Heat dissipation shell, electronic equipment and vehicle

Abstract

The utility model discloses a heat dissipation shell, electronic equipment and vehicle, relates to electronic equipment technical field, the heat dissipation shell comprises a first shell part and a second shell part that are connected, the second shell part at least partially surrounds the outside of the first shell part, the first shell part has a first side and a second side that are opposite to each other, and the first side and the second side are opposite to each other. The first side and an electrical element of the electronic equipment are oppositely arranged, the first shell part is provided with a heat dissipation structure, and the material of the first shell part is different from that of the second shell part. According to the technical scheme provided by the utility model, heat dissipation is carried out on the electric appliance element so as to guarantee the performance of the electronic equipment.

Description

Technical Field

[0001] This utility model relates to the field of electronic equipment technology, and in particular to a heat sink housing, electronic equipment, and vehicle. Background Technology

[0002] When the electrical components inside electronic devices are working, they often generate heat. The heat generated by these components accumulates inside the casing, which will affect the performance of the electronic devices. Utility Model Content

[0003] The main purpose of this invention is to provide a heat dissipation housing, electronic equipment, and vehicle, which aims to dissipate heat from electrical components to ensure the performance of electronic equipment.

[0004] To achieve the above objectives, the heat dissipation housing proposed in this utility model includes a first housing portion and a second housing portion connected to each other. The second housing portion is at least partially surrounded by the first housing portion. The first housing portion has a first side and a second side that are opposite to each other. The first side is disposed opposite to the electrical components of the electronic device. The first housing portion is provided with a heat dissipation structure. The materials of the first housing portion and the second housing portion are different.

[0005] In one embodiment, the density of the first shell portion is lower than the density of the second shell portion.

[0006] In one embodiment, the structural strength of the second shell portion is higher than that of the first shell portion.

[0007] In one embodiment, the first shell portion is configured as a thermally conductive plastic material.

[0008] In one embodiment, the second shell portion is made of metal.

[0009] In one embodiment, the first shell portion is connected to the second shell portion by insert injection molding, welding, bonding, or fusion.

[0010] In one embodiment, the first side protrusion is provided with a plurality of heat-conducting protrusions.

[0011] In one embodiment, the heat dissipation structure includes a plurality of spaced-apart heat dissipation fins disposed on the second side.

[0012] In one embodiment, the second side is recessed with a receiving groove, and the heat dissipation fins are received in the receiving groove.

[0013] In one embodiment, the inner peripheral edge of the second shell portion is embedded within the outer peripheral edge of the first shell portion.

[0014] In one embodiment, the inner peripheral edge of the second shell portion is recessed on the side where the second side is located to form an annular step.

[0015] In one embodiment, the inner peripheral edge of the second shell portion is formed with a plurality of through holes spaced apart circumferentially.

[0016] In one embodiment, the outer peripheral edge of the first shell portion is smoothly connected to the second shell portion on the second side.

[0017] In one embodiment, the second shell portion includes an enclosure portion and a side portion. The inner peripheral edge of the enclosure portion is embedded within the outer peripheral edge of the first shell portion, and the side portion is connected to the outer peripheral edge of the enclosure portion and folded away from the first side relative to the enclosure portion.

[0018] In one embodiment, the second shell portion includes a plurality of said side portions distributed along the outer periphery of the enclosure portion, with each pair of adjacent said side portions connected together.

[0019] In one embodiment, each pair of adjacent sides is connected by welding.

[0020] In one embodiment, the plurality of side portions are integrally formed with the enclosure portion by stamping, and then bent relative to the enclosure portion.

[0021] In one embodiment, the enclosure portion has at least two positioning posts for insertion into the circuit board and / or multiple first connecting posts for fastener connection and enclosing the first shell portion on the side where the first side is located.

[0022] In one embodiment, the first housing portion has a plurality of spaced second connecting posts protruding on the side where the first side is located, and the second connecting posts are used for fastener connection.

