Cleaning equipment for photoresist removal and stripping of silicon wafer

Abstract

The utility model provides a cleaning device for degumming and stripping a silicon wafer, which comprises a tank body, a first cleaning area and a second cleaning area, and is characterized in that a division bin is arranged in the tank body and divides the interior of the tank body into the first cleaning area and the second cleaning area; the number of the placing tools is multiple, every two placing tools form a group to form a storage mechanism, and the storage mechanism is connected with a driving unit arranged in the partition bin; the placing tool comprises end plates and a plurality of groups of annular frames arranged between the end plates, a silicon wafer to be processed is placed on a supporting seat assembly arranged between the annular frames, the driving unit pulls the storage mechanism to swing back and forth, and the silicon wafer to be processed is in full contact with the cleaning liquid in the swinging process. According to the utility model, the bearing capacity of a single placing tool is reduced in a manner that the length of the placing tool is shortened and the placing tool is separated, so that the torque of the single placing tool for maintaining the swinging action is reduced, and the torque requirement on the driving unit is reduced.

Description

Technical Field

[0001] This utility model belongs to the field of silicon wafer cleaning technology, and in particular relates to a cleaning device for removing adhesive from silicon wafers. Background Technology

[0002] The cleanliness of silicon wafer surfaces is a key factor affecting silicon wafer yield and cell conversion efficiency. To obtain silicon wafers with high cleanliness, a debonding and cleaning process is often required after wire cutting. Typically, the debonding and cleaning equipment used for silicon wafers usually employs an immersion cleaning method to complete the debonding and cleaning process.

[0003] In existing technologies, rotating equipment is used to rotate the fixture that holds the silicon wafer in the cleaning equipment for removing adhesive from silicon wafers, thereby increasing the contact between the cleaning solution and the silicon wafer and improving the immersion cleaning effect. However, the total weight of the silicon wafer and the fixture means that the drive equipment needs to have a large enough torque to drive the fixture and the silicon wafer to rotate, which places high demands on the torque of the drive equipment. Utility Model Content

[0004] This invention provides a cleaning device for removing adhesive from silicon wafers, aiming to solve the problem that the total weight of the silicon wafer and tooling requires a sufficiently large torque to drive the tooling and silicon wafer to rotate, resulting in high torque requirements for the drive device.

[0005] This invention is achieved as follows: a cleaning device for removing adhesive from silicon wafers, comprising:

[0006] The tank body has a partition compartment inside, which divides the interior of the tank body into a first cleaning area and a second cleaning area;

[0007] The tooling is arranged in several pairs to form a storage mechanism, which is connected to a drive unit located inside the partition compartment.

[0008] The placement fixture includes an end plate and several sets of ring frames arranged between the end plates. The silicon wafer to be processed is placed on the support base assembly arranged between the ring frames. The drive unit pulls the storage mechanism to swing back and forth, and the silicon wafer to be processed comes into full contact with the cleaning fluid during the swinging process.

[0009] Preferably, three sets of connecting rods are provided between the end plate and the ring frame, and the end plate and the ring frame are connected by connecting rods. The ring frame includes an upper arc frame and a lower arc frame, and the connecting rods are distributed in a ring array on the lower arc frame.

[0010] Preferably, the support assembly includes two sets of side support seats and an arc-shaped bottom support seat, wherein the bottom support seats and side support seats are arranged in a ring array on the lower arc frame of the ring frame.

[0011] Preferably, the drive unit includes a first power output shaft, a second power output shaft, and a power device. The power output shaft of the power device is driven by the first power output shaft and the second power output shaft through a helical gear. The first power output shaft and the second power output shaft are respectively connected to the mounting fixture located in the first cleaning zone and the second cleaning zone.

[0012] Preferably, the side support base is provided with a lateral support groove, which is an arc-shaped structure, and the silicon wafer to be processed is engaged in the lateral support groove.

[0013] Preferably, the bottom support base is provided with a bottom support groove, and the silicon wafer to be processed is engaged in the bottom support groove of the arc-shaped structure.

[0014] Preferably, the bottom support is also provided with a through hole, through which one of the three sets of connecting rods passes.

[0015] Compared with the prior art, the embodiments of this application have the following main advantages:

[0016] 1. The silicon wafer de-adhesive stripping cleaning equipment provided by this utility model uses the principle of a swing motor to generate rotational force, allowing the placement fixture to swing back and forth, so that the silicon wafer to be processed can fully contact the cleaning liquid during the swinging process of the placement fixture.

[0017] 2. The silicon wafer adhesive removal and peeling cleaning equipment provided by this utility model utilizes a first cleaning zone and a second cleaning zone to arrange the fixtures. By actively locking the length of the fixtures and combining the arrangement method, the load on each fixture is reduced, thereby reducing the torque required for each fixture to maintain its swinging motion and thus reducing the torque requirement of the drive unit. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of a cleaning device for removing adhesive from silicon wafers provided by this utility model.

[0019] Figure 2 This is a schematic diagram of the mounting fixture structure for a cleaning device for removing adhesive from silicon wafers provided by this utility model.

