Trimming device and trimming system for polishing pad
By providing a polishing pad dressing device that includes first and second dressing components, the problem of the dressing area being unable to be adjusted is solved, and flexible adaptation of overall and partial dressing is achieved, thereby improving polishing efficiency and quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ZHONGHUAN ADVANCED SEMICONDUCTOR TECHNOLOGY CO LTD
- Filing Date
- 2025-05-06
- Publication Date
- 2026-04-21
AI Technical Summary
Existing polishing pad dressing devices cannot adjust the dressing area and have limited applicability to various application scenarios, resulting in reduced polishing efficiency and quality.
A polishing pad dressing device is provided, including first and second dressing components. The first dressing component is used for overall dressing, and the second dressing component can selectively adjust the dressing area. The dressing area can be adjusted by selectively installing dressing components to adapt to overall and partial dressing needs.
The dressing area of the dressing device can be adjusted, which enriches the applicable application scenarios, improves polishing efficiency and quality, and meets the dressing needs of different polishing pads.
Smart Images
Figure CN224144351U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of polishing pad technology for semiconductor silicon wafers, specifically to a polishing pad polishing device and polishing system. Background Technology
[0002] Polishing pads are one of the core consumables in the chemical mechanical polishing (CMP) process of semiconductor silicon wafers. They are mainly used for planarization of the silicon wafer surface to meet the flatness requirements of integrated circuit manufacturing. During the silicon wafer polishing process, impurities are generated on the surface of the polishing pad, leading to a reduction in the volume and number of micropores and a decrease in surface roughness. Furthermore, molecular recombination occurs on the surface of the polishing pad, forming a glaze layer of a certain thickness, which reduces polishing efficiency and quality. Therefore, it is necessary to trim the polishing pad to improve its surface cleanliness and roughness.
[0003] However, current dressing devices used for dressing polishing pads often require users to rely on experience to replace them with different structures when dressing specific areas of the pad, which presents certain limitations. Furthermore, the application scenarios that current dressing devices are suitable for are limited. Utility Model Content
[0004] This application provides a dressing device and dressing system for a polishing pad, which can adjust the dressing area of the dressing device and enrich the application scenarios that the dressing device can be adapted to.
[0005] This application provides a dressing device for a polishing pad. The dressing device includes a first dressing assembly, which includes a first dressing wheel and a first dressing element. The first dressing wheel has a plurality of first mounting holes, each housing a first dressing element. The dressing device also includes a second dressing assembly, which includes a second dressing wheel and a second dressing element. The second dressing wheel has a plurality of second mounting holes, each configured to selectively house a second dressing element to adjust the dressing area of the second dressing assembly. The first and second dressing assemblies are configured to be selectively used for dressing the polishing pad.
[0006] In one embodiment of this application, the plurality of second mounting holes include a plurality of first mounting sub-holes, each of the first mounting sub-holes being distributed at intervals along the circumference of the second dressing wheel, and the minimum distance from each of the first mounting sub-holes to the outer edge of the second dressing wheel being equal.
[0007] In one embodiment of this application, the plurality of second mounting holes further include second mounting sub-holes, and each first mounting sub-hole surrounds the outer periphery of the second mounting sub-hole.
[0008] In one embodiment of this application, a second trimming element is installed in the second mounting sub-hole and at least a portion of the first mounting sub-hole.
[0009] In one embodiment of this application, the first dressing wheel is further provided with a first functional hole, the opening area of the first functional hole being smaller than the opening area of the first mounting hole; and / or the second dressing wheel is further provided with a second functional hole, the opening area of the second functional hole being smaller than the opening area of the second mounting hole.
[0010] In one embodiment of this application, the first dressing wheel is further provided with a plurality of first functional holes, the opening area of a single first functional hole is smaller than the opening area of a single first mounting hole, and the first mounting holes and the first functional holes are alternately distributed along the circumference of the first dressing wheel.
[0011] In one embodiment of this application, the second dressing wheel is further provided with a plurality of second functional holes, the opening area of a single second functional hole is smaller than the opening area of a single first mounting sub-hole, and the first mounting sub-holes and the second functional holes are alternately distributed along the circumference of the second dressing wheel.
