Optical element driving mechanism

Abstract

The utility model discloses an optical element driving mechanism, which comprises a base, a frame, a carrier, a first capacitor and a second capacitor, and the frame is suspended above the base and movably connected with the base. And the carrier is movably connected with the frame. The first capacitor comprises two first induction pieces and a first electrode piece, the two first induction pieces are located in the base, and the first electrode piece is located above the first induction pieces and connected with the frame. The second capacitor comprises two second induction sheets and a second electrode sheet, the two second induction sheets are connected with the frame, one of the first electrode sheets is integrally formed, and the second electrode sheet is connected with the carrier. The elastic piece is elastically connected with the frame and the carrier and used for driving the carrier to reset.

Description

Technical Field

[0001] This utility model relates to the field of optical element driving technology, and in particular to an optical element driving mechanism. Background Technology

[0002] With the development of technology, many electronic devices today (such as smartphones or digital cameras) have the function of taking pictures or recording videos. The use of these electronic devices is becoming more and more common, and they are developing towards convenient and thinner designs to provide users with more choices.

[0003] Some electronic devices with photographic or video recording capabilities include a lens drive module to move optical components such as a lens, thereby achieving autofocus and optical image stabilization. Light can pass through the aforementioned optical components to form an image on a photosensitive element.

[0004] In existing optical element driving mechanisms, frame-based image stabilization is generally used. However, various components need to be installed inside the frame, which makes processing difficult and makes it hard to guarantee accuracy. Summary of the Invention

[0005] The purpose of this invention is to provide an optical element driving mechanism to solve the problems of the prior art.

[0006] To solve the above-mentioned technical problems, the present invention provides an optical element driving mechanism, comprising:

[0007] Base;

[0008] A frame, which is suspended above the base and movably connected to the base.

[0009] A carrier, wherein the carrier is movably connected to the frame;

[0010] A first capacitor, comprising two first sensing plates and a first electrode plate, wherein the two first sensing plates are located within the base, and the first electrode plate is located above the first sensing plates and connected to the frame;

[0011] The second capacitor includes two second sensing plates and a second electrode plate. The two second sensing plates are connected to the frame, and one of the second sensing plates is integrally formed with the first electrode plate. The second electrode plate is connected to the carrier.

[0012] An elastic element is elastically connected to the frame and the carrier, and is used to drive the carrier to reset.

[0013] In one embodiment, the frame further includes a first metal frame and a shielding metal sheet, the shielding metal sheet being electrically connected to the first metal frame and located radially outside the two second sensing sheets.

[0014] In one embodiment, the first electrode sheet is electrically connected to the first metal frame.

[0015] In one embodiment, the top surface of the frame is provided with a mounting groove, and the two second sensing sheets are attached to the side walls of the mounting groove.

[0016] In one embodiment, the frame further includes a sensing metal frame, which is electrically connected to the first metal frame;

[0017] The first electrode and the two second sensing plates are electrically connected to the sensing metal frame.

[0018] In one embodiment, two second sensing plates are connected to the frame, and one of the second sensing plates is integrally formed with the first electrode plate, while the other second sensing plate is L-shaped with one side attached to the inner wall of the mounting groove.

[0019] In one embodiment, the frame is a rectangular frame;

[0020] The sensing metal frame is located at least on one side of the frame;

[0021] The first metal frame is a rectangular ring, with one side located radially outside the sensing metal frame and electrically connected to the sensing metal frame.

[0022] In one embodiment, the carrier further includes a second metal frame, which is bent and electrically connected to the second electrode sheet.

[0023] In one embodiment, the optical element driving mechanism further includes:

[0024] A magnet assembly, wherein the magnet assembly is an electromagnet or is coated with a conductive coating and is electrically connected to the first metal frame;

[0025] A first coil group, which is electrically connected to the carrier and cooperates with the magnet group to drive the carrier to move;

[0026] The third sensing element is electrically connected to the base and located below the magnet assembly, and cooperates with the magnet assembly to form a third capacitor.

[0027] In one embodiment, the optical element driving mechanism further includes:

[0028] A circuit board, which is stacked on the base;

[0029] The second coil group is located on one side of the circuit board and one corner is chamfered;

[0030] The third coil group is located on the other side of the circuit board and is adjacent to the second coil group. One corner of the third coil group adjacent to the second coil group is also chamfered and abuts against the chamfer of the second coil group.

[0031] In one embodiment, the optical element driving mechanism further includes a fourth coil group, which is located within the circuit board and adjacent to the third coil group, and one corner of the fourth coil group adjacent to the third coil group is chamfered;

[0032] The corner of the third coil group adjacent to the fourth coil group is also chamfered and abuts against the chamfer of the fourth coil group.

