Environment-friendly accompanying plating substrate

Abstract

The utility model discloses an environment-friendly accompanying plating base plate which comprises a base plate and a connector plate, and the connector plate is detachably connected to the upper end of the base plate. A connecting plate part is arranged at the lower end of the connecting head plate, and the connecting plate part is attached to and connected with the upper end face of the base plate; a plurality of first conical edges are sequentially distributed on the front face and the back face of the base plate in the left-right direction, and the first conical edges extend in the up-down direction. The front face and the back face of the connecting plate part are provided with second conical edges in one-to-one correspondence with the first conical edges of the base plate, and the first conical edges and the second conical edges are the same in section shape and size. Electro-coppering layers are arranged on the front surfaces and the back surfaces of the substrate and the connecting plate part; nick grooves matched with the first conical edges and the second conical edges are formed in the inner wall surfaces of the electro-coppering layers; the strippable electroplating copper layers are arranged on the front face and the back face of the base plate, on one hand, the cylinder dragging plate function is achieved, on the other hand, the base plate can be repeatedly used, cost is reduced, the resource utilization rate is improved, and the cylinder dragging plate is more environmentally friendly.

Description

Technical Field

[0001] This utility model relates to the field of electroplating technology, specifically to environmentally friendly plating substrates. Background Technology

[0002] In the electroplating industry, dummy plating plates play a crucial role in stabilizing and activating the performance of the plating solution. Newly prepared or maintained plating solutions often have uneven metal ion concentrations and unstable additive dispersions, leading to inconsistent plating quality when used directly for product electroplating. Once in use, dummy plating plates, through their electrochemical reaction with the plating solution, quickly balance the metal ion concentration, promote uniform additive dispersion, and stabilize the solution's performance indicators. Simultaneously, when electroplating equipment has been idle for extended periods or is newly commissioned, the electrode surface activity is low. The dummy plating process effectively activates the electrode surface, enhancing the efficiency of the electrochemical reaction between the electrode and the plating solution, laying a solid foundation for subsequent formal electroplating operations. This significantly reduces the product plating defect rate and ensures product quality.

[0003] Currently, most electroplating processes in the industry commonly use copper-clad laminates (CCLs) or conductive metal plates as plating plates. However, these traditional plating plates have revealed many significant drawbacks in practical applications. From a cost perspective, the raw materials for CCLs and conductive metal plates are expensive, and frequent replacement of plating plates keeps the production costs of electroplating companies high, severely compressing profit margins, especially in large-scale production scenarios where cost pressures are even more pronounced. In terms of resource utilization, after using CCLs as plating plates, the substrate cannot be recycled, resulting in a large waste of resources; while the copper and other metals in conductive metal plates can be recycled after completing their plating task, the recycling process involves complex chemical treatment and physical separation processes, which not only has high recycling costs but also requires a large investment of manpower and resources, resulting in extremely low resource utilization efficiency.

[0004] In conclusion, given the high cost, low resource utilization, and environmental pollution associated with traditional electroplating processes for plating plates, developing a new type of environmentally friendly plating substrate that is lower in cost, more efficient in resource utilization, and more environmentally friendly has become a critical issue that the industry urgently needs to address, and has significant practical implications and broad application prospects. Utility Model Content

[0005] The purpose of this invention is to provide an environmentally friendly plating substrate, which aims to improve the problems of high cost, low resource utilization and environmental pollution caused by the existing electroplating process of the plate dragging plate.

[0006] This utility model is implemented as follows: an environmentally friendly plating substrate includes a substrate and a connecting head plate, wherein the connecting head plate is detachably connected to the upper end of the substrate; the lower end of the connecting head plate is provided with a connecting plate portion, which is in close contact with the upper end surface of the substrate, the length of the connecting plate portion is the same as that of the upper end of the substrate, and the thickness of the connecting plate portion is the same as that of the substrate; a plurality of first conical ridges are arranged sequentially along the left-right direction on the front and back of the substrate, the first conical ridges extending in the up-down direction, and the upper and lower ends of the first conical ridges are respectively aligned with the upper and lower end surfaces of the substrate; the front and back of the connecting plate portion are provided with second conical ridges corresponding one-to-one with the first conical ridges of the substrate, and the cross-sectional shape and size of the first and second conical ridges are the same; the front and back of the substrate and the connecting plate portion are provided with an electroplated copper layer, and the inner wall surface of the electroplated copper layer is provided with grooves adapted to the first and second conical ridges.

