Operating tool

Abstract

The utility model discloses an operation tool, and relates to the technical field of semiconductor processing. The operating tool comprises a supporting piece and a clamping piece, the supporting piece is provided with a supporting face, and the supporting face is used for supporting a semiconductor to be operated; the clamping piece is movably connected to the supporting piece, the clamping piece is provided with a clamping surface, the clamping surface and the supporting surface are oppositely arranged and form a limiting space, and the limiting space is used for containing a semiconductor; the operating tool has a first state and a second state, the clamping piece can move relative to the supporting piece to switch the first state and the second state, and in the first state, the clamping face and the supporting face abut against the two opposite sides of the semiconductor respectively so as to clamp the semiconductor; in the second state, at least one of the clamping surface and the supporting surface is separated from the semiconductor to release the semiconductor. The operation tool can stably take and place semiconductors, and is simple in structure, light and easy to use.

Description

Technical Field

[0001] This application relates to, but is not limited to, the field of semiconductor processing, and in particular to an operating tool. Background Technology

[0002] Manipulation tools can be used to manipulate semiconductors in environments such as coating and developing machines, spin coating and developing machines, and wafer cassettes. However, in related technologies, these manipulation tools have complex structures, occupy a large amount of space, are difficult to effectively hold semiconductors in place, and are prone to causing semiconductor damage. Utility Model Content

[0003] The operating tool provided in this application embodiment can stably pick up and place semiconductors, and has a simple structure, is lightweight and easy to use. Specifically, it is implemented through the following scheme:

[0004] This application provides an operating tool, including a support member and a clamping member. The support member has a support surface for supporting a semiconductor to be operated. The clamping member is movably connected to the support member and has a clamping surface. The clamping surface and the support surface are disposed opposite to each other and form a limiting space for accommodating the semiconductor. The operating tool has a first state and a second state. The clamping member can move relative to the support member to switch between the first state and the second state. In the first state, the clamping surface and the support surface respectively abut against opposite sides of the semiconductor to clamp the semiconductor. In the second state, at least one of the clamping surface and the support surface is separated from the semiconductor to release the semiconductor.

[0005] The operating tool provided in this application embodiment has a support surface that supports the semiconductor to be operated, providing support from below to reduce the possibility of the semiconductor falling. A clamping member is movably connected to the support member, allowing relative movement between the clamping member and the support member to change the relative position of the clamping surface and the support surface. This allows the operating tool to switch between a first state and a second state. In the first state, the operating tool can clamp the semiconductor for operations such as transfer. In the second state, the operating tool can release the clamped semiconductor to place it in the desired position. The clamping surface and the support surface are arranged opposite each other to form a limiting space for accommodating the semiconductor. In the first state, the clamping surface and the support surface abut against opposite sides of the semiconductor, and the clamping member and the support member can provide limiting for the semiconductor from two opposite directions, thereby clamping and fixing the semiconductor. On the one hand, the manipulator provides support and clamping for the semiconductor. The combination of support and clamping improves the stability of the semiconductor relative to the manipulator and reduces the possibility of the semiconductor slipping out and falling. On the other hand, the clamping surface and the supporting surface work together to achieve clamping, and the supporting surface can be reused, which helps to reduce the number of parts in the manipulator, making it easier to operate and lightweight. Compared with related technologies, which have complex manipulator structures and poor stability, the manipulator of this application, through the cooperation of the clamping surface and the supporting surface, can provide stable support and clamping for the semiconductor, and its simple structure is conducive to lightweight design.

[0006] In one possible implementation of this application, the clamping member includes a first connecting portion, which is slidably connected to the support member. The first connecting portion is slidable relative to the support member to switch the operating tool between a first state and a second state. The sliding direction of the first connecting portion and the support member is parallel to the support surface.

[0007] Here, the clamping member slides relative to the support member through the first connecting part. The relative sliding of the first connecting part and the support member can switch between the first state and the second state. During the movement of the clamping member relative to the support member, the space occupied in the direction of the vertical support surface is small, which is suitable for use in narrow spaces. Moreover, the sliding connection makes it easy for the clamping member and the support member to maintain a large contact area, which helps to firmly connect the two.

[0008] In one possible implementation of this application, the clamping surface includes a first edge and a second edge, with the first edge being farther away from the first connecting portion relative to the second edge; the clamping surface and the supporting surface have an angle, and the distance between the clamping surface and the supporting surface gradually decreases along the direction from the first edge toward the second edge.

[0009] Here, the clamping surface and the supporting surface are at an angle, and the distance between the clamping surface and the supporting surface gradually decreases along the direction from the first edge to the second edge. That is, the clamping surface is set as an inclined surface that gradually tilts towards the first connecting part. On the one hand, it is convenient to adapt to the chamfer of the semiconductor edge; on the other hand, it can provide guidance for the semiconductor to enter between the clamping surface and the supporting surface, which is convenient for operating the semiconductor.

[0010] In one possible implementation of this application, the operating tool further includes a limiting part, which is connected to at least one of the support member and the clamping member. The limiting part is provided with a limiting surface. The limiting surface is located on the outer periphery of the support surface or the clamping surface, and the extending direction of the limiting surface intersects the extending direction of the support surface or the clamping surface. The limiting surface, the support surface, and the clamping surface together define a limiting space.

[0011] Here, by setting a limiting surface, the limiting surface, clamping surface, and supporting surface together define a limiting space. The limiting surface can limit the semiconductor. On the one hand, the limiting surface restricts the semiconductor from entering the area between the clamping surface and the supporting surface so that the operating tool can clamp the edge area of ​​the semiconductor. On the other hand, the limiting surface can also abut against the semiconductor to maintain the relative position of the semiconductor with the supporting and clamping components, reducing the possibility of the semiconductor shaking or tilting.

[0012] In one possible implementation of this application, the support surface includes a first region and a second region, the first region corresponding to the middle of the semiconductor and the second region corresponding to the edge of the semiconductor; when the operating tool is switched to the first state, the projection of the clamping surface along the direction perpendicular to the support surface has a first overlapping area with the projection of the second region; when the operating tool is switched to the second state, the projection of the clamping surface along the direction perpendicular to the support surface does not overlap with the projection of the second region, or the projection of the clamping surface has a second overlapping area with the projection of the second region, and the first overlapping area is greater than the second overlapping area.