[0012] In one embodiment of this application, the trimming device further includes an internal gear and an external gear ring, the external gear ring being sleeved on the outer periphery of the internal gear, a first trimming component and a second trimming component being configured to selectively mesh between the internal gear and the external gear ring, the internal gear and the external gear ring being configured to cooperate in driving the first trimming component or the second trimming component to rotate and revolve around the circumference of the internal gear.
[0013] In one embodiment of this application, the rotational speed of the first trimming component is greater than that of the second trimming component, and the revolution speed of the first trimming component is greater than that of the second trimming component.
[0014] In one embodiment of this application, when the internal gear and the external gear ring are engaged to drive the second trimming assembly, one of the internal gear and the external gear ring is in a stationary state.
[0015] Accordingly, this application also provides a dressing system, including a polishing disc and a dressing device as described in the above embodiments, wherein the polishing disc is used to set a polishing pad.
[0016] In one embodiment of this application, the polishing disc includes a first polishing disc and a second polishing disc disposed opposite to each other. A first trimming component and a second trimming component of the trimming device are configured to be selectively disposed between the first polishing disc and the second polishing disc to trim the polishing pads on the first polishing disc and the second polishing disc. Specifically, when the first trimming component trims the polishing pads, the rotational speed of the first polishing disc and the second polishing disc is greater than when the second trimming component trims the polishing pads; and the pressure between the first polishing disc and the second polishing disc is greater when the first trimming component trims the polishing pads than when the second trimming component trims the polishing pads.
[0017] The beneficial effects of this application are as follows: Unlike existing technologies, this application provides a dressing device and system for polishing pads. The dressing device includes a first dressing component and a second dressing component. In the first dressing component, each first mounting hole on the first dressing wheel is fitted with a first dressing element, meaning the first dressing component is used for overall dressing of the polishing pad. In the second dressing component, each second mounting hole on the second dressing wheel is configured to selectively mount a second dressing element to adjust the dressing area of the second dressing component. By selectively mounting the second dressing element through the second mounting holes of the second dressing wheel, this application can adjust the dressing area of the second dressing component, thus enabling adjustment of the dressing area of the dressing device to meet the need for dressing a localized area of the polishing pad. Furthermore, since the first and second dressing components are configured to be selectively used for dressing the polishing pad, this application can adapt to application scenarios such as overall dressing of the polishing pad and dressing a localized area, thereby enriching the application scenarios that the dressing device can adapt to. Attached Figure Description
[0018] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0019] Figure 1 This is a schematic diagram of an embodiment of the first trimming component of the trimming device of this application being used to trim a polishing pad;
[0020] Figure 2 This is a schematic diagram of an embodiment of the second trimming component of the trimming device of this application being used to trim a polishing pad;
[0021] Figure 3 This is a schematic diagram of the structure of an embodiment of the first trimming wheel of this application;
[0022] Figure 4 This is a schematic diagram of the structure of an embodiment of the second trimming wheel of this application;
[0023] Figure 5 yes Figure 2 A schematic diagram of another state of the trimming device shown.
[0024] Figure 6 This is a schematic diagram of the structure of an embodiment of the trimming system of this application.
[0025] Explanation of reference numerals in the attached figures:
[0026] 10- Dressing device; 11- First dressing assembly; 111- First dressing wheel; 112- First dressing component; 113- First mounting hole; 114- First functional hole; 12- Second dressing assembly; 121- Second dressing wheel; 122- Second dressing component; 123- Second mounting hole; 1231- First mounting sub-hole; 1232- Second mounting sub-hole; 124- Second functional hole; 131- Internal gear; 132- External gear ring; 20- Polishing disc; 21- First polishing disc; 22- Second polishing disc; 31- First polishing pad; 32- Second polishing pad. Detailed Implementation
[0027] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. In addition, it should be understood that the specific embodiments described herein are only for illustration and explanation of this application and are not intended to limit this application. In this application, unless otherwise stated, directional terms such as "up," "down," "left," and "right" generally refer to up, down, left, and right in the actual use or working state of the device, specifically the drawing directions in the accompanying drawings.
[0028] In this application, unless otherwise expressly specified and limited, the terms "connected," "linked," "stacked," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two elements or the interaction between two elements. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0029] This application provides a dressing device and a dressing system for a polishing pad, which are described in detail below. It should be noted that the order of description of the following embodiments is not intended to limit the preferred order of the embodiments of this application. Furthermore, in the following embodiments, the descriptions of each embodiment have their own emphasis; parts not described in detail in a certain embodiment can be referred to in the relevant descriptions of other embodiments.
