Heat-conducting silicone grease

By using a multi-layer structure and graphene sheet design, the problems of poor thermal conductivity and uneven coating of thermal grease were solved, enabling rapid deheating and uniform coating of electronic components and improving heat dissipation performance.

CN224139353UActive Publication Date: 2026-04-17GUANGDONG CONTINENTAL HIGH-TECH MATERIALS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
GUANGDONG CONTINENTAL HIGH-TECH MATERIALS CO LTD
Filing Date
2025-05-15
Publication Date
2026-04-17

AI Technical Summary

Technical Problem

Existing thermal grease designs are flawed, have poor thermal conductivity, cannot de-heat quickly, and are unevenly applied, leading to a decrease in the heat dissipation performance of electronic components.

Method used

It adopts a multi-layer structure design, including an upper high filler layer, a lower high filler layer, a low filler layer and a protective filler layer, with graphene sheets placed on the inside. The high thermal conductivity of the graphene sheets is used to quickly dissipate heat, and the curved slope and overflow openings ensure uniform coating.

Benefits of technology

It improves thermal conductivity, enabling rapid deheating and uniform coating of electronic components, and ensuring the stability of heat dissipation performance and the integrity of coverage.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

The utility model relates to a heat-conducting consumable, in particular to heat-conducting silicone grease which comprises a body, the body is provided with an upper high filler layer and a lower high filler layer, the upper high filler layer is in a square shape, the inner side of the upper high filler layer is filled with a low filler layer, a containing groove is formed in the bottom of the lower high filler layer, and the lower high filler layer is filled with a heat-conducting material. The containing groove is filled with a protective filler layer, a graphene sheet is arranged on the inner side of the protective filler layer, the graphene sheet is attached to the bottom of a low filler layer, and the low filler layer and the protective filler layer are the same in component. The heat-conducting silicone grease has the advantages of being reasonable in design and high in heat-conducting performance, heat in electronic components can be more efficiently conducted out through the graphene sheets inside the heat-conducting silicone grease, the temperature of the electronic components can be reduced, the heat-conducting silicone grease can be evenly spread on the surfaces of the electronic components, the probability that the heat-conducting silicone grease overflows unevenly is reduced, and the heat dissipation performance is guaranteed.
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Description

Technical Field

[0001] This utility model relates to a thermally conductive consumable, specifically a thermally conductive silicone grease. Background Technology

[0002] Thermal grease is a highly thermally conductive and insulating silicone material primarily used for heat conduction and dissipation in electronic components to ensure the stable electrical performance of electronic instruments and meters. Thermal grease is typically in paste form, possesses good filling and thermal transfer properties, and remains stable at high temperatures without drying out or flowing.

[0003] However, existing thermal grease designs are flawed, exhibiting poor thermal conductivity. They rely solely on the paste-like grease itself to contact and conduct heat to electronic components. Due to the grease's limited heat absorption capacity, it cannot quickly dissipate heat when components have significant internal heat, leading to heat buildup. Furthermore, the paste-like consistency of existing thermal grease makes it prone to spreading improperly during application, resulting in gaps in component coverage and ultimately reduced heat dissipation. Therefore, the inventors have improved the structure of the thermal grease. Utility Model Content

[0004] The purpose of this invention is to provide a thermal grease that has the advantages of reasonable design and strong thermal conductivity. Through the internal graphene sheet, it can more efficiently conduct heat out of electronic components, which helps to reduce the temperature of electronic components, quickly deheat electronic components, and can be spread more evenly on the surface of electronic components, reducing the probability of uneven overflow of thermal grease. It is convenient to achieve full coverage of the surface of electronic components, ensuring heat dissipation performance and solving the problems mentioned in the above technical background.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a thermally conductive silicone grease, comprising a body having an upper high filler layer and a lower high filler layer, the upper high filler layer being U-shaped, and a low filler layer being filled inside the upper high filler layer, a receiving groove being formed at the bottom of the lower high filler layer, a protective filler layer being filled in the receiving groove, a graphene sheet being disposed inside the protective filler layer, the graphene sheet being attached to the bottom of the low filler layer, and the low filler layer and the protective filler layer having the same composition.

[0006] Preferably, the lower high filler layer is disposed at the bottom of the upper high filler layer, and the thickness of the lower high filler layer is between 0.8 mm and 1.8 mm.

[0007] Preferably, four inclined surfaces are formed at the edge of the lower high filler layer, and all four inclined surfaces are arc-shaped. The arc-shaped inclined surfaces are designed to facilitate the slow overflow of the low filler layer and the protective filler layer in the receiving groove to the outside.

