Photoelectric coupler packaging structure

Abstract

The utility model discloses a photoelectric coupler packaging structure which comprises a substrate, supports are installed on the left side and the right side of the top of the substrate, installation grooves are formed in the tops of the supports, positioning protrusions are arranged on the two sides of each installation groove, and a first pin and a second pin are installed in the installation grooves in the left side and the right side. The first pin and the second pin are provided with limiting notches corresponding to the positioning protrusions, the first pin is provided with a first bent plate, the first bent plate is arranged on the side away from the substrate, the second pin is provided with a second bent plate, the second bent plate is arranged on the side close to the substrate, and a light-emitting element is installed at the bottom of the first bent plate. A light receiving element is installed on the top of the second bending plate, the light emitting element is arranged over the light receiving element, inner plastic packaging layers are arranged on the outer sides of the first bending plate, the light emitting element, the second bending plate and the light receiving element, outer plastic packaging layers are arranged on the outer sides of the inner plastic packaging layers, and the substrate is arranged in the outer plastic packaging layers.

Description

Technical Field

[0001] This utility model belongs to the field of packaging technology, specifically relating to an optocoupler packaging structure. Background Technology

[0002] An optocoupler is an electro-optical-electrical conversion device that transmits electrical signals using light as a medium. It consists of two parts: a light source and a light receiver. The light source and light receiver are assembled in the same sealed housing and isolated from each other by a transparent insulator. Therefore, optocoupler manufacturing requires encapsulation to isolate the internal light source and light receiver from the external environment and prevent corrosion from airborne impurities that could degrade performance. However, existing optocouplers are prone to pin loosening after encapsulation, resulting in low connection strength and insufficiently tight encapsulation, affecting the long-term use of the optocoupler. Therefore, there is an urgent need for an optocoupler encapsulation structure to solve these problems. Utility Model Content

[0003] In view of the problems mentioned in the background art, the purpose of this utility model is to provide an optocoupler packaging structure.

[0004] To achieve the above-mentioned technical objectives, the technical solution adopted by this utility model is as follows:

[0005] An optocoupler packaging structure includes a substrate. Supports are mounted on the top left and right sides of the substrate. The top of each support has a mounting groove, and positioning protrusions are provided on both sides of the mounting groove. A first pin and a second pin are mounted within the mounting groove on both sides. Each of the first and second pins has a limiting notch at a corresponding positioning protrusion. The first pin has a first bending plate located on the side away from the substrate. The second pin has a second bending plate located on the side closer to the substrate. A light-emitting element is mounted at the bottom of the first bending plate, and a light-receiving element is mounted at the top of the second bending plate, positioned directly above the light-receiving element. An inner plastic sealing layer is provided on the outer sides of the first bending plate, the light-emitting element, the second bending plate, and the light-receiving element. An outer plastic sealing layer is provided on the outer side of the inner plastic sealing layer, and the substrate is disposed within the outer plastic sealing layer.

[0006] Furthermore, the substrate and the supports on the left and right sides are integrally formed. A positioning post is provided inside the mounting groove, and positioning holes are provided on the first and second pins. Connection holes are provided on the outer sides of the mounting groove, the first pin, and the second pin, for filling the outer plastic sealant. This structural design further improves the pin mounting and fixing effect.

[0007] Furthermore, the inner encapsulation layer is an insulating and transparent epoxy resin encapsulation body. This insulating and transparent epoxy resin layer encapsulates the first bent plate, the light-emitting element, the second bent plate, and the light-receiving element, and encapsulates them within the substrate and the supports on the left and right sides. This structural design improves the encapsulation effect and prevents light scattering.

[0008] Further specifying, the outer molding layer is a black opaque epoxy resin encapsulation body, which encapsulates the substrate, support, first pin, second pin, and inner molding layer. This structural design facilitates encapsulation protection.

[0009] Furthermore, a thermally conductive copper plate is mounted on the bottom of the substrate, and the thermally conductive copper plate is disposed at the bottom of the outer plastic sealing layer. This structural design can achieve a heat conduction effect, allowing internal heat to be dissipated.