[0030] To address the technical problems of existing dressing devices having unadjustable dressing areas and limited applicable scenarios, one embodiment of this application provides a dressing device for a polishing pad. This dressing device includes a first dressing assembly, which comprises a first dressing wheel and a first dressing element. The first dressing wheel has multiple first mounting holes, each housing a first dressing element. The dressing device also includes a second dressing assembly, which comprises a second dressing wheel and a second dressing element. The second dressing wheel has multiple second mounting holes, each configured to selectively house a second dressing element to adjust the dressing area of the second dressing assembly. The first and second dressing assemblies are configured to be selectively used to dress the polishing pad. This will be described in detail below.
[0031] Please see Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of an embodiment of the first trimming component of the trimming apparatus of this application used to trim a polishing pad. Figure 2 This is a schematic diagram of an embodiment of the second trimming component of the trimming device of this application used to trim a polishing pad.
[0032] In one embodiment, the dressing device 10 is used to dress a polishing pad. The dressing device 10 includes a first dressing component 11, which includes a first dressing wheel 111 and a first dressing element 112. The first dressing wheel 111 has a plurality of first mounting holes 113, and each first mounting hole 113 is fitted with a first dressing element 112. That is, the first dressing component 11 is used to dress the polishing pad as a whole. The dressing device 10 also includes a second dressing component 12, which includes a second dressing wheel 121 and a second dressing element 122. The second dressing wheel 121 has a plurality of second mounting holes 123, and each second mounting hole 123 is configured to selectively fit a second dressing element 122 to adjust the dressing area of the second dressing component 12. That is, the dressing area of the dressing device 10 can be adjusted to meet the need for dressing a local area of the polishing pad.
[0033] Furthermore, in this embodiment, the first trimming component 11 and the second trimming component 12 are configured to be selectively used for trimming the polishing pad. This means that the trimming device 10 in this embodiment can adapt to application scenarios such as overall trimming of the polishing pad and trimming of a local area. When overall trimming of the polishing pad is required, the first trimming component 11 is selected to trim the polishing pad. When trimming of a local area of the polishing pad is required, the second trimming component 12 is selected to trim the polishing pad. The trimming area of the second trimming component 12 can be adjusted so that the second trimming component 12 can precisely and efficiently trim the local area of the polishing pad that needs trimming, thus enriching the application scenarios that the trimming device 10 can adapt to.
[0034] The first trimming component 11 of the present application embodiment will be described below.
[0035] Please refer to the following: Figure 3 , Figure 3 This is a structural schematic diagram of an embodiment of the first trimming wheel of this application.
[0036] In one embodiment, a plurality of first mounting holes 113 on the first dressing wheel 111 are distributed at intervals along the circumference of the first dressing wheel 111. Further, each first mounting hole 113 may be evenly distributed at intervals along the circumference of the first dressing wheel 111, that is, the distance between any two adjacent first mounting holes 113 is equal in the circumference of the first dressing wheel 111. Figure 3 An example is shown where the first dressing wheel 111 has three first mounting holes 113, which are evenly spaced along the circumference of the first dressing wheel 111.
[0037] Optionally, the first mounting hole 113 extends through the first dressing wheel 111 along its thickness direction, allowing the first dressing element 112 mounted in the first mounting hole 113 to simultaneously dress the polishing pads on both sides of the first dressing wheel 111. Furthermore, the first dressing element 112 can be a diamond disc or similar material, composed of a metal disc plated with diamond particles. The diamond particles on the first dressing element 112 are fine and do not easily fall off, ensuring good flatness and cleanliness of the polishing pad surface after dressing. This helps guarantee dressing efficiency and effect, thereby more effectively controlling the parameters and morphology of the silicon wafer and reducing the likelihood of scratches. The first dressing wheel 111 can be made of materials such as fiberglass, which possess excellent mechanical properties and wear resistance.
