Split type double-layer grading ring
By designing a split-type double-layer equalizing ring, combined with a limiting plate and a limiting clip, the problem of the difficulty in installing the double-layer equalizing ring on the high-pressure test platform was solved, enabling easy installation by one or two people and reducing manpower consumption.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JIANGSU ANERDA POWER ENG TECH CO LTD
- Filing Date
- 2025-05-22
- Publication Date
- 2026-04-21
AI Technical Summary
The installation of double-layer equalizing rings on existing high-voltage test platforms is difficult, requiring both single-person and multi-person collaborative installation, and is very labor-intensive.
Design a split-type double-layer equalizing ring, including a chassis, bearing, double-layer mounting base, upper and lower mounting plates, and an arc-shaped equalizing split body. Rotation is limited by a limiting plate and a limiting clip. The split design reduces weight and facilitates installation by one or two people.
By combining a split design with a limiting plate and a limiting card, the installation difficulty of the double-layer equalizing ring is significantly reduced, allowing one or two people to complete the installation, thus reducing manpower consumption.
Smart Images

Figure CN224153196U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the technical field of high-pressure test platforms, and particularly relates to a split-type double-layer equalizing ring. Background Technology
[0002] A high-voltage test platform is a device used for high-voltage and high-current testing, widely used in the power industry, electronic component manufacturing, and the research and development and production of various high-voltage electrical appliances. The main functions of this type of platform include insulation strength testing, withstand voltage testing, and operational testing of power equipment, insulating materials, and electrical components to determine their safety performance and operational reliability under high-voltage environments.
[0003] High-voltage testing platforms are typically equipped with high-voltage generators, measuring instruments, and control systems, capable of simulating various electrical operating conditions and testing equipment performance under high voltage. This is crucial for ensuring the safety and effectiveness of equipment, particularly in power transmission, substation construction, and compliance testing of electrical products.
[0004] Due to the special nature of high-voltage equipment, double-layer grading rings are used in the testing of some ultra-high voltage withstand equipment to meet product requirements. These double-layer grading rings are installed on top of the resonant reactor on the high-voltage test platform. A single-layer ring weighs approximately 152 kg, and the double-layer ring weighs around 300 kg, making installation impossible for a single person. Even with multiple people working together, installation is extremely cumbersome and labor-intensive. Therefore, there is an urgent need to develop a grading ring device that can effectively reduce the installation difficulty of double-layer grading rings. Utility Model Content
[0005] The technical problem to be solved by this utility model is to provide a split-type double-layer pressure equalizing ring to address the shortcomings of the existing technology.
[0006] To achieve the above-mentioned technical objectives, the technical solution adopted by this utility model is as follows:
[0007] A split-type double-layer equalizing ring includes a chassis, a bearing mounted on the chassis, a double-layer mounting base mounted on the bearing, an upper mounting plate and a lower mounting plate on the double-layer mounting base, several upper arc-shaped equalizing components are detachably mounted on the upper mounting plate, and the upper arc-shaped equalizing components are combined to form an upper equalizing ring, and several lower arc-shaped equalizing components are detachably mounted on the lower mounting plate, and the lower arc-shaped equalizing components are combined to form a lower equalizing ring, the double-layer mounting base can rotate relative to the chassis via the bearing, and the chassis is fixedly mounted on a resonant reactor.
[0008] To optimize the above technical solution, the specific measures also include:
[0009] The aforementioned double-layer mounting base also includes a central positioning plate and a connecting rod. The central positioning plate is fixedly connected to the upper mounting plate and the lower mounting plate respectively via the connecting rod.
[0010] Both the upper and lower mounting plates mentioned above are provided with a number of mounting plate holes, which are set with equal arc around the center of the corresponding mounting plate.
[0011] Both the upper and lower arc-shaped pressure equalizing sub-units are equipped with sub-plates. The sub-plates have sub-holes that can be aligned with the holes in the mounting plates. Fasteners pass through both the sub-holes and the mounting plate holes to fix the sub-plates to the corresponding mounting plates.
[0012] A limiting plate is installed on the aforementioned bearing. The limiting plate is fixedly fitted to the chassis and rotatably fitted to the lower mounting plate. The limiting plate is provided with several limiting holes for installing limiting clips. The limiting clips can extend to the surface of the lower mounting plate and block the rotation path of the lower arc-shaped pressure equalizing split body, thereby limiting the rotation of the double-layer mounting base.