[0013] Here, the first region of the support surface corresponds to the middle of the semiconductor, which facilitates providing stable support for the semiconductor; the second region of the support surface corresponds to the edge of the semiconductor and is projected along the direction perpendicular to the support surface. The projection of the clamping surface can at least partially overlap with the projection of the second region. The second region and the clamping surface can provide balanced force from both sides of the semiconductor so that the semiconductor is in a state of balanced force.

[0014] In one possible implementation of this application, the support member includes a support portion and a second connecting portion, the second connecting portion being connected to the clamping member; a first region and a second region are disposed on the support portion, and the second region is located between the first region and the second connecting portion, the second region being arc-shaped, and the first region extending from the middle of the second region toward the center of the arc.

[0015] Here, the second connecting part of the support is connected to the clamping part. When the clamping part and the support are in relative motion, they are combined into a connected component, which is convenient for carrying and operation. The second region is arc-shaped, which is convenient for adapting to the edge contour of the semiconductor. The first region extends towards the center of the arc, which helps the first region to provide support for the geometric center position of the semiconductor and improves the stability of the support.

[0016] In one possible implementation of this application, the operating tool further includes a guide structure, which includes a guide groove and a guide protrusion. One of the support member and the clamping member is provided with the guide groove, and the other of the support member and the clamping member is provided with the guide protrusion. At least a portion of the guide protrusion is accommodated in the guide groove, and the guide protrusion is slidable along the extension direction of the guide groove. The guide groove is used to guide the movement of the support member relative to the clamping member to switch between the first state and the second state.

[0017] Here, by setting a guide structure, the guide protrusion and guide groove slide together, which can guide and limit the relative movement of the clamping part and the support part. On the one hand, it reduces the possibility of skew during the relative movement of the clamping part and the support part; on the other hand, it helps to improve the stability of the relative movement of the clamping part and the support part.

[0018] In one possible implementation of this application, the operating tool further includes a functional structure disposed on the support surface and / or clamping surface; the functional structure includes multiple anti-slip protrusions; and / or, the functional structure includes an elastic pad capable of elastic deformation.

[0019] Here, the support surface and / or clamping surface are provided with functional structures. Multiple anti-slip protrusions can increase the friction between the operating tool and the semiconductor, so as to keep the semiconductor on the operating tool. The elastic pad can adapt to semiconductors of different shapes through elastic deformation, and can also provide protection for the semiconductor, reducing the possibility of damage to the semiconductor due to hard contact.

[0020] In one possible implementation of this application, the support member includes a gripping part, and the clamping member includes an operating part, which is disposed corresponding to the gripping part; the operating part moves relative to the gripping part under the action of an external force, so that the support member moves relative to the clamping member, and switches between a first state and a second state.

[0021] Here, a gripping part is provided to facilitate the operator's gripping, and an operating part is provided corresponding to the gripping part to facilitate the operator's operation while gripping the gripping part. The operator can drive the clamping part to move relative to the support part through the operating part, so as to switch the relative position of the clamping part and the support part and realize the operation of clamping or releasing the semiconductor.

[0022] In one possible implementation of this application, the operating tool further includes a driving member, the fixed end of which is connected to the support member, and the output end of which is connected to the clamping member. The driving member is used to drive the clamping member to move relative to the support member in order to switch between the first state and the second state.

[0023] Here, by setting a driving component, the fixed end of the driving component is connected to the support component, and the output end of the driving component can drive the clamping component to move relative to the support component, making the use of the operating tool more labor-saving, and the driving component has high positioning accuracy, making the operation more precise. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the structure of the operating tool for holding a semiconductor provided in an embodiment of this application;

[0025] Figure 2 A schematic diagram of the structure of the operating tool provided in the embodiments of this application in a first state;

[0026] Figure 3 A schematic diagram of the operating tool provided in the embodiments of this application in its second state;

[0027] Figure 4 A cross-sectional structural diagram of the operating tool provided in the embodiments of this application;

[0028] Figure 5 Provided for the embodiments of this application Figure 4 A magnified schematic diagram of the local structure at point A;

[0029] Figure 6 Provided for the embodiments of this application Figure 4 A magnified view of the structure at point B (operating tools in the first state);

[0030] Figure 7 A partially enlarged structural diagram of the operating tool provided in the embodiments of this application in its second state;

[0031] Figure 8 This is a schematic diagram of the structure of the support member in the operating tool provided in the embodiments of this application;

[0032] Figure 9 A schematic diagram of the clamping component in the operating tool provided in the embodiments of this application from one perspective;

[0033] Figure 10 This is a schematic diagram of the clamping component in the operating tool provided in the embodiments of this application from another perspective.

[0034] Figure label:

[0035] 100 - Support member; 110 - Support part; 111 - Support surface; 111a - First region; 111b - Second region; 120 - Second connecting part; 130 - Grip part; 131 - Elongated through hole; 200 - Clamping member; 210 - Clamping surface; 211 - First edge; 212 - Second edge; 220 - First connecting part; 230 - Operating part; 300 - Limiting part; 310 - Limiting surface; 400 - Guide structure; 410 - Guide groove; 420 - Guide protrusion; 500 - Functional structure; 510 - Anti-slip protrusion; 600 - Semiconductor; X - Preset direction. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the specific technical solutions of this application will be further described in detail below with reference to the accompanying drawings of the embodiments of this application. The following embodiments are used to illustrate this application, but are not intended to limit the scope of this application.

[0037] In the embodiments of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of this application, unless otherwise stated, "multiple" means two or more.

[0038] Furthermore, in the embodiments of this application, directional terms such as "upper," "lower," "left," and "right" are defined relative to the positions in which the components are schematically placed in the accompanying drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and can change accordingly depending on the position of the components in the accompanying drawings.

[0039] In the embodiments of this application, unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection through an intermediate medium.

