Resin plate and equipment for wafer rod

Abstract

The utility model provides a resin plate and equipment for a wafer rod, and the resin plate comprises a body of a long-strip-shaped structure, the body is provided with an arc bottom surface attached to the outer wall surface of the wafer rod, the arc bottom surface is also provided with a plurality of grooves, and the grooves are configured along the length direction of the body. According to the resin plate for the wafer rod, the thickness and the width of the resin plate are optimized, the grooves are additionally formed in the arc-shaped face of the resin plate so that the bonding area of the resin plate and the wafer rod can be increased, and meanwhile the trapezoid through holes formed in the middle of the thickness of the resin plate in the length direction of the resin plate are formed so that the heat dissipation rate and the heat dissipation effect during degumming can be improved; therefore, the wafer is ensured to be degummed prior to the material seat in the degumming process, the arrangement degumming efficiency is improved, and the rod falling risk is reduced.

Description

Technical Field

[0001] This application belongs to the field of semiconductor silicon wafer processing technology, and in particular relates to a resin plate for wafer rods and equipment using the resin plate. Background Technology

[0002] With advancements in existing manufacturing technologies, the demand for cost reduction in semiconductor wafer manufacturing is increasing. Large-size silicon wafers offer significant advantages in terms of chip output per unit and unit cost, leading to a trend towards larger diameter semiconductor silicon substrates. The increasing wafer area also places higher demands on the resin boards used for bonding large-size wafer ingots.

[0003] The existing resin boards have low bonding strength for large-sized wafer ingots, resulting in unstable bonding and a high risk of ingot detachment, which can damage the wafer ingots. Furthermore, after dicing, the wafers need to be debonded before the substrate, but the poor thermal conductivity of the solid resin boards causes the substrate to debond before the wafers, reversing the debonding process and reducing efficiency. This results in more time being wasted on debonding the wafers. Summary of the Invention

[0004] This application provides a resin plate and equipment for wafer rods, which solves the technical problems in the prior art of easy rod detachment due to unreasonable resin plate structural design and low debonding efficiency.

[0005] To solve at least one of the above-mentioned technical problems, the technical solution adopted in this application is:

[0006] A resin plate for wafer ingots includes a long strip-shaped body. The body has an arc-shaped bottom surface that fits against the outer wall of the wafer ingot, and a plurality of grooves are formed on the arc-shaped bottom surface. The grooves are arranged along the length of the body.

[0007] Furthermore, the groove is configured as a through groove along the length of the body; the groove is also constructed at least at the highest point of the arc-shaped bottom surface.

[0008] Furthermore, the groove is a curved surface structure and / or a polygonal structure, and is uniformly arranged on the arc-shaped bottom surface.

[0009] Furthermore, the opening width of the groove is 1-6mm, and its depth ranges from 0.5-3mm.

[0010] Furthermore, above the arc-shaped bottom surface of the body, a plurality of holes and slots are arranged side by side along the width direction of the body, and the length of the holes and slots is set along the length direction of the body.

[0011] Furthermore, the cross-section of the slot is constructed as a trapezoidal structure, with its center line perpendicular to the width direction of the body; the larger side of the slot is close to the groove side.

[0012] Furthermore, the central angle α corresponding to the arc bottom surface is in the range of 24°≤α≤38°; the width W of the body is 2R*sin(α / 2), where R is the radius of the wafer rod.

[0013] Furthermore, the length of the larger side of the slot is (0.1-0.15)W, and the length of the smaller side is (0.04-0.08)W;

[0014] The minimum horizontal distance between adjacent holes and slots is (0.04-0.07)W.

[0015] Furthermore, the distance from the top of the slot to the top surface of the body is greater than or equal to 6 mm and less than or equal to 8 mm.

[0016] An apparatus that uses a resin board as described above.

[0017] This application discloses a resin board for wafer ingots. By optimizing the thickness and width of the resin board and adding several grooves to its curved surface to increase the bonding area with the wafer ingots, and by creating several trapezoidal through holes along its length in the middle of the resin board's thickness, the heat dissipation rate and effect during debinding are improved. This ensures that the wafers are debinded before the substrate during the debinding process, improving the debinding efficiency and reducing the risk of ingot detachment. This application also proposes an apparatus for processing wafers using this resin board. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the resin plate and the wafer rod in this application.

[0019] Figure 2 This is a schematic diagram of the structure of the resin board with adhesive layer in this application;

[0020] Figure 3 This is a schematic diagram of the resin plate with a semi-circular groove structure in this application;

[0021] Figure 4 This is a schematic diagram of the resin plate with polygonal grooves in this application;

[0022] Figure 5 This is a schematic diagram of a resin plate with a mixed-structure groove in this application.

[0023] In the picture:

[0024] 10. Wafer rod; 20. Resin board; 21. Main body

[0025] 22. Groove; 23. Hole; 30. Material holder

[0026] 40. Adhesive layer Detailed Implementation

[0027] The present application will now be described in detail with reference to the accompanying drawings and specific embodiments.

