Novel surface-mounted metal oxide semiconductor (MOS) tube

Abstract

The utility model relates to a novel paster MOS tube, comprising an MOS tube body, the MOS tube body is provided with a heat dissipation mechanism, the MOS tube body is provided with a fixing mechanism, the heat dissipation mechanism comprises limiting blocks, the limiting blocks are fixedly installed on the MOS tube body, a heat absorption plate is inserted between the limiting blocks, and the heat absorption plate is connected with the fixing mechanism. First heat dissipation fins are fixedly installed on the heat absorption plate, second heat dissipation fins are fixedly installed at the two ends of the heat absorption plate, and heat dissipation through holes are formed in the heat absorption plate. By arranging the heat dissipation mechanism, the purpose of improving the heat dissipation function of the MOS tube body is achieved, long-time use of the MOS tube body is facilitated, by arranging the fixing mechanism, the purpose of conveniently mounting and dismounting the heat dissipation mechanism is achieved, cleaning of the heat dissipation mechanism is facilitated, and therefore the lasting heat dissipation effect is kept.

Description

Technical Field

[0001] This utility model relates to the field of surface mount MOSFET technology, specifically a novel surface mount MOSFET. Background Technology

[0002] Surface mount MOSFETs are core components of modern electronic design. With their advantages of miniaturization, high efficiency, and easy automated production, they are widely used in power supplies, motors, communications, and other fields.

[0003] Currently, under high-power operating conditions, MOSFETs generate a large amount of heat. If heat cannot be dissipated in a timely and effective manner, the temperature of the MOSFET will rise, which will affect its performance and reliability, shorten its service life, and may even cause it to be damaged due to overheating. Existing surface-mount MOSFETs have poor heat dissipation performance. In addition, when dust or impurities accumulate on the heat dissipation structure and affect the heat dissipation effect, the existing heat dissipation structure is usually difficult to install and disassemble, making it inconvenient to clean and difficult to maintain long-term heat dissipation.

[0004] Therefore, a new type of surface-mount MOSFET is proposed to solve the problems mentioned above. Summary of the Invention

[0005] The purpose of this invention is to address the aforementioned shortcomings in the existing technology by proposing a novel surface-mount MOSFET.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a novel surface-mount MOSFET, comprising a MOSFET body, a heat dissipation mechanism disposed on the MOSFET body, a fixing mechanism disposed on the MOSFET body, the heat dissipation mechanism comprising a limiting block, the limiting block being fixedly installed on the MOSFET body, a heat absorption plate being inserted between the limiting blocks, a first heat dissipation fin being fixedly installed on the heat absorption plate, a second heat dissipation fin being fixedly installed at both ends of the heat absorption plate, and heat dissipation through holes being formed on the heat absorption plate;

[0007] The fixing mechanism includes a bracket, which is fixedly installed on the MOS transistor body. A housing is fixedly installed on the bracket. A slider is slidably arranged on the inner wall of the housing. A plug rod is fixedly installed on one side of the slider. One end of the plug rod passes through the inner wall of the bracket. A slot is opened on the heat absorption plate. A pull rod is fixedly installed on the other end of the slider. One end of the pull rod passes through the housing. A handle is fixedly installed on one end of the pull rod.

[0008] Preferably, there are four limiting blocks, and all four limiting blocks are square blocks.

[0009] Preferably, the heat absorber plate is arched in shape and is attached to the surface of the MOS tube body.

[0010] Preferably, the first heat dissipation fin is in the shape of a strip plate, the second heat dissipation fin is in the shape of a strip plate, and the heat dissipation through hole is in the shape of a cylindrical hole.

[0011] Preferably, there are two supports, which are symmetrically arranged with respect to the MOS transistor body, and the supports are L-shaped.

[0012] Preferably, the box body is cylindrical and horizontally positioned; the insert rod is cylindrical; the slot is cylindrical; the handle is circular; and the pull rod is cylindrical and horizontally positioned.

[0013] Preferably, a spring is fixedly installed on the inner wall of the box, the spring is wound around the pull rod, and one end of the spring is fixedly connected to the slider.