[0040] In embodiments of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0041] In the embodiments of this application, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design that is described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design. Specifically, the use of the terms "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0042] This application provides an operating tool for performing operations such as picking up, placing, transferring, and adjusting the orientation of semiconductors during semiconductor production or testing. For example, it can be used for picking up and placing semiconductors in positions such as coating and developing machines, spin coating and developing machines, and wafer cassettes. Semiconductors can be wafers for various stages of chip processing.

[0043] In some technical solutions, the handling tool manipulates the semiconductor through adsorption or lifting methods. Adsorption-based handling tools require components such as vacuum generators and suction cups, resulting in a complex structure, large space occupation, and difficulty in operating in compact spaces. They also struggle to meet the requirements of portability and ease of maintenance. Furthermore, vacuum adsorption methods may be limited by environmental factors in actual operation, such as the stability of the vacuum system and the precise control of the vacuum level, which can affect the reliability and efficiency of semiconductor handling. Lifting operations cannot effectively secure the semiconductor, easily leading to its drop and damage. Moreover, lifting operations offer limited support for the semiconductor, lack versatility, and are suitable for a limited range of scenarios, making them unsuitable for diverse semiconductor handling needs.

[0044] Reference Figure 1 , Figure 2 and Figure 3 The operating tool of this application embodiment includes a support member 100 and a clamping member 200. The support member 100 has a support surface 111 for supporting the semiconductor 600 to be operated. The clamping member 200 is movably connected to the support member 100 and has a clamping surface 210. The clamping surface 210 and the support surface 111 are disposed opposite to each other and form a limiting space for accommodating the semiconductor. The operating tool has a first state and a second state. The clamping member 200 can move relative to the support member 100 to switch between the first state and the second state. In the first state, the clamping surface 210 and the support surface 111 respectively abut against opposite sides of the semiconductor 600 to clamp the semiconductor 600. In the second state, at least one of the clamping surface 210 and the support surface 111 is separated from the semiconductor 600 to release the semiconductor 600.

[0045] In some examples, the support member 100 is a plate-like structure, and the surface with the largest area of ​​the support member 100 is the support surface 111; in other examples, the support member 100 is a block-like structure; in still other examples, the support member 100 is a mesh-like structure. The support member 100 can be a one-piece molded structure or a split structure, that is, the support member 100 is composed of multiple parts connected to each other.

[0046] In some examples, the outline of the support surface 111 is an arc; in other examples, the outline of the support surface 111 is a straight line; and in still other examples, the outline of the support surface 111 is a combination of an arc and a straight line. Referring to the figures, in some possible embodiments of this application, one edge of the support surface 111 is an arc to adapt to the outline of the semiconductor 600.

[0047] In some examples, the support surface 111 is planar; in other examples, the support surface 111 is curved. The shape of the support surface 111 is adapted to the corresponding surface of the semiconductor 600. For example, the surface of the semiconductor 600 that abuts the support surface 111 is planar, and the support surface 111 is set to be planar.

[0048] In some examples, the outline of the clamping surface 210 is curved; in other examples, the outline of the clamping surface 210 is straight; and in still other examples, the outline of the clamping surface 210 is a combination of curved and straight lines. Referring to the figures, in some possible embodiments of this application, at least one edge of the clamping surface 210 is rounded to adapt to the outline of the semiconductor 600.

[0049] In some examples, the clamping surface 210 is planar; in other examples, the clamping surface 210 is curved. The shape of the clamping surface 210 is adapted to the corresponding surface of the semiconductor 600. For example, the surface of the semiconductor 600 that abuts against the clamping surface 210 is planar, and the clamping surface 210 is set to be planar.

[0050] In some examples, the clamping surface 210 has a different profile shape than the supporting surface 111; in other examples, the profile shape of the clamping surface 210 is the same as a portion of the profile shape of the supporting surface 111. For example, both the clamping surface 210 and the supporting surface 111 include a fan-shaped profile.

[0051] In some examples, the movable connection between the clamping member 200 and the support member 100 is a sliding connection. The sliding direction of the clamping member 200 and the support member 100 can be parallel to the clamping surface 210 or at an angle to the clamping surface 210, such as an acute angle or a right angle. In other examples, the movable connection between the clamping member 200 and the support member 100 is a rotational connection. The rotation axis of the clamping member 200 and the support member 100 can be parallel to the clamping surface 210 or perpendicular to the clamping surface 210. In still other examples, the clamping member 200 and the support member 100 are movablely connected by an elastic member. The elastic member can elastically deform to change the relative position of the clamping member 200 and the support member 100, and the elastic force of the elastic member helps the clamping member 200 to reset relative to the support member 100.

[0052] In some examples, the clamping surface 210 and the supporting surface 111 are opposite each other along a preset direction X, which is perpendicular to the supporting surface 111. When the operating tool is in the first state, the distance between the clamping surface 210 and the supporting surface 111 along the preset direction X is small, so as to clamp and fix the semiconductor 600. When the operating tool is in the second state, the distance between the clamping surface 210 and the supporting surface 111 along the preset direction X is large, and the semiconductor 600 can move relative to the operating tool so as to release or put the semiconductor 600 into the operating tool.

[0053] In other examples, when the operating tool is in the first state, the relative area of ​​the clamping surface 210 and the supporting surface 111 along the preset direction X is larger, so as to clamp and fix the semiconductor 600; when the operating tool is in the second state, the relative area of ​​the clamping surface 210 and the supporting surface 111 along the preset direction X is smaller, and the semiconductor 600 can move relative to the operating tool so as to release or put the semiconductor 600 into the operating tool.

[0054] In this embodiment, the opposite sides of semiconductor 600 refer to two non-contacting surfaces of semiconductor 600, and the projections of the two surfaces along the vertical direction of one of the surfaces at least partially overlap. For example, semiconductor 600 is a plate-like structure, and the opposite sides of semiconductor 600 are its two surfaces with the largest areas.

