Slicing device for wafer production
By combining precise displacement design with a dust collection system, the problems of insufficient cutting accuracy and inadequate dust handling in traditional wafer slicing equipment have been solved, achieving efficient cutting and clean production, and improving the quality and safety of semiconductor manufacturing.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SICHUAN HAICHENG CHUANGTE TECHNOLOGY CO LTD
- Filing Date
- 2025-04-24
- Publication Date
- 2026-04-21
AI Technical Summary
Traditional wafer slicing equipment lacks sufficient positioning and movement precision during the cutting process, resulting in uneven wafer thickness, large dimensional deviations, and a lack of effective dust control systems, which affects equipment operation and the health of operators.
The cutting device and dust collection system, designed with precise displacement, ensure stable movement of the cutting components through the sliding connection between the movable block and the plate, and utilize the filter mesh and suction head to adsorb dust, achieving efficient dust collection and treatment.
It improves cutting precision, ensures uniform wafer thickness, reduces production costs, enhances chip performance and yield, and reduces dust diffusion, protecting operator health and equipment operation.
Smart Images
Figure CN224145040U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to a wafer slicing device for wafer production. Background Technology
[0002] In traditional wafer slicing equipment, the positioning and movement precision of the cutting components are limited. Ordinary mechanical transmission structures cannot guarantee that the cutting blades maintain a stable and precise position throughout the cutting process, resulting in uneven wafer thickness and large dimensional deviations. This lack of precision is extremely critical in high-end semiconductor manufacturing. For example, in chip manufacturing, even small deviations in wafer thickness can affect chip performance and yield, increasing production costs. At the same time, current equipment generates a large amount of fine dust during wafer slicing. Traditional equipment lacks effective dust collection and treatment systems. If this dust spreads in the workshop, it will not only harm the health of operators but may also adhere to the equipment surface and wafers, affecting the normal operation of the equipment and wafer quality. Utility Model Content
[0003] The main objective of this invention is to provide a wafer slicing apparatus for wafer production, which can effectively solve the problems in the background art.
[0004] To achieve the above objectives, the technical solution adopted by this utility model is as follows:
[0005] A wafer slicing apparatus includes a base plate. A cutting device is fixedly connected to the upper front and upper rear of the base plate. Support feet are fixedly connected to the four corners of the lower end of the base plate. A mounting plate is fixedly connected to the inner sides of the four support feet. A dust extraction device is fixedly connected to the upper end of the mounting plate. Clamping frames are fixedly connected to the upper left and upper right of the base plate. Screws are threaded into the two clamping frames. A handwheel and a clamping plate are fixedly connected to the upper and lower ends of the two screws, respectively.
[0006] Preferably, the cutting device includes an L-shaped connecting plate, and two L-shaped connecting plates are provided. The inner sides of the two L-shaped connecting plates are fixedly connected to a connecting frame. The left and right inner walls of the connecting frame are fixedly connected to a clamping plate. The upper end of the connecting frame is fixedly connected to a U-shaped fixing frame, and the lower inner wall of the U-shaped fixing frame is fixedly connected to a rack.
[0007] Preferably, the two card plates are slidably connected to a movable block. The upper left and right ends of the movable block are fixedly connected to side plates. The right end of the right side plate is fixedly connected to a first rotary motor. The output end of the first rotary motor passes through the right side plate and is fixedly connected to a gear. The lower end of the movable block is fixedly connected to a cutting component.
[0008] Preferably, the two L-shaped connecting plates are arranged in a front-to-back mirror image configuration.
[0009] Preferably, the gear and rack are meshed together, and the left end of the gear is movably connected to the right end of the left side plate via a bearing, with the two side plates being distributed in a left-right mirror image.
[0010] Preferably, the cutting assembly includes an electric telescopic rod, the output end of which is fixedly connected to an L-shaped frame, the rear end of which is fixedly connected to a second rotary motor, the output end of which passes through the L-shaped frame and is fixedly connected to a cutting wheel, a top block is fixedly connected to the front of the upper inner wall of the L-shaped frame, a lifting sleeve is fixedly connected to the lower end of the top block, a spring is provided on the outer surface of the lifting sleeve, a pulley is fixedly connected to the lower end of the lifting sleeve, and the upper end of the electric telescopic rod is fixedly connected to the lower end of the movable block.
[0011] Preferably, the vacuuming device includes a fixed frame, with a filter mesh embedded in the upper part of the fixed frame, a drawer plate fixedly connected to the inner center of the fixed frame, a plurality of suction heads fixedly connected to the upper end of the drawer plate, a suction pipe fixedly installed at the lower end of the drawer plate, a suction pump fixedly installed at the end of the suction pipe away from the drawer plate, a discharge pipe fixedly installed on the outer surface of the suction pump, a collection box fixedly connected to the end of the discharge pipe away from the suction pump, and a drawer provided at the front end of the collection box.
