Grinding device for wafer production

Abstract

The utility model relates to the technical field of grinding devices, in particular to a wafer production grinding device which comprises a workbench, a first hydraulic cylinder is fixedly installed in the workbench, a lifting plate is fixedly installed at the output end of the first hydraulic cylinder, and a positioning rod is fixedly installed at the bottom end of the lifting plate. A first motor is fixedly mounted on the side face of the lifting plate, and a rotating rod is fixedly mounted at the output end of the first motor. According to the wafer polishing device, the first hydraulic cylinder drives the lifting plate to ascend and descend, the first motor drives the rotating rod to rotate, the clamping plate moves to place and fix a wafer, the second motor and the third motor drive the first lead screw and the second lead screw to rotate and drive the sliding block and the moving plate to move, and the fourth motor is started to enable the polishing piece to polish the wafer. And meanwhile, the first spring on the upper portion enables the wafer to be stressed more evenly, and the wafer is prevented from being broken.

Description

Technical Field

[0001] This utility model relates to the field of grinding equipment technology, and in particular to a wafer production grinding equipment. Background Technology

[0002] A grinding device, a device for grinding workpieces. Publication No.: CN217371658U. This utility model discloses a grinding device for silicon wafer production and processing, including an operating table, support rod, arc groove, support frame, turntable, drive motor, brush head, connecting column, support column, and adjusting bolts. This grinding device for silicon wafer production and processing allows adjustment of the brush head's relative position to the turntable via adjusting bolts, facilitating adjustment of the brush head's position relative to the silicon wafer. Furthermore, the complementary interaction between the slider and the groove guides the adjustment direction of the support plate, thus facilitating support of the connecting column by the support plate, effectively ensuring the brush head grinds the silicon wafer on the turntable. However, in practical applications, this device has some shortcomings; it cannot achieve multi-directional adjustment and grinding, and it is not suitable for adapting to wafers of various sizes, requiring improvement. Utility Model Content

[0003] The purpose of this utility model is to solve the technical problems mentioned in the background section.

[0004] This utility model adopts the following technical solution: a wafer production grinding device, including a worktable, a hydraulic cylinder fixedly installed inside the worktable, a lifting plate fixedly installed at the output end of the hydraulic cylinder, a positioning rod fixedly installed at the bottom end of the lifting plate, a motor fixedly installed on the side of the lifting plate, a rotating rod fixedly installed at the output end of the motor, a clamping plate fixedly installed at one end of the rotating rod, a bolt threaded inside the clamping plate, a soft pad fixedly installed at the bottom of the bolt, a side plate fixedly installed on the side of the worktable, a sliding groove opened at one end of the side plate, and a sliding connection inside the sliding groove. A slider is attached, and a second motor is fixedly installed on the side of the slider. A second lead screw is fixedly installed at the output end of the second motor. A third motor is fixedly installed on the side of the side plate, and a first lead screw is fixedly installed at the output end of the third motor. A moving block is threadedly connected to the surface of the first lead screw. The second lead screw is rotatably connected inside the moving block. A moving plate is threadedly connected to the surface of the second lead screw. A fourth motor is fixedly installed on the upper surface of the moving plate. A lifting rod is fixedly installed at the output end of the fourth motor. A grinding disc is fixedly installed at the bottom end of the lifting rod. A first spring is fixedly installed between the grinding disc and the moving plate.

[0005] Preferably, the surface of the positioning rod is slidably connected to the interior of the worktable. This sliding connection design between the positioning rod and the worktable enhances the stability of the lifting plate during vertical movement, reduces horizontal offset, ensures wafer positioning accuracy, and the symmetrically distributed positioning rod structure suppresses the torsional torque generated during hydraulic cylinder drive, preventing the lifting plate from tilting during movement.