[0008] Preferably, multiple overflow openings are provided on each inclined surface, and the multiple overflow openings are distributed in a straight line. By setting multiple overflow openings, the low filler layer and the protective filler layer can be more finely dispersed and overflow to the outside.

[0009] Preferably, the protective filler layer is disposed at the bottom of the low filler layer, and the protective filler layer is in contact with the low filler layer.

[0010] Preferably, the protective filler layer is U-shaped, and the thickness of the protective filler layer is equal to the thickness of the graphene sheet, which is between 0.5 mm and 0.8 mm.

[0011] Preferably, an upper plastic film layer and a lower plastic film layer are respectively provided at both ends of the body. The upper plastic film layer is attached to the surface of the upper filler layer, and the lower plastic film layer is attached to the surface of the lower filler layer. The thickness of the upper plastic film layer is equal to that of the lower plastic film layer, and the thickness of both the upper and lower plastic film layers is between 0.2 mm and 0.8 mm.

[0012] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0013] 1. This utility model provides a thermal grease comprising a body having an upper high-filler layer and a lower high-filler layer. The upper high-filler layer is U-shaped, and a low-filler layer is filled inside the upper high-filler layer. A receiving groove is formed at the bottom of the lower high-filler layer, and a protective filler layer is filled in the receiving groove. A graphene sheet is disposed inside the protective filler layer and is attached to the bottom of the low-filler layer. This thermal grease is reasonably designed and has strong thermal conductivity. By setting the high-filler layer and the low-filler layer, the high-filler layer surrounds the outside of the low-filler layer, and a graphene sheet is provided that directly contacts the surface of electronic components. Since the thermal conductivity of the graphene sheet is higher than that of the grease itself, it can more efficiently conduct heat out of the electronic components. The heat is then conducted to the outside through the paste-like high-filler layer and the low-filler layer, thus helping to reduce the temperature of electronic components and quickly de-heat them, making the thermal grease more practical.

[0014] 2. The thermal grease provided by this utility model has a lower high filler layer with four beveled edges formed at the edge of the lower high filler layer. All four beveled edges are arc-shaped. By setting the arc-shaped bevels, the lower filler layer and the protective filler layer in the receiving groove can be better and slowly overflowed to the outside. Multiple overflow openings are provided on each bevel, and the multiple overflow openings are distributed in a straight line. Through the multiple overflow openings, the lower filler layer and the protective filler layer can be more finely dispersed, avoiding the thermal grease from being scattered and overflowing on the surface of electronic components. This reduces the probability of uneven overflow of thermal grease, facilitates full coverage of the surface of electronic components, and ensures heat dissipation performance. Therefore, this thermal grease is suitable for widespread use. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0016] Figure 2 This is a schematic diagram of the structure of the main body of this utility model;

[0017] Figure 3 This utility model Figure 1 Sectional view of AA.

[0018] The reference numerals and names in the figure are as follows: 1. Body; 11. Upper high filler layer; 12. Lower high filler layer; 121. Receiving groove; 122. Sloping surface; 123. Overflow opening; 13. Low filler layer; 14. Protective filler layer; 15. Graphene sheet; 2. Upper plastic film layer; 3. Lower plastic film layer. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] In the description of the embodiments of this utility model, it should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing the embodiments of this utility model and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of this utility model, "multiple" means two or more, unless otherwise explicitly specified.

[0021] In this embodiment of the invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this embodiment of the invention according to the specific circumstances.

[0022] Please see Figure 1 One embodiment of this utility model is a thermally conductive silicone grease, which includes a body 1, with an upper plastic film layer 2 and a lower plastic film layer 3 respectively disposed at both ends of the body 1. The upper plastic film layer 2 and the lower plastic film layer 3 are used to protect the shape of the body 1.

[0023] Please see Figure 2The main body 1 has an upper high filler layer 11 and a lower high filler layer 12. The upper high filler layer 11 is U-shaped, and the lower high filler layer 12 is disposed at the bottom of the upper high filler layer 11. The thickness of the lower high filler layer 12 is between 0.8 mm and 1.8 mm. An upper plastic film layer 2 is attached to the surface of the upper high filler layer 11, and a lower plastic film layer 3 is attached to the surface of the lower high filler layer 12. The thicknesses of the upper plastic film layer 2 and the lower plastic film layer 3 are... The thicknesses of the upper plastic film layer 2 and the lower plastic film layer 3 are both between 0.2 mm and 0.8 mm. A receiving groove 121 is formed at the bottom of the lower high filler layer 12, and a protective filler layer 14 is filled in the receiving groove 121. Four inclined surfaces 122 are formed on the edge of the lower high filler layer 12, and the four inclined surfaces 122 are all arc-shaped. Multiple overflow openings 123 are provided on each inclined surface 122, and the multiple overflow openings 123 are distributed in a straight line.

