Chemical vapor deposition equipment

Abstract

The embodiment of the utility model provides chemical vapor deposition equipment. The chemical vapor deposition equipment comprises a chamber; the liftable heating table is positioned at the bottom of the chamber; the air exhaust component is arranged around the heating table and is provided with a side wall and a bottom, and the section of the air exhaust component is L-shaped; a shadow ring is arranged above the heating table, the shadow ring is provided with a plurality of lug parts, the lug parts are provided with positioning pins protruding downwards, and the positioning pins are provided with conical parts with inclined side faces; wherein positioning grooves which are in one-to-one correspondence with the lug parts and are sunken inwards are formed in the side wall of the air exhaust component, the size of the positioning grooves is larger than that of the lug parts, and the lug parts extend into the positioning grooves in a one-to-one correspondence mode in the state that installation is completed; the bottom of the air exhaust part is provided with step parts which are in one-to-one correspondence with the supporting lug parts, and the step parts are provided with grooves matched with the positioning pins; in the installation completion state, the positioning pins extend into the grooves in a one-to-one correspondence mode so that the shadow ring can be fixed to the air exhaust component. By adopting the technical scheme, the positioning precision of mutual matching of the shadow ring and the heating table can be effectively improved.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor manufacturing technology, and more particularly to a chemical vapor deposition apparatus. Background Technology

[0002] In chemical vapor deposition (CVD) equipment, a shadow ring is used to cover the edge of the silicon wafer to prevent deposition at the wafer edge. The shadow ring is mainly positioned by cooperating with the heating stage, and its fit is mainly cylindrical. After prolonged use, there is some wear on the cylinder and the sides of the groove, which affects its positioning effect.

[0003] Therefore, how to provide a technical solution to improve the positioning accuracy of the shadow ring and the heating stage has become an urgent technical problem to be solved. Utility Model Content

[0004] In view of this, the present disclosure provides a chemical vapor deposition apparatus that can effectively improve the positioning accuracy of the shadow ring and the heating stage in cooperation.

[0005] To address the aforementioned technical problems, this disclosure provides a chemical vapor deposition apparatus, comprising: a chamber; a height-adjustable heating stage located at the bottom of the chamber; an extraction component surrounding the heating stage, the extraction component having sidewalls and a bottom, and the extraction component having an L-shaped cross-section; a shadow ring disposed above the heating stage, the shadow ring having multiple ears, and each ear having a downwardly protruding positioning pin, the positioning pin having a tapered portion with an inclined side; wherein, the sidewall of the extraction component has inwardly recessed positioning grooves corresponding to each ear, and the size of the positioning grooves is larger than the size of the ears, and in the installed state, the ears extend into the positioning grooves corresponding to each other; the bottom of the extraction component has stepped portions corresponding to each ear, and the stepped portions have grooves adapted to the positioning pins; in the installed state, the positioning pins extend into the grooves corresponding to each other to fix the shadow ring on the extraction component.

[0006] Optionally, the locating pin has a first end and a second end connected together; the first end is a cylindrical portion and connected to the shadow ring; the second end is a tapered portion with an inclined side.

[0007] Optionally, the tapered portion of the positioning pin is a frustum, and the larger circular bottom of the frustum is connected to one end of the cylindrical portion of the positioning pin, with the connected end faces having the same size.

[0008] Optionally, the groove on the suction component includes a frustum space, wherein the diameter of the upper bottom surface of the frustum space is larger than the diameter of the lower bottom surface, and the frustum space is adapted to the size and shape of the tapered portion of the positioning pin for accommodating the tapered portion of the positioning pin to fix the shadow ring.

[0009] Optionally, the groove on the air extraction component further includes a dust collection space, which is connected to the lower bottom surface of the frustum space, for collecting dust generated by the friction between the positioning pin and the groove; wherein the dust collection space and the frustum space together form a continuous space, and the inner surface of the groove is smoothly transitioned.

[0010] Optionally, the dust collection space is cylindrical, and the depth of the groove is determined by the height of the frustum space and the height of the dust collection space.

[0011] Optionally, the number of ears in the shadow ring is four.

[0012] Optionally, the shadow ring is made of ceramic.

[0013] Optionally, the heating stage has a lifting pin, and the lifting pin is made of ceramic material, for receiving and carrying wafers.