[0023] In one embodiment, the heat dissipation housing further includes a third shell portion disposed on the side of the side portion away from the enclosure portion, thereby forming a receiving space.

[0024] This invention also proposes an electronic device, including the aforementioned heat dissipation housing.

[0025] In one embodiment, the electronic device is configured as an electronic control device.

[0026] In one embodiment, the electronic device is configured as a power amplifier for driving a speaker.

[0027] In one embodiment, the electronic device is configured as an audio system, the audio system including a speaker and an amplifier for driving the speaker, and the heat sink is applied to the amplifier.

[0028] This utility model also proposes a vehicle that includes the aforementioned electronic equipment.

[0029] In this invention, the first housing is positioned opposite to the electrical components, allowing heat generated by the components to be promptly transferred to the heat dissipation structure on the first housing. This heat dissipation structure prevents heat accumulation inside the housing, ensuring the performance and extending the lifespan of the components, thus guaranteeing the overall performance of the electronic device. Furthermore, by using a second housing made of a different material than the first housing, different areas of the heat dissipation housing can be differentiated. Each housing performs its corresponding function, avoiding the need for a single material to handle multiple performance aspects. This reduces the requirements for material selection and allows the heat dissipation housing to possess a variety of superior properties. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0031] Figure 1 An exploded structural diagram of an embodiment of the electronic device provided by this utility model;

[0032] Figure 2 for Figure 1 A magnified view of a section at point A in the middle;

[0033] Figure 3 A partial structural cross-sectional view of an embodiment of the electronic device provided by this utility model;

[0034] Figure 4 A schematic diagram of the structure of a heat dissipation housing provided by this utility model from one perspective;

[0035] Figure 5 This is a schematic diagram of the structure of one embodiment of the heat dissipation housing provided by this utility model from another perspective.

[0036] Explanation of icon numbers:

[0037] 100, First shell portion; 101, First side; 102, Second side; 110, Thermally conductive protrusion; 120, Heat dissipation fins; 130, Receiving groove; 140, Second connecting post;

[0038] 200. Second shell portion; 210. Enclosing portion; 211. Annular step; 212. Through hole; 213. Positioning post; 214. First connecting post; 220. Side portion;

[0039] 300. Third shell section;

[0040] 410. Circuit board; 420. Electrical components; 430. Fasteners.

[0041] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0042] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0043] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0044] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0045] This invention proposes a heat dissipation housing for use in electronic devices.

[0046] In one embodiment, the electronic device is configured as an electronic control device, that is, the heat sink housing serves as the outer shell structure of the electronic control device, and the control circuit board is housed inside it. At least the first shell portion of the heat sink housing and the side of the control circuit board where electrical components are mounted are arranged opposite each other.

[0047] In one embodiment, the electronic device is configured as a power amplifier for driving a speaker. Specifically, a heat sink serves as the housing structure of the power amplifier, internally housing and mounting a power amplifier circuit board. At least the first portion of the heat sink and the side of the power amplifier circuit board where electrical components are mounted are positioned opposite each other. Based on this, the electronic device can also be configured as an audio system, including a speaker and a power amplifier for driving the speaker, with the heat sink applied to the power amplifier. The aforementioned speaker can be a speaker in a vehicle audio system or a speaker in a room audio system.

[0048] Please see Figure 1 , Figure 4 and Figure 5 In one embodiment of the present invention, the heat dissipation housing includes a first housing portion 100 and a second housing portion 200 connected to each other. The second housing portion 200 is at least partially surrounding the first housing portion 100. The first housing portion 100 has a first side 101 and a second side 102 opposite to each other. The first side 101 and the electrical components 420 of the electronic device are disposed opposite to each other. The first housing portion 100 is provided with a heat dissipation structure.

