Package structure
By combining pads and bumps on the chip structure, the problems of chip damage and pick-up difficulties caused by improper ejector pin lifting height are solved, achieving more efficient chip pick-up and improved heat dissipation performance.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HUAYUAN SEMICON SHENZHEN LTD
- Filing Date
- 2025-05-27
- Publication Date
- 2026-04-17
AI Technical Summary
During chip picking, improper pin lifting height can easily damage the chip or result in poor lifting effect, making it difficult for the die bonder to effectively pick up the chip.
A pad is placed on the chip structure to contact the ejector pin, and several bump structures are distributed around the pad to protect the chip structure, while allowing the ejector pin to be lifted to a certain height for easy pickup.
The protective effect of the gasket reduces the risk of chip damage during the ejector pin lifting process, improves the pick-up efficiency of the die bonder, and increases the soldering area and heat dissipation performance.
Smart Images
Figure CN224139468U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor devices, and in particular to a packaging structure. Background Technology
[0002] Generally, arranging chips in an array on a blue or UV film is a common chip transport method. The chip's bump structure faces downwards, allowing the die bonder to pick up the chip from the side opposite the bump structure and transfer it directly to the bonding position for soldering. While the die bonder picks up the chip, a push pin lifts it from the side with the bump structure. However, if the push pin lifts the chip too high, it may puncture the blue film, potentially damaging the chip. If the push pin lifts it too low, the lifting effect will be poor, making it difficult for the die bonder to pick up the chip. Utility Model Content
[0003] This invention provides a packaging structure that solves the problem that the ejector pins can easily damage the circuitry in the chip structure when picking up the packaging structure.
[0004] According to the packaging structure provided by this utility model, it includes:
[0005] Chip structure;
[0006] A spacer, located on the chip structure, for contacting a ejector pin;
[0007] A plurality of bump structures are spaced apart on the chip structure, and the pad and the plurality of bump structures are located on the same side of the chip structure, and the plurality of bump structures are distributed around the pad.
[0008] Optionally, the area of the pad on the chip structure is larger than the projected area of the bump structure on the chip structure.
[0009] Optionally, the gasket may be square or round.
[0010] Optionally, the bump structure is ellipsoidal, the height of the bump structure is 25 micrometers to 35 micrometers, and the diameter of the projection of the bump structure onto the chip structure is 95 micrometers to 105 micrometers.
[0011] Optionally, the bump structure includes, from bottom to top, a copper layer, a nickel layer, and a tin-silver alloy layer.
[0012] Optionally, the material of the gasket is the same as the material of the bump structure.
[0013] Optionally, the surface of the chip structure is a first passivation layer, and the pads and the plurality of bump structures are all located on the first passivation layer.
[0014] Optionally, the chip structure further includes a second passivation layer, which is located on the first passivation layer, the pad is located between the first passivation layer and the second passivation layer, and the bump structure is located on the second passivation layer.
[0015] Optionally, both the first passivation layer and the second passivation layer are made of polyimide.
[0016] Optionally, the material of the gasket is copper.
[0017] Compared with the prior art, the technical solution of this utility model has the following beneficial effects:
[0018] In the packaging structure provided by this utility model, a pad is provided on the chip structure, and the pad is used to contact the ejector pin. This allows the pad to protect the chip structure when the ejector pin lifts the packaging structure. Furthermore, the ejector pin can be lifted to a certain height, making it easier for the die bonder to pick up the packaging structure, thereby improving the pick-up abnormality.
[0019] Furthermore, since the pad and the bump structure are made of the same material, the pad can be used for grounding, thereby increasing the soldering area while taking into account chip heat dissipation.
[0020] Furthermore, since the gasket is made of copper and is located between the first passivation layer and the second passivation layer, the gasket can relieve stress and prevent oxidation. Attached Figure Description
[0021] Figure 1 This is a bottom view of the packaging structure provided in this embodiment of the utility model;
[0022] Figure 2 This is a front view of the packaging structure provided in an embodiment of this utility model.