[0014] Optionally, the number of lifting pins is three, and they are evenly arranged around the center of the heating platform.

[0015] Compared with the prior art, the technical solution of the present disclosure has the following advantages:

[0016] In a chemical vapor deposition apparatus provided in this embodiment, a shadow ring with multiple ears is provided above the heating stage. Each ear has a downwardly protruding positioning pin, and the positioning pin has a tapered portion with an inclined side. The bottom of the suction component has corresponding stepped portions supporting the ears, and each stepped portion has a groove adapted to the positioning pin. This design, where the tapered portion of the positioning pin matches the size and shape of the groove, ensures that even when both the positioning pin and the groove wear down, the tapered portion and the groove maintain accurate positioning under gravity. Therefore, it effectively improves the positioning accuracy of the interaction between the shadow ring and the heating stage. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this specification, the drawings used in the description of the embodiments of this specification or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this specification. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A cross-sectional schematic diagram of a chemical vapor deposition apparatus stage is shown in an embodiment of this disclosure;

[0019] Figure 2 A schematic diagram of a shadow ring according to an embodiment of this disclosure is shown;

[0020] Figure 3 It shows Figure 1 A cross-sectional view of the air extraction component along cutting line A1-A2 and a cross-sectional view of the air extraction component along cutting line B1-B2.

[0021] Figure 4 Another embodiment of this disclosure is shown. Figure 1 A cross-sectional view of the air extraction component along the cutting line A1-A2;

[0022] Figure 5 It shows Figure 2 A side view of the cross section along the cutting line C1-C2.

[0023] Explanation of reference numerals in the attached figures:

[0024] The components include: an air extraction component 100, a positioning groove 110, an air extraction hole 120, a stepped portion 130, a groove 131, a frustum space 131a, and a dust collection space 131b.

[0025] Shadow ring 200, ear 210, positioning pin 220, cylindrical part 221, conical part 222;

[0026] Heating platform 300, lifting pin 310. Detailed Implementation

[0027] The technical solutions described herein will be described in detail below with reference to specific embodiments and accompanying drawings. The embodiments described herein are specific implementations of this disclosure and are used to illustrate the concept of this disclosure; these descriptions are illustrative and exemplary and should not be construed as limiting the implementation methods or the scope of protection of this disclosure. In addition to the embodiments described herein, those skilled in the art can employ other obvious technical solutions based on the content disclosed in the claims and specification of this application. These technical solutions include those that make any obvious substitutions and modifications to the embodiments described herein.

[0028] It should be noted that the accompanying drawings in this embodiment are schematic diagrams, used to illustrate the concept of this disclosure, and to schematically show the shapes of the various parts and their interrelationships. It should be understood that, in order to clearly show the structure of the various components of this disclosure, the drawings are not drawn to the same scale, and the same reference numerals are used to indicate the same parts in the drawings.

[0029] As described in the background section, in chemical vapor deposition (CVD) equipment, a shadow ring is used to cover the edge of the silicon wafer to prevent deposition at the wafer edge. The shadow ring is mainly positioned by cooperating with the heating stage, and its mating shape is mainly cylindrical. After prolonged use, there is some wear on the cylinder and the sides of the groove, which affects its positioning effect.

[0030] To address the aforementioned technical problems, this disclosure provides a chemical vapor deposition apparatus in which a shadow ring is provided above the heating stage. The shadow ring has multiple ears, each ear having a downwardly protruding positioning pin. Each positioning pin has a tapered portion with an inclined side. The bottom of the suction component has corresponding stepped portions supporting the ears, and each stepped portion has a groove adapted to the positioning pin. This design, where the tapered portion of the positioning pin matches the size and shape of the groove, ensures that even when both the positioning pin and the groove wear down, the tapered portion and the groove maintain accurate positioning under gravity. Therefore, it effectively improves the positioning accuracy of the interaction between the shadow ring and the heating stage.

[0031] To make the above-described objects, features and advantages of this disclosure more apparent and understandable, a clear and complete illustrative description of this disclosure is provided below in conjunction with the accompanying drawings.

[0032] See Figure 1 , Figure 1 A cross-sectional schematic diagram of a chemical vapor deposition apparatus stage is shown in an embodiment of this disclosure.