[0006] Preferably, a rubber pad is fixedly mounted on the surface of the clamping plate. Here, the rubber pad on the surface of the clamping plate disperses the clamping pressure through elastic deformation, reduces local stress concentration, and lowers the risk of wafer edge chipping or surface microcracks. The insulating properties of the rubber material can reduce the accumulation of static electricity during the polishing process, avoiding the electrostatic adsorption of contaminants or the occurrence of discharge damage to the wafer surface.

[0007] Preferably, a second hydraulic cylinder is fixedly mounted on the surface of the worktable, and a lifting platform is fixedly mounted on the output end of the second hydraulic cylinder. A third lead screw is rotatably connected inside the lifting platform, and a fifth motor is fixedly mounted on one end of the third lead screw. A bracket is threadedly connected to the surface of the third lead screw, and a brush is threadedly connected to the inside of the bracket. Here, the lifting platform driven by the second hydraulic cylinder and the brush assembly driven by the third lead screw can quickly intervene in cleaning during the grinding process, promptly removing grinding debris and preventing debris accumulation from affecting processing quality. The threaded connection structure between the bracket and the brush simplifies the replacement process of the cleaning components, facilitates daily maintenance and consumable replacement, and improves equipment utilization efficiency.

[0008] Preferably, a waste bin is slidably connected to the upper surface of the lifting platform, and an insert block is slidably connected to the side of the bracket. A second spring is fixedly installed inside the insert block, and a locking head is fixedly installed at one end of the second spring. Here, the insert block and spring locking design allows the waste bin to be quickly installed and disassembled, facilitating the cleaning of grinding waste and improving the continuous operation capability of the equipment. The sliding fit structure between the locking head and the bracket ensures that the waste bin remains firmly locked during equipment operation, preventing accidental detachment due to vibration.

[0009] Compared with the prior art, the advantages and positive effects of this utility model are as follows:

[0010] 1. In this utility model, the lifting plate is raised and lowered by the first hydraulic cylinder, the rotating rod is driven by the first motor to rotate, the clamping plate moves to place and fix the wafer, the second and third motors drive the first and second lead screws to rotate, which drives the slider and the moving plate to move, and the fourth motor is started to make the grinding disc grind the wafer, thus achieving precise grinding. At the same time, the first spring above makes the wafer more evenly stressed and prevents the wafer from breaking.

[0011] 2. In this utility model, the lifting platform is raised and lowered by the No. 2 hydraulic cylinder, and the No. 3 lead screw is driven by the No. 5 motor to rotate, which drives the bracket and the brush to move together, thereby cleaning the debris generated during the wafer polishing process. During the movement, the brush can evenly and accurately sweep away the debris on the wafer surface, ensuring that the debris on the wafer surface is removed and preventing the debris from scratching the crystal surface and affecting the product quality. Attached Figure Description

[0012] Figure 1 This utility model provides a schematic diagram of a wafer production grinding apparatus;

[0013] Figure 2 This utility model provides a schematic diagram of the worktable of a wafer production grinding device;

[0014] Figure 3 This utility model provides a schematic diagram of a lifting plate for a wafer production grinding device;

[0015] Figure 4 This utility model provides a schematic diagram of a grinding disc for a wafer manufacturing grinding apparatus;

[0016] Figure 5 This utility model provides a schematic diagram of a lifting platform for a wafer production grinding apparatus;

[0017] Figure 6 This invention provides a schematic diagram of a chuck head for a wafer production grinding apparatus.