[0055] The technical solution provided in this application embodiment provides support for the semiconductor 600 to be operated on by the support surface 111 of the support member 100, so as to provide support from below the semiconductor 600 and reduce the possibility of the semiconductor 600 falling; the clamping member 200 is movably connected to the support member 100 so that the clamping member 200 and the support member 100 can move relative to each other, changing the relative position of the clamping surface 210 and the support surface 111, so that the operating tool can switch between a first state and a second state. When the operating tool is in the first state, the operating tool can clamp and fix the semiconductor 600 so as to perform operations such as transferring the semiconductor 600; when the operating tool is in the second state, the operating tool can release the clamped semiconductor 600 so as to place the semiconductor 600 in the desired position.

[0056] The clamping surface 210 and the supporting surface 111 are arranged opposite to each other to form a limiting space for accommodating the semiconductor 600. In the first state, the clamping surface 210 and the supporting surface 111 abut against opposite sides of the semiconductor 600. The clamping member 200 and the supporting member 100 can provide limiting for the semiconductor 600 from two opposite directions, thereby clamping and fixing the semiconductor 600. On the one hand, the operating tool can provide support and clamping fixation for the semiconductor 600. The combination of support and clamping can improve the stability of the semiconductor 600 relative to the operating tool and reduce the possibility of the semiconductor 600 slipping out and falling. On the other hand, the clamping surface 210 and the supporting surface 111 work together to achieve clamping. The supporting surface 111 is reused, which helps to reduce the number of parts of the operating tool, facilitates operation and weight reduction, and helps to operate the semiconductor 600 with high precision and efficiency.

[0057] Compared with related technologies, which have complex operating tools and poor stability, the operating tool of this application can provide stable support and clamping for the semiconductor 600 through the cooperation of the clamping surface 210 and the support surface 111. Moreover, the structure is simple and conducive to weight reduction.

[0058] In this embodiment, the support member 100 can be made of rubber, plastic, metal, composite materials, etc., and the support member 100 and the clamping member 200 can be made of the same or different materials. For example, both the support member 100 and the clamping member 200 are made of Teflon, which has excellent heat resistance and corrosion resistance, and can be used stably in high-temperature, high-humidity, or corrosive environments, effectively avoiding wafer contamination caused by environmental factors. The soft nature of Teflon material makes it less prone to generating debris, further reducing the risk of semiconductor 600 contamination by debris.

[0059] Reference Figure 2 , Figure 3 and Figure 4In some possible embodiments of this application, the clamping member 200 includes a first connecting portion 220, which is slidably connected to the support member 100. The first connecting portion 220 is slidable relative to the support member 100 to switch the operating tool between a first state and a second state.

[0060] In some embodiments, the first connecting portion 220 and the support member 100 slide toward each other, which means that the first connecting portion 220 and the support member 100 slide towards each other so as to switch the operating tool to a first state; the first connecting portion 220 and the support member 100 slide away from each other, which means that the first connecting portion 220 and the support member 100 slide away from each other so as to switch the operating tool to a second state.

[0061] In some examples, the first connecting portion 220 forms a sliding space, a portion of the support member 100 is located within the sliding space, and the support member 100 slides along the inner wall of the sliding space; in other examples, the support member 100 forms a sliding space, at least a portion of the first connecting portion 220 is located within the sliding space, and the first connecting portion 220 slides along the inner wall of the sliding space. The sliding space can be a groove structure, a hole structure, etc.

[0062] In some examples, the first connecting part 220 slides directly with the support member 100, that is, the surfaces of the first connecting part 220 and the support member 100 are in contact, and lubricant can be filled between them; in other examples, the first connecting part 220 slides indirectly with the support member 100, and balls, rollers, wheels, etc. can be provided between them.

[0063] In some examples, the sliding direction of the first connecting portion 220 and the support member 100 is perpendicular to the support surface 111. During the relative sliding process of the first connecting portion 220 and the support member 100, the distance between the support surface 111 and the clamping surface 210 along the preset direction X changes, causing sound emission. In other examples, the sliding direction of the first connecting portion 220 and the support member 100 is parallel to the support surface 111. During the relative sliding process of the first connecting portion 220 and the support member 100, the relative area of ​​the support surface 111 and the clamping surface 210 changes, causing sound emission.

[0064] The technical solution provided in this application embodiment allows the clamping member 200 to slide relative to the support member 100 via the first connecting portion 220. The relative sliding of the first connecting portion 220 and the support member 100 can switch between a first state and a second state. During the movement of the clamping member 200 relative to the support member 100, the space occupied in the direction of the vertical support surface 111 is small, making it suitable for use in narrow spaces. Furthermore, the sliding connection facilitates the clamping member 200 and the support member 100 to maintain a large contact area, which helps to ensure a firm connection between the two.

[0065] Reference Figure 3 , Figure 5 , Figure 6 and Figure 7 In some possible embodiments of this application, the clamping surface 210 includes a first edge 211 and a second edge 212. The first edge 211 is away from the first connecting portion 220 relative to the second edge 212. The clamping surface 210 has an angle with the supporting surface 111, and the distance between the clamping surface 210 and the supporting surface 111 gradually decreases along the direction from the first edge 211 to the second edge 212.

[0066] In some examples, the outline of the first edge 211 and the outline of the second edge 212 are different. For example, the outline of the first edge 211 is an arc and the outline of the second edge 212 is a straight line. In other examples, the outline of the first edge 211 and the outline of the second edge 212 are the same. For example, the outline of the first edge 211 and the outline of the second edge 212 are two concentric arcs.

[0067] In this embodiment, the extended surface of the clamping surface 210 intersects with the extended surface of the supporting surface 111, meaning that the clamping surface 210 and the supporting surface 111 have an angle. The angle between the clamping surface 210 and the supporting surface 111 is an acute angle, such as 5 degrees, 10 degrees, 15 degrees, etc. This embodiment does not limit the specific angle value between the clamping surface 210 and the supporting surface 111.

[0068] It is understandable that the second edge 212 is close to the first connecting part 220, and the first edge 211 is far away from the first connecting part 220. During the process of the operating tool gripping the semiconductor 600, the outer edge of the semiconductor 600 first passes through the first edge 211 and moves toward the second edge 212; during the process of the operating tool releasing the semiconductor 600, the outer edge of the semiconductor 600 first moves away from the second edge 212 and then passes through the first edge 211. The space between the clamping surface 210 and the supporting surface 111 is equivalent to an open space.