[0038] In one embodiment, the first dressing wheel 111 is further provided with a first functional hole 114, through which the user can conveniently put in and take out the first dressing wheel 111, and the user can also hang the first dressing wheel 111 on an external storage structure through the first functional hole 114. The opening area of the first functional hole 114 is smaller than the opening area of the first mounting hole 113, which means that the opening area of the first functional hole 114 in this embodiment is smaller, so that the first functional hole 114 will not significantly affect the size of the area of the first dressing wheel 111 used to set the first dressing element 112. This is beneficial to ensure that the first dressing wheel 111 is provided with a sufficient size and number of first dressing elements 112, and to ensure the dressing efficiency and dressing effect of the first dressing component 11.
[0039] For example, in the case where the plurality of first mounting holes 113 are distributed at intervals along the circumference of the first dressing wheel 111, the first dressing wheel 111 is provided with a plurality of first functional holes 114, the opening area of a single first functional hole 114 is smaller than the opening area of a single first mounting hole 113, and the first mounting holes 113 and the first functional holes 114 are distributed alternately at intervals along the circumference of the first dressing wheel 111.
[0040] The second trimming component 12 of the present application embodiment will be described below.
[0041] Please refer to the following: Figure 4 , Figure 4 This is a schematic diagram of the structure of an embodiment of the second trimming wheel of this application.
[0042] In one embodiment, the plurality of second mounting holes 123 on the second dressing wheel 121 include first mounting sub-holes 1231 and second mounting sub-holes 1232. There are multiple first mounting sub-holes 1231, which are spaced apart circumferentially along the second dressing wheel 121, and the minimum distance from each first mounting sub-hole 1231 to the outer edge of the second dressing wheel 121 is equal. Each first mounting sub-hole 1231 surrounds the outer periphery of the second mounting sub-hole 1232. In this embodiment, the second dressing member 122 is mounted by providing the first mounting sub-holes 1231 and / or the second mounting holes 1232 to adjust the dressing area of the second dressing assembly 12.
[0043] Specifically, such as Figure 1 and Figure 2 As shown, the dressing device 10 also includes an internal gear 131 and an external gear ring 132, with the external gear ring 132 fitted around the outer periphery of the internal gear 131. A first dressing assembly 11 and a second dressing assembly 12 are configured to selectively mesh between the internal gear 131 and the external gear ring 132. The internal gear 131 and the external gear ring 132 are configured to cooperate in driving either the first dressing assembly 11 or the second dressing assembly 12 to rotate on its own axis and revolve around the circumference of the internal gear 131, thereby dressing the polishing pad. Figure 1 An exemplary illustration shows the first trimming component 11 meshing between the internal gear 131 and the external gear ring 132. There are three groups of the first trimming component 11, each group of which meshes between the internal gear 131 and the external gear ring 132, and each group of the first trimming component 11 is distributed at intervals along the circumference of the internal gear 131. Figure 2 An exemplary illustration shows the second trimming assembly 12 meshing between the internal gear 131 and the external gear ring 132. There are three groups of the second trimming assembly 12, each group meshing between the internal gear 131 and the external gear ring 132, and the groups of the second trimming assembly 12 are distributed circumferentially along the internal gear 131.
[0044] For example, such as Figure 4As shown, the center of the second mounting sub-hole 1232 coincides with the center of the second dressing wheel 121. There are six first mounting sub-holes 1231, evenly spaced along the outer periphery of the second mounting sub-holes 1232. Two of the first mounting sub-holes 1231 are fitted with second dressing components 122. The second dressing components 122 revolve around the internal gear 131 in the circumferential direction to form the first dressing area M. Figure 5 As shown, the second mounting sub-hole 1232 is fitted with the second trimming component 122, while the first mounting sub-hole 1231 is not fitted with the second trimming component 122. The second trimming assembly 12 revolves around the internal gear 131 in the circumferential direction to form the second trimming area N. This achieves the adjustment of the trimming area of the second trimming assembly 12.
[0045] It should be noted that, Figure 2 At least a portion of the first mounting subhole 1231 is fitted with a second trimming element 122, and the second mounting subhole 1232 is fitted with a second trimming element 122. At this time, the trimming area of the second trimming component 12 is determined by the second trimming element 122 in the first mounting subhole 1231, and the installation of the second trimming element 122 in the second mounting subhole 1232 can improve the trimming efficiency of the second trimming component 12.
