Welding anti-deformation device for power module

Abstract

The utility model discloses a welding anti-deformation device for a power module, which comprises a body, a clamping mechanism and a pressing mechanism are arranged on the body, the clamping mechanism is used for clamping a plastic package body, and the pressing mechanism is used for applying pressure to the plastic package body after the plastic package body is clamped. By applying pressure to the plastic package body, the deformation of the plastic package body during welding is ensured to be within a controllable range, so that the thickness of the welding layer of the power module is uniform, the occurrence of welding holes can be reduced, the heat conduction efficiency of the welding layer is improved, and the service life of the power module is prolonged.

Description

Technical Field

[0001] This utility model relates to the field of power module manufacturing technology, specifically a welding anti-deformation device for power modules. Background Technology

[0002] In existing technologies, the soldering of power modules involves self-overlapping the heat sink substrate, solder, and molding compound. During the reflow soldering cooling process, the significant difference in the linear thermal expansion coefficients between the heat sink substrate and the molding compound makes the product prone to bending. This also results in uneven solder layer thickness—thicker in the center and thinner at the edges. This leads to uneven heat conduction during product cooling, reduced reliability, and the risk of voids forming in the middle, as well as warping and deformation of the appearance. Figure 1 As shown. Specifically, if the weld layer thickness is uneven, during the use of the power module, thermal stress will be generated inside the module due to long-term high-power operation. Under special operating conditions, it will also be subjected to significant temperature changes, causing creep in the weak areas of the weld layer, leading to delamination. This results in a decrease in heat dissipation capacity, creating a vicious cycle and accelerating module failure. If the surface warpage is not within the control range, coolant is prone to leakage after installation, leading to the risk of damage to the entire vehicle. Summary of the Invention

[0003] Purpose of the utility model: To solve the above-mentioned technical problems, this utility model provides a welding anti-deformation device for power modules.

[0004] Technical solution: The present invention provides a welding anti-deformation device for power modules, comprising a body, wherein a clamping mechanism and a pressing mechanism are provided on the body, the clamping mechanism is used to clamp the plastic seal, and the pressing mechanism is used to apply pressure to the plastic seal after it is clamped.

[0005] Furthermore, the clamping mechanism includes two handles, each of which is connected to a gripper.

[0006] Furthermore, the clamping mechanism also includes a guide shaft disposed on the main body, and the handles are a left handle and a right handle disposed on the guide shaft, and the left handle and the right handle are respectively connected to the gripper.

[0007] Furthermore, a first spring is provided between the left handle and the right handle, and the first spring is disposed on the guide shaft.

[0008] Furthermore, the gripper includes a left gripper and a right gripper, the left handle is connected to a left handle slider, the left handle slider is connected to the right gripper; the right handle is connected to a right handle slider, the right handle slider is connected to the left gripper.

[0009] Furthermore, the left and right grippers are frame-shaped.

[0010] Furthermore, the clamping mechanism includes a floating block, and multiple shafts are arranged below the main body. Each shaft is equipped with a second spring, and the end of each shaft passes through the floating block and is equipped with a retaining ring at the end.

[0011] Furthermore, a cover plate is provided on the main body.

[0012] Beneficial effects: Compared with the prior art, this utility model has the following beneficial effects:

[0013] By applying pressure to the molding compound while clamping it, the deformation of the molding compound during welding is kept within a controllable range, resulting in a uniform weld layer thickness in the power module. This reduces the occurrence of weld voids, improves the thermal conductivity of the weld layer, and extends the lifespan of the power module. Attached Figure Description

[0014] Figure 1 A schematic diagram illustrating the soldering voids in the power module caused by existing technology;

[0015] Figure 2 This is a schematic diagram of the structure of this utility model;

[0016] Figure 3 for Figure 2 A front view structural diagram;

[0017] Figure 4 This is a schematic diagram showing the state of the clamping mechanism of this utility model when it is released;

[0018] Figure 5 This is a diagram showing the state of the power module during welding of this utility model.

[0019] In the diagram: 1-body; 2-clamping mechanism; 3-pressing mechanism; 4-cover plate; 5-molded body; 6-heat dissipation base plate; 11-guide block; 12-guide shaft; 13-first spring; 21-slider; 22-handle; 23-gripper; 31-floating block; 32-shaft; 33-second spring; 232-left gripper; 231-right gripper; 223-left handle slider; 224-right handle slider. Detailed Implementation

[0020] The technical solution of this utility model will be further described below with reference to the accompanying drawings.

