Slide glass device for heat treatment

Abstract

The utility model relates to the technical field of semiconductor heat treatment, and discloses a slide glass device for heat treatment, which comprises a slide glass box, the inside of the slide glass box is hollow to form a slide glass cavity, and the slide glass box is provided with an inlet; a bearing structure is fixed in the slide glass box, a plurality of bearing grooves are formed in the bearing structure in the height direction, a plurality of fixing grooves are formed in the inner walls of the two vertical side edges of the slide glass box, and the fixing grooves correspond to the bearing grooves in a one-to-one mode. In practical application, the heat treatment efficiency is guaranteed, and meanwhile the heat treatment quality of products is effectively improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor heat treatment technology, and specifically to a wafer carrier device for heat treatment. Background Technology

[0002] Heat treatment is a crucial step in the substrate or wafer manufacturing process. Its core operation involves placing the substrate or wafer in an environment filled with a specific gas and applying heat. Common processes include oxidation, diffusion, and annealing. These heat treatment processes effectively improve the physical and chemical properties of the substrate or wafer, meeting the diverse needs of subsequent production.

[0003] Currently, during heat treatment, substrates or wafers are typically placed in the furnace using a carrier device. For example, Chinese patent CN218705429U discloses a wafer storage device with a detachable frame inside the enclosure. Trays are spaced apart on the frame, and wafers are placed on these trays before baking. This design enables batch heat treatment to a certain extent, significantly improving processing efficiency and has been widely used in production practice.

[0004] However, in practical applications, the aforementioned storage device has revealed significant drawbacks. When the heat treatment temperature reaches or exceeds the critical melting point of the metal thin film layer, the metal thin film layer on the wafer surface undergoes agglomeration. This phenomenon covers existing defects, interfering with the accurate assessment of product quality. More critically, at this point, tiny areas in the thin film metal layer that were originally poorly adhered to the wafer substrate will stick to the clean tray, leading to metal layer detachment. This detachment of tiny areas of the metal layer severely impacts the final manufactured component circuitry, resulting in defects such as breakpoints and gaps. Breakpoints cause open circuits in the component circuitry, rendering it unable to function properly; gaps cause the component circuitry to melt instantly upon power-on, significantly increasing the product rejection rate and scrap rate, resulting in substantial cost losses and potential quality risks for the manufacturing company. Utility Model Content

[0005] The present invention aims to provide a carrier device for heat treatment, so as to improve the heat treatment quality of products and reduce production costs.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a substrate carrier device for heat treatment, comprising a substrate carrier box, the interior of which is hollow to form a substrate carrier cavity, and the substrate carrier box having an inlet; a support structure is fixed inside the substrate carrier box, the support structure having multiple support grooves along the height direction, and multiple fixing grooves are provided on the inner walls of the two vertical sides of the substrate carrier box, the fixing grooves corresponding one-to-one with the support grooves.

[0007] The principles and advantages of this scheme are:

[0008] 1. Avoid overlapping contact and ensure product quality: This solution utilizes the internal wall structure of the wafer carrier to create the fixing slots, eliminating the need for additional complex connecting components and making the fixing slots and wafer carrier a stable whole. Furthermore, the wafer carrier has an intermediate support block with corresponding support slots on it. The wafers are positioned and supported by the support slots and fixing slots. The distributed support greatly reduces the contact area between the wafers and the support structure, reducing the risk of the metal thin film layer peeling off due to adhesion to the support structure in small areas. This effectively avoids defects such as breakpoints and gaps in component circuits caused by metal layer peeling, thereby reducing the product defect rate and scrap rate.

[0009] 2. Precise Positioning and Excellent Heat Treatment: Traditional storage devices may suffer from uneven heating during heat treatment due to inaccurate wafer placement on the tray, further affecting product quality. This wafer carrier device features vertically arranged and corresponding support and fixing slots, providing precise wafer positioning. The fixing slots on the inner wall of the wafer carrier box, with their integral molding structure, provide a more stable support base during positioning. When placing the wafer into the wafer carrier cavity, it ensures that it is in the optimal heat treatment position, guaranteeing uniform heating. Simultaneously, the combined action of the fixing slots on both sides and the central support block provides stable support for the wafer, preventing displacement due to vibration or other factors during heat treatment.