[0028] This embodiment proposes a resin plate 20 for wafer rods, such as... Figure 1 As shown, the top surface of the resin plate 20 is bonded to the substrate 30 via an adhesive layer 40, and the bottom surface is bonded to the wafer ingot 10 via an adhesive layer 40. Specifically, the resin plate 20 includes a long strip-shaped body 21. The body 21 has an arc-shaped bottom surface that conforms to the outer wall of the wafer ingot 10, and several grooves 22 are formed on the arc-shaped bottom surface. All grooves are constructed as through slots arranged along the length direction of the body 21, and their cross-sections are all arranged along the length direction of the body 21. The grooves 22 not only increase the contact area between the resin plate 20 and the wafer ingot 10, but also improve the bonding strength of the resin plate 20. The adhesive layer 40 bonded to the wafer ingot 10 is adapted to the arc-shaped bottom surface structure of the resin plate 20, that is, it is an arc-shaped layer with a boss structure. The adhesive layer 40 bonded to the substrate 30 has the same structure as the top surface of the resin plate 20, which is a flat surface.

[0029] like Figure 2 As shown, the groove 22 has a curved surface structure and / or a polygonal structure, and the structure of the adhesive layer 40 is adapted to the structure of the groove 22. Specifically, the groove 22 can be a semi-circular opening groove, such as... Figure 3 As shown, its opening is located on its semi-circular surface, and the opening size is its diameter. It can also be a polygonal opening slot, such as... Figure 4 The hexagonal opening shown has its opening located at the midline of the hexagon, and its opening size is the distance between opposite sides. Of course, the polygonal structure can also be quadrilateral, pentagonal, or octagonal. In this case, these polygons are externally or internally tangent to the semicircle, ensuring not only the width of the opening but also the consistency of the groove depth. Furthermore, on the same arc-shaped bottom surface, there can be both semicircular and hexagonal grooves, but the semicircular and hexagonal grooves are evenly alternating, such as... Figure 5 As shown, the purpose is to ensure the uniformity of the groove structure arrangement and improve the consistency of bonding strength. Regardless of the structure of the groove 22, at least one groove is constructed at the highest point of the arc-shaped bottom surface to improve the bonding strength at the highest point. The groove 22 not only increases the adhesive application area but also increases the contact area between the adhesive and the resin board 20, thereby improving the bonding strength between the adhesive and the resin board 20 and avoiding the risk of stick detachment caused by poor adhesion between the adhesive and the resin board 20.

[0030] like Figure 3 As shown, preferably, the opening width w of the groove 22 is 1-6mm, and its depth h is in the range of 0.5-3mm. The opening of the groove 22 should not be too large. Within this size range, not only can the bonding area on the arc bottom surface be increased, thus expanding the contact area between the adhesive and the resin board 20, but the bonding strength between the adhesive and the resin board 20 can also be improved, thereby increasing the bonding force on the wafer rod 10 and reducing the probability of the wafer rod falling off.

[0031] Furthermore, to improve the heat dissipation of the resin board 20, several parallel slots 23 are constructed above the arc-shaped bottom surface of the body 21, arranged along the width direction of the body 21. All slots 23 are through-hole structures with a length along the length direction of the body 21. Because the solid resin board 20 has poor thermal conductivity, the substrate 30 is debonded before the wafer during the debonding process, causing a reversal of the debonding process and affecting the wafer debonding efficiency. The through-hole slots 23 on the body 21 improve the heat dissipation capacity of the resin board 20, allowing for differentiation in hot water flow, thus ensuring that the wafer is debonded before the substrate 30 during debonding, aligning with the debonding process and improving debonding efficiency.

[0032] like Figure 2-4 As shown, the cross-section of the slot 23 is constructed as a trapezoidal structure, with its centerline perpendicular to the width direction of the body 21. That is, all trapezoidal slots 23 are vertically symmetrically arranged, with the larger side of the slot 23 positioned closer to the groove 22 and the smaller side positioned closer to the top. This structure not only increases the contact area between the hot water and the resin strip, improving the thermal conductivity of the resin plate 20, but also, while the smaller side increases its heat dissipation with the substrate, the larger side further enhances the heat dissipation between the resin plate 20 and the wafer. This ensures that the wafer is debonded before the substrate, thereby improving the debonding efficiency.

[0033] In this embodiment, the central angle α corresponding to the arc bottom surface is in the range of 24°≤α≤38°; the width W of the body 21 is 2R*sin(α / 2), where R is the radius of the wafer rod. This is because if the width W is too small, the bonding center of gravity of the wafer rod 10 will be unstable, resulting in the rod falling; if the width W is too large, the resin board 20 will exceed the width of the base 30, making it unusable and wasting resin material. Based on the cross-sectional radius of the wafer rod and combined with a specific angle, the stability of the resin board 20 can be guaranteed.

