thermally conductive tape not only provides high peel strength, but also, through the metal foil, conductive nonwoven fabric, and conductive cloth, provides better XY and Z-axis conductive and thermal conduction pathways, achieving higher overall thermal conductivity and lower XY and Z-axis contact resistance. While providing better grounding and shielding performance, it also provides a more efficient thermal conduction channel, offering an effective material solution for simplifying the design and assembly process of electronic devices in consumer electronics products.

[0004] To achieve the above objectives, this utility model discloses a conductive and thermally conductive tape structure, including an intermediate conductive layer and an outer conductive layer. The intermediate conductive layer is composed of an intermediate conductive material coated with conductive and thermally conductive adhesive on both sides, and the outer conductive layer is composed of an outer conductive material coated with conductive and thermally conductive adhesive on both sides. The intermediate conductive layer and the outer conductive layers covering both sides of the intermediate conductive layer are combined to form a conductive and thermally conductive tape structure. The intermediate conductive material and the outer conductive material are different types of materials, while the outer conductive material is the same type of material.

[0005] Furthermore, the intermediate conductive material is a metal foil base layer, and the outer conductive material is a conductive cloth, a conductive non-woven fabric, or a conductive mesh.

[0006] Furthermore, the intermediate conductive material is conductive cloth, conductive non-woven fabric, or conductive mesh, and the outer conductive material is a metal foil base layer.

[0007] Furthermore, the metal foil base layer is made of copper foil, aluminum foil, or composite alloy metal foil.

[0008] Furthermore, the thickness of the conductive and thermally conductive adhesive is 5μm to 50μm.

[0009] Furthermore, the conductive and thermally conductive adhesive is composed of metal conductive fillers, high thermal conductivity fillers, carbon nanotubes, and modified acrylic pressure-sensitive adhesive.

[0010] Compared with the prior art, the beneficial effects of this utility model are as follows: This utility model discloses a conductive and thermally conductive tape structure. This conductive and thermally conductive tape not only provides high peel strength, but also provides better XY and Z-direction conductive and thermal conduction paths through metal foil, conductive non-woven fabric, and conductive cloth. This achieves higher overall thermal conductivity and lower XY and Z-direction contact resistance. While providing better grounding and shielding performance, it also provides a more effective heat conduction channel, providing an effective material solution for simplifying the design and assembly process of electronic devices in consumer electronics products. Attached Figure Description

[0011] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0012] Figure 1 This is a schematic diagram of Embodiment 1 of the present invention.

[0013] Figure 2 This is a schematic diagram of Embodiment 2 of the present invention.

[0014] In the diagram: 1 is the middle conductive layer; 11 is the middle conductive material; 2 is the outer conductive layer; 21 is the outer conductive material; 3 is the conductive and thermally conductive adhesive. Detailed Implementation

[0015] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0016] This utility model discloses a conductive and thermally conductive tape structure, comprising a middle conductive layer 1 and an outer conductive layer 2. The middle conductive layer 1 is composed of a middle conductive material 11 coated with conductive and thermally conductive adhesive 3 on both sides. The outer conductive layer 2 is composed of an outer conductive material 21 coated with conductive and thermally conductive adhesive 3 on both sides. The middle conductive layer 1 and the outer conductive layers 2 covering both sides of the middle conductive layer 1 form a conductive and thermally conductive tape structure. The middle conductive material 11 and the outer conductive material 21 are different types of materials, while the outer conductive material 21 is of the same type of material. The metal foil base layer is made of copper foil, aluminum foil, or a composite alloy metal foil. In a preferred embodiment, the metal foil base layer is made of copper foil. The thickness of the conductive and thermally conductive adhesive 3 is 5μm to 50μm. The conductive and thermally conductive adhesive 3 is composed of… The tape is composed of conductive metal filler, high thermal conductivity filler, carbon nanotubes, and modified acrylic pressure-sensitive adhesive. The ratio of conductive filler to thermal conductivity filler is 5% to 80%. The conductive metal filler provides high conductivity, ensuring that the tape effectively conducts current in electronic devices, reducing resistance and energy loss. The high thermal conductivity filler and carbon nanotubes significantly improve thermal conductivity, helping to dissipate heat quickly, preventing equipment overheating, and extending service life. The modified acrylic pressure-sensitive adhesive accounts for 20% to 70%, and the carbon nanotubes account for 0.1% to 5%. The carbon nanotubes not only improve thermal conductivity but also enhance the mechanical strength of the tape, making it more durable, with better tensile and tear resistance. They provide better XY and Z-axis conductive and thermal conduction pathways, achieving higher overall thermal conductivity and lower XY and Z-axis contact resistance.

