Edge polishing device for wafer rounding

Abstract

The utility model discloses an edge polishing device for wafer rounding, which comprises a lower working table, a three-axis moving assembly, a multi-station rotating table, a rotating disc, a wafer carrying disc, an extruding assembly and a polishing assembly which are arranged on the three-axis moving assembly, a blowing assembly and a CCD (Charge Coupled Device) acquisition assembly which are fixed on the lower working table, and a polishing protective cover which covers the polishing assembly, the upper shield is arranged on the lower workbench; the grinding assembly comprises a first longitudinal sliding plate fixed to the three-axis moving assembly, a grinding motor, a supporting plate, a plurality of rolling bearing seats arranged on the supporting plate in a sleeving mode, grinding shafts arranged in the rolling bearing seats in a one-to-one correspondence mode, and grinding heads arranged on the lower portions of the grinding shafts, wherein the grinding motor and the supporting plate are arranged on the first longitudinal sliding plate. The transmission belt assembly is arranged on the grinding shaft and connected with the grinding motor; the extrusion assembly comprises an extrusion installation frame fixed to the bottom of the supporting plate and at least one set of elastic extrusion assembly fixed to the extrusion installation frame.

Description

Technical Field

[0001] This utility model relates to the field of wafer rounding and polishing technology, and in particular to an edge polishing device for wafer rounding. Background Technology

[0002] This technology involves rounding a wafer, which means changing its shape from non-circular to circular, or rounding the edges of the wafer to meet the requirements of subsequent processing or use. During the rounding process, the edges of the wafer need to be polished. Currently, existing wafer polishing technologies, such as the technology disclosed in "Publication No. CN119703947A, entitled 'Wafer Surface Polishing Apparatus and Polishing Method'", can only polish the surface of the wafer.

[0003] Therefore, there is an urgent need to propose an edge grinding device for rounding wafers that is simple in structure and reliable in grinding. Utility Model Content

[0004] To address the aforementioned problems, the purpose of this invention is to provide an edge grinding device for rounding wafers. The technical solution adopted by this invention is as follows:

[0005] An edge polishing device for rounding wafers is disclosed, comprising a lower worktable, a three-axis moving assembly and a multi-station rotary table fixed on the lower worktable, an operating table covering the multi-station rotary table, a rotary disk mounted on the multi-station rotary table and embedded in the operating table, several wafer mounting trays mounted on the rotary disk, a pressing assembly and a polishing assembly mounted on the three-axis moving assembly, a blowing assembly and a CCD acquisition assembly fixed on the lower worktable and positioned around the perimeter of the rotary disk, a polishing protective cover covering the polishing assembly, and an upper protective cover mounted on the lower worktable; the operating table extends through the lower part of the upper protective cover; a circular groove is provided on the operating table; the rotary disk is placed within the circular groove;

[0006] The polishing assembly includes a first longitudinal slide plate fixed on a three-axis moving assembly, a polishing motor and a support plate mounted on the first longitudinal slide plate, several rolling bearing seats sleeved on the support plate, a polishing shaft corresponding to each of the rolling bearing seats, a polishing head mounted at the lower part of the polishing shaft, and a transmission belt assembly mounted on the polishing shaft and connected to the polishing motor; the polishing head polishes the edge of the rounded wafer.

[0007] The extrusion assembly includes an extrusion mounting frame fixed to the bottom of a support plate, and at least one set of elastic extrusion assemblies fixed to the extrusion mounting frame; the elastic extrusion assemblies extrude onto a rounded wafer within a wafer mounting tray.

[0008] Furthermore, the three-axis moving assembly includes a rear sliding assembly fixed on the lower worktable, a vertical mounting bracket disposed on the rear sliding assembly, a transverse moving assembly disposed on the vertical mounting bracket, and a longitudinal moving assembly disposed on the transverse moving assembly; the grinding assembly is disposed on the longitudinal moving assembly.

[0009] Furthermore, the rear sliding assembly includes a first slide rail and a lead screw assembly fixed on the lower worktable, a first slide table with a sliding sleeve disposed on the first slide rail and connected to the lead screw assembly; the vertical mounting bracket is fixed on the first slide table.

