Crystal cutting positioning auxiliary device
By designing a crystal cutting positioning auxiliary device, the wax heating and cooling steps in the crystal longitudinal slicing process are simplified. Only the tray angle and position need to be adjusted, which solves the problem of low efficiency in the existing technology and realizes efficient, convenient and safe cutting operation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JIANGSU TANKEBLUE SEMICON CO LTD
- Filing Date
- 2025-05-09
- Publication Date
- 2026-04-24
Smart Images
Figure CN224158660U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the technical field of auxiliary equipment for crystal cutting processing equipment, and in particular to a crystal cutting positioning auxiliary device. Background Technology
[0002] In the current polysilicon processing field, it is often necessary to cut crystals into strips. Accordingly, the industry usually uses single-wire cutting machines to carry out the above-mentioned strip cutting operations for crystals.
[0003] Specifically, at present, when performing longitudinal slit cutting on crystals, the process generally involves first marking the surface of the crystal with a marker. Then, workers manually place an iron fixture to support the crystal onto a heating plate or other heating device for heating. Once the fixture is heated to a temperature matching the melting point of wax, wax is applied to it. After the wax is evenly spread on the working surface of the fixture, the crystal to be processed is placed on the working surface of the fixture, and its position is adjusted to align the pre-marked lines on the crystal with the reference lines on the fixture. This crystal position adjustment process currently relies entirely on the operator's visual inspection and personal experience. After the crystal is adjusted to the appropriate position to match the working surface of the fixture, the fixture containing the crystal is placed aside to cool and allow the wax to solidify.
[0004] After the wax coating on the fixture has cooled and solidified, the fixture carrying the crystal to be processed is reliably installed onto the corresponding single-wire cutting machine. Then, the cutting line of the single-wire cutting machine is adjusted and checked to ensure that it coincides with the pre-drawn reference line on the crystal to be processed on the fixture. If the two lines coincide, the single-wire cutting machine is used to cut the crystal on the fixture. If the two lines do not coincide, the wax that has cooled and solidified on the fixture needs to be reheated and melted, and the position of the crystal on the fixture is readjusted. Then, the fixture carrying the crystal to be processed is cooled again to solidify the wax before the corresponding cutting line calibration and subsequent cutting operations can be performed. If the crystal needs to be longitudinally cut at multiple angles or if the placement angle of the crystal to be processed needs to be readjusted under other working conditions, the fixture also needs to be removed from the cutting equipment and reheated to melt the wax again before the crystal position is adjusted accordingly. After the corresponding adjustment operation is completed, the wax on the fixture needs to cool and solidify again before it can be refitted with the single-wire cutting machine to complete the corresponding crystal cutting operation.
[0005] It is not difficult to see that although the existing crystal slitting strip processing method can meet the basic process requirements at the current stage, it requires frequent heating and cooling of the tooling during the process. This is necessary to repeatedly melt and cool the wax coated on the tooling in order to meet the corresponding crystal position adjustment and other operational requirements. This undoubtedly increases the processing time of the crystal slitting strip, restricts the corresponding crystal cutting efficiency, and also increases the workload of the relevant operators, causing many adverse effects on the overall crystal cutting process.
[0006] In view of this, how to improve the efficiency of slitting crystal strips is an important technical problem that needs to be solved by those skilled in the art. Utility Model Content
[0007] The purpose of this invention is to provide a crystal cutting and positioning auxiliary device, which is convenient and efficient to operate and can significantly improve the efficiency of longitudinal strip cutting of crystals.
[0008] To solve the above technical problems, this utility model provides a crystal cutting positioning auxiliary device, including a base that can be detached and connected to a cutting equipment and a material preparation tray that can hold crystals and wax. The top surface of the base is recessed and provided with a positioning groove that is adapted to the detachment and assembly of the material preparation tray.
[0009] The lower part of the material preparation tray is rotatably inserted into the positioning slot, and the top of the material preparation tray protrudes from the top surface of the base. The base is also provided with a locking device that can fix the material preparation tray in the positioning slot.