[0069] It should be noted that when the outline of the first edge 211 and the outline of the second edge 212 are arcs, the direction of the first edge 211 toward the second edge 212 is the radial direction of the arc, and this direction is different for different positions of the first edge 211.

[0070] The technical solution provided in this application embodiment has an angle between the clamping surface 210 and the supporting surface 111, and the distance between the clamping surface 210 and the supporting surface 111 gradually decreases along the direction from the first edge 211 toward the second edge 212. That is, the clamping surface 210 is set as an inclined surface that gradually tilts toward the first connecting portion 220. On the one hand, this facilitates the adaptation to the chamfer of the edge of the semiconductor 600; on the other hand, it can provide guidance for the semiconductor 600 to enter between the clamping surface 210 and the supporting surface 111, which facilitates the operation of the semiconductor 600.

[0071] Reference Figure 6 and Figure 7 In some possible embodiments of this application, the operating tool includes a limiting part 300, which is connected to at least one of the support member 100 and the clamping member 200. The limiting part 300 is provided with a limiting surface 310. The limiting surface 310 is located on the outer periphery of the support surface 111 or the clamping surface 210, and the extending direction of the limiting surface 310 intersects the extending direction of the support surface 111 or the clamping surface 210. The limiting surface 310, the support surface 111 and the clamping surface 210 together define a limiting space.

[0072] In some examples, the limiting portion 300 is connected to the support member 100. The limiting portion 300 and the support member 100 can be connected by means of snap-fit, bonding, welding, integral molding, etc. For example, the limiting portion 300 is integrally formed on the support member 100. In other examples, the limiting portion 300 is connected to the clamping member 200. The limiting portion 300 and the clamping member 200 can be connected by means of snap-fit, bonding, welding, integral molding, etc. For example, the limiting portion 300 is integrally formed on the clamping member 200. In still other examples, the support member 100 and the clamping member 200 each have an integrally formed limiting portion 300.

[0073] In some examples, the support member 100 and the limiting part 300 are connected to form a groove structure, and the two adjacent surfaces of the groove structure are the support surface 111 and the limiting surface 310, respectively; in other examples, the clamping member 200 and the limiting part 300 are connected to form a groove structure, and the two adjacent surfaces of the groove structure are the clamping surface 210 and the limiting surface 310, respectively; in still other examples, the support member 100 and the clamping member 200 are respectively connected to the corresponding limiting part 300 to form a groove structure, and the limiting surfaces 310 of the two limiting parts 300 extend in the same direction.

[0074] In some examples, the extending direction of the limiting surface 310 intersects the supporting surface 111, for example, the extending direction of the limiting surface 310 forms a right angle, an acute angle, or an obtuse angle with the supporting surface 111; and / or, the extending direction of the limiting surface 310 intersects the clamping surface 210, for example, the extending direction of the limiting surface 310 forms a right angle, an acute angle, or an obtuse angle with the clamping surface 210.

[0075] In some examples, the limiting surface 310 is an arc surface, and the arc of the limiting surface 310 can extend in the direction from the clamping surface 210 toward the supporting surface 111, or the arc of the limiting surface 310 can be set along the second edge 212; in other examples, the limiting surface 310 is a plane.

[0076] In some examples, when the operating tool is switched to the first state, the limiting space has a first volume; when the operating tool is switched to the second state, the limiting space has a second volume, and the first volume is greater than the second volume.

[0077] The technical solution provided in this application embodiment defines a limiting surface 310. The limiting surface 310, together with the clamping surface 210 and the supporting surface 111, defines a limiting space. The limiting surface 310 can limit the semiconductor 600. On the one hand, the limiting surface 310 restricts the semiconductor 600 from entering the area between the clamping surface 210 and the supporting surface 111, so that the operating tool can be clamped at the edge area of ​​the semiconductor 600. On the other hand, the limiting surface 310 can also abut against the semiconductor 600 to maintain the relative position of the semiconductor 600 with the supporting member 100 and the clamping member 200, reducing the possibility of the semiconductor 600 shaking or tilting.

[0078] Reference Figure 2 , Figure 3 and Figure 8 In some possible embodiments of this application, the support surface 111 includes a first region 111a and a second region 111b. The first region 111a corresponds to the middle part of the semiconductor 600, and the second region 111b corresponds to the edge of the semiconductor 600. When the operating tool is switched to the first state, the projection of the clamping surface 210 along the direction perpendicular to the support surface 111 (such as the preset direction X) has a first overlapping area with the projection of the second region 111b. When the operating tool is switched to the second state, the projection of the clamping surface 210 along the direction perpendicular to the support surface 111 (such as the preset direction X) does not overlap with the projection of the second region 111b, or the projection of the clamping surface 210 has a second overlapping area with the projection of the second region 111b. The first overlapping area is greater than the second overlapping area.

[0079] In some examples, the first region 111a and the second region 111b are two connected regions; in other examples, there is a gap between the first region 111a and the second region 111b. For example, the first region 111a and the second region 111b are connected as a single unit.

[0080] In some examples, when the semiconductor 600 is held by an operating tool, when projected along a preset direction X, the central projection of the semiconductor 600 at least partially overlaps with the first region 111a, and the edge projection of the semiconductor 600 at least partially overlaps with the second region 111b.

[0081] The shape of the clamping surface 210 is not limited in this embodiment. Projected along the preset direction X, the projection of the clamping surface 210 overlaps with the projection of the second region 111b. In some examples, the clamping surface 210 is square, and the second region 111b is also square; in other examples, the clamping surface 210 is circular, and the second region 111b is also circular; in still other examples, the clamping surface 210 is fan-shaped, and the second region 111b is also fan-shaped.