[0033] In one embodiment, the second coil group and the two first induction sheets are located on the same side of the circuit board.

[0034] In one embodiment, the optical element driving mechanism further includes a sensing chip electrically connected to the third capacitor. Attached Figure Description

[0035] Figure 1 , Figure 2 and Figure 3 This is an exploded view of the optical element driving mechanism of one embodiment of the present invention.

[0036] Figure 4 yes Figure 1 A perspective view of the circuit board in the illustrated embodiment.

[0037] Figure 5 yes Figure 1 The illustrated embodiment is a perspective view of the second coil group, the third coil group, the fourth coil group, and the third induction sheet.

[0038] Figure 6 and Figure 7 yes Figure 1 The assembly diagram of the frame, carrier, and upper spring in the illustrated embodiment.

[0039] Figure 8 yes Figure 6 Exploded view of the frame, carrier, and upper spring in the illustrated embodiment.

[0040] Figure 9 yes Figure 6 Exploded view of the frame and carrier in the illustrated embodiment.

[0041] Figure 10and Figure 11 yes Figure 1 The illustrated embodiment is a perspective view of the first metal frame, the shielding metal sheet, the first electrode sheet, the second sensing sheet, the second metal frame, and the second electrode sheet.

[0042] Figure 12 yes Figure 1 The illustrated embodiment is a perspective view of the first metal frame, magnet group, shielding metal sheet, sensing metal frame, first electrode sheet, second sensing sheet, second metal frame, and second electrode sheet.

[0043] Figure 13 yes Figure 10 The illustrated embodiment is a perspective view of the first metal frame, the sensing metal frame, the shielding metal sheet, the first electrode sheet, and the second sensing sheet.

[0044] Figure 14 yes Figure 10 A perspective view of the shielding metal sheet, the first electrode sheet, and the second sensing sheet in the illustrated embodiment.

[0045] Figure 15 yes Figure 1 Assembly diagram of the optical element driving mechanism in the illustrated embodiment.

[0046] Figure 16 yes Figure 15 A cross-sectional view of the optical element driving mechanism along line AA in the embodiment shown.

[0047] Reference numerals: 100, Optical element driving mechanism; 1, Base; 11, Base plate; 111, Groove; 112, Sensing chip; 12, Circuit board; 13, Built-in circuit; 14, Suspension wire; 15, First sensing plate; 16, Third sensing plate; 17, Second coil group; 171, Chamfer; 18, Third coil group; 19, Fourth coil group; 2, Frame; 21, First metal frame; 22, First electrode plate; 23, Second sensing plate; 24, L-shaped sensing plate; 25, Shielding metal plate; 26, Sensing metal frame; 261, Conductor plate; 27, Magnet group; 271, Conductive magnet; 28, Mounting groove; 3, Carrier; 31, Second electrode plate; 32, First coil group; 33, Second metal frame; 4, Upper spring; 5, Lower spring; 6, Outer shell; Detailed Implementation

[0048] To make the objectives, technical solutions, and advantages of this utility model clearer, the various embodiments of this utility model will be described in detail below with reference to the accompanying drawings. However, those skilled in the art will understand that many technical details have been provided in the various embodiments of this utility model to facilitate a better understanding of this application. However, the technical solutions claimed in the claims of this application can be implemented even without these technical details and with various variations and modifications based on the following embodiments.

[0049] Unless the context requires otherwise, throughout the specification and claims, the word “comprising” and its variations, such as “including” and “having”, shall be understood to have an open, inclusive meaning, that is, to be interpreted as “including, but not limited to”.

[0050] The embodiments of this utility model will be described in detail below with reference to the accompanying drawings to provide a clearer understanding of the purpose, features, and advantages of this utility model. It should be understood that the embodiments shown in the drawings are not intended to limit the scope of this utility model, but are merely illustrative of the essential spirit of the technical solution of this utility model.

[0051] Throughout this specification, references to "an embodiment" or "an embodiment" indicate that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment. Therefore, the appearance of "in an embodiment" or "an embodiment" in various places throughout the specification does not necessarily refer to the same embodiment. Furthermore, a particular feature, structure, or characteristic may be combined in any manner in one or more embodiments.

[0052] The singular forms “a” and “the” used in this specification and the appended claims include plural references unless otherwise expressly stated herein. It should be noted that the term “or” is generally used to mean “and / or” unless otherwise expressly stated herein.

[0053] In the following description, in order to clearly demonstrate the structure and working method of this utility model, a number of directional terms will be used. However, terms such as "front", "back", "left", "right", "outside", "inside", "outward", "inward", "up", and "down" should be understood as convenient terms and not as limiting terms.