[0010] Furthermore, the longitudinal moving component includes a first transverse sliding plate disposed on the transverse moving component, two second slide rails disposed on the first transverse sliding plate, several second sliders slidably sleeved on the second slide rails and connected to the first longitudinal sliding plate, a first servo motor disposed on the first transverse sliding plate, a rack fixed along the longitudinal direction to the back of the first longitudinal sliding plate, and a gear disposed on the first servo motor and meshing with the rack.

[0011] Furthermore, the elastic extrusion assembly includes a support fixed on the extrusion mounting frame, several slide rods extending through the support in the longitudinal direction, an extrusion head disposed at the bottom of the slide rods, an upper limit seat disposed at the top of the slide rods, and a spring sleeved on the slide rods and extruded between the support and the extrusion head.

[0012] Compared with the prior art, the present invention has the following beneficial effects:

[0013] (1) This utility model uses a three-axis moving component to drive the extrusion component and the polishing component to extrude and polish the wafer in the wafer mounting tray; in addition, this utility model uses a multi-station rotary table and a rotary disk to feed the wafer.

[0014] (2) This utility model uses several elastic extrusion components to extrude force onto the wafer surface, preventing the wafer from rotating during the polishing process. In addition, this utility model uses several polishing heads arranged in a ring array around the wafer to facilitate polishing.

[0015] In summary, this utility model has the advantages of simple structure and reliable grinding, and has high practical and promotional value in the field of wafer rounding and grinding technology. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope of protection. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a structural schematic diagram of the present invention from a first angle.

[0018] Figure 2 This is a structural schematic diagram of the present invention from a second angle.

[0019] Figure 3 This is a structural schematic diagram of the present invention from a third angle.

[0020] Figure 4 This is a schematic diagram of the operating table in this utility model.

[0021] Figure 5 This is a first partial enlarged schematic diagram of the present invention.

[0022] Figure 6 This is a second enlarged schematic diagram of the present invention.

[0023] Figure 7 This is a schematic diagram of the extrusion assembly in this utility model.

[0024] Figure 8 This is a schematic diagram of the structure of the rear sliding component in this utility model.

[0025] In the above figures, the component names corresponding to the reference numerals are as follows:

[0026] 1. Lower worktable; 2. Operating table; 3. Multi-station rotary table; 4. Rotary disk; 5. Rear sliding assembly; 6. Vertical mounting bracket; 7. Lateral movement assembly; 8. Longitudinal movement assembly; 9. Grinding protective cover; 10. Extrusion assembly; 11. Grinding assembly; 12. Blowing assembly; 13. CCD acquisition assembly; 21. Circular slot; 41. Wafer mounting tray; 51. First slide rail; 52. Lead screw assembly; 53. First slide table; 81. First lateral sliding plate; 8 2. Second slide rail; 83. Second slider; 84. First servo motor; 85. Gear; 86. Rack; 87. First longitudinal slide plate; 101. Extrusion mounting bracket; 102. Elastic extrusion assembly; 1021. Support base; 1022. Slide rod; 1023. Upper limit seat; 1024. Spring; 1025. Extrusion head; 111. Grinding motor; 112. Support plate; 113. Rolling bearing seat; 114. Transmission belt assembly; 115. Grinding head. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of this application clearer, the present invention will be further described below with reference to the accompanying drawings and embodiments. The embodiments of this utility model include, but are not limited to, the following embodiments. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0028] In this embodiment, the term "and / or" is merely a description of the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can represent three situations: A exists alone, A and B exist simultaneously, and B exists alone.

[0029] The terms "first" and "second," etc., used in the specification and claims of this embodiment are used to distinguish different objects, not to describe a specific order of objects. For example, "first target object" and "second target object," etc., are used to distinguish different target objects, not to describe a specific order of target objects.

[0030] In the embodiments of this application, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design that is described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design. Specifically, the use of the terms "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0031] In the description of the embodiments in this application, unless otherwise stated, "multiple" means two or more. For example, multiple processing units means two or more processing units; multiple systems means two or more systems.

