Optical storage power supply case

Abstract

The utility model relates to an optical storage power supply case, which is characterized in that the whole heat dissipation device is arranged in the case, so that the overall height of the case is greatly reduced. The electronic device generating more heat is arranged on the side wall of the heat dissipation channel or in the heat dissipation channel, and the fan in the heat dissipation channel is also beneficial for improving the heat dissipation efficiency. Waterproof rubber rings are arranged among the upper cover, the side plate, the pipeline side wall of the heat dissipation channel, the PCB, the filter screen and the like, so that the optical storage power supply case has good waterproof performance. Meanwhile, the air outlet pipeline is horizontally arranged, the middle of the air outlet pipeline is high, the two ends of the air outlet pipeline are low, the air inlet cover is vertically arranged, and the fan is arranged at the joint of the air inlet cover and the air outlet pipeline, so that air enters from the lower portion of the heat dissipation channel and exits from the left side and the right side of the heat dissipation channel, the heat dissipation function of the case is achieved, and the waterproof performance of the case is improved; and the overall protection performance of the case reaches IP65 or above.

Description

Technical Field

[0001] This utility model relates to the field of power supply equipment technology, specifically to a photovoltaic power storage chassis. Background Technology

[0002] In existing photovoltaic power storage products, two or more inductor slots are usually fixed independently at the bottom of the enclosure, and the heat sink with the MOSFET is also fixed separately at the bottom of the enclosure.

[0003] The installation of inductor slots at the bottom of the chassis increases the overall height of the unit. The installation of MOSFET heatsinks at the bottom of the chassis also increases the overall size of the unit. The MOSFETs require separate heatsinks, further increasing the cost of the optical storage power supply. Additionally, the placement of an axial fan outside the chassis increases overall noise levels. Utility Model Content

[0004] Therefore, it is necessary to provide a photovoltaic power storage chassis that can meet the requirements of heat dissipation and waterproofing, and has a smaller overall height.

[0005] A photovoltaic power storage chassis includes a base and a top cover fitted onto the base. The base includes a bottom plate and multiple side plates surrounding the outer periphery of the bottom plate. The base and the top cover define a closed cavity. A PCB circuit board is mounted on the bottom plate, and multiple electronic components are mounted on the PCB circuit board. An air inlet shroud and an air outlet duct are provided inside the cavity, forming a heat dissipation channel. The heat dissipation channel has at least one air inlet and at least one air outlet, which are inserted through the side plates. The multiple electronic components include at least one first electronic component and at least one second electronic component. The first electronic component is attached to the outer wall of the heat dissipation channel, and the second electronic component is located inside the heat dissipation channel. A fan is provided inside the heat dissipation channel to circulate air inside the channel, thereby dissipating heat from the PCB circuit board and the electronic components inside the cavity.

[0006] Preferably, the air inlet shroud and the air outlet duct form a heat dissipation channel, which is T-shaped; the air inlet shroud includes a top surface and two side walls connected to the top surface, the air inlet shroud is mounted on the PCB circuit board, the first electronic device is closely attached to the outer side of the two side walls of the air inlet shroud, and the second electronic device extends into the air inlet shroud from the bottom surface; the inner side of the two side walls of the air inlet shroud has a plurality of evenly arranged heat dissipation fins.

[0007] Preferably, the air outlet duct is shaped with the middle section higher than both ends, and more preferably, it is an arc or arch shape with the middle section convex upwards. The air outlet duct adopts a hollow barrel-shaped structure formed by continuous sidewalls. The air inlet hood is connected to the air outlet duct at the lower sidewall of the highest point of the arc. A connecting and mounting through hole is provided in the middle of the bottom sidewall of the air outlet duct. One end of the air inlet hood is fixedly installed in the connecting and mounting through hole, and the other end of the air inlet hood is fixed to the side plate. The two ends of the air outlet duct are respectively fixed to the two opposite side plates. The cross-sectional area of ​​the air inlet hood is larger than the cross-sectional area of ​​the air outlet duct.

[0008] Preferably, the fan is located at the connection between the air inlet shroud and the air outlet duct, so that an airflow channel with downward air intake and left and right air outlet is formed in the heat dissipation channel; the fan is a centrifugal fan.

[0009] Preferably, the top cover and each of the side plates of the base are connected by a snap-fit ​​or bolt, and a waterproof rubber ring is provided between the top cover and the side plates; the side plates are provided with a waterproof connector that communicates with the interior of the cavity, and the waterproof connector is used to connect an external cable.