[0023] Figure label:
[0024] 10-Chip structure;
[0025] 20-Bump structure;
[0026] 30-Gasket;
[0027] 11 - First passivation layer. Detailed Implementation
[0028] As described in the background art, while the die bonder picks up the chip, the ejector pins lift the chip from the side with the bump structure. However, if the ejector pins lift the chip too high, they may break through the blue film, thus posing a risk of damaging the chip. If the ejector pins lift the chip too low, the lifting effect will be poor, making it difficult for the die bonder to pick up the chip.
[0029] In view of this, the present invention creatively proposes a packaging structure, comprising:
[0030] Chip structure;
[0031] A spacer, located on the chip structure, for contacting a ejector pin;
[0032] A plurality of bump structures are spaced apart on the chip structure, and the pad and the plurality of bump structures are located on the same side of the chip structure, and the plurality of bump structures are distributed around the pad.
[0033] By placing a pad on the chip structure, and having the pad contact the ejector pin, the pad can protect the chip structure when the ejector pin lifts the package structure. Furthermore, the ejector pin can lift the package structure to a certain height, making it easier for the die bonder to pick up the package structure, thereby improving pick-up abnormalities.
[0034] The embodiments of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model. The terms "first," "second," "third," etc., in the specification, claims, and accompanying drawings of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this utility model described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or device that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or devices.
[0035] Please refer to Figure 1 as well as Figure 2 The package structure includes a chip structure 10, a pad 30, and several bump structures 20.
[0036] The chip structure 10 includes a substrate, a circuit formed on the substrate, at least one passivation layer, and at least one metal layer.
[0037] The pad 30 is located on the chip structure 10 and is used to contact the ejector pin.
[0038] A plurality of bump structures 20 are spaced apart on the chip structure 10, and the pad 30 and the plurality of bump structures 20 are located on the same side of the chip structure 10, and the plurality of bump structures 20 are distributed around the pad 30.
[0039] In this embodiment, the bump structure 20 is ellipsoidal, with a height of 25 to 35 micrometers and a diameter of its projection onto the chip structure 10 of 95 to 105 micrometers. Of course, those skilled in the art should recognize that there are many other possible choices for the height of the bump structure 20 and the diameter of its projection onto the chip structure 10, and this invention is not limited thereto.
[0040] In this embodiment, the bump structure 20 includes a copper layer, a nickel layer, and a tin-silver alloy layer from bottom to top. For example, when the height of the bump structure 20 is 30 micrometers, the bump structure 20 includes a copper layer with a thickness of 7 micrometers, a nickel layer with a thickness of 3 micrometers, and a tin-silver alloy layer with a thickness of 20 micrometers.
[0041] In this embodiment, the projected area of the pad 30 on the chip structure 10 is greater than the projected area of the bump structure 20 on the chip structure 10. Furthermore, the distance between the pad 30 and the bump structure 20 closest to the pad 30 is greater than the safety distance. This safety distance depends on the forming soldering process and the forming process of the bump structure 20, so that there will be no unnecessary interference between the pad 30 and the bump structure 20.
[0042] In this embodiment, the gasket 30 may be square or circular in shape. Additionally, please refer to... Figure 1 The square pad 30 is missing a corner, and the bump structure 20 corresponding to the missing corner corresponds to the position of the first pin, thereby determining the pin position of the package structure.
[0043] As an example, please refer to Figure 1The pad 30 is made of the same material as the bump structure 20, that is, the pad 30 includes a copper layer, a nickel layer, and a tin-silver alloy layer from bottom to top. Furthermore, the surface of the chip structure 10 on which the bump structure 20 and the pad 30 are located is a first passivation layer 11, and the pad 30 and several bump structures 20 are all located on this first passivation layer 11. Therefore, the pad 30 and several bump structures 20 are exposed, allowing the pad 30 to be used for grounding, thereby increasing the soldering area while increasing the heat dissipation of the chip structure 10.