[0049] In this utility model, the first housing 100 is arranged opposite to the electrical component 420, so that the heat generated by the electrical component 420 can be transferred to the heat dissipation structure on the first housing 100 in a timely manner. Heat dissipation through the heat dissipation structure can prevent the heat generated by the electrical component 420 from accumulating inside the housing, which is beneficial to ensuring the working performance of the electrical component 420 and extending the service life of the electrical component 420, thereby ensuring the working performance of the electronic equipment.

[0050] Furthermore, please refer to the following: Figure 1 , Figure 3 and Figure 5The first side 101 is provided with a plurality of heat-conducting protrusions 110. The first housing can directly or indirectly abut against the electrical component 420 through the heat-conducting protrusions 110. In this way, the heat transfer mode between the electrical component 420 and the first housing is changed to heat conduction, which has a higher heat transfer efficiency than natural convection, and the heat generated by the electrical component 420 can be transferred outward more promptly. Each heat-conducting protrusion 110 abuts against one electrical component 420, and the protrusion height of each heat-conducting protrusion 110 is adaptively set according to the electrical component 420 that needs to be abutted and heat-conducted. Thermal grease can be applied to the surface of the thermally conductive protrusion 110. This grease fills the tiny gaps and irregularities between the contact surfaces of the thermally conductive protrusion 110 and the electrical component 420. This not only reduces the processing precision requirements for the surface flatness and protrusion height of the thermally conductive protrusion 110, reliably ensuring heat conduction between the thermally conductive protrusion 110 and the corresponding electrical component 420, but also reduces thermal resistance and improves heat conduction efficiency. Alternatively, in other embodiments, the first side 101 may not have a protrusion. Instead, a thermally conductive structure, such as thermally conductive rubber or thermally conductive silicone, with high thermal conductivity, can be sandwiched between the electrical component 420 and the first side 101 to achieve heat conduction between the electrical component 420 and the first housing 100.

[0051] For details, please refer to the following: Figure 1 , Figure 3 and Figure 4 The heat dissipation structure includes a plurality of spaced-apart heat dissipation fins 120 disposed on the second side 102. Heat dissipation is achieved through convection heat exchange with external air. The arrangement of the heat dissipation fins 120 significantly increases the heat exchange area between the first shell 100 and the external air, thereby improving the heat exchange efficiency between the first shell 100 and the external air, and thus enhancing the heat dissipation capacity of the heat dissipation shell. Alternatively, the heat dissipation structure can also be a coolant channel, dissipating heat through liquid cooling.

[0052] Furthermore, please refer to the following: Figure 1 , Figure 3 and Figure 4 The second side 102 has a recessed receiving groove 130, and the heat dissipation fins 120 are housed within the receiving groove 130. In this way, the heat dissipation fins 120 can be recessed, without excessively occupying external space. The heat dissipation fins 120 can also be flush with the surface of the second side 102, or they can protrude appropriately. When the first side 101 has a heat-conducting protrusion 110, the receiving groove 130 ensures that the thickness of the first shell portion 100 is not too thick, which helps reduce the amount of material required for processing the first shell portion 100 and ensures the yield of the finished product. Of course, in other embodiments, the heat dissipation fins 120 can also protrude from the surface of the second side 102.

[0053] The first shell 100 is made of a different material than the second shell 200, which allows for differentiated design of different areas of the heat dissipation shell. The first shell 100 and the second shell 200 each perform their respective functions, avoiding the problem of using a single material to achieve multiple performance aspects. This reduces the requirements for material selection and also helps the heat dissipation shell to have multiple excellent performance aspects.

[0054] It should be noted that both the first shell 100 and the second shell 200 should be made of materials with certain thermal conductivity and structural strength. In this way, both the first shell 100 and the second shell 200 can reliably transfer the heat generated by the electrical component 420 to the outside in a timely manner and provide reliable protection for the electrical component 420.