[0012] Preferably, the four outer sides of the fixing frame are embedded and fixed inside the base plate, and the lower end of the fixing frame is fixedly connected to the upper end of the mounting plate.
[0013] Compared with the prior art, the present invention has the following beneficial effects:
[0014] 1. In this utility model, the cutting device of this apparatus has an ingenious structural design. The movable block achieves precise displacement through sliding connection with two clamping plates. The first rotary motor drives the gear to rotate. Since the gear and rack mesh precisely, it can ensure that the movable block moves smoothly and accurately along the rack direction, thereby driving the fixed cutting component below to move stably. Compared with the traditional ordinary mechanical transmission structure, this design greatly improves the positioning and movement accuracy of the cutting component, so that the cutting wheel always maintains a stable and precise position during the cutting process, effectively ensuring that the cut wafer has uniform thickness and minimal dimensional deviation. In the field of high-end semiconductor manufacturing, such as chip manufacturing, it can significantly improve chip performance and yield, and reduce production costs.
[0015] 2. In this utility model, the dust collection device provides an effective solution to the dust problem. The filter iron mesh embedded in the upper part of the fixed frame can initially intercept larger dust particles. Under the action of the pump, the suction heads on the drawer can strongly adsorb the fine dust generated during the cutting process. The dust is pumped to the collection box through the suction pipe. The drawer facilitates regular cleaning of the collected dust. This dust collection and dust treatment system effectively avoids the spread of dust in the workshop, greatly reduces the harm to the health of operators, and at the same time reduces the possibility of dust adhering to the surface of equipment and wafers, ensuring the normal operation of equipment, improving wafer quality, and eliminating resource waste and environmental pollution caused by dust. Attached Figure Description
[0016] Figure 1 This is a schematic diagram of the overall structure of a wafer slicing device for wafer production according to the present invention;
[0017] Figure 2 This is a schematic diagram of the connection and disassembly structure of the cutting device of a wafer slicing apparatus for wafer production according to the present invention;
[0018] Figure 3 This is a schematic diagram of the connection and disassembly structure of the cutting component of a wafer slicing device for wafer production according to the present invention;
[0019] Figure 4 This is a schematic diagram of the connection and disassembly structure of the dust collection device in a wafer slicing apparatus for wafer production according to this utility model.
[0020] In the diagram: 1. Base plate; 2. Cutting device; 3. Support foot; 4. Mounting plate; 5. Dust collection device; 6. Clamping frame; 7. Screw; 8. Handwheel; 9. Clamping plate; 21. L-shaped connecting plate; 22. Connecting frame; 23. Clamping plate; 24. U-shaped fixing frame; 25. Rack; 26. Movable block; 27. Side plate; 28. First rotary motor; 29. Gear; 210. Cutting assembly; 2101. Electric telescopic rod; 2102. L-shaped frame; 2103. Second rotary motor; 2104. Cutting wheel; 2105. Top block; 2106. Lifting sleeve; 2107. Spring; 2108. Pulley; 51. Fixing frame; 52. Filter mesh; 53. Drawer; 54. Suction head; 55. Suction pipe; 56. Pump; 57. Discharge pipe; 58. Collection box; 59. Drawer. Detailed Implementation
[0021] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.
[0022] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0023] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," and "connected," etc., should be interpreted broadly. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0024] Please see Figure 1-4 This utility model provides a technical solution:
[0025] A wafer slicing apparatus includes a base plate 1. A cutting device 2 is fixedly connected to the upper front and upper rear of the base plate 1. Support feet 3 are fixedly connected to the four corners of the lower end of the base plate 1. Mounting plates 4 are fixedly connected to the inner sides of the four support feet 3. A dust collection device 5 is fixedly connected to the upper end of the mounting plate 4. Clamping frames 6 are fixedly connected to the upper left and upper right of the base plate 1. Screws 7 are threaded into the two clamping frames 6. Handwheels 8 and clamping plates 9 are fixedly connected to the upper and lower ends of the two screws 7, respectively.