[0010] The top surface of the base has a positioning reference line that can be aligned with a preset marking line on the crystal being processed.
[0011] Preferably, the top of the material preparation tray is provided with an operating handle protruding from the outer periphery of the material preparation tray.
[0012] Preferably, the top surface of the operating handle is provided with an alignment marking module, which includes a plurality of alignment scale lines evenly arranged at equal intervals along the circumference of the material preparation tray.
[0013] Preferably, the operating handle is made of silicone.
[0014] Preferably, the base has a locking screw hole, which connects the outer side wall of the base and the inner peripheral wall of the positioning slot. The locking device is a locking bolt threaded into the locking screw hole, and the end face of the threaded end of the locking bolt can abut against the lower outer peripheral surface of the material preparation tray.
[0015] Preferably, the lower outer diameter of the material preparation tray is smaller than the inner diameter of the positioning groove.
[0016] Preferably, the threaded end of the locking bolt is covered with an elastic buffer layer.
[0017] Preferably, the elastic buffer layer is a silicone layer.
[0018] Preferably, the material preparation tray is made of aluminum alloy.
[0019] Preferably, the side of the base is provided with a mounting plate extending in a direction perpendicular to the top surface of the base, and the mounting plate has a vertically penetrating mounting hole. The base is fixedly connected to the cutting equipment by mounting bolts inserted into the mounting hole and detachably connected to the cutting equipment.
[0020] Compared to the aforementioned background technology, the crystal cutting and positioning auxiliary device provided by this utility model, during operation, when a single-wire cutting machine or other types of cutting equipment are needed to perform longitudinal strip cutting on the crystal to be processed, firstly, the base is reliably installed at the corresponding part of the main structure of the cutting equipment. Then, the material preparation tray can be heated by a heating device until the temperature of the material preparation tray reaches the temperature that can melt the wax. After that, wax can be coated inside the material preparation tray. Then, the crystal to be processed, which has been pre-marked, is placed in the material preparation tray after the wax coating has been completed. After the crystal is placed in the material preparation tray, the material preparation tray containing the crystal to be processed and the wax can be left to stand for the wax to cool and solidify. After the wax in the material preparation tray has cooled and solidified, the crystal to be processed is reliably positioned and connected in the material preparation tray by the solidified wax. At this time, the entire material preparation tray containing the crystal to be processed and the solidified wax can be transferred to the base, and the lower part of the material preparation tray is aligned and installed into the positioning groove. Next, the material tray in the positioning slot can be rotated moderately until the preset mark line on the crystal aligns with the positioning reference line on the top surface of the base. Then, the current position of the material tray in the positioning slot can be locked using the locking device to keep the arrangement position of the crystal being processed constant. In this way, the position calibration and locking of the crystal being processed can be completed. Afterward, the cutting equipment can be started to cut the crystal being processed on the material tray. After a single crystal cutting operation is completed, if it is necessary to adjust the placement angle of the crystal to complete the cutting operation of other parts or angles, simply release the locking device from the position lock of the material tray, then rotate the material tray moderately in the positioning slot to adjust the placement angle of the crystal being processed inside to the target position, and then use the locking device to lock the adjusted arrangement position of the material tray in the positioning slot. This adjustment and cutting process is repeated several times until all the crystals currently in the preparation tray have been cut. Then, the locking device is released, allowing the preparation tray containing the crystals to be removed from the positioning slot. The tray is then heated to melt the wax inside, and the cut crystals can be removed. This crystal cutting positioning auxiliary device effectively simplifies the operation of longitudinal strip cutting of crystals. Especially when the placement angle and position of the crystals need to be adjusted, only the angle of the preparation tray in the positioning slot and its relative position to the slot need to be adjusted. The entire operation eliminates the need for repeated heating, melting, cooling, and solidification of the wax, significantly shortening the crystal cutting time and improving the efficiency of longitudinal strip cutting. Furthermore, the entire operation eliminates the need for frequent heating and cooling operations, effectively reducing the labor intensity of workers and making the crystal processing flow smoother and more efficient.