[0055] Compared to the second shell 200, the first shell 100 can be made of a lower density material. This allows for a lighter weight even with a heat dissipation structure, making assembly easier and less labor-intensive. The first shell 100 can also be made of a more manufacturable material. Even if the heat dissipation structure increases the structural complexity of the first shell 100, it can still be manufactured using reliable, efficient, and low-cost processes, thereby improving the yield and production efficiency of the heat dissipation shell and reducing its production cost. Furthermore, the first shell 100 can be made of a material with higher thermal conductivity, allowing heat generated by electronic devices to be transferred outwards more efficiently. Specifically, the first shell 100 can be made of thermally conductive plastics, graphite, or other materials. Thermally conductive plastics are made by adding thermally conductive metal oxides, graphite fibers, or carbon fibers to ordinary plastics to improve their thermal conductivity. Their thermal conductivity can reach 3-30 W / (m·K), enabling reliable heat dissipation.

[0056] Compared to the first shell 100, the second shell 200 can be made of a material with higher structural strength to provide reliable support for the first shell 100, thereby ensuring the structural stability of the heat dissipation shell. The second shell 200 can also be made of a more ductile material. Considering that the heat dissipation structure is not formed in the second shell 200, the wall thickness of the second shell 200 can be designed to be relatively thin, and the more ductile material can be easily processed and formed. Specifically, the second shell 200 can be made of metallic materials, such as copper, iron, aluminum, and their alloys.

[0057] The first shell portion 100 and the second shell portion 200 can be integrally formed. For example, when the first shell portion 100 is made of plastic and the second shell portion 200 is made of metal, the first shell portion 100 can be integrally formed with the second shell portion through insert injection molding, thereby achieving the connection between the first shell portion 100 and the second shell portion 200. This ensures the stability of the connection between the first shell portion 100 and the second shell portion 200, and improves the production efficiency of the heat dissipation shell. Of course, the first shell portion 100 and the second shell portion 200 can also be formed independently and then connected by welding, bonding, or fusion.

[0058] In one embodiment, please refer to the following: Figures 1 to 3 The inner peripheral edge of the second shell portion 200 is embedded within the outer peripheral edge of the first shell portion 100. That is, both sides of the inner peripheral edge of the second shell portion 200 are covered by the first shell portion 100, thus ensuring the stable connection between the first shell portion 100 and the second shell portion 200, thereby ensuring the structural stability of the heat dissipation shell. Of course, in other embodiments, the outer peripheral edge of the first shell portion 100 and the inner peripheral edge of the second shell portion 200 may overlap.

[0059] In one embodiment, please refer to the following: Figures 1 to 3 The inner peripheral edge of the second shell portion 200 is recessed on the side where the second side 102 is located to form an annular step 211. In this way, a stepped surface that abuts against the outer peripheral surface of the first shell portion 100 can be formed, thereby increasing the contact area between the first shell portion 100 and the second shell portion 200, thereby improving the bonding stability of the first shell portion 100 and the second shell portion 200 and ensuring the structural stability of the heat dissipation shell.

[0060] In one embodiment, please refer to the following: Figure 1 and Figure 2 The inner peripheral edge of the second shell portion 200 has a plurality of through holes 212 spaced apart along the circumference. When the first shell portion 100 is made of thermally conductive plastic and the second shell portion 200 is made of metal, and the two are formed by insert injection molding, the through holes 212 will be distributed in the first shell portion 100, thereby improving the bonding stability of the first shell portion 100 and the second shell portion 200 and ensuring the structural stability of the heat dissipation shell.

[0061] In one implementation, please refer to Figure 4 The outer peripheral edge of the first shell portion 100 is smoothly connected to the second shell portion 200 on the second side 102. That is, the exposed portion of the second shell portion 200 and the adjacent part of the first shell portion 100 do not form an obvious step structure, which helps to ensure the appearance consistency of the heat dissipation shell.