[0010] Preferably, both the air inlet shroud and the air outlet duct are made of extruded profiles. The bottom of the sidewall of the air inlet shroud and the air outlet duct is connected to the PCB circuit board by welding or bolts. Waterproof adhesive is provided between the bottom of the sidewall of the air inlet shroud and the air outlet duct and the PCB circuit board. Thermally conductive adhesive is provided at the connection between the sidewall of the air inlet shroud and the sidewall of the air outlet duct.

[0011] Preferably, filters are provided at the air inlet and the air outlet, the filters are located at the connection between the side plate and the heat dissipation channel, and a waterproof rubber ring is provided at the end of the heat dissipation channel, between the side plate and the filters.

[0012] Preferably, the first electronic device includes a MOSFET, and the second electronic device includes an inductor and a transformer, which are encapsulated together.

[0013] Preferably, it further includes a control box, the lower half of the upper cover has a recessed groove, the control box is disposed in the recessed groove, and the recessed groove is integrally stretched and formed with the upper cover; the control box is used for wiring the PCB circuit board and external cables.

[0014] Preferably, the lower groove is provided with a top cover, the area of ​​which is larger than the top surface area of ​​the lower groove. The top cover fits onto the lower groove and is flush with the upper surface of the top cover. A waterproof rubber ring is provided between the top cover and the four sides of the lower groove. At least one drainage hole is provided at the connection edge between the top surface of the four sides of the lower groove and the top cover. The drainage hole is used to drain water droplets from the gap between the top cover and the top cover.

[0015] In the aforementioned photovoltaic power storage chassis, the entire heat dissipation device is located inside the chassis. Electronic components that generate significant heat, such as MOSFETs, inductors, and transformers, are also installed inside the chassis, greatly reducing the overall height of the chassis. These heat-generating components are placed on the side walls or inside the heat dissipation channel, and the fan within the channel further enhances heat dissipation efficiency. Waterproof gaskets are installed between the top cover, side panels, the side walls of the heat dissipation channel ducts, the PCB circuit board, and the filter, giving the photovoltaic power storage chassis excellent waterproof performance. Simultaneously, the exhaust duct is horizontally positioned, higher in the middle and lower at both ends, while the air inlet shroud is vertically positioned. The fan is located at the connection between the air inlet shroud and the exhaust duct, allowing air to enter from the bottom and exit from the sides of the heat dissipation channel. This achieves both heat dissipation and improved waterproof performance, resulting in an overall protection rating of IP65 or higher. This invention has a simple structure, is easy to implement, has low cost, and is readily applicable. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of the photovoltaic power storage chassis according to an embodiment of the present invention.

[0017] Figure 2 This is a schematic diagram of the internal structure of the photovoltaic power storage chassis according to an embodiment of the present invention. Figure 1 (Remove the top cover).

[0018] Figure 3 This is a schematic diagram of the internal structure of the photovoltaic power storage chassis according to an embodiment of the present invention. Figure 2 (Remove the top cover and air inlet cover).

[0019] Figure 4 This is a schematic diagram of the air inlet cover and air outlet duct of the photovoltaic energy storage power supply chassis according to an embodiment of this utility model.

[0020] Figure 5 This is a schematic diagram of the structure of the top cover of the photovoltaic power storage chassis according to an embodiment of this utility model. Detailed Implementation

[0021] The present invention will now be described in detail with reference to specific embodiments and accompanying drawings.

[0022] Please see Figures 1 to 5 The diagram illustrates a photovoltaic power storage chassis 100, comprising a base 10 and a top cover 20 fitted onto the base 10. The base 10 includes a bottom plate 11 and a plurality of side plates 12 surrounding the outer periphery of the bottom plate 11. The base 10 and the top cover 20 define a closed cavity. A PCB circuit board 30 is mounted on the bottom plate 11, and a plurality of electronic components are mounted on the PCB circuit board 30. An air inlet shroud 40 and an air outlet duct 50 are provided inside the cavity, forming a heat dissipation channel. The heat dissipation channel has a depth of up to [missing information]. The device has at least one air inlet 41 and at least one air outlet 51, which are installed on the side plate 12. The multiple electronic devices include at least one first electronic device 31 and at least one second electronic device 32. The first electronic device 31 is attached to the outer wall of the air inlet cover 40, and the second electronic device 32 is located inside the air inlet cover 40. A fan 60 is provided in the heat dissipation channel to circulate the air inside the heat dissipation channel and realize the heat dissipation of the PCB circuit board 30 and the electronic devices inside the cavity.