[0026] In this embodiment, the cutting device 2 includes two L-shaped connecting plates 21. A connecting frame 22 is fixedly connected to the inner sides of both L-shaped connecting plates 21. A clamping plate 23 is fixedly connected to the left and right inner walls of the connecting frame 22. A U-shaped fixing frame 24 is fixedly connected to the upper end of the connecting frame 22, and a rack 25 is fixedly connected to the lower inner wall of the U-shaped fixing frame 24. A movable block 26 is slidably connected to both clamping plates 23. Side plates 27 are fixedly connected to the upper left and right ends of the movable block 26. A first rotary motor 28 is fixedly connected to the right end of the right side plate 27. A gear 29 is fixedly connected to the output end of the first rotary motor 28 through the right side plate 27. A cutting assembly 210 is fixedly connected to the lower end of the movable block 26. The two L-shaped connecting plates 21 are arranged in a front-to-back mirror image. The gear 29 and rack 25 are meshed with... The gear 29 is connected to the right end of the left side plate 27 via a bearing, and the two side plates 27 are mirror images of each other. The cutting assembly 210 includes an electric telescopic rod 2101, an L-shaped frame 2102 is fixedly connected to the output end of the electric telescopic rod 2101, a second rotary motor 2103 is fixedly connected to the rear end of the L-shaped frame 2102, a cutting wheel 2104 is fixedly connected to the output end of the second rotary motor 2103 through the L-shaped frame 2102, a top block 2105 is fixedly connected to the front of the upper inner wall of the L-shaped frame 2102, a lifting sleeve rod 2106 is fixedly connected to the lower end of the top block 2105, a spring 2107 is provided on the outer surface of the lifting sleeve rod 2106, a pulley 2108 is fixedly connected to the lower end of the lifting sleeve rod 2106, and the upper end of the electric telescopic rod 2101 is fixedly connected to the lower end of the movable block 26.
[0027] Through the above scheme: When the cutting device 2 is working, two L-shaped connecting plates 21, which are distributed in a front-to-back mirror shape, stably support the connecting frame 22. The clamping plates 23 on the left and right inner walls of the connecting frame 22 are slidably connected to the movable block 26, providing guidance for its movement. The first rotary motor 28 is started, and its output end drives the gear 29 to rotate. Because the gear 29 meshes with the rack 25 on the lower inner wall of the U-shaped fixed frame 24, the movable block 26 moves smoothly under the action of the rack 25. The side plates 27 distributed in a left-to-right mirror shape ensure the stable movement of the movable block 26. The electric telescopic rod 2101 connected to the lower end of the movable block 26 pushes the L-shaped frame 2102 down. The second rotary motor 2103 at the rear end of the L-shaped frame 2102 is started, driving the cutting wheel 2104 to rotate at high speed to cut the crystal rod 4. At the same time, the spring 2107 outside the lifting sleeve 2106 at the lower end of the top block 2105 makes the pulley 2108 close to the surface of the crystal rod, assisting in stable cutting and ensuring that the cutting operation is accurate and efficient.
[0028] In this embodiment, the vacuuming device 5 includes a fixed frame 51, a filter iron mesh 52 is embedded in the upper part of the fixed frame 51, a drawer plate 53 is fixedly connected to the middle part of the fixed frame 51, a plurality of suction heads 54 are fixedly connected to the upper end of the drawer plate 53, a suction pipe 55 is fixedly installed at the lower end of the drawer plate 53, a suction pump 56 is fixedly installed at the end of the suction pipe 55 away from the drawer plate 53, a discharge pipe 57 is fixedly installed on the outer surface of the suction pump 56, a collection box 58 is fixedly connected to the end of the discharge pipe 57 away from the suction pump 56, and a drawer 59 is provided at the front end of the collection box 58; the four outer sides of the fixed frame 51 are embedded and fixed in the base plate 1, and the lower end of the fixed frame 51 is fixedly connected to the upper end of the mounting plate 4.
[0029] Through the above scheme: When the dust collection device 5 is working, the fixed frame 51 is tightly embedded in the base plate 1, and the lower end is connected to the mounting plate 4, providing stable support for the whole. After the dust generated by cutting is raised, it first encounters the filter iron mesh 52 embedded in the upper part of the fixed frame 51. Larger dust particles are initially intercepted here. The pump 56 is started, which generates suction. The suction force is transmitted through the suction pipe 55 to the suction head 54 on the suction plate 53. Several suction heads 54 suck the fine dust into the suction plate 53, and then transport it to the pump 56 through the suction pipe 55. The pump 56 discharges the collected dust into the collection box 58 through the discharge pipe 57, completing the dust collection. The drawer 59 set at the front of the collection box 58 makes it convenient to open and clean the collected dust regularly, ensuring that the dust collection device 5 continues to operate efficiently, effectively purifying the dust generated by the cutting operation, maintaining the cleanliness of the workshop environment, and ensuring that the equipment and wafers are not contaminated by dust.