[0018] Legend:

[0019] 1. Workbench; 2. Hydraulic Cylinder No. 1; 3. Lifting Plate; 4. Positioning Rod; 5. Motor No. 1; 6. Rotating Rod; 7. Clamping Plate; 8. Bolt; 9. Soft Pad; 10. Side Plate; 11. Slide Groove; 12. Slider; 13. Motor No. 2; 14. Lead Screw No. 1; 15. Motor No. 3; 16. Lead Screw No. 2; 17. Moving Plate; 18. Motor No. 4; 19. Lifting Rod; 20. Grinding Disc; 21. Spring No. 1; 22. Hydraulic Cylinder No. 2; 23. Lifting Platform; 24. Lead Screw No. 3; 25. Motor No. 5; 26. Support; 27. Brush; 28. Rubber Pad; 29. ​​Scrap Bin; 30. Insert Block; 31. Spring No. 2; 32. Clamp; 33. Moving Block. Detailed Implementation

[0020] To better understand the above-mentioned objectives, features, and advantages of this utility model, the present utility model will be further described below with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0021] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the present invention is not limited to the specific embodiments disclosed in the following specification. Example

[0022] Please see Figure 1-5 This utility model provides a technical solution: a wafer production grinding device, including a worktable 1. A hydraulic cylinder 2 is fixedly installed inside the worktable 1. A lifting plate 3 is fixedly installed at the output end of the hydraulic cylinder 2. A positioning rod 4 is fixedly installed at the bottom end of the lifting plate 3. The surface of the positioning rod 4 is slidably connected to the inside of the worktable 1. Here, the sliding connection design between the positioning rod 4 and the worktable 1 enhances the stability of the lifting plate 3 in vertical movement, reduces horizontal offset, and ensures wafer positioning accuracy. The symmetrically distributed positioning rod 4 structure can suppress the torsional torque generated when the hydraulic cylinder is driven, preventing the lifting plate 3 from tilting during movement. A motor 5 is fixedly installed on the side of the lifting plate 3. A rotating rod 6 is fixedly installed at the output end of the motor 5. A clamping plate 7 is fixedly installed at one end of the rotating rod 6. A rubber pad 28 is fixedly installed on the surface of the clamping plate 7. Here, the rubber pad 28 on the surface of the clamping plate 7 disperses the clamping pressure through elastic deformation, reducing local stress concentration and lowering the risk of wafer edge chipping or surface micro-cracks. The insulating properties of the rubber material reduce static electricity accumulation during the polishing process, preventing static electricity from attracting contaminants or causing discharge damage to the wafer surface. The clamping plate 7 is internally threaded with bolts 8, and soft pads 9 are fixedly installed at the bottom of the bolts 8. A side plate 10 is fixedly installed on the side of the worktable 1. A groove 11 is opened at one end of the side plate 10, and a slider 12 is slidably connected inside the groove 11. A second motor 13 is fixedly installed on the side of the slider 12. A lead screw 14 is fixedly installed at the output end. A motor 15 is fixedly installed on the side of the side plate 10. A lead screw 16 is fixedly installed at the output end of the motor 15. A moving block 33 is threadedly connected to the surface of the lead screw 16. The lead screw 14 is rotatably connected inside the moving block 33. A moving plate 17 is threadedly connected to the surface of the lead screw 14. A motor 18 is fixedly installed on the upper surface of the moving plate 17. A lifting rod 19 is fixedly installed at the output end of the motor 18. A grinding disc 20 is fixedly installed at the bottom end of the lifting rod 19. A spring 21 is fixedly installed between the grinding disc 20 and the moving plate 17. Example

[0023] Please see Figure 1 and 6A second hydraulic cylinder 22 is fixedly mounted on the surface of the workbench 1. A lifting platform 23 is fixedly mounted on the output end of the second hydraulic cylinder 22. A third lead screw 24 is rotatably connected inside the lifting platform 23. A fifth motor 25 is fixedly mounted on one end of the third lead screw 24. A bracket 26 is threadedly connected to the surface of the third lead screw 24. A brush 27 is threadedly connected inside the bracket 26. A waste bin 29 is slidably connected to the upper surface of the lifting platform 23. An insert block 30 is slidably connected to the side of the bracket 26. A second spring 31 is fixedly mounted inside the insert block 30. A clamp 32 is fixedly mounted on one end of the second spring 31. Here, the insert block 30 and spring clamp design allows the waste bin 29 to be quickly installed and removed, facilitating the cleaning of grinding waste and improving the continuous operation capability of the equipment. The sliding fit structure between the clamp 32 and the bracket 26 ensures that the waste bin 29 remains firmly locked during equipment operation, preventing accidental detachment due to vibration.