[0021] like Figure 2-5As shown, this utility model discloses a welding anti-deformation device for power modules, comprising a body 1. The body 1 includes a guide block 11, on which a clamping mechanism 2, a pressing mechanism 3, and a cover plate 4 are disposed. The clamping mechanism 2 is used to clamp a plastic sealant, and the pressing mechanism 3 is used to apply pressure to the plastic sealant after it is clamped. The clamping mechanism 2 includes two handles, each connected to a gripper. The clamping mechanism 2 also includes a guide shaft 12 disposed on the body 1. The handles are a left handle 221 and a right handle 222 disposed on the guide shaft 12, and the left handle 221 and the right handle 222 are respectively connected to the gripper. A first spring 13 is disposed between the left handle 221 and the right handle 222, and the first spring 13 is disposed on the guide shaft 12. The gripper includes a left gripper 232 and a right gripper 231. The left handle 221 is connected to a left handle slider 223, and the left handle slider 223 is connected to the right gripper 231. The right handle 222 is connected to a right handle slider 224, and the right handle slider 224 is connected to the left gripper 232. The left gripper 232 and the right gripper 231 are frame-shaped, which provides better clamping and gripping of the plastic seal. The clamping mechanism 3 includes a floating block 31. Multiple shafts 32 are arranged below the body 1. Each shaft 32 is equipped with a second spring 33. The end of each shaft 32 passes through the floating block 31 and is equipped with a retaining spring at the end.

[0022] The method of using this utility model is as follows:

[0023] The pressure application process: Squeeze the left handle 221 and right handle 222 to separate the left gripper 232 and right gripper 231, then insert the molding compound 5. Release the left handle 221 and right handle 222, and the first spring 13 pushes the left handle 221 and right handle 222, causing the left gripper 232 and right gripper 231 to move towards each other and clamp the molding compound. At this time, the second spring 33 of the clamping mechanism 3 applies pressure to the floating block, and the floating block applies pressure to the molding compound. The clamped molding compound is then placed above the heat sink substrate 6 of the power module for soldering.

[0024] Release process: Press down on the main body 1 to further compress the second spring 33 of the clamping mechanism 3. At this time, squeeze the left handle 221 and the right handle 222 to release the plastic seal 5 with the left gripper 232 and the right gripper 231, and then take out the welded power module.

[0025] This invention applies pressure to the molding compound 5 through the pressing mechanism 3, which ensures that the deformation of the molding compound 5 is within a controllable range, making the welding layer thickness of the power module uniform, thereby improving the life of the power module, reducing the occurrence of welding voids, and improving the thermal conductivity of the welding layer.

[0026] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present utility model should be included within the protection scope of the present utility model.

Claims

1. A solder deformation prevention device for a power module, characterized by: Includes a body (1), on which a clamping mechanism (2) and a pressing mechanism (3) are provided. The clamping mechanism (2) is used to clamp the plastic seal, and the pressing mechanism (3) is used to apply pressure to the plastic seal after it is clamped.

2. A solder deformation prevention device for a power module according to claim 1, characterized by: The clamping mechanism (2) includes two handles, each of which is connected to a gripper.

3. A solder deformation prevention device for a power module according to claim 2, characterized by: The clamping mechanism (2) also includes a guide shaft (12) on the body (1), and the handles are a left handle (221) and a right handle (222) on the guide shaft (12), and the left handle (221) and the right handle (222) are respectively connected to the gripper.

4. A solder deformation prevention device for a power module according to claim 3, characterized by: A first spring (13) is provided between the left handle (221) and the right handle (222), and the first spring (13) is provided on the guide shaft (12).

5. A solder deformation prevention device for a power module according to claim 4, characterized by: The gripper includes a left gripper (232) and a right gripper (231). The left gripper (221) is connected to the left gripper slider (223), and the left gripper slider (223) is connected to the right gripper (231). The right gripper (222) is connected to the right gripper slider (224), and the right gripper slider (224) is connected to the left gripper (232).

6. A solder deformation prevention device for a power module according to claim 5, characterized by: The left gripper (232) and right gripper (231) are frame-shaped.

7. The welding deformation prevention device for power modules according to claim 1, characterized in that: The pressing mechanism (3) includes a floating block (31), and multiple shafts (32) are arranged below the body (1). Each shaft (32) is provided with a second spring (33), and the end of each shaft (32) passes through the floating block (31) and is provided with a retaining ring at the end.

8. A solder deformation prevention device for a power module according to claim 1, characterized by: The main body (1) is provided with a cover plate (4).

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