[0082] When the operating tool is switched to the first state, the projection along the direction perpendicular to the support surface 111 is as follows: In some examples, the projection of the clamping surface 210 is completely within the projection range of the second region 111b, and the first overlapping area is the projected area of ​​the clamping surface 210; in other examples, the projection of the second region 111b is completely within the projection range of the clamping surface 210, and the first overlapping area is the projected area of ​​the second region 111b; in still other examples, the projection of the clamping surface 210 and the projection of the second region 111b completely overlap, and the first overlapping area is the projected area of ​​either one; in yet another example, the projection of the clamping surface 210 and the projection of the second region 111b partially overlap, and the first overlapping area is the area of ​​the overlapping portion of the two projections.

[0083] When the operating tool is switched to the second state, the projection of the clamping surface 210 along the direction of the vertical support surface 111 partially overlaps with the projection of the second region 111b, and the second overlapping area is smaller than the first overlapping area. Alternatively, the projection of the clamping surface 210 does not overlap with the projection of the second region 111b at all.

[0084] The technical solution provided in this application embodiment has a first region 111a of the support surface 111 corresponding to the middle of the semiconductor 600, which facilitates providing stable support for the semiconductor 600; the second region 111b of the support surface 111 corresponds to the edge of the semiconductor 600 and is projected along the direction perpendicular to the support surface 111. The projection of the clamping surface 210 overlaps at least partially with the projection of the second region 111b. The second region 111b and the clamping surface 210 can provide balanced force from both sides of the semiconductor 600 so that the semiconductor 600 is in a state of balanced force.

[0085] Reference Figure 3 and Figure 8 In some possible embodiments of this application, the support member 100 includes a support portion 110 and a second connecting portion 120, the second connecting portion 120 being connected to the clamping member 200; a first region 111a and a second region 111b are disposed on the support portion 110, and the second region 111b is located between the first region 111a and the second connecting portion 120, the second region 111b being arc-shaped, and the first region 111a extending from the middle of the second region 111b toward the center of the arc.

[0086] In some examples, the second connecting portion 120 is slidably connected to the clamping member 200; in other examples, the second connecting portion 120 is rotatably connected to the clamping member 200. For example, the second connecting portion 120 forms a sliding space with a perforated structure, and the first connecting portion 220 is slidably connected within the sliding space of the second connecting portion 120.

[0087] In some examples, the second region 111b is arc-shaped, with the concave side of the second region 111b corresponding to the first region 111a, and the convex side of the second region 111b corresponding to the second connecting portion 120, and the first region 111a extending radially along the arc.

[0088] In some examples, the arcuate outline of the second region 111b is a semicircular arc; in other examples, the arcuate outline of the second region 111b is a minor arc.

[0089] In some examples, the second connecting portion 120 is provided at the end of the arc; in other examples, the second connecting portion 120 is provided at the middle of the arc, that is, the arc of the second region 111b is symmetrical about the axis of the second connecting portion 120.

[0090] The technical solution provided in this application embodiment is that the second connecting portion 120 of the support member 100 is connected to the clamping member 200. When the clamping member 200 and the support member 100 are kept in relative motion, the two are combined into a connected component, which is convenient for carrying and operation. The second region 111b is arc-shaped, which is convenient for adapting to the edge contour of the semiconductor 600. The first region 111a extends towards the center of the arc, which helps the first region 111a to provide support for the geometric center position of the semiconductor 600 and improve the stability of the support.

[0091] Reference Figure 6 , Figure 7 , Figure 8 and Figure 9 In some possible embodiments of this application, the operating tool further includes a guide structure 400, which includes a guide groove 410 and a guide protrusion 420. One of the support member 100 and the clamping member 200 is provided with the guide groove 410, and the other of the support member 100 and the clamping member 200 is provided with the guide protrusion 420. At least a portion of the guide protrusion 420 is accommodated in the guide groove 410, and the guide protrusion 420 is slidable along the extension direction of the guide groove 410. The guide groove 410 is used to guide the support member 100 to move relative to the clamping member 200 to switch between the first state and the second state.

[0092] In some examples, the guide groove 410 extends along the relative movement direction of the support 100 and the clamping member 200, and the guide protrusion 420 slides between the two ends of the guide groove 410; in other examples, the guide protrusion 420 extends along the relative movement direction of the support 100 and the clamping member 200, and the structure containing the guide groove 410 slides between the two ends of the guide protrusion 420.

[0093] In some examples, the support member 100 is provided with a guide groove 410, and the clamping member 200 is provided with a guide protrusion 420; in other examples, the support member 100 is provided with a guide protrusion 420, and the clamping member 200 is provided with a guide groove 410. Referring to the figures, in some embodiments of this application, the second connecting portion 120 of the support member 100 is a plate-like structure, and a guide groove 410 is provided on the side facing the clamping member 200, and a guide protrusion 420 is provided on the side of the clamping member 200 corresponding to the guide groove 410.

[0094] The technical solution provided in this application embodiment, by setting a guide structure 400, with the guide protrusion 420 and guide groove 410 sliding together, can provide guidance and limit for the relative movement of the clamping member 200 and the support member 100. On the one hand, it reduces the possibility of skew during the relative movement of the clamping member 200 and the support member 100; on the other hand, it helps to improve the stability of the relative movement of the clamping member 200 and the support member 100.

[0095] Reference Figure 5 and Figure 8 In some possible embodiments of this application, the operating tool also includes a functional structure 500, which is disposed on the support surface 111 and / or the clamping surface 210; the functional structure 500 includes a plurality of anti-slip protrusions 510; and / or, the functional structure 500 includes an elastic pad that is capable of elastic deformation.

[0096] In some examples, the support surface 111 is provided with a functional structure 500, while the clamping surface 210 is not provided with a functional structure 500; in other examples, the clamping surface 210 is provided with a functional structure 500, while the support surface 111 is not provided with a functional structure 500; and in still other examples, both the clamping surface 210 and the support surface 111 are provided with functional structures 500. Additionally, the limiting surface 310 may also be provided with a functional structure 500.

[0097] In some examples, the protective protrusion of the support member 100 is provided in the first region 111a; in other examples, the anti-slip protrusion 510 of the support member 100 is provided in the second region 111b; and in still other examples, both the first region 111a and the second region 111b are provided with anti-slip protrusions 510.