[0032] like Figures 1 to 8 As shown, this embodiment provides a wafer recirculation edge grinding device to grind the edges of the recirculated wafer. The device uses a wafer mounting disk 41 on a rotating disk 4 for loading and unloading.

[0033] Specifically, the wafer rounding edge polishing device includes a lower worktable 1, a multi-station rotary table 3 fixed on the lower worktable 1, a rear sliding assembly 5 on the lower worktable 1, a vertical mounting frame 6 on the rear sliding assembly 5, a lateral moving assembly 7 on the vertical mounting frame 6, a longitudinal moving assembly 8 on the lateral moving assembly 7, an operating table 2 covering the multi-station rotary table 3, a rotating disk 4 on the multi-station rotary table 3 and embedded in the operating table 2, several wafer mounting disks 41 on the rotating disk 4, a pressing assembly 10 and a polishing assembly 11 on the longitudinal moving assembly 8, a blowing assembly 12 and a CCD acquisition assembly 13 fixed on the lower worktable 1 and located around the perimeter of the rotating disk 4, a polishing protective cover 9 covering the polishing assembly 11, and an upper protective cover on the lower worktable 1; the operating table 2 is disposed through the lower part of the upper protective cover. The operating table 2 extends through the lower part of the upper protective cover and has a circular groove 21, within which the turntable 4 is placed. The multi-station rotary table 3 rotates, causing the wafer mounting tray 41 to rotate outwards to the outside of the upper protective cover for manual loading and unloading. Furthermore, this embodiment utilizes a purging assembly 12 to purge the wafers and wafer mounting tray 41, and a CCD acquisition assembly 13 to acquire images.

[0034] In this embodiment, the rear sliding assembly 5 includes a first slide rail 51 and a lead screw assembly 52 fixed on the lower worktable 1, and a first slide table 53 with a sliding sleeve disposed on the first slide rail 51 and connected to the lead screw assembly 52. ​​The vertical mounting bracket 6 is fixed on the first slide table 53. Additionally, the longitudinal moving assembly 8 includes a first transverse sliding plate 81 disposed on the transverse moving assembly 7, two second slide rails 82 disposed on the first transverse sliding plate 81, several second sliders 83 slidably sleeved on the second slide rails 82 and connected to the first longitudinal sliding plate 87, a first servo motor 84 disposed on the first transverse sliding plate 81, a rack 96 fixed longitudinally to the back of the first longitudinal sliding plate 87, and a gear 85 disposed on the first servo motor 84 and meshing with the rack 96. This embodiment utilizes the rear sliding assembly 5, the transverse moving assembly 7, and the longitudinal moving assembly 8 to perform three-axis movement of the grinding assembly 11.

[0035] During the polishing process, to prevent wafer displacement, a pressing assembly 10 is used for pressing. This pressing assembly 10 includes a pressing mounting bracket 101 fixed to the bottom of a support plate 112, and at least one set of elastic pressing assemblies 102 fixed to the pressing mounting bracket 101. Here, the elastic pressing assembly 102 presses the rounded wafer within the wafer mounting tray 41. The elastic pressing assembly 102 includes a support base 1021 fixed to the pressing mounting bracket 101, several slide rods 1022 extending longitudinally through the support base 1021, a pressing head 1025 located at the bottom of the slide rods 1022, an upper limit seat 1023 located at the top of the slide rods 1022, and a spring 1024 sleeved on the slide rods 1022 and pressed between the support base 1021 and the pressing head 1025.

[0036] In this embodiment, a grinding assembly 11 is used to grind the edge of the wafer. This assembly includes a first longitudinal sliding plate 87 fixed to a longitudinal moving assembly 8, a grinding motor 111 and a support plate 112 mounted on the first longitudinal sliding plate 87, several rolling bearing seats 113 sleeved on the support plate 112, a grinding shaft correspondingly disposed within each of the rolling bearing seats 113, grinding heads 115 disposed at the lower part of the grinding shaft, and a transmission belt assembly 114 disposed on the grinding shaft and connected to the grinding motor 111. Here, three, four, or five grinding heads 115 are arranged in a circular array around the wafer to grind the edge of the rounded wafer.

