Heat dissipation type semiconductor lighting device

Abstract

The utility model discloses a heat dissipation type semiconductor lighting device, and relates to the technical field of semiconductor lighting devices. Comprising a heat conduction base, a cavity is formed in the heat conduction base, cooling liquid is poured into the cavity, a through opening is formed in the middle of the cavity, an assembly groove is formed in the top of the cavity and penetrates through the through opening, a vapor chamber is installed at the bottom of the assembly groove, an LED substrate is installed on the vapor chamber, and LED lamp beads are arranged on the LED substrate. According to the heat dissipation type semiconductor lighting device, heat generated by lighting is conducted to the heat conduction base from the vapor chamber, the heat can be efficiently and evenly distributed, meanwhile, cooling liquid is used as a heat conduction medium, the heat conduction efficiency and the specific heat capacity of the cooling liquid are far higher than those of air, and therefore heat can be more effectively absorbed from a heat source; and in cooperation with the directly-connected sunflower radiator, higher heat dissipation efficiency is provided under strong wind power of the vortex heat dissipation fan.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor lighting device technology, specifically a heat dissipation type semiconductor lighting device. Background Technology

[0002] Semiconductor lighting devices use solid semiconductor chips as light-emitting materials and release energy through carrier recombination to directly emit visible light. For example, LEDs generate photons through the recombination of electrons and holes in semiconductors, emitting light of colors such as red, yellow, blue, and green. Combined with phosphor technology, full-spectrum light emission can also be achieved.

[0003] The shortcomings of existing heat dissipation technology for high-power semiconductor lighting devices are that the packaged chip substrate and the heat sink are bonded together as two separate devices with thermally conductive adhesive, which increases the interfacial thermal resistance. In addition, the heat sinks are generally inefficient, making it difficult to achieve ideal heat dissipation, which greatly reduces the lifespan of the lighting devices. Utility Model Content

[0004] This invention provides a heat-dissipating semiconductor lighting device to solve the problems in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a heat-dissipating semiconductor lighting device, comprising a heat-conducting base, a cavity provided in the heat-conducting base and filled with coolant, an opening in the middle of the cavity, an assembly groove provided at the top of the cavity and penetrating the opening, a heat spreader plate installed at the bottom of the assembly groove, an LED substrate mounted on the heat spreader plate, LED beads disposed on the LED substrate, a sunflower heat sink installed at the bottom of the cavity, a fan slot provided in the middle of the sunflower heat sink, an air inlet provided at the top inner part of the fan slot, and a vortex cooling fan installed at the top inner part of the fan slot.

[0006] Furthermore, the heat-conducting base is disc-shaped, and a viewing lens is embedded in the side wall of the cavity.

[0007] Furthermore, a water inlet is provided on the side wall of the cavity, and a sealing head is threaded onto the water inlet.

[0008] Furthermore, a gap is left between the side of the LED substrate and the mounting groove, and a gap is left between the bottom surface of the LED substrate and the bottom of the mounting groove.

[0009] Furthermore, the bottom of the opening is provided with a protruding ring, and the top of the sunflower radiator is provided with a positioning groove, and the positioning groove and the protruding ring are engaged with the heat-conducting base.

[0010] Furthermore, the air inlet is connected to the positioning groove and also to the through-hole.

[0011] Compared with the prior art, the present invention provides a heat-dissipating semiconductor lighting device, which has the following advantages:

[0012] This heat-dissipating semiconductor lighting device transfers heat generated by illumination from the heat spreader to the heat-conducting base, achieving efficient and uniform heat distribution. It utilizes coolant as the heat transfer medium, whose thermal conductivity and specific heat capacity are far superior to air. Therefore, it can more effectively absorb heat from the heat source and dissipate it into the external environment. Combined with a directly connected sunflower-shaped heat sink and the powerful airflow of the vortex cooling fan, it provides even higher heat dissipation efficiency. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the structure of this utility model;

[0014] Figure 2 This is a top view of the present invention;

[0015] Figure 3 This is a cross-sectional view of the present invention.

[0016] In the diagram: 1. Heat-conducting base; 2. Cavity; 3. Coolant; 4. Through-hole; 5. Assembly slot; 6. Heat spreader; 7. LED substrate; 8. LED beads; 9. Sunflower heat sink; 10. Fan slot; 11. Air inlet; 12. Vortex cooling fan; 13. Transparent lens; 14. Water inlet; 15. End cap; 16. Raised ring; 17. Positioning slot. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0018] Please see Figures 1-3This utility model discloses a heat dissipation type semiconductor lighting device, including a heat-conducting base 1, a cavity 2 inside the heat-conducting base 1, and a coolant 3 filled in the cavity 2. A through-hole 4 is provided in the middle of the cavity 2, and an assembly groove 5 is provided at the top of the cavity 2, penetrating the through-hole 4. A heat spreader 6 is installed at the bottom of the assembly groove 5, and an LED substrate 7 is installed on the heat spreader 6. LED beads 8 are disposed on the LED substrate 7. A sunflower heat sink 9 is installed at the bottom of the cavity 2, and a [missing information - likely a design element] is provided in the middle of the sunflower heat sink 9. The fan slot 10 has an air inlet 11 at its inner top and a vortex cooling fan 12 installed at its inner top. The heat generated by the lighting is conducted from the heat spreader 6 to the heat-conducting base 1, which can efficiently and evenly distribute the heat. At the same time, the coolant 3 is used as the heat conduction medium. The heat conduction efficiency and specific heat capacity of the coolant 3 are much higher than those of air. Therefore, it can more effectively absorb heat from the heat source and dissipate it to the external environment. With the direct connection of the sunflower radiator 9, the strong airflow of the vortex cooling fan 12 provides higher heat dissipation efficiency.