[0010] 3. Batch processing and reduced production costs: The wafer carrier unit, with multiple vertically arranged support and fixing slots, can efficiently accommodate more wafers within a limited wafer carrier cavity, optimizing space layout. The fixing slots on the inner wall of the wafer carrier box utilize their own structure, eliminating the need for additional space to install support components, thus maximizing the usable space within the wafer carrier cavity. During batch heat treatment, a larger number of wafers can be processed at once, further improving processing efficiency compared to traditional units. This meets the needs of manufacturing enterprises for large-scale production and helps reduce the production cost per unit.

[0011] 4. Uniform heat dissipation and heating: The fixing grooves on the inner wall of the wafer carrier box and the support grooves on the intermediate support block not only support the wafer but also provide ample space for hot air circulation. Hot air can flow quickly along these channels, promptly carrying away excess heat from the wafer surface, achieving efficient heat dissipation. This effectively avoids wafer quality problems caused by localized overheating or poor heat dissipation, further improving product yield, providing strong support for high-quality heat treatment processes, and reducing enterprise waste costs.

[0012] Furthermore, the fixing groove is serrated, including a horizontally arranged bottom surface and an inclined surface.

[0013] Beneficial effects: Compared to the common rectangular slot design, this solution uses a serrated slot. On one hand, the bottom and inclined surfaces of the serrated slot work together to form a tighter and more stable contact with the wafer. The inclined surfaces provide additional friction and lateral support, limiting the wafer's position in both horizontal and lateral dimensions. This reduces problems such as metal film layer peeling and uneven heating caused by displacement, ensuring product quality. On the other hand, the right-angled structure of the rectangular slot may cause the wafer to jam when being inserted and removed, requiring operators to spend more effort and time adjusting its position. The inclined surfaces of the serrated slot have a guiding effect, allowing operators to more easily insert the wafer into the slot and remove it more smoothly, further improving overall production efficiency.

[0014] Furthermore, different manufacturing processes and wafer types have varying requirements for the mounting grooves. Rectangular grooves have a relatively simple structure and are less adaptable to wafers with special specifications or complex heat treatment processes. The serrated shape of the mounting groove can better adapt to diverse needs. For example, for wafers with irregular edges, the inclined surface of the serrated mounting groove can be adaptively adjusted to a certain extent according to the shape of the wafer, providing stable support. In some heat treatment processes with special requirements for the rate of temperature change, the optimized heat convection effect of the serrated mounting groove can better meet the process requirements, thereby expanding the application potential of wafer carriers in different production scenarios.

[0015] Furthermore, the angle between the bottom surface and the inclined surface ranges from 40° to 60°.

[0016] Beneficial effects: In actual use, wafers are picked up and placed from the front of the mounting slot. The inclined surface allows the wafer to first contact the relatively smooth inclined surface and gradually slide into the mounting slot along the inclined surface, acting as a buffer to reduce the risk of collision. The guiding force provided by the inclined surface helps the operator to put the wafer into the slot with less effort. Compared with the absence of an inclined surface, where the operator needs to control the force and direction more precisely to place the wafer in place, the presence of the inclined surface reduces the difficulty of operation and improves the placement efficiency, especially when placing wafers in batches.

[0017] In actual production, heat treatment equipment vibrates during operation. If the angle is too small, the contact area between the fixing tank and the wafer is limited, and the support provided by the inclined surface is insufficient. The wafer may wobble during placement, resulting in poor stability and increasing the risk of collision between the wafer and the edge of the fixing tank, potentially damaging the wafer. Furthermore, heat is easily trapped within the angle and cannot be effectively dissipated or transferred. If the angle is too large, the inclined surface is too steep. Although the guiding effect seems enhanced, in actual operation, the wafer will slide down rapidly after contacting the inclined surface due to the large angle, making it difficult for operators to accurately control the wafer's sliding speed and position, which is also detrimental to accurate placement. In addition, an excessively large angle will increase the lateral pressure on the wafer within the fixing tank, which may cause displacement or deformation of the wafer within the fixing tank, affecting its stability.

[0018] Furthermore, the bottom surface of the fixing groove is flush with the bottom surface of the supporting groove.