[0098] In some examples, the first region 111a of the support member 100 is provided with a plurality of anti-slip protrusions 510, which may be distributed in a rectangular array or a circular array. For example, the first region 111a is a rectangular structure, and the plurality of anti-slip protrusions 510 are distributed in a rectangular array.

[0099] In this embodiment, the cross-section (parallel to the surface) of the anti-slip protrusion 510 is a regular or irregular shape such as a circle, square, triangle, trapezoid, rhombus, or hexagon. The end of the protective protrusion can be set as a plane or an arc surface.

[0100] In some examples, the elastic pad can elastically deform along the direction parallel to the support surface 111; in other examples, the elastic pad can elastically deform along the direction perpendicular to the support surface 111; and in still other examples, the elastic pad can elastically deform along multiple different directions.

[0101] In this embodiment, the elastic pad includes one or more elastic materials such as rubber, silicone, carbon fiber, and aerogel.

[0102] In some examples, the elastic pad and the anti-slip protrusion 510 are provided separately; in other examples, the elastic pad and the anti-slip protrusion 510 are provided as a single unit, for example, the elastic pad forms the anti-slip protrusion 510.

[0103] In some embodiments, the first region 111a is provided with a protective protrusion, and the second region 111b and the clamping surface 210 are provided with an elastic pad. The elastic pad is made of rubber, which not only protects the semiconductor 600, but also increases friction to improve the clamping effect.

[0104] The technical solution provided in this application embodiment has a functional structure 500 on the support surface 111 and / or clamping surface 210. Multiple anti-slip protrusions 510 can increase the friction between the operating tool and the semiconductor 600 so as to keep the semiconductor 600 on the operating tool. The elastic pad can adapt to the semiconductor 600 of different shapes through elastic deformation, and can also provide protection for the semiconductor 600, reducing the possibility of damage to the semiconductor 600 due to hard contact.

[0105] Reference Figure 3 , Figure 8 , Figure 9 and Figure 10 In some possible embodiments of this application, the support member 100 includes a gripping part 130, and the clamping member 200 includes an operating part 230, which is disposed corresponding to the gripping part 130. The operating part 230 moves relative to the gripping part 130 under the action of an external force, so that the support member 100 moves relative to the clamping member 200, and switches between the first state and the second state.

[0106] In some examples, the grip portion 130 is for the operator to hold, and the cross-section of the grip portion 130 can be circular, elliptical, square, hexagonal, etc. The outer surface of the grip portion 130 can be covered with a flexible material or a damping material to improve the grip's firmness and comfort.

[0107] In some examples, the operating part 230 is operated by an operator, and the operating part 230 can be a button, lever, wheel, or other structure. In some embodiments, the operating part 230 is a push button, which is disposed in the first connecting part 220. The second connecting part 120 has a strip-shaped through hole, through which the operating part 230 extends to the outside of the second connecting part 120 so that it can be pushed by an operator.

[0108] In some examples, the strip-shaped through hole can also serve as a guide groove 410, and the operating part 230 can also serve as a guide protrusion 420. Alternatively, the strip-shaped through hole and the operating part 230 can cooperate, and the guide protrusion 420 and the guide groove 410 can cooperate to jointly guide the clamping member 200 to move relative to the support member 100.

[0109] The technical solution provided in this application embodiment is to provide a gripping part 130 for easy gripping by the operator. The corresponding operation part 230 is provided for the gripping part 130 so that the operator can operate while gripping the gripping part 130. The operator can drive the clamping member 200 to move relative to the support member 100 through the operation part 230 so as to switch the relative position of the clamping member 200 and the support member 100 to realize the operation of clamping or releasing the semiconductor 600. The operation part 230 and the gripping part 130 are designed to facilitate one-handed operation and are applicable to a wide range of scenarios.

[0110] In some possible embodiments of this application, the operating tool further includes a driving member, the fixed end of which is connected to the support member 100, and the output end of which is connected to the clamping member 200. The driving member is used to drive the clamping member 200 to move relative to the support member 100 to switch between the first state and the second state.

[0111] In some examples, the driving component is a motor, a rotary cylinder, or other drive component that drives the output shaft to rotate. The motor can be a servo motor, a stepper motor, or the like. In other examples, the driving component is a hydraulic cylinder, a pneumatic cylinder, an electric telescopic rod, or other drive component that drives the output shaft to move linearly.

[0112] For example, the driving component is an electric telescopic rod, which is disposed in the sliding space. One end of the driving component is fixedly connected to the support member 100, and the other end is fixedly connected to the clamping member 200. The electric telescopic rod extends and retracts along the relative movement direction of the clamping member 200 and the support member 100.

[0113] The technical solution provided in this application embodiment, by setting a driving component, the fixed end of the driving component is connected to the support component 100, and the output end of the driving component can drive the clamping component 200 to move relative to the support component 100, making the use of the operating tool more labor-saving, and the driving component has high positioning accuracy, making the operation more precise.

[0114] In one specific embodiment of this application, the operating tool includes a support member 100 and a clamping member 200. The clamping member 200 includes a first connecting portion 220, and the support member 100 includes a second connecting portion 120 and a clamping portion. The clamping portion forms a clamping surface 210, which includes a first region 111a and a second region 111b. The second region 111b is arc-shaped, with its convex side facing the second connecting portion 120. The first region 111a is rectangular, extending from the middle of the arc towards the circular shape. The clamping member 200 is provided with a clamping surface 210 corresponding to the second region 111b. The shape of the clamping surface 210 corresponds to that of the second region 111b, and along the direction away from the first region 111a from the second region 111b, the clamping surface 210 gradually approaches the second region 111b. Elastic pads are provided on the clamping surface 210 and the second region 111b, and anti-slip protrusions 510 are provided on the first region 111a.

