Transparent conductive film with flat surface
By coating a resin layer onto a transparent conductive film and embedding metal wires, the problems of poor surface flatness and insufficient toughness of traditional transparent metal conductive films are solved, achieving a smooth surface and enhanced toughness, expanding the application range and improving heat dissipation performance.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- MICRON OPTOELECTRONICS CO LTD
- Filing Date
- 2025-02-24
- Publication Date
- 2026-04-24
AI Technical Summary
Traditional subtractive etching processes produce transparent conductive metal films with poor surface smoothness and insufficient toughness, which limits their application in fields such as photovoltaic solar cells, especially as they are prone to breakage when bent.
A smooth surface is formed by coating a resin layer on a substrate and polishing it. Metal wires are embedded in the resin layer to increase toughness and heat dissipation performance. Subtractive etching process is used to form etched grooves and filling grooves.
This achieves a smooth and flat surface on the conductive metal film, increasing its application range and toughness, preventing breakage, and effectively dissipating heat to ensure good working condition.
Smart Images
Figure CN224164085U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of metal conductive film technology, specifically a transparent conductive film with a flat surface. Background Technology
[0002] With societal development, people's pursuit of application products has gradually extended towards the concepts of ultra-lightweight and ultra-thin. Metal conductive films, due to their light weight, extreme thinness, and excellent conductivity, are widely used in ultra-lightweight and ultra-thin products, gaining favor from researchers and manufacturers. However, transparent metal conductive films produced using traditional subtractive etching processes are essentially raised metal circuits with poor surface flatness, limiting their application, especially in the rapidly developing field of photovoltaic solar cells. Furthermore, existing metal conductive films have poor toughness; when bent, the internal metal conductive structure is prone to breakage, leading to damage to the metal conductive film. Utility Model Content
[0003] The purpose of this invention is to provide a transparent conductive film with a flat surface to solve the problems mentioned in the background art.
[0004] To achieve the above objectives, the present invention provides the following technical solution: a transparent conductive film with a flat surface, comprising a substrate, a conductive substrate covering the upper end of the substrate, an etched groove formed in the middle of the conductive substrate by a subtractive etching process, a resin layer coated on the upper surface of the substrate, a filling groove provided in the middle of the resin layer, and a metal wire filled in the middle of the filling groove.
[0005] Preferably, the substrate 1 includes, but is not limited to, transparent substrates such as PET, COP, and CPI, and the substrate thickness includes, but is not limited to, conventional material thicknesses of 25µm, 50µm, and 100µm.
[0006] Preferably, the conductive substrate is a conductive metal material, including but not limited to silver and copper, and the thickness of the conductive metal layer is no more than 5 μm.
[0007] Preferably, when the conductive substrate is subjected to subtractive etching, the conductive substrate is meshed to form a raised transparent metal conductive film, and multiple reinforcing pits are formed on the substrate.
[0008] Preferably, the resin layer is cured by UV irradiation or heat curing after being applied to the substrate, and the thickness of the resin layer is greater than or equal to the thickness of the conductive substrate.
[0009] Preferably, the resin layer is polished by physical mechanical polishing or chemical polishing until the conductive substrate is exposed.
[0010] Preferably, the filling groove is located at the etching groove. The filling groove is formed by etching after the resin layer is polished, and the width of the filling groove is smaller than that of the etching groove.
[0011] Preferably, after the filling groove is formed, it is filled with metal wire. After the metal wire is filled, it is ground and polished until the surface of the metal wire is flush with the surface of the conductive substrate.
[0012] Compared with the prior art, the beneficial effects of this utility model are as follows: a resin layer is coated on the surface of the substrate and polished to ensure that the surface of the metal conductive film is flat and smooth, which greatly increases the application range of the metal conductive film; a metal wire is embedded in the middle of the resin layer, and the two work together to increase the toughness of the metal conductive film, so that the conductive substrate will not break when the metal conductive film is bent; at the same time, the metal wire can also dissipate the heat generated by the metal conductive film during operation, ensuring that the metal conductive film is in good working condition. Attached Figure Description
[0013] Figure 1 This is a schematic diagram of the etching process on a conductive substrate.
[0014] Figure 2 This is a schematic diagram showing the connection between the resin layer and the substrate.
[0015] Figure 3 This is a schematic diagram of the etching process to fill the grooves.
[0016] Figure 4 This is a schematic diagram of the metal wire filling.