[0054] This utility model relates to an optical element driving mechanism 100, which includes a base 1, a housing 6, four suspension wires 14, a frame 2, a carrier 3, a first capacitor, a second capacitor, and an elastic element.

[0055] The base 1 includes a base plate 11, a circuit board 12, and an internal circuit 13 located within the base plate 11. The base plate 11 is a rectangular plate, and the internal circuit 13 is electrically connected to an external power source.

[0056] The circuit board 12 is stacked on the top surface of the base plate 11 and is electrically connected to the built-in circuitry 13.

[0057] Four suspension wires 14 are respectively connected to the four corners of the base plate 11 and the bottom end is electrically connected to the built-in circuit 13.

[0058] Frame 2 is a rectangular ring suspended above circuit board 12 by four suspension wires 14 and elastic elements. Carrier 3 is located inside the ring of frame 2 and is movably connected to frame 2. Specifically, the elastic elements include an upper spring 4 and a lower spring 5. The upper spring 4 is located on the top surface of frame 2 and connected to frame 2 and carrier 3, while the lower spring 5 is located on the bottom surface of frame 2. Both upper spring 4 and lower spring 5 are elastic. After carrier 3 moves along the optical axis, upper spring 4 and lower spring 5 cooperate to drive carrier 3 to reset.

[0059] The upper spring plate 4 is also connected to the top of the four suspension wires 14. The four suspension wires 14 and the upper spring plate 4 work together to support the frame 2 suspended above the circuit board 12.

[0060] The first capacitor includes two first sensing plates 15 and a first electrode plate 22. The two first sensing plates 15 are located inside the circuit board 12 of the base 1, while the first electrode plate 22 is located above the two first sensing plates 15 and embedded in the frame 2. The first sensing plates 15 and the second sensing plates 23 are both metal plates extending along the horizontal plane.

[0061] The second capacitor includes two second sensing plates 23 and a second electrode plate 31, both of which are metal plates extending along a vertical plane. The two second sensing plates 23 are located in the frame 2, and the second electrode plate 31 is connected to the radially outer side of the carrier 3 with its bottom end inserted between the two second sensing plates 23.

[0062] Of the two second sensing elements 23, one is a transmitting sensing element and the other is a receiving sensing element. The transmitting sensing element emits a signal, which is reflected by the second electrode 31 and received by the receiving sensing element. As the second electrode 31 moves with the position of the carrier 3, its reflected signal also changes, thereby changing the capacitance value between the two sensing elements, and thus determining the position of the carrier 3. The two first sensing elements 15 and the first electrode 22 operate on the same principle and will not be described in detail here.

[0063] Furthermore, the bottom end of one of the second sensing plates 23 is connected to one side of the first electrode plate 22, meaning that the second sensing plate 23 and the first electrode plate 22 form an L-shape and are integrally molded together. During the injection molding process of the frame 2, the L-shaped second sensing plate 23 and the first electrode plate 22 are injection molded together into the frame 2, which facilitates processing. Moreover, the installation of the second sensing plate 23, the first electrode plate 22, and the subsequent first metal frame 21 can ensure the accuracy of positioning of each part.

[0064] Two second sensing plates 23 are located inside the frame 2. The top surface of the frame 2 is also provided with a mounting groove 28, which is open to the top surface and the inner side of the frame 2. The two second sensing plates 23 are located inside the mounting groove 28 and fit against the inner and outer walls of the mounting groove 28. The second sensing plate 23 located on the outer side is integrally formed with the first electrode plate 22, and the bottom end of the second sensing plate 23 is bent outward before being connected to the first electrode plate 22 to form an irregular L-shape, so as to reduce stress and increase stability.

[0065] The second sensing piece 23 located on the inner side is also L-shaped. This second sensing piece 23 is defined as an L-shaped sensing piece 24. The top surface of the L-shaped sensing piece 24 is bent and extended inward into an L-shape. In other words, the top of the L-shaped sensing piece 24 is offset from the opening of the mounting groove 28 and will not cover the top opening of the mounting groove 28.

[0066] The frame 2 is also provided with a first metal frame 21 and a shielding metal sheet 25. The first metal frame 21 is ring-shaped and embedded in the frame 2, which can increase the strength of the frame 2.

[0067] The shielding metal plate 25 is a vertical metal plate and is connected to one side of the first metal frame 21. The shielding metal plate 25 is radially aligned with the two second sensing plates 23 and is located radially outside the two second sensing plates 23.

