Chip packaging fixing platform

Abstract

The utility model discloses a chip packaging fixing platform. The chip packaging fixing platform comprises a base; the central supporting column is fixedly arranged at the center of the upper side wall of the base; the fixed platform is movably connected with the upper end of the central supporting column through a spherical joint bearing, and a placement groove is formed in the upper side wall of the fixed platform; and the leveling mechanism is arranged on the upper side wall of the base and is used for adjusting the levelness of the fixed platform, compared with the prior art, the leveling mechanism is arranged, so that in practical application, an operator can flexibly adjust the leveling mechanism according to the specific inclination condition of the fixed platform, and the leveling efficiency is improved. The surface of the fixing platform is restored to a horizontal state, the chip is ensured to be always in a horizontal position in the packaging process, packaging errors caused by the fact that the fixing platform is not horizontal are effectively eliminated, the chip packaging precision is remarkably improved, and the packaging quality and the yield of the chip are improved.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging technology, and in particular to a chip packaging fixing platform. Background Technology

[0002] A chip packaging fixing platform is a device used to fix chips or related components during the chip packaging process to ensure the precise and stable execution of the packaging process. In various stages of the packaging process, such as dispensing, soldering, and potting, the fixing platform provides stable support for the chip, preventing displacement, shaking, or falling during operation, thus ensuring the smooth progress of the packaging process.

[0003] Currently, most common chip packaging mounting platforms lack leveling capabilities. In actual use, factors such as uneven installation surfaces, structural errors in the equipment itself, and component deformation due to prolonged use can easily cause the platform surface to tilt. When performing chip packaging operations on such uneven platforms, the chip cannot be kept level, making it difficult to guarantee the positional accuracy of each step in the packaging process. This leads to a significant decrease in packaging precision, severely impacting chip packaging quality and yield, and failing to meet the current demands for high-precision chip packaging. Utility Model Content

[0004] The main purpose of this invention is to provide a chip packaging and fixing platform that can effectively solve the problems in the background art.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is: a chip packaging and fixing platform, comprising:

[0006] Base;

[0007] A central support column is fixedly installed at the center of the upper side wall of the base;

[0008] A fixed platform is movably connected to the upper end of a central support column via a spherical joint bearing, and a placement groove is provided on the upper side wall of the fixed platform;

[0009] A leveling mechanism is provided on the upper side wall of the base, and the leveling mechanism is used to adjust the level of the fixed platform;

[0010] A positioning mechanism is disposed in a placement slot and is used to position the chip in the placement slot;

[0011] As a further description of the above technical solution, the leveling mechanism includes four threaded sleeves, which are rotatably disposed at the four corners of the upper side wall of the base. Each threaded sleeve is internally threaded with a threaded post, and the upper end of the threaded post is movably connected to the fixed platform through a spherical joint bearing. An adjusting ring is fixedly sleeved on the outer side of each threaded sleeve.

[0012] As a further description of the above technical solution, the positioning mechanism includes a cavity, which is opened on the lower side wall of the placement slot. Two symmetrically distributed sliders are slidably arranged in the cavity. A bidirectional screw is rotatably arranged between the two side walls of the cavity. Both sliders are threaded onto the bidirectional screw. One end of the bidirectional screw extends to the outside of the fixed platform and is fixedly connected to a knob. A positioning plate is fixedly connected to the upper side wall of the slider.

[0013] As a further description of the above technical solution, the adjusting ring is provided with a number of pin holes, and the upper side wall of the base is provided with a number of limiting holes at the four corners. A stop pin is provided in the pin hole, and the lower end of the stop pin extends into the limiting hole.

[0014] As a further description of the above technical solution, rubber pads are provided on the side walls of the two positioning plates that are close to each other.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] 1. Through the set leveling mechanism, in practical applications, operators can flexibly adjust the leveling mechanism according to the specific situation of the fixed platform tilt, so that the surface of the fixed platform is restored to a horizontal state, ensuring that the chip is always in a horizontal position during the packaging process. This effectively eliminates the packaging error caused by the fixed platform not being horizontal, significantly improves the chip packaging accuracy, and enhances the chip packaging quality and yield. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of a chip packaging fixing platform according to the present invention;

[0018] Figure 2 This is a cross-sectional view of the threaded sleeve of a chip packaging fixing platform according to the present invention;

[0019] Figure 3 This is a schematic diagram of the stop pin structure of a chip packaging fixing platform according to the present invention;

[0020] Figure 4 This is a cross-sectional view of the fixing platform of the chip packaging fixing platform of this utility model;

[0021] In the diagram: 1. Base; 2. Central support; 3. Fixed platform; 31. Placement slot; 4. Leveling mechanism; 5. Positioning mechanism; 41. Threaded sleeve; 42. Threaded post; 43. Adjusting ring; 51. Groove cavity; 52. Slider; 53. Bidirectional screw; 54. Knob; 55. Positioning plate; 431. Pin hole; 11. Limiting hole; 12. Stop pin. Detailed Implementation

[0022] To make the technical means, creative features, and objectives of this utility model easier to understand, the following describes this utility model in conjunction with specific embodiments.

[0023] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0024] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," and "connected," etc., should be interpreted broadly. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0025] Please see Figure 1-4 This utility model provides a chip packaging fixing platform, comprising:

[0026] Base 1;

[0027] Central support 2 is fixedly installed at the center of the upper side wall of base 1;

[0028] Fixed platform 3 is movably connected to the upper end of central support column 2 via spherical joint bearing. Placement groove 31 is provided on the upper side wall of fixed platform 3.