[0020] Figure 3 This is a top view schematic diagram of the mounting fixture for a cleaning device used for removing adhesive from silicon wafers, provided by this utility model.

[0021] Figure 4 This is a schematic diagram of the ring frame and support base assembly in a cleaning device for removing adhesive from silicon wafers provided by this utility model.

[0022] Figure 5 This is a schematic diagram of the drive unit structure of a cleaning device for removing adhesive from silicon wafers provided by this utility model.

[0023] Figure 6 This is a schematic diagram of the support base assembly structure of a cleaning device for removing adhesive from silicon wafers provided by this utility model.

[0024] Explanation of reference numerals in the attached figures:

[0025] 100. Tank body; 101. First cleaning zone; 102. Second cleaning zone; 110. Dividing compartment;

[0026] 200. Fixture placement; 210. End plate; 220. Circular frame; 230. Connecting rod;

[0027] 310. Side support seat; 311. Lateral support groove; 312. Side limiting rod; 320. Bottom support seat; 321. Limiting rod; 322. Bottom support groove; 323. Through hole;

[0028] 410. First power output shaft; 420. Second power output shaft; 430. Power equipment. Detailed Implementation

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein in the specification of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having," and any variations thereof, in the specification, claims, and foregoing drawings of this application are intended to cover non-exclusive inclusion. The terms "first," "second," etc., in the specification, claims, or foregoing drawings of this application are used to distinguish different objects, not to describe a particular order.

[0030] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0031] This utility model embodiment provides a cleaning device for removing adhesive from silicon wafers, such as... Figures 1-6 As shown, the cleaning equipment for removing adhesive from silicon wafers includes:

[0032] The tank 100 has a dividing compartment 110 inside, which divides the interior of the tank 100 into a first cleaning area 101 and a second cleaning area 102.

[0033] The cleaning unit includes two sets of mounting fixtures 200 and a drive unit disposed inside the dividing chamber 110. The two sets of mounting fixtures 200 are respectively arranged in the first cleaning area 101 and the second cleaning area 102. The drive unit generates power to drive the mounting fixtures 200 located in the first cleaning area 101 and the second cleaning area 102 to swing. The two sets of mounting fixtures 200 constitute a storage mechanism and serve as a silicon wafer storage area. When the mounting fixtures 200 swing, the silicon wafers to be processed come into full contact with the cleaning fluid during the swing process.

[0034] The mounting fixture 200 includes an end plate 210 and several sets of annular frames 220 disposed between the end plates 210. The annular frame 220 includes an upper arc frame and a lower arc frame. A support seat assembly is provided on the lower arc frame. The support seat assembly includes two sets of side support seats 310 and a bottom support seat 320. The side support seats 310 and the bottom support seats 320 are arranged in annular array on the annular frame 220. The side support seats 310 are disposed on both sides of the bottom support seat 320.

[0035] The silicon wafer to be processed is placed on the support assembly, and the drive unit pulls the storage mechanism to swing back and forth, so that the silicon wafer can fully contact the cleaning solution during the swinging process;

[0036] The side support 310 is provided with a lateral support groove 311, and the bottom support 320 is provided with a bottom support groove 322. The silicon wafer to be processed is engaged inside the lateral support groove 311 and the bottom support groove 322. The drive unit uses the principle of a swing motor to generate rotational force, allowing the mounting fixture 200 to swing back and forth, so that the silicon wafer to be processed can fully contact the cleaning solution; the swing function reduces the damage to the silicon wafer caused by high-speed rotation.

[0037] In this application, the fixture 200 is arranged in a separate first cleaning zone 101 and second cleaning zone 102. By actively locking the length of the fixture 200 and combining it with the separate arrangement, the load-bearing capacity of a single fixture 200 is reduced, thereby reducing the torque required for a single fixture 200 to maintain its swinging motion. This reduces the torque requirement of the drive unit. By using multiple low-torque devices to replace a single high-torque device, the need for a single high-torque device is reduced. This not only allows for a larger cleaning load under low-torque conditions, but also indirectly reduces the equipment investment requirement by reducing the investment in high-torque devices.

[0038] In a preferred embodiment of this invention, the drive unit includes a first power output shaft 410, a second power output shaft 420, and a power device 430. The power output shaft of the power device 430 is driven by the first power output shaft 410 and the second power output shaft 420 through a helical gear. The first power output shaft 410 and the second power output shaft 420 are respectively connected to the mounting fixture 200 located in the first cleaning zone 101 and the second cleaning zone 102. The power device 430 is a device based on the principle of a swing motor.

[0039] The end plate 210 is provided with a bearing seat for connecting the shaft mechanism. The end plate 210 of the mounting fixture 200 near the dividing chamber 110 is mounted on the first power output shaft 410 or the second power output shaft 420. The end plate 210 of the mounting fixture 200 away from the dividing chamber 110 is mounted on the wheel axle of the groove 100 through the bearing seat.