[0023] Specifically, the sidewall of the air inlet shroud 40 and the PCB circuit board 30 form the heat dissipation channel. The first electronic device 31 is disposed on the PCB circuit board 30 outside the heat dissipation channel and is tightly attached to the sidewall of the pipe. The second electronic device 32 is disposed on the PCB circuit board 30 inside the heat dissipation channel.

[0024] Preferably, the air inlet shroud 40 and the air outlet duct 50 form a heat dissipation channel, which is T-shaped; the air inlet shroud 40 includes a top surface and two side walls connected to the top surface, the air inlet shroud 40 is mounted on the PCB circuit board 30, the first electronic device 31 is tightly attached to the outer side of the two side walls of the air inlet shroud 40, and the second electronic device 32 extends into the air inlet shroud 40 from the bottom surface; the inner side of the two side walls of the air inlet shroud 40 has a plurality of evenly arranged heat dissipation fins.

[0025] Preferably, the air outlet duct 50 has a shape where the middle is higher than both ends, and is more preferably an arc or arch shape with the middle bulging upwards. The air outlet duct 50 adopts a hollow barrel-shaped structure formed by continuous sidewalls. The air inlet hood 40 is connected to the air outlet duct 50 on the lower sidewall of the highest point of the arc. The bottom sidewall of the air outlet duct 50 is provided with a connecting and mounting through hole in the middle. One end of the air inlet hood 40 is fixedly installed on the connecting and mounting through hole, and the other end of the air inlet hood 40 is fixed on the side plate 12. The two ends of the air outlet duct 50 are respectively fixed on the two opposite side plates 12. The cross-sectional area of ​​the air inlet hood 40 is larger than the cross-sectional area of ​​the air outlet duct 50.

[0026] Preferably, the fan 60 is located at the connection between the air inlet shroud 40 and the air outlet duct 50, so that an airflow channel with downward air intake and left and right air outlet is formed in the heat dissipation channel; the fan 60 is a centrifugal fan 60.

[0027] Specifically, the photovoltaic power storage chassis 100 is fixedly installed on the wall during use. The air outlet duct 50 is horizontally arranged, and the air inlet shroud 40 is vertically arranged. The air outlet duct 50 is located above the air inlet shroud 40, the air inlet 41 is located at the bottom of the photovoltaic power storage chassis 100, and the air outlet 51 is located on both side walls of the photovoltaic power storage chassis 100. The air outlet duct 50 is higher in the middle and lower at both ends to prevent water from entering the air inlet shroud 40 from the air outlet duct 50, thus giving the heat dissipation channel good waterproof performance.

[0028] Specifically, the waterproof connector 80 and the air inlet 41 are both located on the lower side plate 12 of the base 10, that is, the waterproof connector 80 and the air inlet 41 face downwards to prevent water from entering the chassis through the waterproof connector 80 or the air inlet 41.

[0029] Specifically, the air outlet duct 50 has four interconnected sidewalls. The inner sidewall of the air outlet duct 50 does not contact the PCB circuit board 30, thus preventing water entering the air outlet duct 50 at the air outlet 51 from contacting the PCB circuit board 30.

[0030] Specifically, the centrifugal fan 60 has a large air volume and low noise, which gives the photovoltaic power storage chassis 100 a good heat dissipation effect.

[0031] Preferably, the upper cover 20 is connected to each of the side plates 12 of the base 10 by a snap-fit ​​connection or bolt connection, and a waterproof rubber ring is provided between the upper cover 20 and the side plate 12; the side plate 12 is provided with a waterproof connector 80 that communicates with the interior of the cavity, and the waterproof connector 80 is used to connect an external cable.

[0032] Preferably, both the air inlet shroud 40 and the air outlet duct 50 are made of extruded profiles. The bottom of the pipe sidewall of the air inlet shroud 40 and the air outlet duct 50 are connected to the PCB circuit board 30 by welding or bolts. Waterproof adhesive is provided between the bottom of the pipe sidewall of the air inlet shroud 40 and the air outlet duct 50 and the PCB circuit board 30. Thermally conductive adhesive is provided at the connection between the pipe sidewall of the air inlet shroud 40 and the pipe sidewall of the air outlet duct 50.