[0010] The beneficial effects of this utility model are as follows: This utility model uses the limiting notches on the first and second pins to cooperate with the positioning protrusions in the mounting groove, and the positioning holes on the first and second pins are simultaneously installed into the positioning posts in the mounting groove, further improving the installation effect. Moreover, when filling the outer plastic seal, the black opaque epoxy resin encapsulant will flow into the mounting groove, the connecting holes in the first and second pins, and make them connected and fixed, making the encapsulation connection more stable and tight, preventing the pins from becoming loose, improving the connection strength, and extending the service life of the optocoupler. Attached Figure Description

[0011] This utility model can be further illustrated by the non-limiting embodiments given in the accompanying drawings;

[0012] Figure 1 This is a schematic diagram of an optocoupler packaging structure according to an embodiment of the present invention;

[0013] Figure 2 This is a schematic diagram of a bracket structure for an optocoupler packaging structure according to an embodiment of the present invention;

[0014] Figure 3 This is a schematic diagram of the first pin structure of an optocoupler packaging structure according to an embodiment of the present invention;

[0015] The symbols for the main components are explained below:

[0016] 1. Substrate; 2. Support; 3. Mounting groove; 4. Positioning protrusion; 5. First pin; 6. Second pin; 7. Limiting notch; 8. First bending plate; 9. Second bending plate; 10. Light-emitting element; 11. Light-receiving element; 12. Inner plastic sealant; 13. Outer plastic sealant; 14. Positioning post; 15. Positioning hole; 16. Connecting hole; 17. Thermally conductive copper plate. Detailed Implementation

[0017] To enable those skilled in the art to better understand this utility model, the technical solution of this utility model will be further described below in conjunction with the accompanying drawings and embodiments.

[0018] like Figure 1-3 As shown, in the optocoupler packaging structure of this utility model, brackets 2 are installed on the top left and right sides of the substrate 1. The top of the brackets 2 is provided with mounting grooves 3, and the sides of the mounting grooves 3 are provided with positioning protrusions 4. A first pin 5 and a second pin 6 are installed in the mounting grooves 3 on the left and right sides. The first pin 5 and the second pin 6 are provided with limiting notches 7 at the corresponding positioning protrusions 4. The first pin 5 is provided with a first bending plate 8, which is located on the side away from the substrate 1. The second pin 6 is provided with a second bending plate 9, which is located on the side close to the substrate 1. A light-emitting element 10 is installed at the bottom of the first bending plate 8, and a light-receiving element 11 is installed at the top of the second bending plate 9. The light-emitting element 10 is located directly above the light-receiving element 11. An inner plastic sealing layer 12 is provided on the outside of the first bending plate 8, the light-emitting element 10, the second bending plate 9, and the light-receiving element 11. An outer plastic sealing layer 13 is provided on the outside of the inner plastic sealing layer 12. The substrate 1 is located inside the outer plastic sealing layer 13.

[0019] Preferably, the substrate 1 and the left and right side supports 2 are integrally formed. A positioning post 14 is provided inside the mounting groove 3, and positioning holes 15 are provided on the first pin 5 and the second pin 6. Connecting holes 16 are provided on the outer sides of the mounting groove 3, the first pin 5, and the second pin 6, for filling the outer plastic sealant 13. This structural design further improves the pin mounting and fixing effect. In practice, other structural shapes of the support 2 can also be considered depending on the specific circumstances.

[0020] Preferably, the inner molding layer 12 is an insulating and transparent epoxy resin encapsulator. This insulating and transparent epoxy resin layer encapsulates the first bent plate 8, the light-emitting element 10, the second bent plate 9, and the light-receiving element 11, and encapsulates them within the substrate 1 and the left and right side supports 2. This structural design improves the encapsulation effect and prevents light scattering. In practice, other structural shapes of the inner molding layer 12 can also be considered depending on the specific circumstances.

[0021] Preferably, the outer molding layer 13 is a black opaque epoxy resin encapsulator that encapsulates the substrate 1, the support 2, the first pin 5, the second pin 6, and the inner molding layer 12. This structural design facilitates encapsulation and protection. In practice, other structural shapes of the outer molding layer 13 can also be considered depending on the specific circumstances.

