Cleaning device

Abstract

The utility model relates to the technical field of chips, and discloses a cleaning device, which is used for cleaning a to-be-cleaned object at the edge of a to-be-cleaned part, and comprises a rotating part, a driving part and a driving part, and the cleaning assembly is arranged above the rotating part, a cleaning part is arranged at the end of the cleaning assembly, and the cleaning part is arranged opposite to the to-be-cleaned object and used for removing the to-be-cleaned object when the rotating part drives the to-be-cleaned part to rotate. The rotary part is matched with the cleaning assembly to remove the object to be cleaned, the structure is simple, operation is convenient, automatic cleaning can be achieved, the cleaning time can be shortened, and the cleaning efficiency can be improved; the to-be-cleaned object is removed through the cleaning device, the cleaning capacity is stable, the quality of the to-be-cleaned object can be guaranteed, and then the cleaning cost is reduced.

Description

Technical Field

[0001] This utility model relates to the field of chip technology, and specifically to a cleaning device. Background Technology

[0002] During chip packaging, tiny metal bumps are electroplated onto the chip's pads to create electrical connections between the chip and the packaging substrate. This improves chip connectivity, reduces chip size and weight, and enhances chip reliability and stability. However, solder balls can form at the chip's edges after electroplating, severely impacting chip quality. If a blade is used for cutting, the blade's tip is prone to chipping due to the tight bond between the solder balls and the chip, and the resulting fragments can easily scratch the chip.

[0003] Therefore, existing technologies use specialized equipment to blow away solder balls. However, this method requires manual operation, resulting in low efficiency. Furthermore, during the process, it is easy to miss or fail to blow away the solder balls, leading to poor chip quality. Utility Model Content

[0004] In view of this, the present invention provides a cleaning device to solve the problem that the prior art cannot clean the solder balls on the chip, thus affecting the chip quality and resulting in low processing efficiency.

[0005] This utility model provides a cleaning device for cleaning the edges of a part to be cleaned, including:

[0006] A rotating component, on which the part to be cleaned is fixed, is used to drive the part to be cleaned to rotate.

[0007] A cleaning component is disposed above the rotating component. The end of the cleaning component is provided with a cleaning element, which is disposed opposite to the object to be cleaned. The cleaning element is used to remove the object to be cleaned when the rotating component drives the object to be cleaned to rotate.

[0008] Beneficial effects: By using a rotating component in conjunction with a cleaning assembly to remove the object to be cleaned, the structure is simple and easy to operate. It can automatically clean, thereby shortening the cleaning time and improving the cleaning efficiency. The cleaning device removes the object to be cleaned, ensuring stable cleaning ability and guaranteeing the quality of the object to be cleaned, thus reducing cleaning costs.

[0009] In one alternative implementation, the cleaning component is a retractable structure.

[0010] Beneficial effects: By making the cleaning component a retractable structure, it can automatically raise the position of the cleaning component away from the component when the end of the component to be cleaned warps, thus avoiding scratching the component and making it more widely applicable.

[0011] In one alternative implementation, the cleaning component includes:

[0012] The fastener has a through groove.

[0013] The telescopic component has the cleaning component fixed at one end and the other end slidably disposed in the through groove, used to adjust the distance between the cleaning component and the object to be cleaned.

[0014] In one optional embodiment, an elastic element is sleeved on the outer side of the telescopic member, one end of the elastic element is fixedly connected to the fixing element, and the other end is fixedly connected to the cleaning member.

[0015] Beneficial effects: By incorporating elastic elements, it is possible to connect the telescopic elements and the fixed elements, and to provide the force needed to remove the object to be cleaned.

[0016] In one optional embodiment, the distance between the cleaning component and the component to be cleaned is 3 mm;

[0017] And / or, the end of the cleaning component is provided with a cleaning part, the cross-section of which is planar.

[0018] Beneficial effects: By spacing the cleaning part 3mm away from the part to be cleaned, it is possible to avoid the cleaning part being too close to the part to be cleaned and scratching it; by making the cross-section of the cleaning part planar, it is possible to ensure that the cleaning part makes contact with the object to be cleaned, thereby removing the object to be cleaned.

[0019] In one alternative embodiment, the cleaning device includes:

[0020] A first support member is connected to the cleaning component and is used to support the cleaning component;

[0021] And / or, a second support member, connected to the rotating member, for supporting the rotating member.