[0030] It should be noted that this utility model is a slicing device for wafer production. During use, firstly, the device is placed in a stable working area. The base plate 1 is firmly supported by four support feet 3. The mounting plate 4 connects to the four support feet 3 and carries the dust collection device 5. The crystal rod to be cut is placed between two clamping frames 6. Turning the handwheel 8 rotates the screw 7, causing the clamping plate 9 to move and firmly clamp the crystal rod, ensuring stability during the cutting process. The cutting device 2 is then started, and the first rotary motor 28 operates, driving the gear 29 to rotate. Because the gear 29 meshes with the rack 25, the movable block 26 moves smoothly along the rack 25, driving the slicing device... The cutting component 210 is displaced, and the electric telescopic rod 2101 pushes the L-shaped frame 2102 down. The second rotary motor 2103 drives the cutting wheel 2104 to rotate at high speed to cut the crystal rod. The pulley 2108 is pressed tightly against the surface of the crystal rod under the action of the spring 2107 to assist in stabilizing the cutting. The dust generated during cutting is first intercepted by the filter iron mesh 52 in the fixed frame 51. The pump 56 is started, and the fine dust is sucked into the suction pipe 55 through the suction head 54 on the suction plate 53 and transported to the collection box 58. The drawer 59 facilitates regular cleaning of dust. After the cutting is completed, the clamping plate 9 is released by reverse operation, and the cut wafer is taken out, completing one cutting process.
[0031] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.
Claims
1. A slicing apparatus for wafer production comprising a base plate (1), characterized in that: A cutting device (2) is fixedly connected to the front and rear of the upper end of the base plate (1). Support feet (3) are fixedly connected to the four corners of the lower end of the base plate (1). Mounting plate (4) is fixedly connected to the inner side of the four support feet (3). A dust collection device (5) is fixedly connected to the upper end of the mounting plate (4). A clamping frame (6) is fixedly connected to the left and right of the upper end of the base plate (1). A screw (7) is threaded into the two clamping frames (6). A handwheel (8) and a clamping plate (9) are fixedly connected to the upper and lower ends of the two screws (7), respectively. The cutting device (2) includes an L-shaped connecting plate (21), and there are two L-shaped connecting plates (21). The inner sides of the two L-shaped connecting plates (21) are fixedly connected to a connecting frame (22). The left and right inner walls of the connecting frame (22) are fixedly connected to a clamping plate (23). The upper end of the connecting frame (22) is fixedly connected to a U-shaped fixing frame (24), and the lower inner wall of the U-shaped fixing frame (24) is fixedly connected to a rack (25).
2. The slicing apparatus for wafer production according to claim 1, wherein: The two card plates (23) are slidably connected to a movable block (26). The upper left and right ends of the movable block (26) are fixedly connected to side plates (27). The right end of the right side plate (27) is fixedly connected to a first rotary motor (28). The output end of the first rotary motor (28) passes through the right side plate (27) and is fixedly connected to a gear (29). The lower end of the movable block (26) is fixedly connected to a cutting assembly (210).
3. The slicing apparatus for wafer production according to claim 1, wherein: The two L-shaped connecting plates (21) are arranged in a front-to-back mirror image distribution.
4. The slicing apparatus for wafer production according to claim 2, wherein: The gear (29) and rack (25) are meshed together. The left end of the gear (29) is movably connected to the right end of the left side plate (27) through a bearing. The two side plates (27) are distributed in a left-right mirror image.
5. The slicing apparatus for wafer production according to claim 2, wherein: The cutting assembly (210) includes an electric telescopic rod (2101), the output end of which is fixedly connected to an L-shaped frame (2102), the rear end of which is fixedly connected to a second rotary motor (2103), the output end of which passes through the L-shaped frame (2102) and is fixedly connected to a cutting wheel (2104), the front of the upper inner wall of the L-shaped frame (2102) is fixedly connected to a top block (2105), the lower end of which is fixedly connected to a lifting sleeve rod (2106), the outer surface of which is provided with a spring (2107), the lower end of which is fixedly connected to a pulley (2108), and the upper end of the electric telescopic rod (2101) is fixedly connected to the lower end of the movable block (26).
6. The slicing apparatus for wafer production according to claim 1, wherein: The vacuuming device (5) includes a fixed frame (51), a filter iron mesh (52) is embedded in the upper part of the fixed frame (51), a drawer plate (53) is fixedly connected to the middle part of the fixed frame (51), a plurality of suction heads (54) are fixedly connected to the upper end of the drawer plate (53), a suction pipe (55) is fixedly installed at the lower end of the drawer plate (53), a suction pump (56) is fixedly installed at the end of the suction pipe (55) away from the drawer plate (53), a discharge pipe (57) is fixedly installed on the outer surface of the suction pump (56), a collection box (58) is fixedly connected to the end of the discharge pipe (57) away from the suction pump (56), and a drawer (59) is provided at the front end of the collection box (58).
7. The slicing apparatus of claim 6, wherein: The four outer sides of the fixed frame (51) are embedded and fixed inside the base plate (1), and the lower end of the fixed frame (51) is fixedly connected to the upper end of the mounting plate (4).