[0044] In another embodiment, the pad 30 is made of copper and is manufactured using an electroplating process. Furthermore, the surface of the chip structure 10 on the side where the bump structure 20 and the pad 30 are located forms a first passivation layer and a second passivation layer. The pad 30 is situated between the first and second passivation layers, and the bump structure 20 is located on the second passivation layer. Therefore, the pad 30 is covered by the second passivation layer, while the bump structure 20 is exposed, allowing the pad 30 to relieve stress and prevent oxidation.
[0045] In this embodiment, please refer to Figure 2 The thickness d of the spacer 30 is the same as the height d of the bump structure 20. Therefore, when the package structure is placed on the blue film or UV film for transportation, both the spacer 30 and the bump structure 20 are in contact with the blue film or UV film, resulting in a large contact area between the package structure and the blue film or UV film. This increases the adhesion between the package structure and the blue film or UV film, thereby reducing the offset of the package structure on the blue film or UV film during transportation. In addition, when the die bonder picks up the package structure located on the blue film or UV film, it needs to use a pin to lift the chip. The die bonder directly picks up the package structure from the side of the package structure where the spacer 30 and the bump structure 20 are located, thereby transferring the package structure to the target soldering position. Therefore, since the spacer 30 is used to contact the pin, the pin cannot contact the chip structure 10 when lifting. Thus, the spacer 30 can protect the circuit in the chip structure 10 and improve the problem of pick-up abnormalities caused by the small lifting height of the pin.
[0046] In summary, in the packaging structure provided in the embodiments of the present invention, by providing a pad 30 on the chip structure 10 and having the pad 30 in contact with the ejector pin, the pad 30 can protect the chip structure 10 when the ejector pin lifts the packaging structure. Furthermore, the ejector pin can be lifted to a certain height, making it easier for the die bonder to pick up the packaging structure, thereby improving the pick-up abnormality.
[0047] Furthermore, since the pad 30 and the bump structure 20 are made of the same material, the pad 30 can be used for grounding, thereby increasing the soldering area while taking into account chip heat dissipation.
[0048] Furthermore, since the material of the gasket 30 is copper, and the gasket 30 is located between the first passivation layer 11 and the second passivation layer, the gasket 30 can play the role of relieving stress and preventing oxidation.
[0049] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the present invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.
Claims
1. A package structure, characterized by, include: Chip structure; A spacer, located on the chip structure, for contacting a ejector pin; A plurality of bump structures are spaced apart on the chip structure, and the pad and the plurality of bump structures are located on the same side of the chip structure, and the plurality of bump structures are distributed around the pad.
2. The package structure of claim 1, wherein, The area of the pad on the chip structure is larger than the projected area of the bump structure on the chip structure.
3. The package structure of claim 1, wherein, The gasket can be square or round.
4. The package structure of claim 1, wherein, The bump structure is ellipsoidal, with a height of 25 micrometers to 35 micrometers and a diameter of 95 micrometers to 105 micrometers of the projection of the bump structure onto the chip structure.
5. The package structure of claim 1, wherein, The bump structure includes, from bottom to top, a copper layer, a nickel layer, and a tin-silver alloy layer.
6. The package structure of claim 1 or 5, wherein, The material of the gasket is the same as the material of the bump structure.
7. The package structure of claim 1, wherein, The surface of the chip structure is a first passivation layer, and the pads and the plurality of bump structures are all located on the first passivation layer.
8. The package structure of claim 7, wherein, The chip structure further includes a second passivation layer, which is located on the first passivation layer. The pad is located between the first passivation layer and the second passivation layer, and the bump structure is located on the second passivation layer.
9. The package structure of claim 8, wherein, Both the first passivation layer and the second passivation layer are made of polyimide.
10. The package structure of claim 8, wherein, The gasket is made of copper.