[0022] Beneficial effects: By setting the first support member, the cleaning component can be supported to increase its height; by setting the second support member, the height of the rotating component can be increased, which makes it easier for operators to pick up and put down the items to be cleaned, and to observe the effect of removing the items to be cleaned in real time.

[0023] In one alternative embodiment, the first support member and the cleaning component have a first state of relative fixation and a second state of rotatable connection. In the second state, the angle of the cleaning component is adjusted to move the cleaning member away from the object to be cleaned.

[0024] Beneficial effect: By rotatably connecting the first support to the cleaning component, the cleaning component can be rotated to another position when picking up or placing the item to be cleaned, thus preventing the cleaning component from getting too close to the item to be cleaned and scratching it.

[0025] In one alternative embodiment, the first support member has a first through hole, the cleaning component has a second through hole, and the first support member and the cleaning component are connected by a connector to form the first state.

[0026] In one alternative embodiment, the first through hole is an elongated hole, the extension direction of which is different from the extension direction of the cleaning component, and the connector slides within the first through hole.

[0027] Beneficial effect: By setting the first through hole as an elongated hole, the relative position of the cleaning component and the object to be cleaned can be adjusted, thereby ensuring that the cleaning component is directly above the object to be cleaned.

[0028] In one alternative embodiment, the rotating component has a groove, and the component to be cleaned is fixed in the groove.

[0029] Beneficial effects: By fixing the part to be cleaned in the groove, it is possible to prevent the part from changing position during rotation, thus avoiding the inability to remove the part, or the part from falling off the rotating part and causing damage.

[0030] In one alternative embodiment, the rotating component is provided with a slot that connects the groove to the outside.

[0031] Beneficial effect: The groove makes it easier for operators to remove the parts to be cleaned from the groove. Attached Figure Description

[0032] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0033] Figure 1 This is a schematic diagram of the structure of a cleaning device according to an embodiment of the present utility model;

[0034] Figure 2 for Figure 1 A magnified view of a portion of point A in the middle;

[0035] Figure 3 for Figure 1 A magnified view of a portion of point B in the middle.

[0036] Explanation of reference numerals in the attached figures:

[0037] 1. Component to be cleaned; 2. Rotating component; 21. Groove; 22. Slot; 3. Cleaning assembly; 31. Cleaning component; 32. Fixing component; 33. Telescopic component; 34. Elastic component; 4. First support component; 41. First through hole; 5. Second support component; 6. Connecting component; 7. Support platform. Detailed Implementation

[0038] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0039] The following is combined Figures 1 to 3 The following describes embodiments of the present invention.

[0040] According to an embodiment of the present invention, a cleaning device is provided for cleaning the object to be cleaned at the edge of the object to be cleaned 1, comprising: a rotating member 2, on which the object to be cleaned 1 is fixed, for driving the object to be cleaned 1 to rotate; and a cleaning component 3, disposed above the rotating member 2, with a cleaning component 31 at the end of the cleaning component 3, the cleaning component 31 being disposed opposite to the object to be cleaned, for removing the object to be cleaned when the rotating member 2 drives the object to be cleaned 1 to rotate.

[0041] The method of removing the object to be cleaned by using the rotating part 2 in conjunction with the cleaning component 3 is simple in structure and easy to operate. It can automatically clean, thereby shortening the cleaning time and improving the cleaning efficiency. The cleaning device removes the object to be cleaned, and the cleaning ability is stable, which can ensure the quality of the object to be cleaned 1 and thus reduce the cleaning cost.

[0042] In one embodiment, the component to be cleaned 1 is a chip, and the object to be cleaned is a solder ball. The cleaning time for the solder ball on each chip is 1 minute, which improves efficiency by 80% compared to the prior art. As an alternative implementation, the component to be cleaned 1 can also be a printed circuit board, and the object to be cleaned can be excess solder joints on the printed circuit board. No further restrictions are imposed here.

[0043] In one embodiment, the rotating component 2 is driven to rotate by a motor. As an alternative implementation, the rotating component 2 can also be manually driven to rotate; no further restrictions are imposed here.