[0021] In another preferred embodiment of this utility model, an operating handle protruding from the outer periphery of the material preparation tray is linked to the top of the tray. When it is necessary to adjust the angle of the crystal being processed in the tray, or when it is necessary to pick up, place, or move the tray as a whole, the operator can directly contact the operating handle to grasp and hold the effective part of the tray. This prevents the operator's hands from being burned or other adverse situations from direct contact with the tray, especially when the tray has just finished heating or under other unconventional conditions. This further improves the operational safety of the crystal cutting and positioning auxiliary device and makes the related operations and adjustments of the material preparation tray more convenient and smooth. Attached Figure Description
[0022] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0023] Figure 1 An isometric view of the assembly structure of the crystal cutting positioning auxiliary device and cutting equipment provided in a specific embodiment of this utility model;
[0024] Figure 2 for Figure 1 Axonometric view of the middle material preparation pallet from the side;
[0025] Figure 3 for Figure 2 Axonometric drawing from a top-down perspective;
[0026] Figure 4 for Figure 1 Axonometric view of the central base.
[0027] in:
[0028] 10-Cutting equipment;
[0029] 11-Base; 111-Positioning bracket; 112-Positioning reference line; 113-Locking screw hole;
[0030] 12-Preparation tray; 121-Operating handle; 122-Alignment marking module;
[0031] 13-Mounting plate; 131-Mounting hole. Detailed Implementation
[0032] The core of this invention is to provide a crystal cutting and positioning auxiliary device, which is convenient and efficient to operate and use, and can significantly improve the efficiency of longitudinal strip cutting of crystals.
[0033] To enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.
[0034] It should be noted in advance that, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing" in this utility model should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0035] Furthermore, in this invention, unless otherwise explicitly specified and limited, the first feature being "on" or "below" the second feature may include direct contact between the first and second features, or contact between the first and second features not being in direct contact but through another feature between them.
[0036] In addition, the terms "above," "over," and "on top" for the first feature and the second feature include the first feature being directly above or diagonally above the second feature, or simply indicating that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "under," and "beneath" for the first feature and the second feature include the first feature being directly below or diagonally below the second feature, or simply indicating that the first feature is at a lower horizontal level than the second feature. The terms "above," "below," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.
[0037] In specific implementation methods, in conjunction with references Figures 1 to 4 As shown, the crystal cutting positioning auxiliary device provided by this utility model includes a base 11 that can be detachably connected to the cutting equipment 10 and a material preparation tray 12 that can hold crystals and wax materials. Figure 4 As shown, the top surface of the base 11 is recessed and provided with a positioning groove 111 that is compatible with the assembly and disassembly of the material preparation tray 12.
[0038] The lower part of the material preparation tray 12 is rotatably inserted into the positioning slot 111, and the top of the material preparation tray 12 protrudes from the top surface of the base 11. The base 11 is also provided with a locking device that can fix the material preparation tray 12 in the positioning slot 111.
[0039] Reference Figure 4 As shown, the top surface of the base 11 has a positioning reference line 112 that can be aligned with a preset marking line on the crystal being processed.
[0040] In the specific operation and use of the equipment, when it is necessary to use a single-wire cutting machine or other types of cutting equipment 10 to perform longitudinal strip cutting on the crystal to be processed, first, the base 11 is reliably installed at the corresponding part of the main structure of the cutting equipment 10. Then, the preparation tray 12 can be heated by heating equipment until the temperature of the preparation tray 12 reaches the temperature that can melt the wax. After that, the wax can be coated inside the preparation tray 12. Then, the crystal to be processed, which has been pre-marked, is placed in the preparation tray 12 after the wax coating is completed. After the crystal is placed in the preparation tray 12, the preparation tray 12 containing the crystal to be processed and the wax can be left to stand for the wax to cool and solidify.