[0029] The leveling mechanism 4 is installed on the upper side wall of the base 1 and is used to adjust the level of the fixed platform 3.

[0030] Positioning mechanism 5 is disposed in placement slot 31 and is used to position the chip in placement slot 31.

[0031] The above structure enables stable support and positioning of the chip.

[0032] The leveling mechanism 4 includes four threaded sleeves 41, which are rotatably mounted at the four corners of the upper side wall of the base 1. The threaded sleeves 41 are internally threaded with threaded posts 42, and the upper ends of the threaded posts 42 are movably connected to the fixed platform 3 through spherical plain bearings. An adjusting ring 43 is fixedly sleeved on the outer side of the threaded sleeves 41.

[0033] By setting up the above structure, the fixed platform 3 can be leveled according to the actual use scenario, avoiding packaging errors caused by the fixed platform 3 not being level, significantly improving the accuracy of chip packaging, and enhancing the chip packaging quality and yield.

[0034] The positioning mechanism 5 includes a cavity 51, which is located on the lower side wall of the placement groove 31. Two symmetrically distributed sliders 52 are slidably arranged inside the cavity 51. A bidirectional screw 53 is rotatably arranged between the two side walls of the cavity 51. Both sliders 52 are threaded onto the bidirectional screw 53. One end of the bidirectional screw 53 extends to the outside of the fixed platform 3 and is fixedly connected to a knob 54. A positioning plate 55 is fixedly connected to the upper side wall of the sliders 52.

[0035] The above structure can be used to fix the chip in the placement slot 31, ensuring the stability of the chip during packaging.

[0036] The adjusting ring 43 is provided with several pin holes 431, and the upper side wall of the base 1 is provided with several limiting holes 11 at the four corners. The pin holes 431 are provided with stop pins 12, and the lower end of the stop pins 12 extends into the limiting holes 11.

[0037] By setting up the above structure, the adjusting ring 43 can be locked to prevent the adjusting ring 43 from rotating due to external force when there is no need to adjust the level, which would cause the fixed platform 3 to lose its level.

[0038] Rubber pads are provided on the side walls of the positioning plates 55 that are close to each other. This can increase the friction between the positioning plates 55 and the chip, improve the fixing effect, and also prevent the positioning plates 55 from damaging the chip.

[0039] It should be noted that this utility model is a chip packaging fixing platform. When the fixing platform 3 is not horizontal, the corresponding threaded post 42 can be adjusted according to the tilt of the fixing platform 3. During adjustment, the stop pin 12 is pulled out to disengage it from the pin hole 431, releasing the lock on the adjusting ring 43. Then, the adjusting ring 43 is rotated to drive the threaded sleeve 41 to rotate. When the threaded sleeve 41 rotates, the threaded post 42 connected to it can move, adjusting the height of one corner of the fixing platform 3 until the surface of the fixing platform 3 is horizontal. After the adjustment is completed, the stop pin 12 is inserted into the pin hole 431 and then into the limiting hole 11. Under the obstruction of the stop pin 12, the adjusting ring 43 is locked and cannot rotate. Before packaging, the chip is placed in the placement slot 31, and then the knob 54 is rotated to drive the bidirectional screw 53 to rotate. When the bidirectional screw 53 rotates, the two sliders 52 can drive the positioning plate 55 to move closer to each other. The positioning plate 55 will fix the chip, and then the packaging can be performed.

[0040] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A chip packaging fixing platform, characterized in that, include: Base (1); The central support (2) is fixedly installed at the center of the upper side wall of the base (1); Fixed platform (3), the fixed platform (3) is movably connected to the upper end of the central support (2) through a spherical joint bearing, and a placement groove (31) is provided on the upper side wall of the fixed platform (3). A leveling mechanism (4) is provided on the upper side wall of the base (1) and is used to adjust the level of the fixed platform (3). Positioning mechanism (5) is disposed in placement slot (31) and is used to position the chip in placement slot (31).

2. The chip packaging fixing platform according to claim 1, characterized in that, The leveling mechanism (4) includes four threaded sleeves (41), which are rotatably disposed at the four corners of the upper side wall of the base (1). The threaded sleeves (41) are internally threaded with threaded columns (42), and the upper end of the threaded columns (42) is movably connected to the fixed platform (3) through a spherical joint bearing. An adjusting ring (43) is fixedly sleeved on the outer side of the threaded sleeves (41).

3. The chip packaging fixing platform according to claim 1, characterized in that, The positioning mechanism (5) includes a cavity (51), which is opened on the lower side wall of the placement groove (31). Two symmetrically distributed sliders (52) are slidably arranged in the cavity (51). A bidirectional screw (53) is rotatably arranged between the two side walls of the cavity (51). Both sliders (52) are threaded onto the bidirectional screw (53). One end of the bidirectional screw (53) extends to the outside of the fixed platform (3) and is fixedly connected to a knob (54). A positioning plate (55) is fixedly connected to the upper side wall of the slider (52).

4. A chip packaging fixing platform according to claim 2, characterized in that, The adjusting ring (43) is provided with several pin holes (431), and the upper side wall of the base (1) is provided with several limiting holes (11) at the four corners. The pin holes (431) are provided with stop pins (12), and the lower end of the stop pins (12) extends into the limiting holes (11).

5. A chip packaging fixing platform according to claim 3, characterized in that, Rubber pads are provided on the side walls of the two positioning plates (55) that are close to each other.

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