[0033] Specifically, waterproof adhesive is applied between the bottom of the sidewall of the air inlet shroud 40 and the air outlet duct 50 and the PCB circuit board 30, so that the air inlet shroud 40 and the air outlet duct 50 are partially waterproofed with adhesive, thereby improving the protective performance of the PCB circuit board 30.

[0034] Specifically, the heat dissipation channel divides the PCB circuit board 30 into multiple areas, and each area is waterproofed by potting, so that each area has the same protection level.

[0035] Specifically, the air inlet hood 40 and the air outlet duct 50 are made of integrally formed extruded profiles, and the base plate 11 and each of the side plates 12 in the base 10 are integrally stretched and formed, which can improve the waterproof performance of the equipment.

[0036] Preferably, a filter screen 70 is provided at the air inlet 41 and the air outlet 51. The filter screen 70 is located at the connection between the side plate 12 and the heat dissipation channel. A waterproof rubber ring is provided at the end of the heat dissipation channel, between the side plate 12 and the filter screen 70.

[0037] Preferably, the first electronic device 31 includes a MOSFET, and the second electronic device 32 includes an inductor and a transformer, which are encapsulated together.

[0038] Specifically, both the first electronic device 31 and the second electronic device 32 are electronic devices that generate a lot of heat when they are working. By placing these electronic devices on the side wall or inside the heat dissipation pipe, the heat generated during their operation can be quickly dissipated, achieving a good heat dissipation effect.

[0039] Preferably, it also includes a control box (not shown), the lower half of the upper cover 20 has a recessed groove 21, the control box is disposed in the groove 21, and the groove 21 is integrally stretched and formed with the upper cover 20; the control box is used for wiring the PCB circuit board 30 with external cables.

[0040] Preferably, a top cover 22 is provided on the lower groove 21, the area of ​​the top cover 22 is larger than the top surface area of ​​the lower groove 21, the top cover 22 covers the lower groove 21 and is flush with the upper surface of the upper cover 20; a waterproof rubber ring is provided between the top cover 22 and the four sides of the lower groove 21, and at least one drain hole 211 is provided at the connection edge between the top surface of the four sides of the lower groove 21 and the upper cover 20, the drain hole 211 is used to drain water droplets in the gap between the top cover 22 and the upper cover 20.

[0041] Specifically, the control box is installed in the lower groove 21 of the upper cover 20. When performing wiring operations, the top cover 22 of the control box can be opened to perform the wiring operations without opening the upper cover 20 of the photovoltaic power storage chassis 100. All cables enter the interior of the photovoltaic power storage chassis 100 through the waterproof connector 80, which improves the protection performance of the photovoltaic power storage chassis 100.

[0042] Specifically, the upper cover 20 is also provided with a control panel 23, which is equipped with touch buttons and status indicator lights. The control panel 23 is used to control the normal operation of the equipment inside the optical storage power supply chassis 100.

[0043] In the aforementioned photovoltaic power storage chassis 100, the entire heat dissipation device is located inside the chassis. Electronic components that generate significant heat, such as MOSFETs, inductors, and transformers, are also installed inside the chassis, greatly reducing the overall height of the chassis. The heat-generating electronic components are placed on the side walls or inside the heat dissipation channel, and the fan 60 within the heat dissipation channel also effectively improves heat dissipation efficiency. Waterproof gaskets are installed between various components, including the top cover 20, the side plate 12, the side walls of the heat dissipation channel, the PCB circuit board 30, and the filter 70, giving the photovoltaic power storage chassis 100 excellent waterproof performance. Simultaneously, the exhaust duct 50 is horizontally positioned, with a higher center and lower ends, while the air inlet shroud 40 is vertically positioned. The fan 60 is located at the connection between the air inlet shroud 40 and the exhaust duct 50, allowing air to enter from the bottom and exit from the sides of the heat dissipation channel. This achieves the chassis's heat dissipation function and also improves its waterproof performance, enabling the overall chassis protection performance to reach IP65 or higher. This utility model has a simple structure, is easy to implement, has low cost, and is easy to promote.

[0044] It should be noted that this utility model is not limited to the above-described embodiments. Based on the inventive spirit of this utility model, those skilled in the art can make other changes, and these changes made based on the inventive spirit of this utility model should be included within the scope of protection claimed by this utility model.