[0033] In this embodiment, the chemical vapor deposition apparatus may include: an extraction component 100, a positioning groove 110, a shadow ring 200, an ear 210, a heating stage 300, and a lifting pin 310.

[0034] The chemical vapor deposition apparatus provided in this disclosure includes a chamber for providing process space for thin film deposition on silicon wafers.

[0035] The bottom of the chamber has a liftable heating stage 300, which is used to heat and support the wafer in chemical vapor deposition (CVD) or other thin film deposition processes.

[0036] The bottom of the heating stage 300 is connected to a lifting mechanism (not shown in the figure). The lifting mechanism is driven by a motor or hydraulic system and can precisely control the lifting movement of the heating stage 300 to achieve the positioning and transfer of the wafer in the cavity.

[0037] The heating stage 300 is equipped with multiple lifting pins 310, which are used to support and fix the wafer during the process. The lifting pins 310 are made of ceramic material, preferably high-purity ceramic materials such as alumina or silicon nitride. Ceramic materials have excellent high-temperature resistance, chemical stability, and insulation properties, and can maintain stable physical and chemical properties in high-temperature and corrosive gas environments, avoiding contamination or damage to the wafer. Furthermore, the low thermal conductivity of ceramic materials helps reduce heat transfer, thereby optimizing the temperature uniformity of the heating stage 300.

[0038] In some embodiments, the number of lifting pins 310 is three, and they are evenly distributed around the center of the heating stage 300, i.e., the angle between the connecting lines of adjacent lifting pins 310 and the center of the heating stage is 120 degrees. This symmetrical distribution design ensures that the wafer is subjected to uniform force during the support process, avoiding wafer warping or breakage caused by uneven force.

[0039] In some embodiments, each lifting pin 310 has a support surface at its top that contacts the wafer. The support surface is preferably a planar or slightly convex arcuate structure to increase the contact area with the wafer and reduce local stress concentration.

[0040] During the process, the wafer needs to be placed on the heating stage 300. The lifting pin 310 is driven by a lifting mechanism to rise to a predetermined height, receiving the wafer from the transfer device (such as a robotic arm) and placing it smoothly on the surface of the heating stage 300. Subsequently, the lifting pin 310 descends into the heating stage 300, allowing the wafer to directly contact the heating stage 300, ensuring uniform heat distribution during heating. After the process is completed, the lifting pin 310 rises again, lifting the wafer from the heating stage 300 so that the transfer device can remove it from the chamber.

[0041] Through the above structural design, the heating stage 300 and its lifting pin 310 can not only achieve high-precision positioning and stable support of the wafer, but also adapt to the process environment inside the vapor deposition equipment, ensuring the stability and reliability of the thin film deposition process.

[0042] The chemical vapor deposition apparatus provided in this disclosure includes: a gas extraction component 100 disposed around the heating stage 300. The gas extraction component 100 is used to discharge reactive gases, byproducts and unreacted gases from the gas extraction port in chemical vapor deposition (CVD) or other thin film deposition processes to maintain the uniformity of gas flow and pressure stability in the chamber, thereby ensuring the uniformity of thin film deposition and process repeatability.

[0043] In some embodiments, a shadow ring 200 is provided above the heating platform 300.

[0044] The shadow ring 200 has multiple ears 210.

[0045] The side wall of the air extraction component 100 is provided with a plurality of inwardly recessed positioning grooves 110, the number of which corresponds to the number of ears 210 of the shadow ring 200.

[0046] The size of the positioning groove 110 is slightly larger than the size of the ear 210, so as to provide sufficient clearance for the ear 210 during installation and avoid damage caused by bumps during installation.

[0047] The positioning groove 110 is preferably rectangular, trapezoidal, or arc-shaped so that the ear 210 can be smoothly inserted and maintain stable positioning.

[0048] The depth and width of the positioning groove 110 are optimized according to the size of the ear 210 so that the ear 210 can be fully inserted into the positioning groove 110 after installation, while avoiding the shaking or displacement of the shadow ring 200 due to excessive gap.