[0046] Optionally, the second mounting hole 123 is provided through the second dressing wheel 121 along its thickness direction, allowing the second dressing element 122 mounted in the second mounting hole 123 to simultaneously dress the polishing pads on both sides of the second dressing wheel 121. Furthermore, the second dressing element 122 can be a diamond disc or similar material, and can be composed of a metal disc coated with diamond particles. The diamond particles on the second dressing element 122 are fine and do not easily fall off, ensuring good flatness and cleanliness of the polishing pad surface after dressing. This helps to guarantee dressing efficiency and effect, thereby more effectively controlling the parameters and morphology of the silicon wafer and reducing the risk of scratches. The second dressing wheel 121 can be made of materials such as fiberglass, which have excellent mechanical properties and wear resistance.
[0047] Please continue reading. Figure 4 In one embodiment, the second dressing wheel 121 is further provided with a second functional hole 124. The user can easily place and retrieve the second dressing wheel 121 through the second functional hole 124, and the user can also hang the second dressing wheel 121 on an external storage structure through the second functional hole 124. The opening area of the second functional hole 124 is smaller than the opening area of the second mounting hole 123, meaning that the opening area of the second functional hole 124 in this embodiment is smaller. This ensures that the second functional hole 124 does not significantly affect the size of the area on the second dressing wheel 121 used to set the second dressing element 122, which helps to ensure that the second dressing wheel 121 has a sufficient size and number of second dressing elements 122, thus guaranteeing the dressing efficiency and dressing effect of the second dressing assembly 12.
[0048] For example, in the case where the plurality of first mounting sub-holes 1231 are distributed at intervals along the circumference of the second dressing wheel 121, the second dressing wheel 121 is provided with a plurality of second functional holes 124, the opening area of a single second functional hole 124 is smaller than the opening area of a single first mounting sub-hole 1231, and the first mounting sub-holes 1231 and the second functional holes 124 are distributed alternately at intervals along the circumference of the second dressing wheel 121.
[0049] In one embodiment, the rotational speed of the first trimming component 11 is greater than that of the second trimming component 12, and the revolution speed of the first trimming component 11 is greater than that of the second trimming component 12. In other words, when the first trimming component 11 is applied to trim the polishing pad, it has a higher rotational and revolution speed, enabling it to efficiently trim the polishing pad. When the second trimming component 12 is applied to trim the polishing pad, it has a lower rotational and revolution speed. Combined with the adjustable trimming area design of the second trimming component 12, this facilitates uniform trimming of specific trimming areas of the polishing pad, ensuring both trimming efficiency and trimming effect of the second trimming component 12 while maintaining its adjustable trimming area.
[0050] For example, when the second trimming component 12 is applied to trim the polishing pad, that is, when the internal gear 131 and the external gear ring 132 cooperate to drive the second trimming component 12, one of the internal gear 131 and the external gear ring 132 is in a stationary state, so as to control the second trimming component 12 to have a lower rotation speed and revolution speed, which is beneficial to ensure the trimming efficiency and trimming effect of the second trimming component 12 on the basis that the trimming area of the second trimming component 12 is adjustable.
[0051] Please refer to the following: Figure 6 , Figure 6 This is a schematic diagram of the structure of an embodiment of the trimming system of this application.
[0052] In one embodiment, the dressing system includes a polishing disc 20 and a dressing device 10. The polishing disc 20 is used to place a polishing pad, and the dressing device 10 is used to dress the polishing pad on the polishing disc 20. It should be noted that the dressing device 10 has been described in detail in the above embodiments and will not be repeated here.
[0053] In one embodiment, the polishing disc 20 includes a first polishing disc 21 and a second polishing disc 22 disposed opposite to each other. The first trimming component 11 and the second trimming component 12 of the trimming device 10 are configured to be selectively disposed between the first polishing disc 21 and the second polishing disc 22 to trim the polishing pads on the first polishing disc 21 and the second polishing disc 22.
[0054] Specifically, the dressing system includes a first polishing pad 31 and a second polishing pad 32. The first polishing pad 31 is disposed on the side of the first polishing disk 21 facing the second polishing disk 22, and the second polishing pad 32 is disposed on the side of the second polishing disk 22 facing the first polishing disk 21. The first dressing assembly 11 and the second dressing assembly 12 are configured to be selectively disposed between the first polishing pad 31 and the second polishing pad 32 to dress the first polishing pad 31 and the second polishing pad 32.
