Carrier for MEMS chip processing

Abstract

The utility model discloses a carrier for MEMS chip processing, which relates to the technical field of chip processing and comprises a mounting box, a fixing mechanism is arranged in an inner cavity of the mounting box, a lifting mechanism is arranged in the inner cavity of the mounting box, the fixing mechanism comprises mounting cavities arranged on two sides of the inner cavity of the mounting box, and the lifting mechanism is arranged in the mounting cavities. A two-way screw rod is rotationally arranged on the edge portion between the two sides of the interior of the mounting cavity in a penetrating mode, rotary knobs are fixed to the two ends of the two-way screw rod, and movable seats are symmetrically connected to the outer side of the two-way screw rod in a threaded mode; according to the carrier for MEMS chip processing, a fixing mechanism is arranged, a rotary knob is rotated, so that a two-way screw rod rotates, moving bases are driven to be far away from each other, a connecting rod deflects, a connecting base drives clamping plates to move, the distance between the two clamping plates is adjusted, a chip is clamped and fixed, adjustment is conveniently conducted according to the size of the chip, and the practicability of the carrier is improved. Different chips can be fixed conveniently, replacement of different carriers is avoided, and the applicability of the device is improved.

Description

Technical Field

[0001] This utility model relates to the field of chip processing technology, specifically a carrier for MEMS chip processing. Background Technology

[0002] MEMS chips are electromechanical systems manufactured on silicon wafers using semiconductor technology. During the processing of MEMS chips, when the reflow soldering step is reached, the MEMS chip is placed on a conveyor belt and transported to the reflow soldering machine for soldering. However, because the MEMS chip is placed directly on the conveyor belt, and because the high temperature of soldering can easily cause the MEMS chip to bend, it is difficult to position the MEMS chip accurately, and the pins of the MEMS chip are easily mis-soldered, resulting in an increased defect rate. Therefore, a special carrier is added to the outside of the MEMS chip to prevent the MEMS chip from bending.

[0003] Chinese patent CN216957976U discloses a carrier for MEMS chip processing, including a carrier body. A placement groove is formed in the middle of the upper surface of the carrier body. Clamping plates are provided on both sides of the inner cavity of the placement groove. Guide rods are fixedly connected to both ends of the two clamping plates on the side away from each other. Guide grooves are formed on the inner walls of both ends of the placement groove. One end of the guide rod is inserted into the interior of the guide groove, and the other end of the guide rod is connected to the inner wall of the guide groove through a compression spring. This invention features two clamping plates within a placement slot. These plates, under the action of a compression spring, can clamp and limit chips of different sizes. The clamping plates are further tightened and limited by studs on the clamping assembly, ensuring stable chip clamping. This improves the working range and efficiency of the device. As can be seen from the aforementioned patent, current chip carriers generally only support one type and size of chip. Different carriers are required to support different chips, limiting their ability to accommodate varying chip sizes and resulting in lower working range and efficiency. Therefore, we propose a carrier for MEMS chip processing. Summary of the Invention

[0004] The purpose of this utility model is to provide a carrier for MEMS chip processing, so as to solve the problem in the prior art, as can be seen from the above-mentioned patents, that current chip carriers can generally only fix chips of one type and size. When fixing different chips, different carriers need to be changed, and different sizes of chips cannot be fixed as needed, resulting in low working range and efficiency.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a carrier for MEMS chip processing, comprising a mounting box, wherein a fixing mechanism is provided in the inner cavity of the mounting box, and a lifting mechanism is provided in the inner cavity of the mounting box;

[0006] The fixing mechanism includes mounting cavities on both sides of the inner cavity of the mounting box. A bidirectional screw is rotatably driven through the edge between the two sides of the inner cavity. Knobs are fixed at both ends of the bidirectional screw. A movable seat is symmetrically screwed to the outer side of the bidirectional screw. A connecting rod is rotatably driven inside the movable seat. A clamping plate is symmetrically slidable inside the mounting box. A connecting seat is symmetrically fixed to one side of the clamping plate.

[0007] Preferably, the inner cavity of the mounting box is provided with first limiting grooves on both sides, the clamping plate is fixed with first limiting blocks at the middle of both sides, the mounting cavity is provided with a second limiting groove on one side, and the movable seat is fixed with a second limiting block at the middle of one side.

[0008] Preferably, one end of the connecting rod rotates inside the connecting seat, so that the moving seat and the connecting seat are linked. The outer side of the knob is provided with anti-slip texture to prevent slippage when rotating the knob.

[0009] Preferably, the first limiting block slides inside the first limiting groove, and the outer side wall of the first limiting block is in contact with the inner side wall of the first limiting groove to limit the clamping plate and make the clamping plate move stably.