[0044] like Figure 1As shown, in one embodiment, the rotating member 2 has a groove 21, and a chip is fixed in the groove 21. By fixing the chip in the groove 21, it is possible to prevent the chip from changing position during rotation, thus avoiding the inability to remove the solder ball, or the chip from falling off the rotating member 2 and causing damage. As an alternative implementation, multiple protrusions can be provided on the edge of the rotating member 2, and the chip can be engaged between the multiple protrusions; no further restrictions are imposed here.

[0045] like Figure 1 As shown, in one embodiment, the rotating member 2 has a slot 22 that connects the groove 21 to the outside. There are two slots 22, which are arranged opposite each other. The slots 22 facilitate the removal of the chip from the groove 21 by the operator. As an alternative implementation, there may be only one slot 22 or three slots; no further restrictions are imposed here.

[0046] In one embodiment, the distance between the cleaning component 31 and the chip is 3mm. By spacing the cleaning component 31 and the chip by 3mm, it is possible to prevent the cleaning component 31 from being too close to the chip and scratching it. As an alternative implementation, the distance between the cleaning component 31 and the chip can also be 2mm or 4mm, without further limitation.

[0047] like Figure 2 As shown, in one embodiment, the cleaning member 31 has a cleaning portion at its end, and the cleaning portion has a planar cross-section. Specifically, the cleaning portion is a flat plate structure. By making the cross-section of the cleaning portion planar, it is ensured that the cleaning portion makes contact with the solder ball, thereby removing the solder ball. As an alternative implementation, the cleaning portion can also be a blade structure; no further limitations are imposed here. As an alternative implementation, the cross-section of the cleaning portion can also be arc-shaped, thereby adapting to the shape of the solder ball and increasing the contact area.

[0048] like Figure 2 As shown, in one embodiment, the cleaning component 3 is a telescopic structure. The cleaning component 3 includes: a fixing member 32 with a through groove; and a telescopic member 33, one end of which is fixed to the cleaning component 31, and the other end which slides within the through groove, used to adjust the distance between the cleaning component 31 and the solder ball. By making the cleaning component 3 a telescopic structure, when the end of the chip warps, the position of the cleaning component 31 can be automatically raised, moving it away from the chip to avoid scratching it, thus broadening its applicability. Alternatively, when the end of the chip warps, the position of the cleaning component 3 can be manually raised, moving the cleaning component 31 away from the chip. Another alternative implementation is that the telescopic member 33 is threaded into the through groove.

[0049] like Figure 2As shown, in one embodiment, an elastic element 34 is sleeved on the outer side of the telescopic member 33. One end of the elastic element 34 is fixedly connected to the fixing member 32, and the other end is fixedly connected to the cleaning member 31. The elastic element 34 is a spring; when the end of the chip warps, the spring compresses, the fixing member 32 extends into the through slot, thereby raising the position of the cleaning member 31. By providing the elastic element 34, the telescopic member 33 and the fixing member 32 can be connected, and a force for removing solder balls can be provided. As an alternative implementation, the elastic element 34 can also be a rubber or silicone structure; no further limitations are imposed here.

[0050] like Figure 1 As shown, in one embodiment, the cleaning device includes a first support member 4 connected to the cleaning component 3 for supporting the cleaning component 3. The first support member 4 has a "┐" shaped cross-section, with one end connected to the cleaning component 3 and the other end supported on the support platform 7. By providing the first support member 4, the cleaning component 3 can be supported, thereby increasing its height. Alternatively, the first support member 4 can also be a column, with the end of the cleaning component 3 furthest from the cleaning component 31 fixed to the column at a certain height.

[0051] In one embodiment, the first support member 4 and the cleaning component 3 have a relatively fixed first state and a rotatably connected second state. In the second state, the angle of the cleaning component 3 is adjusted to move the cleaning component 31 away from the chip. By rotatably connecting the first support member 4 and the cleaning component 3, the cleaning component 31 can be rotated to other positions when picking up or placing the chip, preventing the cleaning component 31 from getting too close to the chip and scratching it. As an alternative implementation, the cleaning component 3 can also be snapped onto the first support member 4, and the cleaning component 3 can be removed when picking up or placing the chip.

[0052] like Figure 3 As shown, in one embodiment, the first support member 4 has a first through hole 41, and the cleaning component 3 has a second through hole. The first support member 4 and the cleaning component 3 are connected by a connector 6 to form a first state. The connector 6 is a bolt. Alternatively, the first support member 4 and the cleaning component 3 can be connected by a universal joint with a locking structure. As another possible implementation, the connector 6 can also be a pin or other connecting structure; no further limitations are imposed here.