[0055] In one embodiment, when the first trimming assembly 11 trims the polishing pad, the rotational speed of the first polishing disc 21 and the second polishing disc 22 is greater than that when the second trimming assembly 12 trims the polishing pad. The pressure between the first polishing disc 21 and the second polishing disc 22 is greater when the first trimming assembly 11 trims the polishing pad than that when the second trimming assembly 12 trims the polishing pad.
[0056] When the first dressing component 11 is applied to dress the polishing pad, the first polishing disc 21 and the second polishing disc 22 have high rotational speeds and high pressure between them, enabling the first dressing component 11 to efficiently dress the polishing pad. When the second dressing component 12 is applied to dress the polishing pad, the first polishing disc 21 and the second polishing disc 22 have lower rotational speeds and lower pressure between them. Combined with the adjustable dressing area design of the second dressing component 12, this facilitates uniform dressing of specific dressing areas of the polishing pad, ensuring both dressing efficiency and dressing effect of the second dressing component 12 based on its adjustable dressing area.
[0057] The working process of the trimming system according to the embodiments of this application is described below.
[0058] When the first dressing component 11 is applied to dress the polishing pad, the three sets of the first dressing components 11 are evenly placed on the second polishing disc 22 with the second polishing pad 32 attached. The polishing pad dressing program is started, and the first polishing disc 21 with the first polishing pad 31 attached is lowered. After the pressure between the first polishing disc 21 and the second polishing disc 22 reaches the set pressure of 100 daN to 150 daN, 5 L to 7 L of pure water flows out per minute. At the same time, the first polishing disc 21 and the second polishing disc 22 are rotated in the opposite direction. The speed difference between the first polishing disc 21 and the second polishing disc 22 can dress the polishing pad more stably and efficiently. The rotational speed of the first polishing disc 21 can be +18 rpm, the rotational speed of the second polishing disc 22 can be -15.6 rpm, the rotational speed of the internal gear 131 can be -9.9 rpm, and the rotational speed of the external gear ring 132 can be +3.9 rpm.
[0059] When the second dressing component 12 is applied to dress the polishing pad, the three sets of second dressing components 12 are evenly placed on the second polishing disc 22 with the second polishing pad 32 attached. The second dressing component 122 is installed in each of the second mounting holes 123 of the second dressing wheel 121 according to actual needs. The polishing pad dressing program is started, allowing the first polishing disc 21 with the first polishing pad 31 attached to it to descend. After the pressure between the first polishing disc 21 and the second polishing disc 22 reaches the set pressure of 50 daN to 100 daN, 5 L to 7 L of pure water flows out per minute. Simultaneously, the first polishing disc 21 and the second polishing disc 22 rotate in opposite directions. The rotation speed of the first polishing disc 21 can be +6.0 rpm, and the rotation speed of the second polishing disc 22 can be -2.0 rpm. One of the internal gear 131 and the external gear ring 132 is stationary. The function of alternating forward and reverse rotation of the first polishing disc 21 and the second polishing disc 22 is set. The low-speed, low-pressure operation of the first polishing disc 21 and the second polishing disc 22 enables uniform trimming of specific trimming areas of the polishing pad, resulting in better flatness. The second trimming component 122 is selectively installed through the second mounting holes 123 of the second trimming component 12 to adjust the trimming area of the second trimming component 12, allowing trimming of different areas of the polishing pad. Based on the adjustable trimming area of the second trimming component 12, controlling the speed and pressure of the first polishing disc 21 and the second polishing disc 22 allows the trimming system to adapt to a wider range of polishing pad trimming scenarios.
[0060] In summary, this application provides a dressing device and system for a polishing pad. The dressing device includes a first dressing component and a second dressing component. In the first dressing component, each first mounting hole on the first dressing wheel is fitted with a first dressing element, meaning the first dressing component is used for overall dressing of the polishing pad. In the second dressing component, each second mounting hole on the second dressing wheel is configured to selectively mount a second dressing element to adjust the dressing area of the second dressing component. By selectively mounting the second dressing element through the second mounting holes of the second dressing wheel, this application can adjust the dressing area of the second dressing component, thus enabling adjustment of the dressing area of the dressing device to meet the need for dressing a local area of the polishing pad. Furthermore, the first and second dressing components of this application are configured to be used selectively for dressing the polishing pad, adapting to application scenarios such as overall dressing of the polishing pad and dressing a local area, thereby enriching the application scenarios that the dressing device can adapt to.