[0019] Specifically, the heat-conducting base 1 is disc-shaped, and a viewing lens 13 is embedded in the side wall of the cavity 2.

[0020] In this embodiment, the heat-conducting base 1 is a fastener used for the installation and fixation of the LED substrate 7 and the sunflower heat sink 9. The LED substrate 7 is a metal-based copper-clad laminate used in LED lamps, mainly used for heat dissipation and circuit connection. The liquid level in the cavity 2 can be directly observed through the viewing lens 13.

[0021] Specifically, the cavity 2 has a water inlet 14 on its side wall, and a sealing head 15 is threaded onto the water inlet 14.

[0022] In this embodiment, when the liquid level in cavity 2 is insufficient, coolant 3 can be added through water inlet 14.

[0023] Specifically, a gap is left between the side of the LED substrate 7 and the assembly groove 5, and a gap is left between the bottom surface of the LED substrate 7 and the bottom of the assembly groove 5.

[0024] In this embodiment, when the vortex cooling fan 12 is started, outside air is drawn in from the gap between the side of the LED substrate 7 and the mounting groove 5 and the gap between the bottom of the LED substrate 7 and the bottom of the mounting groove 5. After passing through the port 4 and the air inlet 11, it is discharged outward from the bottom of the fan groove 10 under the action of the vortex cooling fan 12. During the process, air convection is formed to more effectively remove heat.

[0025] Specifically, the bottom of the opening 4 is provided with a protruding ring 16, and the top of the sunflower radiator 9 is provided with a positioning groove 17, and the positioning groove 17 and the protruding ring 16 are engaged with the heat-conducting base 1.

[0026] In this embodiment, the assembly between the sunflower radiator 9 and the heat-conducting base 1 is facilitated by the cooperation between the positioning groove 17 and the convex ring 16.

[0027] Specifically, the air inlet 11 is connected to the positioning groove 17 and is also connected to the through-hole 4.

[0028] In this embodiment, outside air is introduced through the vent 4 and the air inlet 11, and air convection is formed under the action of the vortex cooling fan 12.

[0029] During use, the heat generated by the lighting is conducted from the heat spreader 6 (which transfers heat through liquid-vapor phase change, enabling it to quickly remove heat from hot spots during high-load operation) to the heat-conducting base 1, thus efficiently and evenly distributing the heat. At the same time, the coolant 3 is used as the heat transfer medium. The heat transfer efficiency and specific heat capacity of the coolant 3 are much higher than those of air, so it can absorb heat from the heat source more effectively and dissipate it to the external environment. Combined with the directly connected sunflower radiator 9, and the strong airflow of the vortex cooling fan 12, it provides higher heat dissipation efficiency.

[0030] In summary, this heat-dissipating semiconductor lighting device conducts the heat generated by lighting from the heat spreader 6 to the heat-conducting base 1, which can efficiently and evenly distribute the heat. At the same time, the coolant 3 is used as the heat conduction medium. The heat conduction efficiency and specific heat capacity of the coolant 3 are much higher than those of air. Therefore, it can absorb heat from the heat source more effectively and dissipate it to the external environment. Combined with the directly connected sunflower heat sink 9, it provides higher heat dissipation efficiency under the strong airflow of the vortex cooling fan 12.

[0031] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A heat dissipating type semiconductor lighting device comprising a heat conducting base (1), characterized in that: The heat-conducting base (1) has a cavity (2) and is filled with coolant (3). The cavity (2) has a through-hole (4) in the middle and an assembly groove (5) at the top, which is connected to the through-hole (4). A heat spreader (6) is installed at the bottom of the assembly groove (5) and an LED substrate (7) is installed on the heat spreader (6). LED beads (8) are installed on the LED substrate (7). A sunflower radiator (9) is installed at the bottom of the cavity (2) and a fan slot (10) is provided in the middle of the sunflower radiator (9). An air inlet (11) is provided at the top of the fan slot (10) and a vortex cooling fan (12) is installed at the top of the fan slot (10).

2. The heat dissipating type semiconductor lighting device according to claim 1, wherein: The heat-conducting base (1) is disc-shaped, and a viewing lens (13) is embedded in the side wall of the cavity (2).

3. The heat dissipating type semiconductor lighting device according to claim 1, wherein: The cavity (2) has a water inlet (14) on its side wall, and a cap (15) is threaded onto the water inlet (14).

4. The heat dissipating type semiconductor lighting device according to claim 1, wherein: There is a gap between the side of the LED substrate (7) and the assembly groove (5), and there is a gap between the bottom surface of the LED substrate (7) and the bottom of the assembly groove (5).

5. The heat dissipating type semiconductor lighting device according to claim 1, wherein: The bottom of the opening (4) is provided with a protruding ring (16), and the top of the sunflower radiator (9) is provided with a positioning groove (17), and is engaged with the heat-conducting base (1) through the positioning groove (17) and the protruding ring (16).

6. The heat dissipating type semiconductor lighting device according to claim 1, wherein: The air inlet (11) is connected to the positioning groove (17) and is also connected to the opening (4).

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