[0041] After the wax in the preparation tray 12 has cooled and solidified, the crystal to be processed is reliably positioned and connected in the preparation tray 12 by the solidified wax. At this time, the preparation tray 12 containing the crystal to be processed and the solidified wax can be transferred as a whole to the base 11, and the lower part of the preparation tray 12 is aligned and installed into the positioning slot 111.
[0042] The material tray 12 within the positioning slot 111 can then be rotated moderately until the preset marking line on the crystal aligns with the positioning reference line 112 on the top surface of the base 11. Then, the current position of the material tray 12 within the positioning slot 111 can be locked using a locking device to maintain a constant arrangement of the crystal being processed. This completes the position calibration and locking of the crystal being processed. Afterward, the cutting equipment 10 can be started to perform a cutting operation on the crystal being processed located on the material tray 12.
[0043] After a single crystal cutting operation is completed, if it is necessary to adjust the placement angle of the crystal to complete the cutting operation of other parts or angles, simply release the locking device from the position lock of the preparation tray 12, then rotate the preparation tray 12 moderately within the positioning slot 111 to adjust the placement angle of the crystal to be processed to the target position. Then, use the locking device to lock the adjusted position of the preparation tray 12 within the positioning slot 111. Repeat the above adjustment and cutting operation several times until the cutting operation of all the crystals currently in the preparation tray 12 is completed. Then, release the locking device to remove the preparation tray 12 containing the crystals from the positioning slot 111. Next, heat the preparation tray 12 to melt the wax inside, and then remove the cut crystal from the preparation tray 12 to complete the cutting and shaping of the currently processed crystal.
[0044] The crystal cutting and positioning auxiliary device can effectively simplify the operation of longitudinal strip cutting of crystals. In particular, when it is necessary to adjust the placement angle and position of the crystal to be processed, it is only necessary to adjust the arrangement angle of the material tray 12 in the positioning groove 111 and its relative position relationship with the positioning groove 111. The entire operation does not require repeated heating, melting and cooling of wax, which greatly shortens the corresponding crystal cutting time and improves the efficiency of longitudinal strip cutting of crystals. Moreover, the entire operation does not require the staff to frequently perform heating and static cooling operations, which effectively reduces the labor intensity of the staff and makes the corresponding crystal processing flow smoother and more efficient.
[0045] It is easy to understand that, considering the cutting requirements under most working conditions, the cutting equipment 10 used in this solution is usually a single-wire cutting machine. In practical applications, the specific type of cutting equipment 10 can also be flexibly adjusted according to the actual working conditions. These are all relatively conventional technical choices in this field. The corresponding component installation and layout methods can also be understood in conjunction with existing technologies, which will not be elaborated in this article.
[0046] Specifically, such as Figure 2 and Figure 3 As shown, the top of the material preparation tray 12 is equipped with an operating handle 121 that protrudes from the outer periphery of the material preparation tray 12, as follows: Figure 2 As shown, the operating handle 121 extends circumferentially along the material preparation tray 12 and connects end to end, forming a ring around the top outer edge of the material preparation tray 12. When it is necessary to adjust the angle of the crystal being processed in the material preparation tray 12, or when it is necessary to pick up, place, or move the entire material preparation tray 12, the operator can directly contact the operating handle 121 to grasp and hold the effective part of the material preparation tray 12. This prevents the operator's hands from being burned or other adverse situations from direct contact with the material preparation tray 12, especially when the material preparation tray 12 has just finished heating or under other unconventional working conditions. This further improves the operational safety of the crystal cutting positioning auxiliary device and makes the related operation and adjustment process of the material preparation tray 12 more convenient and smooth.
[0047] More specifically, in conjunction with references Figure 3 As shown, an alignment marking module 122 is provided on the top surface of the operating handle 121. The alignment marking module 122 includes several alignment scale lines evenly distributed at equal intervals along the circumference of the material preparation tray 12. In actual operation, the material preparation tray 12 located in the positioning slot 111 can be rotated and adjusted to a suitable position according to the specific crystal cutting process parameters and the actual processing target size, so that the alignment scale line is aligned with the positioning reference line 112 on the top surface of the base 11, thereby achieving the alignment of the cutting line at the corresponding angle or position, and thus performing the corresponding cutting operation on the crystal to be processed in the material preparation tray 12.