[0062] In one embodiment, please refer to the following: Figure 4 and Figure 5 The second shell portion 200 includes an enclosure portion 210 and a side portion 220. The inner peripheral edge of the enclosure portion 210 is embedded within the outer peripheral edge of the first shell portion 100. The side portion 220 is connected to the outer peripheral edge of the enclosure portion 210 and folds away from the first side 101 relative to the enclosure portion 210. Thus, the side portion 220 can provide protection for the electrical component 420 and can be connected to other structures. Alternatively, in other embodiments, the heat dissipation housing can serve as a cover, without the side portion 220.

[0063] Furthermore, please refer to the following: Figure 4 and Figure 5 The second shell portion 200 includes a plurality of side portions 220 distributed along the outer periphery of the enclosure portion 210. Each pair of adjacent side portions 220 is connected, so that the heat dissipation shell can form a receiving space by enclosing the plurality of side portions 220 for accommodating the circuit board 410. Specifically, each pair of adjacent side portions 220 is connected by welding, which ensures that the joint between adjacent side portions 220 is sealed, which helps to improve the waterproof performance of the heat dissipation shell.

[0064] Further, please refer to Figure 1 The heat dissipation housing further includes a third shell portion 300, which is disposed on the side of the side portion 220 away from the enclosure portion 210, thereby forming a receiving space. Specifically, the circuit board 410 or other electrical components 420 are housed and installed within the receiving space, and then the third shell portion 300 is placed on the side of the side portion 220 away from the enclosure portion 210, thereby sealing the receiving space. Of course, in other embodiments, the receiving space can also be sealed by an external mounting base structure.

[0065] In this configuration, the multiple side portions 220 are integrally formed with the enclosing portion 210 through stamping, and then bent relative to the enclosing portion 210. Specifically, the multiple side portions 220 and the enclosing portion 210 are integrally stamped sheet metal parts, avoiding seams between the side portions 220 and the enclosing portion 210, and eliminating the assembly process between the side portions 220 and the enclosing portion 210. The bending process of the side portions 220 can be performed before or after the insert injection molding process of the first shell portion 100. Of course, the side portions 220 can also be integrally formed with the third shell portion 300.

[0066] Further, please refer to Figure 1 and Figure 5The enclosure portion 210 has at least two positioning posts 213 for inserting into the circuit board 410 and / or multiple first connecting posts 214 for fasteners 430 to connect to and surround the first housing portion 100. That is, the enclosure portion 210 is provided with at least one of the positioning posts 213 and the first connecting posts 214. The circuit board 410 has holes corresponding to the positioning posts 213. When installing the circuit board 410, the positioning posts 213 are inserted into the holes on the circuit board 410 to position the circuit board 410. Furthermore, the circuit board 410 may also have holes corresponding to the first connecting posts 214. The fasteners 430 pass through the holes in the third housing portion 300, the circuit board 410, and the first connecting posts 214 in sequence to reliably fix the circuit board 410 and also support the circuit board 410 through the first connecting posts 214. The fasteners 430 can be screws, rivets, studs, etc. Of course, in other embodiments, the first connecting post 214 may be located on the outer periphery of the circuit board 410, and the fastener 430 may only pass through the holes of the third shell 300 and the first connecting post 214.

[0067] In one implementation, please refer to Figure 5 The first housing portion 100 has a plurality of spaced second connecting posts 140 protruding on the side where the first side 101 is located. The second connecting posts 140 are used for fasteners 430 to connect. Both the circuit board 410 and the third housing portion 300 have holes opposite to the second connecting posts 140. The fasteners 430 pass through the holes of the third housing portion 300, the circuit board 410 and the second connecting posts 140 in sequence to further fix and support the circuit board 410 and prevent the electrical components 420 on the circuit board 410 from being compressed.

[0068] This utility model also proposes an electronic device, which includes a heat dissipation housing. The specific structure of the heat dissipation housing is as described in the above embodiments. Since this electronic device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0069] Optionally, the electronic device is configured as an electronic control device.

[0070] Optionally, the electronic device is configured as a power amplifier for driving a speaker.

[0071] Optionally, the electronic device is configured as an audio system, the audio system including a speaker and an amplifier for driving the speaker, and the heat sink is applied to the amplifier.