[0024] Please see Figure 3The inner side of the upper filler layer 11 is filled with a lower filler layer 13. A protective filler layer 14 is disposed at the bottom of the lower filler layer 13 and is attached to the lower filler layer 13. A graphene sheet 15 is attached to the bottom of the lower filler layer 13. The lower filler layer 13 and the protective filler layer 14 have the same composition. The arc-shaped inclined surface 122 facilitates the slow overflow of the lower filler layer 13 and the protective filler layer 14 from the receiving groove 121. Multiple overflow openings 123 are provided. This arrangement allows the low-filler layer 13 and the protective filler layer 14 to be more finely dispersed and overflow to the outside. A graphene sheet 15 is disposed inside the protective filler layer 14. The protective filler layer 14 is U-shaped, and its thickness is equal to that of the graphene sheet 15, ranging from 0.5mm to 0.8mm. The graphene sheet 15 has higher thermal conductivity than the silicone grease itself. In actual use, the graphene sheet 15 is directly attached to the surface of the electronic component, allowing for rapid heat dissipation within the electronic component. Rapid heat dissipation and cooling are achieved through the application of thermal grease, which in turn reduces the internal temperature of electronic components. The heat is then dissipated to the outside through the paste-like upper high-filler layer 11, lower high-filler layer 12, and lower high-filler layer 13. This process helps lower the temperature of the electronic components. All three layers—upper high-filler layer 11, lower high-filler layer 12, lower high-filler layer 13, and protective filler layer 14—are paste-like. When applying the thermal grease, pressure is applied first from the center, causing the lower high-filler layer 13 to be pressurized onto the protective filler layer 14. The protective filler layer 14 overflows from multiple overflow openings 123, while the upper high filler layer 11 and the lower high filler layer 12 are also squeezed and spread out. The graphene sheet 15 is pressed onto the surface of the electronic component. Finally, the upper high filler layer 11, the lower high filler layer 12 and the low filler layer 13 are spread out on the surface of the electronic component, so that the above-mentioned media are mixed together and dispersed to the outside. This helps to spread the thermal grease more evenly on the surface of the electronic component, reduces the probability of uneven overflow of the thermal grease, and ensures heat dissipation performance.

[0025] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A heat-conducting silicone grease, characterized by, The system includes a body (1), which has an upper high filler layer (11) and a lower high filler layer (12). The upper high filler layer (11) is U-shaped and is filled with a low filler layer (13) on its inner side. A receiving groove (121) is formed at the bottom of the lower high filler layer (12). A protective filler layer (14) is filled in the receiving groove (121). A graphene sheet (15) is disposed on the inner side of the protective filler layer (14) and is attached to the bottom of the low filler layer (13).

2. The thermal conductive silicone grease according to claim 1, characterized in that: The lower high filler layer (12) is disposed at the bottom of the upper high filler layer (11), and the thickness of the lower high filler layer (12) is between 0.8 mm and 1.8 mm.

3. The thermal conductive silicone grease according to claim 1, wherein: The lower filler layer (12) has four bevels (122) formed on its edge, and all four bevels (122) are arc-shaped.

4. The thermal conductive silicone grease according to claim 3, characterized in that: Each of the inclined surfaces (122) is provided with a plurality of overflow openings (123), and the plurality of overflow openings (123) are arranged in a straight line.

5. The thermal conductive silicone grease of claim 1, wherein: The protective filler layer (14) is disposed at the bottom of the low filler layer (13), and the protective filler layer (14) is attached to the low filler layer (13).

6. The thermal conductive silicone grease of claim 1, wherein: The protective filler layer (14) is shaped like a square, and the thickness of the protective filler layer (14) is equal to the thickness of the graphene sheet (15), which is between 0.5 mm and 0.8 mm.

7. The thermal conductive silicone grease of claim 1, wherein: The main body (1) has an upper plastic film layer (2) and a lower plastic film layer (3) respectively at both ends. The upper plastic film layer (2) is attached to the surface of the upper filler layer (11), and the lower plastic film layer (3) is attached to the surface of the lower filler layer (12).