Base plate improved structure for mould pressing of LED (light-emitting diode) product
By setting a green ink barrier layer on the substrate of LED products, the problem of backside glue overflow during molding is solved, the coplanarity of the solder pads and product quality are improved, and the stability and production efficiency of SMT assembly are ensured.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ANHUI YUGUAN OPTOELECTRONICS TECH CO LTD
- Filing Date
- 2025-06-04
- Publication Date
- 2026-04-17
AI Technical Summary
Existing LED products are prone to backside glue overflow during molding, resulting in poor pad coplanarity, which affects SMT placement effect and reduces production efficiency and product quality.
Setting a barrier layer on the substrate, especially using green ink as a barrier layer, controls the flow path of the adhesive, avoids adhesive overflow, and improves the coplanarity of the pads.
It effectively prevents back-side adhesive overflow, improves pad coplanarity, reduces surface mount defects, enhances product quality and stability, and lowers the defect rate.
Smart Images
Figure CN224139393U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of LED packaging technology, specifically to an improved structure for a molding substrate of LED products. Background Technology
[0002] In the field of LED packaging technology, 0603-size LED products are widely used, playing a crucial role in indicator lights of various electronic devices, display backlights, and small lighting fixtures. However, the current molding process for 0603-size LED products has significant problems. For example, due to the high fluidity of the adhesive used and the large clearance between the bracket and the mold, the adhesive easily overflows from the non-light-emitting side (the back side) during molding. This backside overflow has many adverse effects, the most serious being the impact on pad coplanarity. When pad coplanarity is affected, surface mount technology (SMT) placement defects occur, such as component misalignment and cold solder joints, significantly reducing production efficiency and product quality. Utility Model Content
[0003] To address the shortcomings of existing technologies, this utility model provides an improved structure for a substrate used in the molding of LED products, solving the technical problem of adhesive overflow on the back side of LED components during molding.
[0004] To solve the above-mentioned technical problems, the present invention provides the following technical solution: an improved structure for a molding substrate for LED products, comprising a substrate and an LED element disposed on the substrate, wherein a functional area is provided on the front side of the substrate, and a barrier layer is disposed on the functional area, the barrier layer being located between the substrate and the LED element.
[0005] Preferably, the LED element includes a negative electrode functional area and a negative electrode pin, with the negative electrode pin located on one side of the negative electrode functional area.
[0006] Preferably, the barrier layer is positioned near the negative electrode pin and the negative electrode functional area.
[0007] Preferably, the barrier layer is green ink.
[0008] Preferably, the thickness of the barrier layer is 10μm to 20μm.
[0009] Preferably, the negative electrode pin is a circle with a hollow center.
[0010] By employing the above technical solution, this utility model provides an improved structure for a molding substrate of LED products, which has at least the following beneficial effects:
[0011] This improved structure for molding substrates used in LED products, by setting a barrier layer with green ink, guides the flow of adhesive, preventing adhesive overflow on the back of LED components and improving the coplanarity of the solder pads. This makes the SMT placement process more stable and reliable, reduces the occurrence of placement defects, thereby improving the overall quality and stability of the product, reducing the product defect rate, and enhancing the product's competitiveness in the market. Attached Figure Description
[0012] The accompanying drawings, which are included to provide a further understanding of the present invention, form part of this application:
[0013] Figure 1 This is a schematic diagram of the overall structure of this utility model;
[0014] Figure 2 This utility model Figure 1 Enlarged structural diagram at point A in the middle.
[0015] Figure label:
[0016] 1. Substrate; 2. LED component; 201. Negative electrode functional area; 202. Negative electrode pin; 3. Barrier layer. Detailed Implementation
[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0018] 0603-sized LED products refer to a type of surface-mount LED element commonly used in the electronics industry. "0603" represents its dimensions. In international electronics industry standards, 0603 indicates that the LED product is approximately 0.06 inches long and 0.03 inches wide. LEDs of this size are characterized by their small size and light weight, and are widely used in indicator lights, display backlights, and lighting modules in various electronic devices. In smartphones, they are used to indicate charging status and message notifications; in tablet computers and LCD monitor backlights, they provide uniform illumination.
[0019] Due to the technical defects of existing technologies that easily lead to adhesive overflow on the back side, please refer to... Figures 1-2This embodiment provides an improved structure for a molding substrate of LED products. By setting a barrier layer 3 of green ink, the flow of adhesive can be guided, preventing adhesive overflow from the back of the LED element 2. The structure includes a substrate 1 and an LED element 2 disposed on the substrate 1. A functional area is provided on the front side of the substrate 1, and a barrier layer 3 is disposed on the functional area. The barrier layer 3 is located between the substrate 1 and the LED element 2. By setting the barrier layer 3 on the functional area, the flow path of the adhesive is structurally intervened, providing a solution to the problem of adhesive overflow on the back.
[0020] Furthermore, the LED element 2 includes a negative electrode functional area 201 and a negative electrode pin 202, with the negative electrode pin 202 disposed on one side of the negative electrode functional area 201.
[0021] To address the issue of adhesive overflow caused by the proximity of the negative electrode functional area 201 to the negative electrode pin 202 and the lack of effective barrier, the barrier layer 3 is positioned near the negative electrode pin 202 and the negative electrode functional area 201. Precise positioning of the barrier layer 3 effectively prevents adhesive from flowing to areas prone to overflow, specifically addressing the backside overflow problem and improving product yield.
[0022] The barrier layer 3 is specifically green ink. As a barrier layer 3, green ink has a relatively low cost and is easy to coat onto the substrate 1. While controlling the flow of the adhesive and preventing adhesive overflow on the back side, it also takes into account the production cost and process feasibility.
[0023] The thickness of the barrier layer 3 is 10μm~20μm; the appropriate thickness can ensure that the green ink barrier layer 3 has a good barrier effect and effectively control the flow path of the colloid, while avoiding adverse effects on the product structure and performance due to excessive thickness or thinness, thus ensuring the stability of product quality.
[0024] Furthermore, the negative pin 202 is a circular hole in the center.
[0025] It should be noted that the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.
[0026] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. An improved structure of a substrate for molding for an LED product, comprising a substrate (1) and an LED element (2) provided on the substrate (1), characterized in that, The substrate (1) has a functional area on its front side, and a barrier layer (3) is provided on the functional area. The barrier layer (3) is located between the substrate (1) and the LED element (2).
2. The improved structure of a substrate for molding for LED products according to claim 1, wherein: The LED element (2) includes a negative electrode functional area (201) and a negative electrode pin (202), with the negative electrode pin (202) located on one side of the negative electrode functional area (201).
3. The improved structure of a substrate for molding for LED products according to claim 1, wherein: The barrier layer (3) is located near the negative electrode pin (202) and the negative electrode functional area (201).
4. The improved structure of a substrate for molding for LED products according to claim 1, wherein: The barrier layer (3) is specifically green ink.
5. The improved structure of a substrate for molding for LED products according to claim 1, wherein: The thickness of the barrier layer (3) is 10μm~20μm.
6. The improved structure of a substrate for molding for LED products according to claim 2, wherein: The negative pin (202) is a circular shape with a hollow center.