[0013] The resonant reactor described above has a reactor top plate fixed to its top, and a mounting base fixed to the reactor top plate. The mounting base has multiple mounting holes, and the chassis has multiple chassis holes. The chassis holes can be aligned with the mounting holes. Fasteners are inserted into both the mounting holes and the chassis holes to fix the resonant reactor to the chassis.
[0014] The aforementioned split plate has vertically bent skirts on both sides. The skirts are used to cooperate with the limit card to limit the rotation of the double-layer mounting base.
[0015] The number of the upper arc-shaped pressure equalization sub-body is three, and the number of the lower arc-shaped pressure equalization sub-body is three.
[0016] Both ends of the aforementioned upper and lower arc-shaped pressure equalization components are rounded.
[0017] Both the upper and lower arc-shaped pressure equalization components mentioned above are made of aluminum.
[0018] The beneficial effects of this utility model are:
[0019] 1. This utility model has two layers of equalizing rings, each of which is composed of multiple arc-shaped equalizing components. By disassembling the equalizing rings, the weight of the equalizing ring components is greatly reduced, allowing for single or double-person operation during installation and disassembly, effectively reducing the difficulty of the operation.
[0020] 2. The arc-shaped voltage equalization unit of this utility model is installed on a rotatable double-layer mounting base. When installing the arc-shaped voltage equalization unit, the resonant reactor can be tilted down, and then the double-layer mounting base can be rotated to install each arc-shaped voltage equalization unit at the predetermined position on the mounting base. Then the resonant reactor can be erected. Rotating the mounting base can greatly reduce the difficulty of installing the arc-shaped voltage equalization unit.
[0021] 3. This utility model also includes a limiting plate, on which a limiting card can be installed. The limiting card is used to lock the rotation of the double-layer mounting base. When it is necessary to install a certain arc-shaped equalizing split unit, the rotating mounting base is rotated to bring the installation position to the front of the installer. At this time, the limiting card locks the rotating mounting base to prevent the installation position from moving randomly, making it convenient for the installer to install the arc-shaped equalizing split unit. Attached Figure Description
[0022] Figure 1 This is a schematic diagram of the structure of a split-type double-layer pressure equalizing ring according to this utility model;
[0023] Figure 2 yes Figure 1 Enlarged view of part A;
[0024] Figure 3 This is a schematic diagram of the double-layer mounting base. Figure 1 ;
[0025] Figure 4 This is a schematic diagram of the double-layer mounting base. Figure 2 ;
[0026] Figure 5 This is a schematic diagram of the double-layer mounting base. Figure 3 ;
[0027] Figure 6 This is a schematic diagram of the chassis mounted on the top plate of the reactor.
[0028] The attached figures are labeled as follows: chassis 1, bearing 2, limiting plate 21, limiting hole 22, double-layer mounting base 3, upper mounting plate 31, lower mounting plate 32, middle positioning plate 33, connecting rod 34, mounting plate hole 35, upper equalizing ring 4, upper arc-shaped equalizing split 41, lower equalizing ring 5, lower arc-shaped equalizing split 51, split plate 6, split hole 61, skirt 62, resonant reactor 7, reactor top plate 71, and mounting base 72. Detailed Implementation
[0029] To make the objectives, technical solutions, and advantages of this application clearer, the application is described and illustrated below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application. All other embodiments obtained by those skilled in the art based on the embodiments provided in this application without inventive effort are within the scope of protection of this application.
[0030] Obviously, the accompanying drawings described below are merely some examples or embodiments of this application. Those skilled in the art can apply this application to other similar scenarios based on these drawings without any inventive effort. Furthermore, it is understood that although the efforts made in this development process may be complex and lengthy, for those skilled in the art related to the content disclosed in this application, any changes to design, manufacturing, or production based on the technical content disclosed in this application are merely conventional technical means and should not be construed as insufficient disclosure of the content of this application.
[0031] In this application, the reference to "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment that is mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described in this application may be combined with other embodiments without conflict.
[0032] Unless otherwise defined, the technical or scientific terms used in this application shall have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms “a,” “an,” “an,” “the,” and similar words used in this application do not indicate quantity limitation and may indicate singular or plural. The terms “comprising,” “including,” “having,” and any variations thereof used in this application are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or device that includes a series of steps or units (elements) is not limited to the listed steps or units, but may also include steps or units not listed, or may include other steps or units inherent to these processes, methods, products, or devices. The terms “connected,” “linked,” “coupled,” and similar words used in this application are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. The terms “multiple” / “several” used in this application refer to two or more. “And / or” describes the relationship between related objects, indicating that three relationships may exist; for example, “A and / or B” can indicate: A alone, A and B simultaneously, or B alone. The character " / " generally indicates that the preceding and following objects are in an "or" relationship. The terms "first," "second," and "third" used in this application are merely to distinguish similar objects and do not represent a specific ordering of the objects.