[0007] Furthermore, the first conical edges are arranged sequentially along the left-right direction, and the distance between two adjacent first conical edges is 10-50mm.

[0008] Furthermore, the maximum depth of the groove is not less than two-thirds of the thickness of the electroplated copper layer.

[0009] Furthermore, the substrate is a rectangular plate with uniform thickness, and the substrate and the connecting head plate are made of any one of the following materials: epoxy resin, glass fiber, ceramic, carbon fiber, and plastic.

[0010] Furthermore, the peel strength of the electroplated copper layer is less than 1 pound / inch.

[0011] Furthermore, the upper surface of the substrate is provided with a plurality of connecting threaded holes along the left-right direction, and the connecting head plate is provided with connecting through holes corresponding to each connecting threaded hole. The connecting through holes penetrate the connecting head plate along the up-down direction. The substrate and the connecting head plate are connected by connecting bolts, and the screw portion of the connecting bolt passes through the connecting through hole and is screwed into the connecting threaded hole.

[0012] Furthermore, the diameter of the two connecting through holes at both ends of the connecting head plate is larger than the diameter of the connecting threaded hole, and the hole walls of these two connecting through holes are provided with threaded structures to form set screw threaded holes.

[0013] Furthermore, lifting rings are threadedly installed in the threaded holes at both ends of the substrate. The lifting rings have threaded rods that pass through the threaded holes of the set screws.

[0014] Furthermore, the upper end face of the substrate and the lower end face of the connecting plate are provided with mutually cooperating positioning structures, which enable the first conical edge and the second conical edge to be aligned one by one.

[0015] Furthermore, the positioning structure includes a positioning groove disposed on the upper end face of the substrate and a positioning block disposed on the lower end face of the connecting plate portion, wherein the shape and size of the positioning block are the same as those of the positioning groove.

[0016] Compared with the prior art, the beneficial effects of this utility model are:

[0017] 1. This utility model achieves the function of a drag plate by setting peelable electroplated copper layers on the front and back of the substrate, and makes the substrate reusable, thereby reducing costs, improving resource utilization, and being more environmentally friendly.

[0018] 2. When peeling off the electroplated copper layer, first remove the connector plate to expose the upper end of the electroplated copper layer, and cut or trim the grooves. Then, use pliers or other clamps to clamp the upper end of the electroplated copper layer, and pull it off easily and completely by applying slow and even force. This makes the peeling of the electroplated copper layer very convenient, does not require chemical peeling, and is more environmentally friendly. Attached Figure Description

[0019] Figure 1 This is a three-dimensional structural schematic diagram of the present invention;

[0020] Figure 2 This is a three-dimensional structural diagram of the substrate of this utility model;

[0021] Figure 3 This is a three-dimensional structural diagram of the connecting head plate of this utility model;

[0022] Figure 4 This is a three-dimensional structural diagram of the electroplated copper layer of this utility model.