[0010] Preferably, the second limiting block slides inside the second limiting groove, and the outer side wall of the second limiting block is in contact with the inner side wall of the second limiting groove to limit the moving seat.

[0011] Preferably, the lifting mechanism includes slide rods fixed at the four corners of the bottom of the inner cavity of the mounting box, a circular plate fixed at the top of the slide rods, a return spring fixed at the top of the circular plate, a placement plate connected to the inner cavity of the mounting box, and a contraction cavity formed at the four corners of the bottom of the placement plate.

[0012] Preferably, the top of both sides of the placement plate is provided with inclined surfaces to facilitate the clamping plate to squeeze the placement plate and lower the placement plate. The circular plate slides inside the contraction cavity, and the outer wall of the circular plate is in contact with the inner wall of the contraction cavity. The top of the return spring is fixed to the top of the inner cavity of the contraction cavity.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] 1. In this application, by using a fixing mechanism, the bidirectional screw is rotated by turning the knob, which drives the moving seats to move away from each other, thereby causing the connecting rod to deflect. This causes the connecting seat to move the clamping plate, thereby adjusting the distance between the two clamping plates to clamp and fix the chip. This makes it easy to adjust according to the size of the chip, making it easy to fix different chips, avoiding the need to change different carriers, and improving the applicability of the device.

[0015] 2. In this application, the lifting mechanism is used to press the inclined surface of the placement plate when the clamping plate moves, causing the placement plate to descend and the circular plate to move inside the shrinkage cavity. This presses the return spring, causing it to deform. After processing, the fixing is released, and the two clamping plates move away from each other. The return spring resets the placement plate, making it easier for the placement plate to lift the chip and facilitate chip removal, thus improving the practicality of the device. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0017] Figure 2 This is a schematic diagram of the fixing mechanism structure of this utility model;

[0018] Figure 3 This is a top view of the fixing mechanism of this utility model;

[0019] Figure 4 This is a schematic diagram of the placement mechanism of this utility model;

[0020] Figure 5 This is a schematic diagram of the main structure of the placement mechanism of this utility model.

[0021] The following numbers are labeled in the diagram: 100, mounting box; 200, fixing mechanism; 210, mounting cavity; 220, double-acting screw; 221, knob; 230, movable seat; 240, connecting rod; 250, clamping plate; 260, connecting seat; 270, first limiting groove; 271, first limiting block; 280, second limiting groove; 281, second limiting block; 300, lifting mechanism; 310, sliding rod; 320, circular plate; 330, return spring; 340, placement plate; 350, retraction cavity. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Example: Figures 1-5 As shown, this utility model provides a technical solution for a carrier for MEMS chip processing, including a mounting box 100, a fixing mechanism 200 provided in the inner cavity of the mounting box 100, and a lifting mechanism 300 provided in the inner cavity of the mounting box 100.

[0024] Please see Figure 2 and Figure 3The fixing mechanism 200 includes mounting cavities 210 formed on both sides of the inner cavity of the mounting box 100. A bidirectional screw 220 is rotatably threaded through the edge between the two sides of the inner cavity 210. Knobs 221 are fixed at both ends of the bidirectional screw 220. A movable seat 230 is symmetrically screwed to the outer side of the bidirectional screw 220. A connecting rod 240 is rotatably connected inside the movable seat 230. A clamping plate 250 is symmetrically slidable inside the mounting box 100. A connecting seat 260 is symmetrically fixed on one side of the clamping plate 250. First limiting grooves 270 are formed on both sides of the inner cavity of the mounting box 100. First limiting blocks 271 are fixed at the middle of both sides of the clamping plate 250. A second limiting groove 280 is formed on one side of the mounting cavity 210. A second limiting block 281 is fixed at the middle of one side of the movable seat 230. One end of the connecting rod 240 rotates inside the connecting seat 260. The knob 221 has anti-slip texture on its outer side; the first limiting block 271 slides inside the first limiting groove 270, and the outer side wall of the first limiting block 271 is in contact with the inner side wall of the first limiting groove 270; the second limiting block 281 slides inside the second limiting groove 280, and the outer side wall of the second limiting block 281 is in contact with the inner side wall of the second limiting groove 280; by using the fixing mechanism 200, rotating the knob 221 causes the bidirectional screw 220 to rotate, which drives the moving seats 230 to move away from each other, thereby causing the connecting rod 240 to deflect, causing the connecting seat 260 to drive the clamping plate 250 to move, thereby adjusting the distance between the two clamping plates 250 to clamp and fix the chip, which is convenient to adjust according to the size of the chip, convenient to fix different chips, avoid changing different carriers, and improve the applicability of the device.