[0033] like Figure 1-2 As shown, the split-type double-layer equalizing ring of this utility model includes a chassis 1, a bearing 2, a double-layer mounting base 3, an upper equalizing ring 4, a lower equalizing ring 5, and a resonant reactor 7, etc.
[0034] The top plate 71 of the resonant reactor 7 is fixed on the top of the reactor. The top plate 71 is fixed with a mounting base 72. The top plate 71 is a circular plate made of insulating material. The mounting base 72 consists of two strip blocks with multiple mounting holes distributed on them. The chassis 1 is fixed in the predetermined mounting holes according to actual needs.
[0035] A bearing 2 is installed on the chassis 1. The bearing 2 is divided into a fixed layer and a rotating layer. The fixed layer and the rotating layer of the bearing 2 can be rotated and engaged by ball bearings. The fixed layer of the bearing 2 is fixedly connected to the chassis 1, and the rotating layer is fixedly connected to the bottom of the double-layer mounting base 3.
[0036] The fixed layer of bearing 2 is equipped with a limiting plate 21. The limiting plate 21 is a circular plate with a ring of limiting holes around its edge. The limiting holes are used to install limiting clips. The limiting clips are not marked in the figure. The limiting clips are long and can extend to the upper surface of the lower mounting plate 32. When the limiting clips are not in use, they can be removed from the limiting plate 21.
[0037] The double-layer mounting base 3 includes an upper mounting plate 31, a lower mounting plate 32, a central positioning plate 33, and a connecting rod 34. The central positioning plate 33 and the connecting rod 34 serve as the mounting base frame, supporting the upper mounting plate 31 and the lower mounting plate 32. Both the upper mounting plate 31 and the lower mounting plate 32 are circular plates. A ring of mounting plate holes 35 is provided around the edges of the upper mounting plate 31 and the lower mounting plate 32. The split plate 6 of the upper arc-shaped pressure equalizing splitter 41 is mated and installed with the upper mounting plate 31, and the split plate 6 of the lower arc-shaped pressure equalizing splitter 51 is mated and installed with the lower mounting plate 32. Figure 1-2 As can be seen, there are three upper-layer arc-shaped equalizing elements 41 and three lower-layer arc-shaped equalizing elements 51. In practical applications, the number of upper-layer arc-shaped equalizing elements 41 and lower-layer arc-shaped equalizing elements 51 can be set to multiple as needed, and the number of upper-layer arc-shaped equalizing elements 41 and lower-layer arc-shaped equalizing elements 51 can be different. Both the upper-layer equalizing ring 4 and the lower-layer equalizing ring 5 are split-type circular rings, and both ends of the upper-layer arc-shaped equalizing elements 41 and lower-layer arc-shaped equalizing elements 51 are rounded. Both the upper-layer arc-shaped equalizing elements 41 and lower-layer arc-shaped equalizing elements 51 are made of aluminum. In this embodiment, the upper-layer equalizing ring 4 and the lower-layer equalizing ring 5 are the same size, with the finished dimensions of the equalizing rings: diameter 3000mm and height 1900mm.
[0038] The advantage of this invention is that it can greatly reduce the installation difficulty of the double-layer equalizing ring.
[0039] Due to transportation requirements, the equalizing ring of the high-pressure test platform needs to be removed when it is not in use. The equalizing ring is only installed when it is in use. However, the weight of a single-layer ring is about 152kg, and the weight of a double-layer ring will reach about 300kg, which cannot be installed by a single person.
[0040] When installing the double-layer equalizing ring of this utility model, the lower arc-shaped equalizing component 51 is installed first. The component ring weighs approximately 50kg and is quickly fixed with bolts. After the double-layer mounting base 3 is rotated to the designated position, the worker installs the first lower arc-shaped equalizing component 51 on the lower mounting plate 32. After installation, the double-layer mounting base 31 is rotated 20°, and then a limit clip is used to block the installed first lower arc-shaped equalizing component 51, preventing the double-layer mounting base 3 from rotating. At this time, the installation point of the second lower arc-shaped equalizing component 51 is exactly rotated to the position of the worker. In front of the worker, the second lower arc-shaped equalizing pressure unit 51 is installed. After installation, the limit clip is removed, and the double-layer mounting base 31 is rotated 20° in the same direction. Then, the limit clip is used to block the first or second lower arc-shaped equalizing pressure unit 51 that has been installed. At this time, the installation point of the third lower arc-shaped equalizing pressure unit 51 is rotated to the worker's front. The worker then installs the third lower arc-shaped equalizing pressure unit 51. At this time, the lower equalizing ring 5 is installed. The upper equalizing ring 4 is installed in the same way. The entire set of equalizing rings is installed and put into use.