[0017] Embodiment 1 of this application, as follows Figure 1 As shown, the middle conductive material 11 is a metal foil base layer, and the outer conductive material 21 is a conductive cloth, conductive non-woven fabric, or conductive mesh, as illustrated in the attached diagram. Figure 1 As shown in the diagram, the hexagonal layer is the metal foil base layer, and the triangular layer is the conductive cloth, conductive non-woven fabric, or conductive mesh.

[0018] Embodiment two of this utility model, such as Figure 2 As shown, the middle conductive material 11 is conductive cloth, conductive non-woven fabric, or conductive mesh, and the outer conductive material 21 is a metal foil base layer. In the illustration, the hexagonal layer is the metal foil base layer, and the triangular layer is conductive cloth, conductive non-woven fabric, or conductive mesh. The conductive and thermal conductivity properties of the conductive and thermally conductive adhesive in this embodiment are shown in the table below.

[0019]

[0020] The electrical and thermal conductivity properties of the conductive and thermally conductive adhesive in Example 1 are shown in the table below. The outer conductive material is selected as conductive non-woven fabric (the experimental variable is the proportion of conductive filler).

[0021]

[0022] The experimental data in Tables 1 and 2 show that changing the proportion of conductive filler and reducing the thickness of the gap between the conductive nonwoven fabric and the metal foil base layer can simultaneously improve the electrical and thermal conductivity. Under the same variable conditions, the thermal conductivity of Example 1 and Example 2 is roughly the same, but the structure of Example 1 has better bendability than that of Example 2. Therefore, Example 1 is selected as the preferred implementation method.

[0023] Working principle: Normally, heat is transferred from one end of a material to the other through electrons and phonons in conductive and thermally conductive particles. When conductive or thermally conductive particles are wrapped with acrylic adhesive, because acrylic adhesive is an insulating adhesive, there are not enough electrons and phonons to transfer heat, resulting in the inability to form an effective thermal conduction path to improve the thermal conductivity. In fact, the thermal conductivity may be much lower than that of the thermally conductive or conductive particles. Using carbon nanotubes to enhance the electrical and thermal conductivity of acrylic pressure-sensitive adhesive can greatly improve the material's electrical and thermal conductivity.

[0024] Several points need to be clarified: First, in the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installation," "connection," and "linkage" should be interpreted broadly, and can refer to mechanical or electrical connections, or internal connections between two components, or direct connections. Terms such as "upper," "lower," "left," and "right" are only used to indicate relative positional relationships, and the relative positional relationships may change when the absolute position of the described objects changes. Second, in this document, relational terms such as "first" and "second" are only used to distinguish one entity from another entity, and do not necessarily require or imply any such actual relationship or order between these entities.

[0025] The examples above are merely illustrative of this utility model and do not constitute a limitation on the scope of protection of this utility model. All designs that are the same as or similar to this utility model are within the scope of protection of this utility model.

Claims

1. An electrically and thermally conductive adhesive tape structure comprising an intermediate electrically conductive layer (1) and an outer electrically conductive layer (2), characterized in that, The intermediate conductive layer (1) is composed of an intermediate conductive material (11) coated with conductive and thermally conductive adhesive (3) on both sides. The outer conductive layer (2) is composed of an outer conductive material (21) coated with conductive and thermally conductive adhesive (3) on both sides. The intermediate conductive layer (1) and the outer conductive layer (2) covering both sides of the intermediate conductive layer (1) are combined to form a conductive and thermally conductive tape structure. The intermediate conductive material (11) and the outer conductive material (21) are different types of materials, while the outer conductive material (21) is the same type of material.

2. An electrically and thermally conductive adhesive tape construction according to claim 1, wherein The intermediate conductive material (11) is a metal foil base layer, and the outer conductive material (21) is a conductive cloth, a conductive non-woven fabric, or a conductive mesh.

3. An electrically and thermally conductive adhesive tape construction according to claim 1, wherein The intermediate conductive material (11) is conductive cloth, conductive non-woven fabric or conductive mesh, and the outer conductive material (21) is a metal foil base layer.

4. An electrically and thermally conductive adhesive tape construction according to claim 2 or 3, characterised in that, The metal foil base layer is made of copper foil, aluminum foil, or composite alloy metal foil.

5. The electrically and thermally conductive adhesive tape structure of claim 1, wherein The thickness of the conductive and thermally conductive adhesive (3) is 5μm to 50μm.

6. An electrically and thermally conductive adhesive tape construction according to claim 5, wherein The conductive and thermally conductive adhesive (3) is composed of metal conductive filler, high thermal conductivity filler, carbon nanotubes and modified acrylic pressure-sensitive adhesive.