[0023] In the figure: 1. Substrate; 11. First conical ridge; 12. Connecting threaded hole; 13. Positioning groove; 2. Connecting head plate; 21. Connecting plate; 22. Second conical ridge; 23. Connecting through hole; 24. Top screw threaded hole; 25. Positioning block; 3. Electroplated copper layer; 31. Scratched groove; 4. Connecting bolt; 5. Lifting eye. Detailed Implementation

[0024] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0025] The following description, in conjunction with the accompanying drawings and specific embodiments, provides further details:

[0026] like Figures 1-3 As shown, the environmentally friendly plating substrate includes a substrate 1 and a connecting head plate 2. The substrate 1 is a rectangular plate with uniform thickness. The substrate 1 and the connecting head plate 2 are made of any one of the following materials: epoxy resin, glass fiber, ceramic, carbon fiber, and plastic. The connecting head plate 2 is generally rectangular, with a thinner connecting plate portion 21 at its lower end. The connecting plate portion 21 is attached to the upper surface of the substrate 1, and the length and thickness of the connecting plate portion 21 are the same as those of the substrate 1. In the vertical direction, the length of the connecting plate portion 21 is 1-3 mm.

[0027] like Figures 1-3 As shown, multiple first conical ridges 11 are arranged equidistantly along the left-right direction on the front and back sides of the substrate 1, with a spacing of 10-50 mm between adjacent first conical ridges 11. The first conical ridges 11 extend vertically, and their upper and lower ends are aligned with the upper and lower end faces of the substrate 1, respectively. Second conical ridges 22, corresponding one-to-one with the first conical ridges 11 of the substrate 1, are provided on the front and back sides of the connecting plate portion 21. The cross-sectional shape and size of the first and second conical ridges 11 and 22 are identical, and the cross-section of the conical ridges forms a triangle. A mutually cooperating positioning structure is provided on the upper end face of the substrate 1 and the lower end face of the connecting plate portion 21. The positioning structure includes a positioning groove 13 on the upper end face of the substrate 1 and a positioning block 25 on the lower end face of the connecting plate portion 21. The shape and size of the positioning block 25 are the same as those of the positioning groove 13. The positioning structure allows the first conical ridges 11 and second conical ridges 22 to be aligned one-to-one.

[0028] like Figures 1-4 As shown, both the front and back sides of the substrate 1 and the connecting plate portion 21 are provided with electroplated copper layers 3. The electroplated copper layers 3 can be formed by chemical electroplating, coating, etc. Since the substrate 1 is provided with a first conical ridge 11 and the connecting plate portion 21 is provided with a second conical ridge 22, when the electroplated copper layer 3 is formed, a groove 31 that matches the first conical ridge 11 and the second conical ridge 22 will be formed on the inner wall surface. The maximum depth of the groove 31 is not less than two-thirds of the thickness of the electroplated copper layer 3. The peel strength of the electroplated copper layer 3 is less than 1 pound / inch, and the peel strength can be achieved by adjusting the surface roughness of the substrate, etc.

[0029] like Figures 1-3As shown, the upper surface of the substrate 1 has multiple threaded holes 12 arranged in the left-right direction. The connecting head plate 2 has connecting through holes 23 corresponding to each threaded hole 12. The connecting through holes 23 penetrate the connecting head plate 2 in the up-down direction. The substrate 1 and the connecting head plate 2 are connected by connecting bolts 4. The screw part of the connecting bolt 4 passes through the connecting through hole 23 and is screwed into the threaded hole 12. The diameter of the two connecting through holes 23 at both ends of the connecting head plate 2 is larger than the diameter of the threaded holes 12, and the hole walls of these two connecting through holes 23 are provided with threaded structures to form set screw threaded holes 24. If necessary, the substrate 1 and the connecting head plate 2, which are connected by the electroplated copper layer 3, can be separated by installing set screws in the set screw threaded holes 24. Lifting rings 5 ​​are threadedly installed in the threaded holes 12 at both ends of the substrate 1. The lifting rings 5 ​​have threaded rods that pass through the set screw threaded holes 24. By setting the lifting rings 5, this utility model can be lifted and used.

[0030] This invention achieves the function of a drag plate by setting peelable electroplated copper layers 3 on the front and back of the substrate 1, and makes the substrate 1 reusable, reducing costs, improving resource utilization, and being more environmentally friendly. To peel off the electroplated copper layer 3, first remove the connecting head plate 2 to expose the upper end of the electroplated copper layer 3, and then cut or shear the groove 31. Then, use pliers or other clamps to clamp the upper end of the electroplated copper layer 3, and pull it off easily and completely by applying slow and even force. This makes peeling the electroplated copper layer 3 very convenient, eliminates the need for chemical peeling methods, and is more environmentally friendly.