[0115] The second connecting part 120 is located at the center of the second region 111b. The second connecting part 120 is slidably connected to the first connecting part 220. The second connecting part 120 includes a plate-like structure and a tubular structure. The plate-like structure is located between the tubular structure and the support part 110. The plate-like structure is provided with a guide groove 410. The clamping member 200 is provided with a guide protrusion 420 corresponding to the guide groove 410. The guide protrusion 420 is slidably connected in the guide groove 410. The tubular structure forms a gripping part 130. The internal space of the tubular structure forms a sliding space. The first connecting part 220 of the clamping member 200 is slidably connected to the gripping part 130. The gripping part 130 has an elongated through hole 131. The clamping member 200 is provided with an operating part 230 corresponding to the elongated through hole 131. The operating part 230 passes through the elongated through hole 131. The operator can grasp the gripping part 130 and operate the operating part 230, thereby driving the clamping member 200 to move relative to the support member 100.

[0116] When it is necessary to operate the semiconductor 600, the operator places the support 110 under the semiconductor 600 to be operated, with the first region 111a supporting the middle of the semiconductor 600 and the second region 111b supporting the edge of the semiconductor 600. The operator pushes the operating part 230, which moves toward the support 110 and drives the clamping member 200 toward the semiconductor 600. When the operating tool is switched to the first state, the clamping surface 210 and the second region 111b are aligned along the preset direction X, and the opposite sides of the semiconductor 600 are respectively clamped. The clamping surface 210 and the supporting surface 111 are clamped and fixed, allowing the semiconductor 600 to be moved by an operating tool. When it is necessary to release the semiconductor 600, the semiconductor 600 is placed on a workbench or other position, and the operator pulls the operating part 230. The operating part 230 moves away from the supporting part 110 and moves the clamping member 200 closer to the second connecting part 120. When the operating tool is switched to the second state, the clamping surface 210 and the second region 111b are misaligned along the preset direction X, and the semiconductor 600 gradually separates from the clamping surface 210 to release the semiconductor 600.

[0117] This operating tool features a mechanical retaining ring design, requiring no additional power source and allowing for easy one-handed operation. Its compact and lightweight design makes it suitable for wafer handling in confined spaces such as coating and developing machines and wafer cassettes. The operating unit 230 moves the clamping component 200, achieving precise wafer clamping and effectively reducing the risk of damage and contamination during wafer transfer due to improper operation, thus improving production efficiency. The tool's back is equipped with an anti-slip structure made of high-friction material, ensuring the wafer remains stable on the support component 100 and preventing processing deviations or damage caused by wafer slippage. This not only improves the stability of wafer processing but also facilitates the handling of wafers of different thicknesses and sizes, demonstrating high versatility.

[0118] The sequence numbers of the embodiments in this application are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments. The above are merely preferred embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made based on the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. An operating tool, characterized in that include: A support member having a support surface for supporting the semiconductor to be operated; A clamping member is movably connected to the support member. The clamping member has a clamping surface, which is disposed opposite to the support surface and forms a limiting space. The limiting space is used to accommodate the semiconductor. The operating tool has a first state and a second state. The clamping member can move relative to the support member to switch between the first state and the second state. In the first state, the clamping surface and the support surface respectively abut against opposite sides of the semiconductor to clamp the semiconductor. In the second state, at least one of the clamping surface and the supporting surface is separated from the semiconductor to release the semiconductor.

2. The operating tool according to claim 1, characterized in that The clamping member includes a first connecting portion, which is slidably connected to the support member. The first connecting portion is slidable relative to the support member to switch the operating tool between the first state and the second state. The sliding direction of the first connecting portion and the support member is parallel to the support surface.

3. The operating tool according to claim 2, characterized in that The clamping surface includes a first edge and a second edge, wherein the first edge is farther away from the first connecting portion relative to the second edge; The clamping surface and the supporting surface have an angle, and the distance between the clamping surface and the supporting surface gradually decreases along the direction from the first edge toward the second edge.

4. The operating tool according to any one of claims 1 to 3, characterized in that It also includes a limiting part, which is connected to at least one of the support member and the clamping member, and the limiting part is provided with a limiting surface; The limiting surface is located on the outer periphery of the supporting surface or the clamping surface, and the extending direction of the limiting surface intersects the extending direction of the supporting surface or the clamping surface. The limiting surface, the supporting surface, and the clamping surface together define the limiting space.

5. The operating tool according to any one of claims 1 to 3, characterized in that The support surface includes a first region and a second region, the first region corresponding to the middle part of the semiconductor and the second region corresponding to the edge of the semiconductor; When the operating tool is switched to the first state, the projection along the direction perpendicular to the support surface has a first overlapping area with the projection of the second region. When the operating tool is switched to the second state, the projection along the direction perpendicular to the support surface does not overlap with the projection of the second region, or the projection of the clamping surface has a second overlapping area with the projection of the second region, and the first overlapping area is greater than the second overlapping area.

6. The operating tool of claim 5, wherein The support member includes a support portion and a second connecting portion, the second connecting portion being connected to the clamping member; The first region and the second region are disposed on the support portion, and the second region is located between the first region and the second connecting portion. The second region is arc-shaped, and the first region extends from the middle of the second region toward the center of the arc.

7. The operating tool according to any one of claims 1 to 3, characterized in that It also includes a guide structure, which includes a guide groove and a guide protrusion. One of the support member and the clamping member is provided with the guide groove, and the other of the support member and the clamping member is provided with the guide protrusion. At least a portion of the guide protrusion is accommodated within the guide groove. The guide protrusion is slidable along the extension direction of the guide groove, which guides the support relative to the clamping member to switch between the first state and the second state.

8. The operating tool according to any one of claims 1 to 3, characterized in that The package also includes a functional structure, which is disposed on the support surface and / or the clamping surface; The functional structure includes multiple anti-slip protrusions; and / or, the functional structure includes an elastic pad that is capable of elastic deformation.

9. The operating tool according to any one of claims 1 to 3, characterized in that The support member includes a gripping part, and the clamping member includes an operating part, the operating part being provided corresponding to the gripping part; The operating part moves relative to the gripping part under the action of an external force, so that the support member moves relative to the clamping member, and switches between the first state and the second state.

10. The operating tool according to any one of claims 1 to 3, characterized in that, It also includes a driving component, the fixed end of which is connected to the support component, and the output end of which is connected to the clamping component. The driving component is used to drive the clamping component to move relative to the support component to switch between the first state and the second state.

Images