[0040] In a preferred embodiment of this invention, three sets of connecting rods 230 are provided between the end plate 210 and the annular frame 220. The end plate 210 and the annular frame 220 are connected by the connecting rods 230. The annular frame 220 includes an upper arc frame and a lower arc frame. The connecting rods 230 are arranged in a circular array on the lower arc frame. The connecting rods 230 are set on one side of the lower arc frame so as not to affect the insertion of the silicon wafer to be processed into the annular frame 220 from the side of the upper arc frame.

[0041] Since the driving unit adopts the principle of swing motor technology, the storage mechanism swings back and forth by the principle of swing motor. The swing angle of the silicon wafer during the swing process is no more than 120°. Small-angle swing will not cause the silicon wafer to slip off the upper arc frame.

[0042] The connecting rod 230 can be connected to the end plate 210 and the ring frame 220 by welding. Alternatively, the connecting rod 230 can be a screw structure, using bolts to fix the ring frame 220 so that they are evenly distributed between the end plates 210. The side support seat 310 and the bottom support seat 320 are respectively provided with side limiting rods 312 and limiting rods 321. The end plate 210 and the ring frame 220 are provided with insertion holes for fixing the side limiting rods 312 and limiting rods 321. After the connecting rod 230 and the ring frame 220 are fixed, the two sets of ring frames 220 and the ring frame 220 and the end plate 210 will clamp the side support seat 310 and the bottom support seat 320, and the side limiting rods 312, limiting rods 321 and insertion holes will restrict the sliding of the side support seat 310 and the bottom support seat 320.

[0043] In a further preferred embodiment of this utility model, the bottom support 320 is also provided with a through hole 323 for connecting one of the three sets of connecting rods 230 of the ring frame 220 to pass through the through hole 323; the bottom support 320 mainly bears the pressure, and the structural stability of the bottom support 320 is improved by the nested connecting rods 230 to prevent the silicon wafer to be processed from slipping off the placement fixture 200;

[0044] It should be noted that, for the sake of simplicity, the foregoing embodiments are all described as a series of actions. However, those skilled in the art should understand that the present invention is not limited to the described order of actions, as some steps may be performed in other orders or simultaneously according to the present invention. Furthermore, those skilled in the art should also understand that the embodiments described in the specification are preferred embodiments, and the actions and modules involved are not necessarily essential to the present invention.

[0045] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit the scope of protection of this utility model. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on these embodiments, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model. Although this utility model has been described in detail with reference to the above embodiments, those skilled in the art can still combine, add, delete, or otherwise adjust the features of the various embodiments of this utility model according to the circumstances without conflict or creative effort, thereby obtaining different technical solutions that do not fundamentally depart from the concept of this utility model. These technical solutions are also within the scope of protection of this utility model.

Claims

1. A cleaning apparatus for silicon wafer de-bonding and stripping, characterized by, include: The tank (100) has a dividing compartment (110) inside, which divides the interior of the tank (100) into a first cleaning area (101) and a second cleaning area (102). The placement fixtures (200) are numerous and arranged in pairs to form a storage mechanism. The storage mechanism is connected to the drive unit located inside the partition compartment (110). The placement fixture (200) includes an end plate (210) and several sets of ring frames (220) arranged between the end plates (210). The silicon wafer to be processed is placed on the support base assembly provided between the ring frames (220). The drive unit pulls the storage mechanism to swing back and forth, and the silicon wafer to be processed comes into full contact with the cleaning fluid during the swinging process.

2. The cleaning apparatus for removing a photoresist from a silicon wafer according to claim 1, wherein Three sets of connecting rods (230) are provided between the end plate (210) and the ring frame (220). The end plate (210) and the ring frame (220) are connected by the connecting rods (230). The ring frame (220) includes an upper arc frame and a lower arc frame. The connecting rods (230) are arranged in a ring array on the lower arc frame.

3. The cleaning apparatus for removing a photoresist from a silicon wafer according to claim 2, wherein The support assembly includes two sets of side support seats (310) and an arc-shaped bottom support seat (320), which are arranged in a ring array on the lower arc frame of the ring frame (220).

4. The cleaning apparatus for removing a photoresist from a silicon wafer according to claim 3, wherein The drive unit includes a first power output shaft (410), a second power output shaft (420), and a power device (430). The power output shaft of the power device (430) is driven by the first power output shaft (410) and the second power output shaft (420) through a helical gear. The first power output shaft (410) and the second power output shaft (420) are respectively connected to the mounting fixture (200) located in the first cleaning zone (101) and the second cleaning zone (102).

5. The cleaning apparatus for removing a photoresist from a silicon wafer according to claim 4, wherein The side support base (310) is provided with a side support groove (311), which is an arc-shaped structure, and the silicon wafer to be processed is engaged in the side support groove (311).

6. The cleaning apparatus for removing a photoresist from a silicon wafer according to claim 5, wherein The bottom support base (320) is provided with a bottom support groove (322), and the silicon wafer to be processed is engaged in the bottom support groove (322) with an arc-shaped structure.

7. The cleaning apparatus for silicon wafer de-bonding and stripping according to claim 6, wherein The bottom support (320) is also provided with a through hole (323), and one of the three sets of connecting rods (230) passes through the through hole (323).

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