[0048] Considering practical application conditions and ease of operation, the alignment scale lines are generally evenly and equidistantly arranged around the circumference of the preparation tray 12, and the included angle between any two adjacent alignment scale lines is 1°. This is to achieve a corresponding arrangement of the entire circumferential space of the outer edge of the preparation tray 12, ensuring effective full-angle coverage when the preparation tray 12 is rotated and adjusted. This significantly optimizes the angle adjustment range when the preparation tray 12 is rotated and adjusted, ensuring accurate and rapid multi-angle positioning of the crystals being processed within the preparation tray 12.
[0049] Correspondingly, the operating handle 121 is generally made of silicone, but it can also be made of rubber or engineering plastic with good high temperature resistance, depending on the actual working conditions and processing conditions, so as to prevent the operator from being burned or scratched by the metal material of the material tray 12 body when directly contacting the material tray 12.
[0050] It should be understood that each alignment scale line in the alignment marking module 122 is usually an indentation or protrusion integrally formed on the top surface of the operating handle 121 by injection molding or other processes. Alternatively, it can be an indentation or protrusion processed on the top surface of the operating handle 121 by cutting or other processes after the operating handle 121 has been integrally formed. Correspondingly, the positioning reference line 112 can also be an indentation or protrusion structure correspondingly processed on the top surface of the base 11 by integral molding or subsequent cutting processes.
[0051] As shown in the figure, the single alignment scale lines extend radially along the material preparation tray 12 and are closely arranged on the top surface of the material preparation tray 12 near the tray opening; while the positioning reference line 112 extends radially along the positioning slot 111 and is closely arranged on the top surface of the base 11 near the slot opening of the positioning slot 111.
[0052] On the other hand, the base 11 has a locking screw hole 113, which is connected between the outer side wall of the base 11 and the inner peripheral wall of the positioning slot 111. The locking device is a locking bolt that is threadedly inserted into the locking screw hole 113. The end face of the threaded end of the locking bolt can abut against the lower outer peripheral surface of the material preparation tray 12. After rotating the material tray 12 located in the positioning slot 111 into position to adjust the placement angle and position of the crystal to be processed in the material tray 12, insert the locking bolt into the locking screw hole 113 from the outside to the inside and screw it in the forward direction so that the threaded end of the locking bolt extends out of the inner peripheral wall of the positioning slot 111 until the end face of the threaded end of the locking bolt reliably abuts against the lower outer peripheral surface of the material tray 12, so that the outer wall of the outer peripheral part of the material tray 12 away from the locking bolt is reliably pressed against the inner wall of the positioning slot 111, thereby reliably clamping the material tray 12 between the threaded end of the locking bolt and the inner peripheral wall of the positioning slot 111, realizing reliable limiting and locking of the material tray 12, preventing the material tray 12 from loosening or misaligning from the positioning slot 111 during subsequent cutting operations, and ensuring the corresponding crystal cutting accuracy and operation efficiency.
[0053] If it is necessary to adjust the position of the material preparation tray 12 and the crystals being processed inside it, or if it is necessary to remove the material preparation tray 12 entirely from the positioning slot 111, simply reverse the rotation of the locking bolt. This releases the threaded end of the locking bolt from contact with the outer circumference of the material preparation tray 12, restoring a suitable clearance. This releases the locking of the material preparation tray 12 within the positioning slot 111, facilitating position adjustment or retrieval of the material preparation tray 12. The locking bolt has a simple and reliable structure, and its thread fit with the locking screw hole 113 is highly efficient. This further improves the operational efficiency of the crystal cutting positioning auxiliary device, optimizes the corresponding crystal position adjustment method, and makes the crystal cutting process smoother and more efficient.
