Grinding device for wafer production

By using a hydraulic cylinder and motor-driven lead screw system, combined with clamping plates and brush assemblies, the problem of existing devices being unable to adjust the grinding in multiple directions has been solved, achieving precise positioning and efficient cleaning of wafers, thus improving processing quality and equipment efficiency.

CN224144185UActive Publication Date: 2026-04-21SICHUAN HAICHENG CHUANGTE TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202520787308.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-04-24
Publication Date
2026-04-21
Estimated Expiration
2035-04-24

AI Technical Summary

Technical Problem

Existing wafer manufacturing grinding equipment cannot achieve multi-directional adjustment grinding, making it difficult to adapt to wafers of different sizes, and has low cleaning efficiency, which affects processing quality.

Method used

It adopts a hydraulic cylinder to drive the lifting plate and a motor to drive the lead screw system, combined with clamping plates, grinding discs and brush components to achieve multi-directional precise grinding and cleaning. The rubber pad disperses the clamping pressure to reduce wafer damage, and the removable waste bin allows for convenient cleaning of grinding debris.

Benefits of technology

It enables precise positioning and multi-directional polishing of wafers, reduces the risk of wafer breakage, ensures surface cleanliness, and improves processing quality and equipment utilization efficiency.

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Abstract

The utility model relates to the technical field of grinding devices, in particular to a wafer production grinding device which comprises a workbench, a first hydraulic cylinder is fixedly installed in the workbench, a lifting plate is fixedly installed at the output end of the first hydraulic cylinder, and a positioning rod is fixedly installed at the bottom end of the lifting plate. A first motor is fixedly mounted on the side face of the lifting plate, and a rotating rod is fixedly mounted at the output end of the first motor. According to the wafer polishing device, the first hydraulic cylinder drives the lifting plate to ascend and descend, the first motor drives the rotating rod to rotate, the clamping plate moves to place and fix a wafer, the second motor and the third motor drive the first lead screw and the second lead screw to rotate and drive the sliding block and the moving plate to move, and the fourth motor is started to enable the polishing piece to polish the wafer. And meanwhile, the first spring on the upper portion enables the wafer to be stressed more evenly, and the wafer is prevented from being broken.
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