[0061] The polishing pad dressing device and dressing system provided in this application have been described in detail above. Specific examples have been used to illustrate the principle and implementation of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core idea of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation and application scope based on the idea of this application. Therefore, the content of this specification should not be construed as a limitation of this application.
Claims
1. A dressing device for a polishing pad, characterized by, The trimming device includes: A first dressing assembly includes a first dressing wheel and a first dressing element. The first dressing wheel has multiple first mounting holes, and the first dressing element is mounted in each of the first mounting holes. The second trimming assembly includes a second trimming wheel and a second trimming element. The second trimming wheel has a plurality of second mounting holes, and each second mounting hole is configured to selectively mount the second trimming element to adjust the trimming area of the second trimming assembly. The first trimming component and the second trimming component are configured to selectively trim the polishing pad.
2. The trimming device according to claim 1, characterized in that, The plurality of second mounting holes include a plurality of first mounting sub-holes, each of the first mounting sub-holes being distributed at intervals along the circumference of the second dressing wheel, and the minimum distance from each of the first mounting sub-holes to the outer edge of the second dressing wheel being equal.
3. The trimming device according to claim 2, characterized in that, The plurality of second mounting holes further include second mounting sub-holes, and each of the first mounting sub-holes surrounds the outer periphery of the second mounting sub-hole.
4. The trimming device according to claim 3, characterized in that, The second mounting sub-hole and at least a portion of the first mounting sub-hole are fitted with the second trimmer.
5. The trimming device according to any one of claims 1 to 4, characterized in that, The first dressing wheel also has a first functional hole, the opening area of which is smaller than the opening area of the first mounting hole; and / or The second dressing wheel is also provided with a second functional hole, the opening area of which is smaller than the opening area of the second mounting hole.
6. The trimming device according to any one of claims 1 to 4, characterized in that, The first dressing wheel is also provided with a plurality of first functional holes. The opening area of a single first functional hole is smaller than the opening area of a single first mounting hole, and the first mounting holes and the first functional holes are alternately distributed along the circumference of the first dressing wheel.
7. The trimming device according to any one of claims 2 to 4, characterized in that, The second dressing wheel is also provided with a plurality of second functional holes. The opening area of a single second functional hole is smaller than the opening area of a single first mounting sub-hole, and each first mounting sub-hole and each second functional hole are alternately distributed along the circumference of the second dressing wheel.
8. The trimming device according to claim 1, characterized in that, The dressing device further includes an internal gear and an external gear ring, the external gear ring being sleeved on the outer periphery of the internal gear, the first dressing component and the second dressing component being configured to selectively mesh between the internal gear and the external gear ring, the internal gear and the external gear ring being configured to cooperate in driving the first dressing component or the second dressing component to rotate and revolve around the circumference of the internal gear.
9. The trimming device according to claim 8, characterized in that, The rotational speed of the first trimming component is greater than that of the second trimming component, and the revolution speed of the first trimming component is greater than that of the second trimming component.
10. The trimming device according to claim 8, characterized in that, When the internal gear and the external gear ring are engaged to drive the second dressing assembly, one of the internal gear and the external gear ring is in a stationary state.
11. A dressing system characterized by, It includes a polishing disc and a dressing device as described in any one of claims 1 to 10, wherein the polishing disc is used to set a polishing pad.
12. The trimming system according to claim 11, characterized in that, The polishing pads include a first polishing pad and a second polishing pad disposed opposite to each other. The first trimming component and the second trimming component of the trimming device are configured to be selectively disposed between the first polishing pad and the second polishing pad to trim the polishing pads on the first polishing pad and the second polishing pad. Wherein, when the first trimming component trims the polishing pad, the rotational speed of the first polishing disc and the second polishing disc is greater than that when the second trimming component trims the polishing pad; When the first trimming component trims the polishing pad, the pressure between the first polishing disc and the second polishing disc is greater than the pressure between the first polishing disc and the second polishing disc when the second trimming component trims the polishing pad.