[0053] like Figure 3As shown, in one embodiment, the first through hole 41 is an elongated hole, and the extension direction of the elongated hole is different from the extension direction of the cleaning component 3. The connector 6 slides within the first through hole 41. By making the first through hole 41 an elongated hole, the relative position of the cleaning component 31 and the solder ball can be adjusted, thereby ensuring that the cleaning component 31 is directly above the solder ball. As an alternative implementation, the cleaning component 31 can also be positioned directly above the solder ball by adjusting the included angle between the first support member 4 and the cleaning component 3.

[0054] like Figure 1 As shown, in one embodiment, the cleaning device includes a second support 5 connected to the rotating member 2 for supporting the rotating member 2. A motor is fixed inside the second support 5, which is supported on a support platform 7. By providing the second support 5, the height of the rotating member 2 can be increased, facilitating the operator to pick up and place chips and to observe the effect of solder ball removal in real time. Alternatively, the rotating member 2 can be directly fixed to the support platform 7.

[0055] In one embodiment, the cleaning device is used as follows:

[0056] Step 1: Place the chip into the groove 21 of the rotating part 2;

[0057] Step 2: Adjust the angle of cleaning component 3 so that cleaning component 31 is directly above the solder ball;

[0058] Step 3: Start the motor. Rotating component 2 drives the chip to rotate, and cleaning component 31 removes the solder balls.

[0059] Step 4: Adjust the angle of cleaning component 3, move cleaning component 31 away from the chip, and remove the chip.

[0060] Although embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. A cleaning device for cleaning a to-be-cleaned object at an edge of a to-be-cleaned piece (1), characterized in that, include: Rotating component (2), on which the component to be cleaned (1) is fixed, for driving the component to be cleaned (1) to rotate; A cleaning component (3) is provided above the rotating component (2). The end of the cleaning component (3) is provided with a cleaning component (31). The cleaning component (31) is arranged opposite to the object to be cleaned and is used to remove the object to be cleaned when the rotating component (2) drives the object to be cleaned (1) to rotate. The cleaning component (3) includes: The fastener (32) is provided with a through groove; The telescopic component (33) has the cleaning component (31) fixed at one end and the other end slidably disposed in the through groove, for adjusting the distance between the cleaning component (31) and the object to be cleaned; An elastic element (34) is sleeved on the outside of the telescopic element (33). One end of the elastic element (34) is fixedly connected to the fixing element (32), and the other end is fixedly connected to the cleaning element (31).

2. The cleaning device of claim 1, wherein, The cleaning component (3) has a retractable structure.

3. The cleaning device according to any one of claims 1 to 2, characterized in that, The distance between the cleaning component (31) and the component to be cleaned (1) is 3mm; And / or, the end of the cleaning component (31) is provided with a cleaning part, the cross-section of which is planar.

4. The cleaning device of any one of claims 1 to 2, wherein, The cleaning device includes: The first support member (4) is connected to the cleaning component (3) and is used to support the cleaning component (3). And / or, a second support member (5) is connected to the rotating member (2) for supporting the rotating member (2).

5. The cleaning device of claim 4, wherein, The first support member (4) and the cleaning component (3) have a first state of relative fixation and a second state of rotational connection. In the second state, the angle of the cleaning component (3) is adjusted so that the cleaning member (31) moves away from the object to be cleaned (1).

6. The cleaning device of claim 5, wherein, The first support member (4) is provided with a first through hole (41), and the cleaning component (3) is provided with a second through hole. The first support member (4) and the cleaning component (3) are connected by a connector (6) to form the first state.

7. The cleaning device of claim 6, wherein, The first through hole (41) is an elongated hole, and the extension direction of the elongated hole is different from the extension direction of the cleaning component (3). The connector (6) slides within the first through hole (41).

8. The cleaning device of any one of claims 1 to 2, wherein, The rotating part (2) is provided with a groove (21), and the part to be cleaned (1) is fixed in the groove (21).

9. The cleaning device of claim 8, wherein, The rotating part (2) is provided with a slot (22) that connects the groove (21) to the outside.

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