[0068] The first metal frame 21 is electrically connected to the upper spring plate 4. The upper spring plate 4 is electrically connected to the built-in circuit 13 in the base 1 through the suspension wire 14. After the built-in circuit 13 is energized, the current is transmitted to the shielding metal plate 25. After the shielding metal plate 25 is energized, it can play the role of shielding and fixing the potential, preventing the change of electric field when the frame 2 moves radially from affecting the sensing signal of the second capacitor, and improving the sensing accuracy of the second capacitor.

[0069] The first electrode plate 22 and the two second sensing plates 23 are electrically connected to the first metal frame 21. After the built-in circuit 13 is energized, it can supply power to the two second sensing plates 23.

[0070] In one embodiment, the frame 2 is further provided with a sensing metal frame 262, which is located on the same side of the frame 2 as the first metal frame 21 and the two second sensing plates 23, and the sensing metal frame 262, the two second sensing plates 23, and the first electrode plate 22 are integrally formed.

[0071] The sensing metal frame 262 is in a bent-pin state and has a conductive plate 261, which is electrically connected to the first metal frame 21 inside the frame 2.

[0072] Specifically, the first metal frame 21 is a rectangular ring with one side located outside the sensing metal frame 262, and the conductive plate 261 extends to the first metal frame 21 and is electrically connected to the first metal frame 21.

[0073] The top end of the second electrode plate 31 is connected to the top end of the carrier 3, and the bottom end extends into the mounting groove 28 and is positioned opposite to the two second sensing plates 23. A second metal frame 33 is also provided inside the carrier 3. The second metal frame 33 is bent and electrically connected to the second electrode plate 31. Furthermore, the second metal frame 33 is also electrically connected to the upper spring plate 4, which, when energized, can supply power to the second electrode plate 31.

[0074] The frame 2 contains a magnet assembly 27, which includes three sets of magnets. These three sets of magnets are respectively installed on three adjacent sides of the frame 2, and the other side has the aforementioned mounting groove 28. The top surface of the magnet assembly 27 has a notch, and the frame 2 has a magnet groove for installing the magnet assembly 27. The shape of the magnet groove matches the magnet assembly 27, and the notch of the magnet assembly 27 can be more stably connected to the magnet groove of the frame 2.

[0075] The carrier 3 is provided with a first coil group 32. The first coil group 32 and the magnet group 27 work together to drive the carrier 3 to move in the vertical direction, which is the direction of the optical axis.

[0076] One set of magnets is made of electromagnetic steel or coated with a conductive coating. This magnet is defined as electromagnet 271. Electromagnet 271 is electrically connected to the first metal frame 21. Electromagnet 271 is relatively long and can be used as an electrode sheet.

[0077] Two third sensing plates 16 are arranged side-by-side within the circuit board 12 of the base 1. The two third sensing plates 16 are located below the aforementioned electromagnet 271 and cooperate with the electromagnet 271 to form a third capacitor. This design uses the electromagnet 271 as an electrode, allowing the length of the third sensing plates 16 to be extended along one side of the circuit board 12, thus increasing the length of the third sensing plates 16 to match the length of the electromagnet 271. This effectively increases the sensing area and sensing accuracy of the third capacitor. The third capacitor and the first capacitor can detect the position of the frame 2.

[0078] Of course, in some embodiments, another set of magnets can be set as conductive magnets 271, and two other sensing plates can be set in the circuit board 12 to be opposite to the conductive magnets 271 and form a new capacitor to more accurately detect the position of the frame 2.

[0079] The circuit board 12 is also provided with a second coil group 17, a third coil group 18 and a fourth coil group 19. The second coil group 17, the third coil group 18 and the fourth coil group 19 are located on three adjacent sides of the circuit board 12, wherein the two ends of the third coil group 18 are arranged adjacent to the second coil group 17 and the fourth coil group 19.

[0080] The corner adjacent to the second coil group 17 and the third coil group 18 is chamfered 171. The corner adjacent to the fourth coil group 19 and the third coil group is also chamfered 191. The two corners of the third coil group 18 adjacent to the second and fourth coil groups are also chamfered 181. The two chamfers 181 of the third coil group 18 abut against the chamfers 171 of the second coil group 17 and the chamfers 191 of the fourth coil group 19, respectively. This can reduce the spacing between the second coil group 17, the third coil group 18 and the fourth coil group 19, and increase the length of the second coil group 17, the third coil group 18 and the fourth coil group 19.

[0081] In addition, the second coil group 17 and the two first sensing pieces 15 are located on the same side of the circuit board 12, while the third sensing piece 16 occupies one side of the circuit board 12 alone, and the third coil group 18 and the fourth coil group 19 occupy the other two sides of the circuit board 12 respectively.