[0019] Beneficial effects: During wafer placement, the wafer can move from the support slot into the holder slot without encountering any height difference. If there is a height difference between the bottom surfaces, the wafer may experience collisions or jamming during movement, affecting the smoothness of placement and potentially causing surface damage or misalignment. The flush bottom design allows the wafer to smoothly transition from the support slot to the holder slot, enabling operators to place the wafer more easily and accurately, reducing adjustments during placement and improving efficiency. Furthermore, the absence of instability caused by height differences enhances the stability of the wafer within the holder slot after placement, making it less prone to displacement during subsequent heat treatment and other operations, thus ensuring process stability and product quality.

[0020] Furthermore, the inlet of the slide box is located on the front and rear sides, and the slide box is provided with a partition perpendicular to the support structure.

[0021] Beneficial effects: The partition divides the wafer carrier cavity into multiple parts, which not only increases the number of wafers that can be placed, but also plays a further positioning role when placing wafers. Operators can quickly and accurately place wafers according to the areas divided by the partition, ensuring the stability of the heat treatment process, improving product quality, and reducing quality problems caused by positional deviation and unstable support.

[0022] Furthermore, the partition is cross-shaped, and each end of the partition is connected to the inner wall of the slide box.

[0023] Beneficial Effects: The cross-shaped partitions not only function as partitions but also cleverly connect the entire wafer carrier cavity. During heat treatment, the hot airflow can utilize these connected areas to form a wider and more orderly circulation path within the wafer carrier box. Compared to traditional closed or partially connected structures, the hot airflow is no longer confined to a small space but can penetrate the entire wafer carrier box, evenly covering the wafers in each partition. This ensures that all parts of the wafer receive consistent and sufficient heat during heat treatment, greatly improving heating uniformity. Simultaneously, the efficient heat transfer also shortens heat treatment time, increases production efficiency, reduces energy consumption, and brings significant economic benefits to enterprises.

[0024] Secondly, the cross-shaped partitions also act as strong supports within the wafer carrier box. Under high-temperature heat treatment environments, the wafer carrier box material experiences stress due to thermal expansion and contraction. Ordinary structures are prone to deformation under this stress, affecting wafer placement accuracy and processing results. However, the cross-shaped partitions, tightly connected to the inner wall of the wafer carrier box, form a stable support frame, much like a load-bearing wall in a building, effectively dispersing thermal stress. Even during prolonged high-temperature operations, the wafer carrier box maintains a stable shape and structure, ensuring the positional accuracy of the fixing slots and support slots, providing a reliable placement environment for the wafers. This not only extends the service life of the wafer carrier box and reduces equipment maintenance and replacement costs, but also ensures the continuity and stability of the production process, avoiding production interruptions and losses due to equipment failure.

[0025] Furthermore, the slide box has heat dissipation holes on its top, bottom, left, and right sides, and the heat dissipation holes extend through the slide box along the thickness of the side.

[0026] Beneficial effects: The heat dissipation holes provide additional channels for hot airflow, accelerating the heat exchange process. Hot air can be quickly exhausted from the holes, while cool outside air can be promptly replenished, forming an efficient thermal convection cycle. This not only allows the wafer to quickly reach the appropriate heat treatment temperature but also enables rapid cooling after processing, shortening the entire heat treatment cycle. The heat dissipation hole design improves heat dissipation efficiency, resulting in more stable temperature changes in the wafer carrier material during heat treatment and reducing thermal stress concentration caused by rapid temperature changes. This further ensures the stability of the wafer carrier in high-temperature environments, extends its service life, reduces equipment maintenance and replacement costs, and guarantees the continuity and stability of the production process.

[0027] Furthermore, the heat dissipation holes located on the left and right sides of the wafer carrier are triangular in shape.

[0028] Beneficial effects: Designing the heat dissipation holes on the left and right sides as triangles ensures excellent heat dissipation and ventilation. Furthermore, the stability of the triangle enhances the structural strength of the wafer carrier. During heat treatment, the wafer carrier experiences stress due to thermal expansion and contraction; the material surrounding the triangular heat dissipation holes better disperses this stress. Compared to other shapes of heat dissipation holes, triangular holes reduce stress concentration on the sides of the wafer carrier under the same stress. After high-temperature heat treatment, the wafer carrier with triangular heat dissipation holes exhibits less deformation. This not only ensures the stability of the wafer carrier during long-term high-temperature operation, extending its service life and reducing maintenance and replacement costs, but also ensures precise positioning of the fixing slots and support slots, providing a stable placement environment for the wafers and guaranteeing stable heat treatment processes.