[0054] Based on this, the lower outer diameter of the material preparation tray 12 is smaller than the inner diameter of the positioning groove 111. This ensures that after the locking bolts are loosened, there is sufficient clearance between the material preparation tray 12 and the positioning groove 111. This clearance is generally no greater than 0.1mm, guaranteeing that the material preparation tray 12 can rotate smoothly and move appropriately within the positioning groove 111. This further reduces the difficulty of adjusting the position and angle of the material preparation tray 12 and improves the efficiency of adjusting the angle and position of the corresponding processed crystal.
[0055] Furthermore, an elastic buffer layer is covered on the end face of the threaded end of the locking bolt. When the end face of the threaded end of the locking bolt abuts against the lower outer circumferential surface of the material tray 12, the elastic buffer layer can directly contact the material tray 12 and undergo moderate elastic deformation due to gradual pressure during the abutment action. Thus, the elastic deformation of the elastic buffer layer provides appropriate structural buffering for the contact process between the locking bolt and the material tray 12, so as to prevent structural damage between the material tray 12 and the locking bolt due to structural impact or rigid contact, and ensure the structural strength and integrity of the main structure of the material tray 12 and other core functional components.
[0056] Furthermore, the elastic buffer layer is a silicone layer. Of course, the elastic buffer layer can also be a rubber layer or an engineering material layer with a certain elastic deformation capability. In principle, as long as it can meet the actual application needs of the crystal cutting positioning auxiliary device and ensure the structural buffering effect between the locking bolt and the material tray 12, it is acceptable.
[0057] Furthermore, the material preparation tray 12 is made of aluminum alloy, which allows for rapid thermal conductivity, further shortening the time required for the wax to melt and solidify, thus making the crystal cutting process smoother and more efficient. In addition, the aluminum alloy material preparation tray 12 has high thermal conductivity, significantly reducing the operating temperature during the actual process and effectively lowering the risk of burns to operators, making the crystal cutting process safer and more reliable.
[0058] Furthermore, a mounting plate 13 extending perpendicular to the top surface of the base 11 is provided on the side of the base 11. A mounting hole 131 is vertically passed through the mounting plate 13. The base 11 is fixedly connected to the cutting equipment 10 by mounting bolts inserted into the mounting hole 131 and detachably fitted to the cutting equipment 10. As shown in the figure, the extended structure of the mounting plate 13 can better adapt to the body of the cutting equipment 10, such as a single-wire cutting machine. Combined with the fastening structure of the mounting bolts, the installation strength between the base 11 and the main structure of the cutting equipment 10 can be further improved. This makes the overall installation and arrangement of the crystal cutting positioning auxiliary device more stable and secure, and the corresponding crystal support effect and positioning accuracy are optimized, thus improving the crystal cutting process effect.
[0059] In summary, the crystal cutting and positioning auxiliary device provided in this utility model, during its operation, when a single-wire cutting machine or other types of cutting equipment are needed to perform longitudinal strip cutting on the crystal to be processed, firstly, the base is reliably installed at the corresponding part of the main structure of the cutting equipment. Then, the material preparation tray can be heated by the heating equipment until the temperature of the material preparation tray reaches the temperature that can melt the wax. After that, the wax can be coated inside the material preparation tray. Then, the crystal to be processed, which has been pre-marked, is placed in the material preparation tray after the wax coating has been completed. After the crystal is placed in the material preparation tray, the material preparation tray containing the crystal to be processed and the wax can be left to stand for the wax to cool and solidify. After the wax in the material preparation tray has cooled and solidified, the crystal to be processed is reliably positioned and connected in the material preparation tray by the solidified wax. At this time, the entire material preparation tray containing the crystal to be processed and the solidified wax can be transferred to the base, and the lower part of the material preparation tray is aligned and installed into the positioning groove. Next, the material tray in the positioning slot can be rotated moderately until the preset mark line on the crystal aligns with the positioning reference line on the top surface of the base. Then, the current position of the material tray in the positioning slot can be locked using the locking device to keep the arrangement position of the crystal being processed constant. In this way, the position calibration and locking of the crystal being processed can be completed. Afterward, the cutting equipment can be started to cut the crystal