[0082] The top surface of the base plate 11 is also provided with a groove 111, which is used to install the sensing chip 112. The sensing chip 112 is electrically connected to the third capacitor and is used to sense the capacitance of the third capacitor.

[0083] The outer shell 6 is connected to the base 1 and covers the frame 2, carrier 3, upper spring 4, and lower spring 5 for protection. The preferred embodiments of this utility model have been described in detail above, but it should be understood that, if necessary, aspects of the embodiments can be modified to utilize aspects, features, and concepts from various patents, applications, and publications to provide other embodiments.

[0084] In light of the detailed description above, these and other changes can be made to the embodiments. Generally, the terminology used in the claims should not be considered limited to the specific embodiments disclosed in the specification and claims, but should be understood to include all possible embodiments together with the full scope of equivalents enjoyed by these claims.

[0085] Those skilled in the art will understand that the above embodiments are specific examples of implementing the present invention, and in practical applications, various changes can be made to them in form and detail without departing from the spirit and scope of the present invention.

Claims

1. An optical element driving mechanism, characterized in that, include: Base; A frame, which is suspended above the base and movably connected to the base. A carrier, wherein the carrier is movably connected to the frame; A first capacitor, comprising two first sensing plates and a first electrode plate, wherein the two first sensing plates are located within the base, and the first electrode plate is located above the first sensing plates and connected to the frame; The second capacitor includes two second sensing plates and a second electrode plate. The two second sensing plates are connected to the frame, and one of the second sensing plates is integrally formed with the first electrode plate. The second electrode plate is connected to the carrier. An elastic element is elastically connected to the frame and the carrier, and is used to drive the carrier to reset.

2. The optical element driving mechanism according to claim 1, characterized in that, The frame also includes a first metal frame and a shielding metal sheet, the shielding metal sheet being electrically connected to the first metal frame and located radially outside the two second sensing sheets.

3. The optical element driving mechanism according to claim 2, characterized in that, The first electrode sheet is electrically connected to the first metal frame.

4. The optical element driving mechanism according to claim 2, characterized in that, The top surface of the frame is provided with a mounting groove, and the two second sensing plates are attached to the two side walls of the mounting groove.

5. The optical element driving mechanism according to claim 2, characterized in that, The frame also includes a sensing metal frame, which is electrically connected to the first metal frame. The first electrode and the two second sensing plates are electrically connected to the sensing metal frame.

6. The optical element driving mechanism according to claim 4, characterized in that, Two second sensing plates are connected to the frame, and one of the second sensing plates is integrally formed with the first electrode plate, while the other second sensing plate is L-shaped with one side attached to the inner wall of the mounting groove.

7. The optical element driving mechanism according to claim 5, characterized in that, The frame is a rectangular frame; The sensing metal frame is located at least on one side of the frame; The first metal frame is a rectangular ring, with one side located radially outside the sensing metal frame and electrically connected to the sensing metal frame.

8. The optical element driving mechanism according to claim 1, characterized in that, The carrier also includes a second metal frame, which is bent and electrically connected to the second electrode sheet.

9. The optical element driving mechanism according to claim 2, characterized in that, The optical element driving mechanism further includes: A magnet assembly, wherein the magnet assembly is an electromagnet or is coated with a conductive coating and is electrically connected to the first metal frame; A first coil group, which is electrically connected to the carrier and cooperates with the magnet group to drive the carrier to move; The third sensing element is electrically connected to the base and located below the magnet assembly, and cooperates with the magnet assembly to form a third capacitor.

10. The optical element driving mechanism according to claim 9, characterized in that, The optical element driving mechanism further includes: A circuit board, which is stacked on the base; The second coil group is located on one side of the circuit board and one corner is chamfered; The third coil group is located on the other side of the circuit board and is adjacent to the second coil group. One corner of the third coil group adjacent to the second coil group is also chamfered and abuts against the chamfer of the second coil group.

11. The optical element driving mechanism according to claim 10, characterized in that, The optical element driving mechanism further includes a fourth coil group, which is located inside the circuit board and adjacent to the third coil group. One corner of the fourth coil group adjacent to the third coil group is chamfered. The corner of the third coil group adjacent to the fourth coil group is also chamfered and abuts against the chamfer of the fourth coil group.

12. The optical element driving mechanism according to claim 10, characterized in that, The second coil group and the two first induction plates are located on the same side of the circuit board.

13. The optical element driving mechanism according to claim 9, characterized in that, The optical element driving mechanism also includes a sensing chip, which is electrically connected to the third capacitor.

Images