[0017] In the figure: 1 Substrate, 2 Conductive substrate, 3 Etched groove, 4 Resin layer, 5 Filling groove, 6 Metal wire. Detailed Implementation
[0018] To enhance understanding of this utility model, the technical solutions in the embodiments of this utility model will be clearly and completely described and introduced below with reference to the accompanying drawings. Obviously, the described embodiments are merely some embodiments of this utility model, not all embodiments, and are not intended to limit the embodiments in any way. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.
[0019] Please see Figure 1-4This utility model provides a technical solution: a transparent conductive film with a flat surface, including a substrate 1, a conductive substrate 2 covering the upper end of the substrate 1, an etched groove 3 formed in the middle of the conductive substrate 2 by a subtractive etching process, a resin layer 4 coated on the upper part of the substrate 1, a filling groove 5 provided in the middle of the resin layer 4, and a metal wire 6 filled in the middle of the filling groove 5.
[0020] The transparent substrate 11 includes, but is not limited to, PET, COP, and CPI transparent substrates, and the substrate thickness includes, but is not limited to, conventional material thicknesses of 25um, 50um, and 100um.
[0021] The conductive substrate 2 is a conductive metal material, including but not limited to silver and copper, and the thickness of the conductive metal layer is no more than 5 μm.
[0022] When the conductive substrate 2 is subjected to subtractive etching, the conductive substrate 2 is meshed to form a transparent conductive metal film with a raised surface, and multiple reinforcing pits are formed on the substrate 1. After the resin layer 4 is applied to the substrate 1, it is cured by UV irradiation or heat curing. The thickness of the resin layer 4 is greater than or equal to the thickness of the conductive substrate 2. The reinforcing pits can firmly connect the resin layer 4 with the substrate, and prevent the resin layer 4 and the conductive substrate 2 from loosening when polishing the resin layer 4 later.
[0023] The resin layer 4 is polished by physical mechanical polishing or chemical polishing until the conductive substrate 2 is exposed. Polishing the resin layer 4 can make the surface of the metal conductive film smooth and flat.
[0024] The filling groove 5 is located at the etching groove 3. After the resin layer 4 is polished, it is etched to form the filling groove 5. The width of the filling groove 5 is smaller than that of the etching groove 3. After the filling groove 5 is formed, the metal wire 6 is filled. After the metal wire 6 is filled, the metal wire 6 is polished until the surface of the metal wire 6 is flush with the surface of the conductive substrate 2 to ensure the flatness of the surface of the metal conductive film. The metal wire 6 and the resin layer 4 work together to increase the toughness of the metal conductive film. When the metal conductive film works at high power, it will generate a lot of heat. The resin layer 4 and the metal wire 6 work together to dissipate the heat generated when the metal conductive film is working.
[0025] Although embodiments of the present invention have been shown and described, it should be emphasized that the above description is merely an introduction and description of the usage of the embodiments of the present invention, and is not intended to limit the present invention in any way. Those skilled in the art will understand that various changes, modifications, substitutions, and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A transparent conductive film with a flat surface, comprising a substrate, characterized in that: The upper end of the substrate is covered with a conductive substrate, and an etched groove is formed in the middle of the conductive substrate by a subtractive etching process. A resin layer is coated on the upper part of the substrate, and a filling groove is provided in the middle of the resin layer. The filling groove is filled with metal wire.
2. The transparent conductive film with a flat surface according to claim 1, characterized in that: The conductive substrate is a conductive metal material, including but not limited to silver and copper, and the thickness of the conductive metal layer is no more than 5 μm.
3. The transparent conductive film with a flat surface according to claim 1, characterized in that: When the conductive substrate is subjected to subtractive etching, the conductive substrate is meshed to form a raised transparent metal conductive film, and multiple reinforcing pits are formed on the substrate.
4. The transparent conductive film with a flat surface according to claim 1, characterized in that: The resin layer is applied to the substrate and then cured by UV irradiation or heat curing. The thickness of the resin layer is greater than or equal to the thickness of the conductive substrate.
5. The transparent conductive film with a flat surface according to claim 1, characterized in that: The resin layer is polished by physical mechanical polishing or chemical polishing until the conductive substrate is exposed.
6. The transparent conductive film with a flat surface according to claim 1, characterized in that: The filling groove is located at the etching groove. After the resin layer is polished, an etching process is performed to form the filling groove, and the width of the filling groove is smaller than that of the etching groove.
7. The transparent conductive film with a flat surface according to claim 1, characterized in that: After the filling groove is formed, it is filled with metal wire. After the metal wire is filled, it is ground and polished until the surface of the metal wire is flush with the surface of the conductive substrate.