[0072] This utility model also proposes a vehicle that includes the aforementioned electronic equipment. Therefore, it employs all the technical solutions of all the above embodiments and possesses at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be elaborated upon here. That is, the heat dissipation housing is applied to the amplifier device of the vehicle audio system.

[0073] The above description is merely an exemplary embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A heat dissipating case applied to an electronic device, characterized by, The heat dissipation housing includes a first housing portion and a second housing portion connected to each other. The second housing portion is at least partially surrounded by the first housing portion. The first housing portion has a first side and a second side opposite to each other. The first side is disposed opposite to the electrical components of the electronic device. The first housing portion is provided with a heat dissipation structure. The materials of the first housing portion and the second housing portion are different.

2. The heat dissipating enclosure of claim 1, wherein, The density of the first shell portion is lower than the density of the second shell portion; And / or, the structural strength of the second shell portion is higher than the structural strength of the first shell portion; And / or, the first housing portion is configured to be made of thermally conductive plastic material; And / or, the second housing is configured to be made of metal.

3. The heat dissipating enclosure of claim 1, wherein, The first shell portion is connected to the second shell portion by means of insert injection molding, welding, bonding or fusion; And / or, the first side protrusion is provided with a plurality of heat-conducting protrusions.

4. The heat dissipating enclosure of claim 1, wherein, The heat dissipation structure includes a plurality of spaced-apart heat dissipation fins disposed on the second side.

5. The heat dissipating enclosure of claim 4, wherein, The second side is recessed with a receiving groove, and the heat dissipation fins are received in the receiving groove.

6. The heat dissipating housing according to any one of claims 1 to 5, wherein The inner peripheral edge of the second shell is embedded within the outer peripheral edge of the first shell.

7. The heat dissipating enclosure of claim 6, wherein, The inner peripheral edge of the second shell portion is recessed on the side where the second side is located to form an annular step; And / or, the inner peripheral edge of the second shell portion is formed with a plurality of through holes spaced apart along the circumferential direction.

8. The heat dissipating enclosure of claim 7, wherein, The outer peripheral edge of the first shell portion is smoothly connected to the second shell portion on the second side.

9. The heat dissipating enclosure of claim 6, wherein, The second shell portion includes an enclosure portion and a side portion. The inner peripheral edge of the enclosure portion is embedded within the outer peripheral edge of the first shell portion. The side portion is connected to the outer peripheral edge of the enclosure portion and is folded away from the first side relative to the enclosure portion.

10. The heat dissipating enclosure of claim 9, wherein, The second shell portion includes a plurality of side portions distributed along the outer periphery of the enclosure portion, with each pair of adjacent side portions connected together.

11. The heat dissipating enclosure of claim 10, wherein, Each pair of adjacent sides is connected by welding; And / or, after the multiple sides are integrally formed with the enclosure by stamping, they are bent relative to the enclosure.

12. The heat dissipating enclosure of claim 9, wherein, The enclosure portion has at least two positioning posts for insertion into the circuit board and / or multiple first connecting posts for fastener connection and enclosing the first shell portion on the side where the first side is located. And / or, the first housing portion is provided with a plurality of spaced second connecting posts on the side where the first side is located, the second connecting posts being used for fastener connection; And / or, the heat dissipation housing further includes a third housing portion disposed on the side of the side portion away from the enclosure portion, thereby forming a receiving space.

13. An electronic device, comprising: Includes the heat dissipation housing as described in any one of claims 1 to 12.

14. The electronic device of claim 13, wherein, The electronic device is configured as an electronic control device; Alternatively, the electronic device may be configured as a power amplifier to drive a speaker; Alternatively, the electronic device may be configured as an audio system, the audio system including a speaker and an amplifier that drives the speaker, the heat sink being applied to the amplifier.

15. A vehicle characterized by comprising: Includes the electronic device described in claim 13 or 14.

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