[0014] Compared with the prior art, this utility model provides a novel surface-mount MOSFET, which has the following beneficial effects:

[0015] 1. This utility model, by providing a heat dissipation mechanism, aims to improve the heat dissipation function of the MOSFET body, thereby facilitating the long-term use of the MOSFET body.

[0016] 2. This utility model, by providing a fixing mechanism, facilitates the installation and removal of the heat dissipation mechanism, makes it easy to clean the heat dissipation mechanism, and thus maintains the heat dissipation effect for a long time.

[0017] The parts of this device not covered herein are the same as or can be implemented using existing technologies. This utility model has a simple structure and is easy to operate. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of a novel surface-mount MOSFET proposed in this utility model;

[0019] Figure 2 This is a schematic diagram of a limiting block for a novel surface-mount MOSFET proposed in this utility model;

[0020] Figure 3 A cross-sectional view of the housing of a novel surface-mount MOSFET proposed in this utility model;

[0021] Figure 4 This is a schematic diagram of a novel heat dissipation mechanism for a surface-mount MOSFET proposed in this utility model.

[0022] In the diagram: 1. MOSFET body; 21. Bracket; 22. Housing; 23. Slider; 24. Handle; 25. Pull rod; 26. Spring; 27. Insert rod; 28. Slot; 31. Limiting block; 32. Second heat sink fin; 33. First heat sink fin; 34. Heat absorber plate; 35. Heat dissipation through hole. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Example:

[0025] Please see Figure 1 - Figure 4 This embodiment discloses a novel surface-mount MOSFET, comprising a MOSFET body 1, on which a heat dissipation mechanism is provided to improve the heat dissipation function of the MOSFET body 1 and facilitate its long-term use. A fixing mechanism is also provided on the MOSFET body 1 to facilitate the installation and removal of the heat dissipation mechanism and cleaning, thereby maintaining a sustained heat dissipation effect. The heat dissipation mechanism includes limiting blocks 31, which are fixedly installed on the MOSFET body 1 and are used to receive the insertion of a heat absorption plate 34. A heat absorption plate 34 is inserted between the limiting blocks 31. A first heat dissipation fin 33 is fixedly installed on the heat absorption plate 34, and second heat dissipation fins 32 are fixedly installed at both ends of the heat absorption plate 34. A heat dissipation through hole 35 is provided on the heat absorption plate 34. The presence of the first heat dissipation fin 33, the second heat dissipation fin 32, and the heat dissipation through hole 35 enhances the heat dissipation effect of the MOSFET body 1.

[0026] The fixing mechanism includes a bracket 21, which is fixedly installed on the MOS tube body 1. A housing 22 is fixedly installed on the bracket 21. A slider 23 is slidably arranged on the inner wall of the housing 22. A plug rod 27 is fixedly installed on one side of the slider 23. One end of the plug rod 27 passes through the inner wall of the bracket 21. A slot 28 is opened on the heat absorption plate 34. A pull rod 25 is fixedly installed on the other end of the slider 23. One end of the pull rod 25 passes through the housing 22. A handle 24 is fixedly installed on one end of the pull rod 25. The handle 24 is provided for pulling the pull rod 25 to move.

[0027] There are four limiting blocks 31, and all four limiting blocks 31 are square blocks. The limiting blocks 31 are used to support the insertion of the heat absorption plate 34.

[0028] The heat absorber plate 34 is arched in shape and is attached to the surface of the MOS tube body 1. The heat absorber plate 34 is designed to absorb heat.

[0029] The first heat dissipation fin 33 is in the shape of a strip plate, the second heat dissipation fin 32 is in the shape of a strip plate, and the heat dissipation through hole 35 is in the shape of a cylindrical hole. By setting the first heat dissipation fin 33, the second heat dissipation fin 32 and the heat dissipation through hole 35, the heat dissipation effect of the MOSFET body 1 is improved.

[0030] There are two brackets 21, which are symmetrically arranged with the MOS transistor body 1 as the center. The brackets 21 are L-shaped and are used to support the installation of the housing 22.

[0031] The box 22 is cylindrical in shape and is horizontally positioned. The insert rod 27 is cylindrical in shape, the slot 28 is cylindrical in shape, the handle 24 is circular in shape, and the pull rod 25 is cylindrical in shape and is horizontally positioned. The pull rod 25 is used to pull the slider 23 to slide along the inner wall of the box 22.