[0049] Specifically, during thin film deposition, the deposition process is irregular, and the film may deposit on the sides of the silicon wafer edge. In subsequent photolithography and etching processes, this can lead to the risk of carbon film peeling off at the edge, thus affecting device performance. Therefore, using the shadow ring 200 to cover the silicon wafer edge (approximately 3mm to 5mm) redirects the film originally deposited at the edge onto the shadow ring 200, thereby preventing deposition at the silicon wafer edge.

[0050] See also Figure 2 , Figure 2 A schematic diagram of a shadow ring according to an embodiment of this disclosure is shown.

[0051] The main body of the shadow ring 200 is a ring structure, preferably made of a material that is resistant to high temperature and has a low coefficient of thermal expansion, such as graphite, silicon carbide or ceramic material.

[0052] In some embodiments, a plurality of ears 210 are evenly distributed on the outer periphery of the shadow ring 200. The ears 210 are preferably outwardly protruding structures, and the size and shape of each ear 210 are adapted to the positioning groove 110.

[0053] The ear portion 210 is provided with a positioning pin 220 near the center. The positioning pins 220 are all located on one side of the shadow ring 200, and each positioning pin 220 corresponds to one ear portion 210.

[0054] The number of the ears 210 is usually 2 to 6, preferably 4, to be evenly distributed around the center of the shadow ring 200, so that the shadow ring 200 is subjected to uniform force during installation and use, avoiding deformation or damage caused by uneven force.

[0055] Specifically, during installation, the ear portion 210 of the shadow ring 200 is first aligned with the positioning groove 110 on the side wall of the suction component 100, and then the ear portion 210 is placed into the positioning groove 110. Since the size of the positioning groove 110 is slightly larger than the size of the ear portion 210, the ear portion 210 can be smoothly inserted into the positioning groove 110 without applying external force. After installation, the ear portion 210 is fully inserted into the positioning groove 110, and a certain gap is maintained between the ear portion 210 and the positioning groove 110 to accommodate dimensional changes caused by thermal expansion. The cooperation between the suction component 100 and the shadow ring 200 enables rapid installation and precise positioning of the shadow ring 200.

[0056] In addition, the design of the positioning groove 110 can provide stable support and positioning for the shadow ring 200, ensuring that it maintains a stable position and function in high temperature and corrosive gas environments, thereby improving the reliability and yield of the thin film deposition process.

[0057] See also Figure 5 , Figure 5 A cross-sectional side view of a shadow ring according to an embodiment of the present disclosure is shown. Figure 5 for Figure 2 It is obtained by cutting along C1-C2 and viewing from the side in the F1 direction.

[0058] In this embodiment, the positioning pin 220 has a tapered portion 222 on an inclined side.

[0059] Specifically, in the installed state, the positioning pins 220 extend into the corresponding grooves, thereby achieving precise fixation and stable support of the shadow ring 200 on the air extraction component 100. The structural design of the positioning pins 220 not only ensures the positional stability of the shadow ring 200 during the process, but also achieves self-centering through its specific geometry, thereby improving installation efficiency and accuracy.

[0060] The positioning pin 220 has a first end and a second end connected together. The first end is a cylindrical portion 221, and the second end is a tapered portion 222 with an inclined side.

[0061] In some embodiments, the cylindrical portion 221 is fixedly connected to the shadow ring 200, preferably by integral molding.

[0062] The diameter and length of the cylindrical portion 221 are optimized according to the size of the ear portion 210 of the shadow ring 200, typically with a diameter of 2mm to 5mm and a length of 2mm to 5mm, to ensure that it has sufficient structural strength and stability.

[0063] In addition, the surface of the cylindrical portion 221 is precision machined to ensure that it is smooth and burr-free, so as to reduce stress concentration at the connection with the shadow ring 200 and thus improve its service life.

[0064] In some embodiments, the tapered portion 222 is frustum-shaped, with the larger circular bottom of the frustum connected to one end of the cylindrical portion 221, and the connected end faces having the same size to achieve a smooth transition.

[0065] In some embodiments, the angle of the inclined side of the tapered portion 222 (the angle between the inclined surface and the larger circular bottom) is selected from 30° to 60°, preferably 45°, so that it can be smoothly inserted into the groove during installation and achieve self-alignment through the tapered surface engagement.

[0066] In some embodiments, the top diameter of the tapered portion 222 is smaller than the bottom diameter, and the bottom diameter is the same as the diameter of the cylindrical portion 221, so as to achieve a smooth transition.