Claims

1. A photovoltaic power storage chassis, comprising a base and a top cover fitted onto the base, the base comprising a bottom plate and a plurality of side plates surrounding the outer periphery of the bottom plate, the base and the top cover defining a closed cavity, a PCB circuit board disposed on the bottom plate, and a plurality of electronic components disposed on the PCB circuit board, characterized in that, The cavity is equipped with an air inlet shroud and an air outlet duct, which form a heat dissipation channel. The heat dissipation channel has at least one air inlet and at least one air outlet, which are inserted through the side plate. The plurality of electronic devices include at least one first electronic device and at least one second electronic device. The first electronic device is attached to the outer wall of the air inlet shroud, and the second electronic device is disposed inside the air inlet shroud. A fan is provided in the heat dissipation channel to circulate air inside the heat dissipation channel, thereby achieving heat dissipation of the PCB circuit board and the electronic devices inside the cavity.

2. The optical power storage power supply cabinet of claim 1, wherein, The heat dissipation channel is T-shaped; the air inlet shroud includes a top surface and two side walls connected to the top surface. The air inlet shroud is mounted on the PCB circuit board. The first electronic device is closely attached to the outer side of the two side walls of the air inlet shroud. The second electronic device extends into the air inlet shroud from the bottom surface. The inner side of the two side walls of the air inlet shroud has a plurality of evenly arranged heat dissipation fins.

3. The optical power storage power supply cabinet of claim 1, wherein, The air outlet duct is shaped with the middle section higher than both ends. The middle section of the air outlet duct is an upward-convex arc or arch. The air outlet duct adopts a hollow barrel-shaped structure formed by continuous sidewalls. The air inlet hood is connected to the air outlet duct at the lower sidewall of the highest point of the arc. A connecting and mounting through hole is provided in the middle of the bottom sidewall of the air outlet duct. One end of the air inlet hood is fixedly installed in the connecting and mounting through hole, and the other end of the air inlet hood is fixed to the side plate. The two ends of the air outlet duct are respectively fixed to the two opposite side plates. The cross-sectional area of ​​the air inlet hood is larger than the cross-sectional area of ​​the air outlet duct.

4. The optical power storage power supply cabinet of claim 1, wherein, The fan is located at the connection between the air inlet shroud and the air outlet duct, so that an airflow channel with downward air intake and left and right air outlet is formed in the heat dissipation channel; the fan is a centrifugal fan.

5. The optical power storage power supply cabinet of claim 1, wherein, The top cover and each of the side plates of the base are connected by a snap-fit ​​or bolt. A waterproof rubber ring is provided between the top cover and the side plates. A waterproof connector communicating with the interior of the cavity is provided on the side plate. The waterproof connector is used to connect external cables.

6. The optical power storage power pack of claim 1, wherein, Both the air inlet hood and the air outlet duct are made of extruded profiles. The bottom of the sidewall of the air inlet hood and the air outlet duct is connected to the PCB circuit board by welding or bolts. Waterproof adhesive is provided between the bottom of the sidewall of the air inlet hood and the air outlet duct and the PCB circuit board. Thermally conductive adhesive is provided at the connection between the sidewall of the air inlet hood and the sidewall of the air outlet duct.

7. The optical power storage power pack of claim 1, wherein, The air inlet and the air outlet are equipped with filters. The filters are located at the connection between the side plate and the heat dissipation channel. A waterproof rubber ring is provided at the end of the heat dissipation channel, between the side plate and the filters.

8. The optical power storage power supply cabinet of claim 1, wherein, The first electronic device includes a MOSFET, and the second electronic device includes an inductor and a transformer, which are encapsulated together.

9. The optical power storage power pack of claim 1, wherein, It also includes a control box, the lower half of which has a recessed groove, and the control box is located in the groove. The groove is integrally stretched and formed with the upper cover. The control box is used for wiring the PCB circuit board with external cables.

10. The optical power storage power pack of claim 9, wherein, A top cover is provided on the lower groove, the area of ​​which is larger than the top surface area of ​​the lower groove. The top cover fits onto the lower groove and is flush with the upper surface of the top cover. A waterproof rubber ring is provided between the top cover and the four sides of the lower groove. At least one drainage hole is provided at the connection edge between the top surface of the four sides of the lower groove and the top cover. The drainage hole is used to drain water droplets from the gap between the top cover and the top cover.

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