[0034] Furthermore, the length of the larger side of the slot 23 is (0.1-0.15)W, and the length of the smaller side is (0.04-0.08)W; the minimum horizontal spacing between adjacent slots 23 is (0.04-0.07)W. This creates a differentiated hot water flow distribution, utilizing the difference in heat conduction to preferentially detach the wafer from the resin plate 20 relative to the substrate, thereby improving the debonding efficiency.

[0035] In this application, as Figure 2 As shown, the arc depth H1 = RR * cos(α / 2); based on the radius R of the wafer rod's cross-section, the depth of the corresponding arc bottom surface is designed to ensure that the resin board 20 has a strong fixing ability. The height H2 of the cutting depth reserved area located below the slot 23 is in the range of 3mm ≤ H2 ≤ 8mm, which is to ensure that the wafer rod is cut through and to avoid poor debonding. At the same time, in order to avoid the cutting position after cutting through the wafer rod affecting the position of the slot 23, the safety distance between the cutting depth and the bottom edge of the slot 23 is required to be H3, which is in the range of 3mm ≤ H3 ≤ 4mm. Within this range, the risk of wafer falling off due to cutting to the bottom edge of the trapezoidal slot 23 can be avoided.

[0036] Preferably, the height H4 of the slot 23 is in the range of 4mm ≤ H4 ≤ 10mm. If the height of the trapezoidal hole is too small, it will affect the flow rate of the degumming agent; if it is too large, it will affect the overall height of the resin board 20, and if it is too high, it will cause poor center of gravity stability, which will easily lead to the rod falling. The distance H5 from the top of the slot 23 to the top surface of the body 21 is in the range of 6mm ≤ H5 ≤ 8mm, which can ensure the strength of the resin board 20 and minimize the probability of the material seat 30 degumming from the resin board 20 first, so as to avoid the risk of the rod falling.

[0037] Therefore, based on the arc bottom height H1, cutting depth H2, the safety distance H3 between the cutting depth and the bottom edge of the slot 23, the height H4 of the trapezoidal slot 23, and the distance H5 between the material holder 30 and the top edge of the trapezoidal slot 23, the final thickness of the resin board 20 can be determined as T = H1 + H2 + H3 + H4 + H5, thus ensuring the overall layout's certainty, stability, and reliability. Through this structure, the wafer is debonded before the material holder during the debonding process, improving debonding efficiency and reducing the risk of die detachment. This effectively improves product quality and reduces production costs, which is of great significance for actual production and wafer research.

[0038] An apparatus that employs the resin plate 20 as described above.

[0039] This application discloses a resin board for wafer ingots. By optimizing the thickness and width of the resin board and adding several grooves to its curved surface to increase the bonding area with the wafer ingots, and by creating several trapezoidal through holes along its length in the middle of the resin board's thickness, the heat dissipation rate and effect during debinding are improved. This ensures that the wafers are debinded before the substrate during the debinding process, improving the debinding efficiency and reducing the risk of ingot detachment. This application also proposes an apparatus for processing wafers using this resin board.

[0040] The embodiments of this application have been described in detail above. These descriptions are merely preferred embodiments and should not be construed as limiting the scope of this application. All equivalent variations and modifications made within the scope of this application should still fall within the patent coverage of this application.

Claims

1. A resin board for wafer rods, characterized in that, The body includes a long strip-shaped structure, the body having an arc-shaped bottom surface that fits against the outer wall of the wafer rod, and a plurality of grooves being formed on the arc-shaped bottom surface, the grooves being arranged along the length direction of the body; Above the arc-shaped bottom surface of the body, a plurality of holes and slots are arranged side by side along the width direction of the body, and the length of the holes and slots is set along the length direction of the body.

2. The resin plate for wafer rods according to claim 1, characterized in that, The groove is configured as a through slot along the length of the body; the groove is also constructed at least at the highest point of the arc-shaped bottom surface.

3. A resin plate for wafer rods according to claim 1 or 2, characterized in that, The groove is a curved surface and / or a polygonal structure, and is uniformly arranged on the arc-shaped bottom surface.

4. The resin plate for wafer rods according to claim 3, characterized in that, The groove has an opening width of 1-6mm and a depth range of 0.5-3mm.

5. A resin plate for wafer rods according to any one of claims 1-2 and 4, characterized in that, The cross-section of the slot is constructed as a trapezoidal structure, with its centerline perpendicular to the width direction of the body; the larger side of the slot is close to the groove side.

6. The resin plate for wafer rods according to claim 5, characterized in that, The central angle α corresponding to the arc bottom surface is in the range of 24°≤α≤38°; the width W of the body is 2R*sin(α / 2), where R is the radius of the wafer rod.

7. A resin plate for wafer rods according to claim 6, characterized in that, The length of the larger side of the slot is (0.1-0.15)W, and the length of the smaller side is (0.04-0.08)W; The minimum horizontal distance between adjacent holes and slots is (0.04-0.07)W.

8. A resin plate for wafer rods according to claim 6 or 7, characterized in that, The distance from the top of the slot to the top surface of the body is greater than or equal to 6 mm and less than or equal to 8 mm.

9. A device, characterized in that, The resin board described in any one of claims 1-8 is used.

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