being processed on the material tray. After a single crystal cutting operation is completed, if it is necessary to adjust the placement angle of the crystal to complete the cutting operation of other parts or angles, simply release the locking device from the position lock of the material tray, then rotate the material tray moderately in the positioning slot to adjust the placement angle of the crystal being processed inside to the target position, and then use the locking device to lock the adjusted arrangement position of the material tray in the positioning slot. This adjustment and cutting process is repeated several times until all the crystals currently in the preparation tray have been cut. Then, the locking device is released, allowing the preparation tray containing the crystals to be removed from the positioning slot. The tray is then heated to melt the wax inside, and the cut crystals can be removed. This crystal cutting positioning auxiliary device effectively simplifies the operation of longitudinal strip cutting of crystals. Especially when the placement angle and position of the crystals need to be adjusted, only the angle of the preparation tray in the positioning slot and its relative position to the slot need to be adjusted. The entire operation eliminates the need for repeated heating, melting, cooling, and solidification of the wax, significantly shortening the crystal cutting time and improving the efficiency of longitudinal strip cutting. Furthermore, the entire operation eliminates the need for frequent heating and cooling operations, effectively reducing the labor intensity of workers and making the crystal processing flow smoother and more efficient.
[0060] The crystal cutting and positioning auxiliary device provided by this utility model has been described in detail above. Specific examples have been used to illustrate the principle and implementation of this utility model. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core idea of this utility model. It should be noted that those skilled in the art can make several improvements and modifications to this utility model without departing from the principle of this utility model, and these improvements and modifications also fall within the protection scope of the claims of this utility model.
Claims
1. A crystal cutting and positioning auxiliary device, characterized in that, It includes a base that can be detached and connected to a cutting device and a material preparation tray that can hold crystals and wax. The top surface of the base is recessed and provided with a positioning groove that is compatible with the detachment and assembly of the material preparation tray. The lower part of the material preparation tray is rotatably inserted into the positioning slot, and the top of the material preparation tray protrudes from the top surface of the base. The base is also provided with a locking device that can fix the material preparation tray in the positioning slot. The top surface of the base has a positioning reference line that can be aligned with a preset marking line on the crystal being processed.
2. The crystal cutting and positioning auxiliary device as described in claim 1, characterized in that, The top of the material preparation tray is equipped with an operating handle that protrudes from the outer periphery of the material preparation tray.
3. The crystal cutting and positioning auxiliary device as described in claim 2, characterized in that, The top surface of the operating handle is provided with an alignment marking module, which includes several alignment scale lines that are evenly distributed at equal intervals along the circumference of the material preparation tray.
4. The crystal cutting and positioning auxiliary device as described in claim 2, characterized in that, The operating handle is made of silicone.
5. The crystal cutting and positioning auxiliary device as described in claim 1, characterized in that, The base has a locking screw hole, which connects the outer side wall of the base to the inner peripheral wall of the positioning slot. The locking device is a locking bolt threaded into the locking screw hole, and the end face of the threaded end of the locking bolt can abut against the lower outer peripheral surface of the material preparation tray.
6. The crystal cutting and positioning auxiliary device as described in claim 5, characterized in that, The lower outer diameter of the material preparation tray is smaller than the inner diameter of the positioning slot.
7. The crystal cutting and positioning auxiliary device as described in claim 5, characterized in that, The threaded end of the locking bolt is covered with an elastic buffer layer.
8. The crystal cutting and positioning auxiliary device as described in claim 7, characterized in that, The elastic buffer layer is a silicone layer.
9. The crystal cutting and positioning auxiliary device as described in claim 1, characterized in that, The material preparation tray is made of aluminum alloy.
10. The crystal cutting and positioning auxiliary device as described in claim 1, characterized in that, The base has a mounting plate extending along a direction perpendicular to the top surface of the base. The mounting plate has a vertically penetrating mounting hole. The base is fixedly connected to the cutting equipment by mounting bolts that are inserted into the mounting hole and are detachably connected to the cutting equipment.