[0031] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. An environmentally friendly substrate to be plated, characterized by, The system includes a substrate (1) and a connecting head plate (2), the connecting head plate (2) being detachably connected to the upper end of the substrate (1); the lower end of the connecting head plate (2) is provided with a connecting plate portion (21), the connecting plate portion (21) being in contact with the upper end surface of the substrate (1), the connecting plate portion (21) having the same length as the upper end of the substrate (1), and the connecting plate portion (21) having the same thickness as the substrate (1); the front and back sides of the substrate (1) are provided with a plurality of first conical ribs (11) arranged sequentially in the left-right direction, the first conical ribs (11) extending in the up-down direction, and the first conical ribs (11) being... The upper and lower ends of the conical ridge (11) are aligned with the upper and lower end faces of the substrate (1), respectively; the front and back sides of the connecting plate (21) are provided with second conical ridges (22) that correspond one-to-one with the first conical ridge (11) of the substrate (1), and the cross-sectional shape and size of the first conical ridge (11) and the second conical ridge (22) are the same; the front and back sides of the substrate (1) and the connecting plate (21) are provided with electroplated copper layers (3), and the inner wall surface of the electroplated copper layer (3) is provided with grooves (31) that are adapted to the first conical ridge (11) and the second conical ridge (22).

2. The environmentally friendly seed substrate of claim 1, wherein The first conical edge (11) is arranged sequentially in the left-right direction, and the distance between two adjacent first conical edges (11) is 10-50mm.

3. The environmentally friendly substrate according to claim 1, wherein The maximum depth of the groove (31) is not less than two-thirds of the thickness of the electroplated copper layer (3).

4. The environmentally friendly seed substrate of claim 1, wherein The substrate (1) is a rectangular plate with uniform thickness, and the substrate (1) and the connecting head plate (2) are made of any one of the following materials: epoxy resin, glass fiber, ceramic, carbon fiber, and plastic.

5. The environmentally friendly seed substrate of claim 4, wherein, The peel strength of the electroplated copper layer (3) is less than 1 pound / inch.

6. The environmentally friendly seed substrate of claim 1, wherein The upper surface of the substrate (1) is provided with a plurality of connecting threaded holes (12) in the left-right direction. The connecting head plate (2) is provided with connecting through holes (23) corresponding to each connecting threaded hole (12). The connecting through holes (23) penetrate the connecting head plate (2) in the up-down direction. The substrate (1) and the connecting head plate (2) are connected by connecting bolts (4). The screw part of the connecting bolt (4) passes through the connecting through hole (23) and is screwed into the connecting threaded hole (12).

7. The environmentally friendly seed substrate of claim 6, wherein, The diameter of the two connecting through holes (23) at both ends of the connecting head plate (2) is larger than the diameter of the connecting threaded hole (12), and the hole walls of the two connecting through holes (23) are provided with threaded structures to form a set screw threaded hole (24).

8. The environmentally friendly seed substrate of claim 7, wherein, A lifting ring (5) is threadedly installed in the threaded holes (12) at both ends of the substrate (1). The lifting ring (5) has a threaded rod portion, which passes through the set screw threaded hole (24).

9. The environmentally friendly seed substrate of claim 1, wherein, The upper end face of the substrate (1) and the lower end face of the connecting plate (21) are provided with mutually cooperating positioning structures, which make the first conical edge (11) and the second conical edge (22) aligned one by one.

10. The environmentally friendly plating substrate according to claim 9, characterized in that, The positioning structure comprises a positioning groove (13) arranged on the upper end surface of the substrate (1) and a positioning block (25) arranged on the lower end surface of the connecting plate part (21), the shape and size of the positioning block (25) being the same as those of the positioning groove (13).

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