[0041] During the installation of the double-layer equalizing ring of this utility model, the weight of the ring installed by the worker is about 50kg, and one or two people can complete the whole process.
[0042] The above are merely preferred embodiments of this utility model. The protection scope of this utility model is not limited to the above embodiments. All technical solutions falling within the scope of this utility model's concept are within its protection scope. It should be noted that for those skilled in the art, any improvements and modifications made without departing from the principle of this utility model should be considered within its protection scope.
Claims
1. A split double-layered equalizing ring, characterized in that: The device includes a chassis (1), on which a bearing (2) is mounted, and on which a double-layer mounting base (3) is mounted. The double-layer mounting base (3) is provided with an upper mounting plate (31) and a lower mounting plate (32). Several upper arc-shaped equalizing components (41) are detachably mounted on the upper mounting plate (31), and the upper arc-shaped equalizing components (41) are combined to form an upper equalizing ring (4). Several lower arc-shaped equalizing components (51) are detachably mounted on the lower mounting plate (32), and the lower arc-shaped equalizing components (51) are combined to form a lower equalizing ring (5). The double-layer mounting base (3) can rotate relative to the chassis (1) through the bearing (2). The chassis (1) is fixedly mounted on the resonant reactor (7).
2. The split double-layered equalizing ring according to claim 1, characterized in that: The double-layer mounting base (3) further includes a central positioning plate (33) and a connecting rod (34). The central positioning plate (33) is fixedly connected to the upper mounting plate (31) and the lower mounting plate (32) respectively through the connecting rod (34).
3. The split double-layered equalizing ring according to claim 2, characterized in that: Both the upper mounting plate (31) and the lower mounting plate (32) are provided with a plurality of mounting plate holes (35), and the mounting plate holes (35) are set with equal arc around the center of the corresponding mounting plate.
4. The split double-layered equalizing ring according to claim 3, characterized in that: Both the upper arc-shaped equalizing split body (41) and the lower arc-shaped equalizing split body (51) are provided with split plates (6). The split plates (6) are provided with split holes (61). The split holes (61) can be aligned with the mounting plate holes (35). Fasteners pass through both the split holes (61) and the mounting plate holes (35) to fix the split plates (6) to the corresponding mounting plates.
5. The split double-layered equalizing ring according to claim 4, characterized in that: A limiting plate (21) is installed on the bearing (2). The limiting plate (21) is fixedly engaged with the chassis (1) and rotatably engaged with the lower mounting plate (32). The limiting plate (21) is provided with several limiting holes (22). The limiting holes (22) are used to install limiting clips. The limiting clips can extend to the surface of the lower mounting plate (32) and block the rotation path of the lower arc-shaped equalizing split body (51), thereby limiting the rotation of the double-layer mounting base (3).
6. The split double-layered equalizing ring according to claim 5, characterized in that: The resonant reactor (7) is fixed with a reactor top plate (71) on top. The reactor top plate (71) is fixed with a mounting base (72). The mounting base (72) is provided with multiple mounting holes. The chassis (1) is provided with multiple chassis holes. The chassis holes can be aligned with the mounting holes. Fasteners are inserted into the mounting holes and chassis holes at the same time, so that the resonant reactor (7) is fixedly connected to the chassis (1).
7. The split double-layered equalizing ring according to claim 6, characterized in that: The split plate (6) is provided with vertically bent skirts (62) on both sides. The skirts (62) are used to cooperate with the limiting card to limit the rotation of the double-layer mounting base (3).
8. The split double-layered equalizing ring of claim 1, wherein: The number of the upper arc-shaped pressure equalization sub-body (41) is three, and the number of the lower arc-shaped pressure equalization sub-body (51) is three.
9. The split double-layered equalizing ring of claim 1, wherein: Both ends of the upper arc-shaped pressure equalizing body (41) and the lower arc-shaped pressure equalizing body (51) are rounded.
10. The split double-layered equalizing ring of claim 1, wherein: The upper arc-shaped equalizing part (41) and the lower arc-shaped equalizing part (51) are made of aluminum.