[0067] Figure 1 See also Figure 3 , Figure 4 , Figure 3 A cross-sectional schematic diagram of an air extraction component according to an embodiment of the present disclosure is shown. Figure 3 Subgraph a in the middle is Figure 1 A cross-sectional view of the central air extraction component cut along A1-A2. Figure 3 Subgraph b in the middle is Figure 1 A cross-sectional view of the central air extraction component cut along B1-B2. Figure 4 A cross-sectional schematic diagram of another air extraction component in an embodiment of this disclosure is shown. Figure 1 Another cross-sectional view of the central air extraction component cut along A1A2.

[0068] In some embodiments, such as Figure 3 The exhaust component 100 shown in sub-Figure a has an L-shaped cross-section, including sidewalls perpendicular to the surface of the heating platform 300 and a bottom extending in the horizontal direction. The sidewalls and bottom are preferably made of a high-temperature resistant and corrosion-resistant material, such as ceramic.

[0069] The sidewall of the air extraction component 100 has a plurality of air extraction holes 120 evenly distributed.

[0070] It should be noted that this embodiment does not limit the number of the air extraction holes 120. The multiple air extraction holes 120 are mainly used to quickly expel the gas in the chamber.

[0071] In some embodiments, the bottom of the suction component 100 is provided with a plurality of stepped portions 130, the number of which corresponds one-to-one with the number of the ears 210 of the shadow ring 200, for supporting the ears 210 after installation.

[0072] Each of the stepped portions 130 is provided with a groove 131 adapted to the positioning pin 220. The groove 131 is used to accommodate the positioning pin 220 and achieves the precise fixing and self-centering function of the shadow ring 200 through its specific structural design.

[0073] In some embodiments, the groove 131 includes two main parts: a frustum space 131a and a dust collection space 131b. The diameter of the upper bottom surface of the frustum space 131a is larger than the diameter of the lower bottom surface, forming a conical structure, and the conical angle of the frustum space 131a is adapted to the inclination angle of the conical portion 222 of the positioning pin 220. This conical structure design enables the positioning pin 220 to achieve self-centering through the conical surface engagement during insertion, thereby achieving precise positioning of the shadow ring 200.

[0074] Furthermore, the depth and taper angle of the frustum space 131a are optimized according to the size and shape of the positioning pin 220 so that after the shadow ring 200 is installed, the tapered part 222 of the positioning pin 220 can fit tightly against the inclined surface of the frustum space 131a, thereby providing stable support and fixation.

[0075] The dust collection space 131b is connected to the bottom surface of the frustum space 131a and is used to collect tiny particles or dust generated by friction between the positioning pin 220 and the groove 131 during installation and use.

[0076] In some embodiments, the dust collection space 131b is cylindrical, with a diameter identical to the diameter of the lower base of the frustum space 131a, to ensure a smooth transition between the frustum space 131a and the dust collection space 131b, forming a continuous groove 131. The depth of the dust collection space 131b is designed according to actual process requirements, typically ranging from 1mm to 5mm, to collect dust and prevent dust accumulation from interfering with the insertion and positioning of the positioning pin 220.

[0077] In some embodiments, such as Figure 3As shown in sub-figure a, the portion of the groove 131 excluding the integrated space 131b can be completely fitted with the positioning pin 220 so that the shadow ring 200 can be stably fixed on the air extraction component 100.

[0078] In some embodiments, such as Figure 4 As shown, the portion of the groove 131 excluding the integrated space 131b can completely fit with the tapered portion 222 of the positioning pin 220.

[0079] The inner surface of the groove 131 is precision machined to make it smooth and burr-free, so as to reduce the frictional resistance of the positioning pin 220 during insertion and removal, thereby extending the service life of the positioning pin 220 and the groove 131.

[0080] The total depth of the groove 131 is determined by the height of the frustum space 131a and the height of the dust collection space 131b, and is typically 3mm to 10mm.