[0024] Working principle: Start hydraulic cylinder 2 to adjust lifting plate 3 to a suitable position. Positioning rod 4 makes the movement of lifting plate 3 more stable. Place the wafer between clamping plates 7. Start motor 5 to clamp the wafer. Rotate bolt 8 to fix the wafer. Start motors 13, 15, and 18. Motor 13 drives lead screw 14 to rotate, which moves slider 12. Motor 15 drives lead screw 16 to move moving plate 17. Motor 18 drives polishing disc 20 to rotate. Spring 21 keeps polishing disc 20 in contact with wafer surface. After polishing one side of the wafer, flip the wafer over. At the same time, start motor 25. Motor 25 drives lead screw 24 to rotate, which drives bracket 26 to move brush 27. Brush 27 cleans the wafer fragments after polishing and polishes the other side.

[0025] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present utility model without departing from the technical solution of the present utility model shall still fall within the protection scope of the technical solution of the present utility model.

Claims

1. A wafer production polishing apparatus comprising a table (1), characterized by: A hydraulic cylinder (2) is fixedly installed inside the workbench (1). A lifting plate (3) is fixedly installed at the output end of the hydraulic cylinder (2). A positioning rod (4) is fixedly installed at the bottom end of the lifting plate (3). A motor (5) is fixedly installed on the side of the lifting plate (3). A rotating rod (6) is fixedly installed at the output end of the motor (5). A clamping plate (7) is fixedly installed at one end of the rotating rod (6). A bolt (8) is threaded inside the clamping plate (7). A soft pad (9) is fixedly installed at the bottom of the bolt (8). A side plate (10) is fixedly installed on the side of the workbench (1). A slide groove (11) is opened at one end of the side plate (10). A slider (12) is slidably connected inside the slide groove (11). A second motor (1) is fixedly installed on the side of the slider (12). 3) The output end of the second motor (13) is fixedly installed with a first lead screw (14). The side of the side plate (10) is fixedly installed with a third motor (15). The output end of the third motor (15) is fixedly installed with a second lead screw (16). The surface of the second lead screw (16) is threadedly connected to a moving block (33). The first lead screw (14) is rotatably connected inside the moving block (33). The surface of the first lead screw (14) is threadedly connected to a moving plate (17). The upper surface of the moving plate (17) is fixedly installed with a fourth motor (18). The output end of the fourth motor (18) is fixedly installed with a lifting rod (19). The bottom end of the lifting rod (19) is fixedly installed with a grinding disc (20). A first spring (21) is fixedly installed between the grinding disc (20) and the moving plate (17).

2. The wafer production polishing apparatus according to claim 1, wherein: The surface of the positioning rod (4) is slidably connected to the inside of the worktable (1).

3. The wafer production lapping apparatus of claim 1, wherein: A rubber pad (28) is fixedly installed on the surface of the clamp (7).

4. The wafer production lapping apparatus of claim 1, wherein: A second hydraulic cylinder (22) is fixedly installed on the surface of the workbench (1). A lifting platform (23) is fixedly installed at the output end of the second hydraulic cylinder (22). A third lead screw (24) is rotatably connected inside the lifting platform (23). A fifth motor (25) is fixedly installed at one end of the third lead screw (24). A bracket (26) is threadedly connected to the surface of the third lead screw (24). A brush (27) is threadedly connected inside the bracket (26).

5. The wafer production lapping apparatus of claim 4, wherein: The upper surface of the lifting platform (23) is slidably connected to a waste bin (29), and the side of the bracket (26) is slidably connected to a plug (30). A second spring (31) is fixedly installed inside the plug (30), and a clip (32) is fixedly installed at one end of the second spring (31).

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