[0037] The above embodiments are merely preferred embodiments of this utility model and are not intended to limit the scope of protection of this utility model. Any changes made based on the design principles of this utility model, or any non-creative changes made on this basis, shall fall within the scope of protection of this utility model.

Claims

1. An edge grinding device for rounding wafers, characterized in that, The system includes a lower worktable (1), a three-axis moving assembly and a multi-station rotary table (3) fixed on the lower worktable (1), an operating table (2) covered on the multi-station rotary table (3), a rotary disk (4) set on the multi-station rotary table (3) and embedded in the operating table (2), several wafer mounting disks (41) set on the rotary disk (4), an extrusion assembly (10) and a polishing assembly (11) set on the three-axis moving assembly, a purging assembly (12) and a CCD acquisition assembly (13) fixed on the lower worktable (1) and placed around the edges of the rotary disk (4), a polishing protective cover (9) covered on the polishing assembly (11), and an upper protective cover set on the lower worktable (1); the operating table (2) is provided through the lower part of the upper protective cover; a circular groove (21) is provided on the operating table (2); the rotary disk (4) is placed in the circular groove (21); The polishing assembly (11) includes a first longitudinal slide plate (87) fixed on a three-axis moving assembly, a polishing motor (111) and a support plate (112) mounted on the first longitudinal slide plate (87), several rolling bearing seats (113) sleeved on the support plate (112), a polishing shaft corresponding to each of the rolling bearing seats (113), a polishing head (115) mounted on the lower part of the polishing shaft, and a transmission belt assembly (114) mounted on the polishing shaft and connected to the polishing motor (111); the polishing head (115) polishes the edge of the rounded wafer; The extrusion assembly (10) includes an extrusion mounting bracket (101) fixed to the bottom of the support plate (112), and at least one set of elastic extrusion assemblies (102) fixed to the extrusion mounting bracket (101); the elastic extrusion assemblies (102) extrude onto the rounded wafer in the wafer mounting tray (41).

2. The edge grinding device for rounding a wafer according to claim 1, characterized in that, The three-axis moving assembly includes a rear sliding assembly (5) fixed on the lower worktable (1), a vertical mounting bracket (6) set on the rear sliding assembly (5), a transverse moving assembly (7) set on the vertical mounting bracket (6), and a longitudinal moving assembly (8) set on the transverse moving assembly (7); the grinding assembly (11) is set on the longitudinal moving assembly (8).

3. The edge grinding device for rounding a wafer according to claim 2, characterized in that, The rear sliding assembly (5) includes a first slide rail (51) and a lead screw assembly (52) fixed on the lower worktable (1), a sliding sleeve is disposed on the first slide rail (51) and connected to the lead screw assembly (52) and a first slide table (53); the vertical mounting bracket (6) is fixed on the first slide table (53).

4. The edge grinding device for rounding a wafer according to claim 2, characterized in that, The longitudinal moving component (8) includes a first transverse sliding plate (81) disposed on the transverse moving component (7), two second slide rails (82) disposed on the first transverse sliding plate (81), several second sliders (83) slidably sleeved on the second slide rails (82) and connected to the first longitudinal sliding plate (87), a first servo motor (84) disposed on the first transverse sliding plate (81), a rack (96) fixed along the longitudinal direction on the back of the first longitudinal sliding plate (87), and a gear (85) disposed on the first servo motor (84) and meshing with the rack (96).

5. The wafer rounding edge grinding device according to claim 1 or 2, characterized in that, The elastic extrusion assembly (102) includes a support base (1021) fixed on the extrusion mounting bracket (101), several slide rods (1022) arranged through the support base (1021) in the longitudinal direction, an extrusion head (1025) arranged at the bottom of the slide rod (1022), an upper limit seat (1023) arranged at the top of the slide rod (1022), and a spring (1024) sleeved on the slide rod (1022) and extruded between the support base (1021) and the extrusion head (1025).

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