[0025] Please see Figure 4 and Figure 5 The lifting mechanism 300 includes slide rods 310 fixed at the four corners of the bottom of the inner cavity of the mounting box 100. A circular plate 320 is fixed to the top of the slide rod 310, and a return spring 330 is fixed to the top of the circular plate 320. A placement plate 340 is connected to the inner cavity of the mounting box 100. A contraction cavity 350 is formed at the four corners of the bottom of the placement plate 340. Inclined surfaces are provided on the top of both sides of the placement plate 340. The circular plate 320 slides inside the contraction cavity 350, and the outer wall of the circular plate 320 is in contact with the inner wall of the contraction cavity 350. The top of the return spring 330 is fixed to the contraction cavity. The top of the inner cavity of cavity 350; with the lifting mechanism 300, when the clamping plate 250 moves, it squeezes the inclined surface of the placement plate 340, causing the placement plate 340 to descend, and the circular plate 320 to move inside the shrinkage cavity 350, squeezing the return spring 330 and causing the return spring 330 to deform. After processing, the fixation is released, and the two clamping plates 250 are moved away from each other. The return spring 330 resets the placement plate 340, which makes it easier for the placement plate 340 to lift the chip, making it easier to pick up the chip and improving the practicality of the device.

[0026] In use, the chip is placed on the placement plate 340 during fixing. Rotating the knob 221 causes the bidirectional screw 220 to rotate, moving the movable seats 230 away from each other. This causes the connecting rod 240 to deflect, causing the connecting seat 260 to move the clamping plate 250, thus adjusting the distance between the two clamping plates 250. Simultaneously, as the clamping plates 250 move, they press against the inclined surface of the placement plate 340, causing it to descend. This allows the circular plate 320 to move within the contraction cavity 350, thus affecting the return spring 33. The chip is then clamped and fixed by the two clamping plates 250. After processing, the knob 221 is reversed to reverse the bidirectional screw 220, thereby resetting the moving seat 230. This causes the connecting seat 260 to drive the clamping plates 250 to reset, releasing the fixation and moving the two clamping plates 250 away from each other. This allows the clamping plates 250 to move out of the inclined surface of the placement plate 340. The reset of the reset spring 330 resets the placement plate 340, making it easier for the placement plate 340 to lift the chip and remove it.

[0027] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A carrier for MEMS chip fabrication, characterized in that: The device includes a mounting box (100), the inner cavity of which is provided with a fixing mechanism (200) and a lifting mechanism (300). The fixing mechanism (200) includes mounting cavities (210) opened on both sides of the inner cavity of the mounting box (100). A bidirectional screw (220) is rotatably driven through the edge between the two sides of the inner cavity (210). A knob (221) is fixed at both ends of the bidirectional screw (220). A movable seat (230) is symmetrically screwed to the outer side of the bidirectional screw (220). A connecting rod (240) is rotatably driven inside the movable seat (230). A clamping plate (250) is symmetrically slidable inside the mounting box (100). A connecting seat (260) is symmetrically fixed on one side of the clamping plate (250).

2. The carrier for processing a MEMS chip according to claim 1, wherein: The inner cavity of the mounting box (100) is provided with a first limiting groove (270) on both sides, the clamping plate (250) is fixed with a first limiting block (271) at the middle of both sides, the mounting cavity (210) is provided with a second limiting groove (280) on one side, and the movable seat (230) is fixed with a second limiting block (281) at the middle of one side.

3. The carrier of claim 1, wherein: One end of the connecting rod (240) rotates inside the connecting seat (260), and the outer side of the knob (221) is provided with anti-slip texture.

4. The carrier of claim 2, wherein: The first limiting block (271) slides inside the first limiting groove (270), and the outer side wall of the first limiting block (271) is in contact with the inner side wall of the first limiting groove (270).

5. The carrier of claim 2, wherein: The second limiting block (281) slides inside the second limiting groove (280), and the outer side wall of the second limiting block (281) is in contact with the inner side wall of the second limiting groove (280).

6. The carrier of claim 1, wherein: The lifting mechanism (300) includes a slide rod (310) fixed at the four corners of the bottom of the inner cavity of the mounting box (100). A circular plate (320) is fixed at the top of the slide rod (310), and a return spring (330) is fixed at the top of the circular plate (320). A placement plate (340) is connected to the inner cavity of the mounting box (100), and a contraction cavity (350) is provided at the four corners of the bottom of the placement plate (340).

7. The carrier of claim 6, wherein: The top of both sides of the placement plate (340) is provided with inclined surfaces. The circular plate (320) slides inside the contraction cavity (350), and the outer wall of the circular plate (320) is in contact with the inner wall of the contraction cavity (350). The top of the return spring (330) is fixed to the top of the inner cavity of the contraction cavity (350).

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