[0032] A spring 26 is fixedly installed on the inner wall of the housing 22. The spring 26 is wound around the pull rod 25. One end of the spring 26 is fixedly connected to the slider 23. The spring 26 is used to apply force to the insertion rod 27 so that the insertion rod 27 can be inserted into the slot 28.

[0033] When the MOSFET body 1 is working, the heat absorption plate 34 will absorb the heat generated by the MOSFET body 1. The heat absorption plate 34 is provided with a first heat dissipation fin 33, a second heat dissipation fin 32 and a heat dissipation through hole 35 to increase the contact area between the air and the heat absorption plate 34, thereby improving the heat dissipation efficiency and facilitating the long-term operation of the MOSFET body 1.

[0034] When the first heat sink fin 33 and the second heat sink fin 32 have been used for a long time and dust has accumulated on their surfaces, they need to be cleaned. Pull the handles 24 on both sides. The handles 24 drive the slider 23 to slide in a straight line along the inner wall of the housing 22 via the pull rod 25. When the slider 23 slides in a straight line, it will drive the insertion rod 27 to move until one end of the insertion rod 27 leaves the slot 28. At this time, the heat absorption plate 34 can be removed from the surface of the MOS tube body 1, so as to facilitate the cleaning of the surface of the heat absorption plate 34 and avoid dust accumulation, which will affect heat dissipation.

[0035] The installation, connection, or setting methods disclosed in this embodiment are all common mechanical connection methods, and any method that can achieve its beneficial effects can be implemented.

[0036] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0037] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A novel patch MOSFET comprising a MOSFET body (1), characterized in that: A heat dissipation mechanism is provided on the MOS transistor body (1), and a fixing mechanism is provided on the MOS transistor body (1); The heat dissipation mechanism includes a limiting block (31), which is fixedly installed on the MOS transistor body (1). A heat absorption plate (34) is inserted between the limiting blocks (31). A first heat dissipation fin (33) is fixedly installed on the heat absorption plate (34). A second heat dissipation fin (32) is fixedly installed at both ends of the heat absorption plate (34). A heat dissipation through hole (35) is opened on the heat absorption plate (34). The fixing mechanism includes a bracket (21), which is fixedly installed on the MOS tube body (1). A housing (22) is fixedly installed on the bracket (21). A slider (23) is slidably arranged on the inner wall of the housing (22). A plug rod (27) is fixedly installed on one side of the slider (23). One end of the plug rod (27) penetrates the inner wall of the bracket (21). A slot (28) is opened on the heat absorption plate (34). A pull rod (25) is fixedly installed on the other end of the slider (23). One end of the pull rod (25) penetrates the housing (22). A handle (24) is fixedly installed on one end of the pull rod (25).

2. A novel patch MOSFET according to claim 1, characterized in that: There are four limiting blocks (31), and the shape of the four limiting blocks (31) is a square block.

3. A novel patch MOSFET according to claim 1, characterized in that: The heat absorption plate (34) is arched and is attached to the surface of the MOS tube body (1).

4. A novel chip MOSFET according to claim 1, characterized in that: The first heat dissipation fin (33) is in the shape of a strip plate, the second heat dissipation fin (32) is in the shape of a strip plate, and the heat dissipation through hole (35) is in the shape of a cylindrical hole.

5. A novel patch MOSFET according to claim 1, characterized in that: There are two brackets (21), and the two brackets (21) are symmetrically arranged with the MOS tube body (1) as the center. The shape of the brackets (21) is L-shaped.

6. A novel surface-mount MOSFET according to claim 1, characterized in that: The box (22) is cylindrical in shape and is horizontally arranged. The plug rod (27) is cylindrical in shape. The slot (28) is cylindrical in shape. The handle (24) is circular in shape. The pull rod (25) is cylindrical in shape and is horizontally arranged.

7. A novel chip MOSFET according to claim 1, characterized in that: A spring (26) is fixedly installed on the inner wall of the box (22). The spring (26) is wound around the pull rod (25). One end of the spring (26) is fixedly connected to the slider (23).

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