[0081] During installation, firstly, align the ear 210 of the shadow ring 200 with the positioning groove 110 on the side wall of the suction component 100, and insert the ear 210 into the positioning groove 110. Then, move the shadow ring 200 downwards, gradually inserting the positioning pin 220 into the groove 131 on the stepped portion 130. Because the conical structure of the frustum space 131a is compatible with the conical portion 222 of the positioning pin 220, the positioning pin 220 can automatically adjust its position during insertion, ultimately achieving precise alignment and fixation. After installation, the conical portion 222 of the positioning pin 220 is fully inserted into the frustum space 131a.

[0082] In some embodiments, the bottom of the positioning pin 220 may extend into the dust collection space 131b, thereby securing the shadow ring 200 to the suction component 100.

[0083] It is understood that the above description of multiple embodiments of chemical vapor deposition equipment may combine and cross-reference the various options described in each embodiment without conflict, thereby extending to a variety of possible embodiments. These can all be considered as disclosed or publicly disclosed embodiments of this utility model.

[0084] It should be understood that the term "and / or" in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article indicates that the preceding and following related objects have an "or" relationship.

[0085] In the embodiments of this application, "multiple" refers to two or more.

[0086] The descriptions of "first," "second," etc., appearing in the embodiments of this application are for illustrative purposes and to distinguish the objects being described. They have no order and do not indicate any special limitation on the number of devices in the embodiments of this application, nor do they constitute any limitation on the embodiments of this application.

[0087] It should be noted that the sequence number of each step in this embodiment does not represent a limitation on the execution order of each step.

[0088] While the embodiments disclosed herein are as described above, this disclosure is not limited thereto. Any person skilled in the art can make various alterations and modifications without departing from the spirit and scope of this disclosure; therefore, the scope of protection of this disclosure should be determined by the scope defined in the claims.

Claims

1. A chemical vapor deposition apparatus characterized by comprising: include: Chamber; A height-adjustable heating platform located at the bottom of the chamber; An air extraction component is arranged around the heating platform, the air extraction component has side walls and a bottom, and the cross-section of the air extraction component is L-shaped; A shadow ring is provided above the heating platform. The shadow ring has multiple ears, and each ear has a downward protruding positioning pin. The positioning pin has a tapered portion with an inclined side. The side wall of the air extraction component has an inwardly recessed positioning groove that corresponds to each of the ears, and the size of the positioning groove is larger than the size of the ears. When the installation is complete, the ears extend into the positioning grooves one by one. The bottom of the air extraction component has a step portion that supports the ear portion, and the step portion has a groove that matches the positioning pin. With the installation complete, the positioning pins extend into the grooves one by one to fix the shadow rings on the air extraction components.

2. The chemical vapor deposition apparatus according to claim 1, wherein The positioning pin has a first end and a second end connected together. The first end is configured as a cylindrical portion and is connected to the shadow ring; The second end is configured as a tapered portion with an inclined side.

3. The chemical vapor deposition apparatus according to claim 2, wherein The tapered portion of the positioning pin is a frustum, and the larger circular bottom of the frustum is connected to one end of the cylindrical portion of the positioning pin, with the connected end faces having the same size.

4. The chemical vapor deposition apparatus of claim 1, wherein The groove on the air extraction component includes: A frustum space, wherein the diameter of the upper base of the frustum space is larger than the diameter of the lower base, and the frustum space is adapted to the size and shape of the tapered portion of the positioning pin, for accommodating the tapered portion of the positioning pin to fix the shadow ring.

5. The chemical vapor deposition apparatus according to claim 4, wherein The groove on the air extraction component further includes: A dust collection space, which is connected to the lower surface of the frustum space, is used to collect dust generated by the friction between the positioning pin and the groove; The dust collection space and the frustum space together form a continuous space, and the inner surface of the groove transitions smoothly.

6. The chemical vapor deposition apparatus according to claim 5, wherein The dust collection space is cylindrical, and the depth of the groove is determined by the height of the frustum space and the height of the dust collection space.

7. The chemical vapor deposition apparatus of claim 1, wherein The shadow ring has four ears.

8. The chemical vapor deposition apparatus of claim 1, wherein, The shadow ring is made of ceramic.

9. The chemical vapor deposition apparatus of claim 1, wherein, The heating stage has lifting pins, which are made of ceramic and are used to receive and support wafers.

10. The chemical vapor deposition apparatus according to claim 9, characterized in that, The number of lifting pins is three, and they are evenly arranged around the center of the heating platform.

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