[0022] Preferably, a thermally conductive copper plate 17 is mounted on the bottom of the substrate 1, and the thermally conductive copper plate 17 is located at the bottom of the outer plastic sealing layer 13. This structural design can achieve a heat conduction effect, allowing internal heat to be dissipated. In practice, other structural shapes of the thermally conductive copper plate 17 can also be considered depending on the specific circumstances.

[0023] In this embodiment, during encapsulation, the first bending plate 8, the light-emitting element 10, the second bending plate 9, and the light-receiving element 11 are first encapsulated by the inner molding layer 12. Then, the first pin 5 and the second pin 6 are installed into the mounting groove 3 of the bracket 2, so that the limiting notch 7 on the first pin 5 and the second pin 6 cooperates with the positioning protrusion 4 in the mounting groove 3, thereby limiting and fixing the first pin 5 and the second pin 6. At this time, the lower side of the inner molding layer 12 is located between the substrate 1 and the bracket 2. Finally, the outer molding layer 13 is filled on the outside, so that the outer molding layer 13 wraps the substrate 1, the bracket 2, the first pin 5, the second pin 6, and the inner molding layer 12, thereby completing the encapsulation of the optocoupler.

[0024] When the first pin 5 and the second pin 6 are installed into the mounting groove 3 of the bracket 2, the positioning holes 15 on the first pin 5 and the second pin 6 are simultaneously installed into the positioning post 14 in the mounting groove 3, which further improves the installation effect. Moreover, when the outer plastic seal 13 is filled, the black opaque epoxy resin encapsulant will flow into the connecting hole 16 in the mounting groove 3, the first pin 5 and the second pin 6, so that they are connected and fixed, making the connection more stable and tight. At the same time, it also has the effect of reducing the water vapor entry rate and extending the water vapor entry time.

[0025] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. An opto-coupler package structure, characterized by: The system includes a substrate (1), on which brackets (2) are mounted on the top left and right sides. The top of each bracket (2) has a mounting groove (3), and both sides of the mounting groove (3) have positioning protrusions (4). A first pin (5) and a second pin (6) are mounted within the mounting grooves (3) on both sides. Each of the first pin (5) and the second pin (6) has a limiting notch (7) at the corresponding positioning protrusion (4). The first pin (5) has a first bending plate (8) located on the side away from the substrate (1). The second pin (6) has a second bending plate (8). The first bending plate (8) has a light-emitting element (10) installed at the bottom and a light-receiving element (11) installed at the top. The light-emitting element (10) is located directly above the light-receiving element (11). The first bending plate (8), the light-emitting element (10), the second bending plate (9) and the light-receiving element (11) are provided with an inner plastic seal layer (12) on the outside. The outer side of the inner plastic seal layer (12) is provided with an outer plastic seal layer (13). The substrate (1) is located inside the outer plastic seal layer (13).

2. An optoelectronic coupler package structure as claimed in claim 1, characterized in that: The substrate (1) and the brackets (2) on the left and right sides are integrally formed. The mounting groove (3) is provided with a positioning post (14) inside. The first pin (5) and the second pin (6) are provided with positioning holes (15). The mounting groove (3), the first pin (5) and the second pin (6) are all provided with connection holes (16) on the outside. The connection holes (16) are used for filling the outer plastic seal layer (13).

3. An optoelectronic coupler package structure as claimed in claim 2, wherein: The inner encapsulation layer (12) is an insulating and light-transmitting epoxy resin encapsulation body. The insulating and light-transmitting epoxy resin layer encapsulates the first bending plate (8), the light-emitting element (10), the second bending plate (9) and the light-receiving element (11), and encapsulates them in the substrate (1) and the brackets (2) on the left and right sides.

4. An optoelectronic coupler package structure as claimed in claim 3, wherein: The outer plastic seal (13) is a black opaque epoxy resin encapsulation body, which encapsulates the substrate (1), the bracket (2), the first pin (5), the second pin (6) and the inner plastic seal (12).

5. An optoelectronic coupler package structure as claimed in claim 4, wherein: A thermally conductive copper plate (17) is mounted on the bottom of the substrate (1), and the thermally conductive copper plate (17) is disposed at the bottom of the outer plastic sealing layer (13).

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