[0029] Furthermore, the top of the slide carrier box is equipped with a handle. The handle design facilitates the handling and transportation of the slide carrier device by workers, improving operational convenience. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the structure of Embodiment 1 of this utility model.

[0031] Figure 2 A schematic diagram of a structure for loading wafers into a wafer carrier device.

[0032] Figure 3 for Figure 1 The front view.

[0033] Figure 4 This is a cross-sectional view of Embodiment 1 of the present utility model.

[0034] Figure 5 This is a structural schematic diagram of Embodiment 2 of the present invention.

[0035] Figure 6 This is a structural schematic diagram of Embodiment 3 of the present invention. Detailed Implementation

[0036] The following detailed description illustrates the specific implementation method:

[0037] The reference numerals in the accompanying drawings include: wafer box 1, fixing groove 2, partition 3, intermediate support block 4, support groove 5, heat dissipation hole 6, handle 7, wafer 8.

[0038] Example 1

[0039] The basics are as follows: Figures 1-4As shown: A wafer carrier device for heat treatment includes a wafer carrier box 1, the wafer carrier box 1 is hollow to form a wafer carrier cavity, the wafer carrier box 1 is provided with an inlet for placing and taking wafers 8; a support structure is fixed inside the wafer carrier box 1, the support structure is an intermediate support block 4 set in the middle of the wafer carrier box 1, the intermediate support block 4 is provided with a plurality of support grooves 5 along the height direction, and a plurality of fixing grooves 2 are provided on the inner walls of the two vertical sides of the wafer carrier box 1, the fixing grooves 2 penetrate the wafer carrier cavity laterally, and the fixing grooves 2 correspond one-to-one with the support grooves 5.

[0040] Preferably, the wafer carrier box 1 has its loading ports located on the front and rear sides. The wafer carrier box 1 is equipped with a partition 3, which is perpendicular to the middle of the intermediate support block 4. The partition 3 divides the wafer carrier cavity into two parts, front and rear. Wafers 8 can be placed through the loading ports on both the front and rear sides, which increases the number of wafers 8 that can be heat-treated in a single process and improves the heat treatment efficiency.

[0041] The fixing groove 2 is serrated, including a bottom surface and an inclined surface. The bottom surface is horizontally positioned parallel to the bottom of the wafer carrier 1. The bottom surface of the fixing groove 2 is flush with the bottom surface of the supporting groove 5. The angle between the bottom surface and the inclined surface ranges from 40° to 60°. In actual use, the wafer 8 is picked up and placed from the front of the fixing groove 2. The inclined surface allows the wafer 8 to first contact the relatively smooth inclined surface and gradually slide into the fixing groove 2 along the inclined surface, which plays a buffering role and reduces the risk of collision. The guiding force provided by the inclined surface can help the operator to put the wafer 8 into the groove with less effort. Compared with the absence of the inclined surface, the operator needs to control the force and direction more precisely to place the wafer 8 in place. The presence of the inclined surface reduces the difficulty of operation and improves the placement efficiency, especially when placing wafers 8 in batches. Preferably, in this embodiment, the angle between the two is 45°. This angle has a good guiding effect and is a common angle that is convenient for processing and production.

[0042] The top of the slide box 1 is equipped with a handle 7, which is designed to facilitate workers to move and transport the slide device, thus improving the ease of operation.

[0043] In this solution, the fixing slot 2 is created by utilizing the internal wall structure of the wafer carrier 1 itself, eliminating the need for additional complex connecting components and making the fixing slot 2 and the wafer carrier 1 a stable whole. Furthermore, the wafer carrier 1 is equipped with an intermediate support block 4, on which a support slot 5 corresponding to the fixing slot 2 is opened. The wafer 8 is positioned and supported by the support slot 5 and the fixing slot 2. The distributed support greatly reduces the contact area between the wafer 8 and the support structure, reducing the risk of the small area of ​​the metal thin film layer falling off due to adhesion to the support structure. This effectively avoids defects such as breakpoints and gaps in the component circuits caused by the metal layer falling off, thereby reducing the product defect rate and scrap rate.

[0044] Secondly, by setting multiple support slots 5 and fixing slots 2 arranged along the height direction, more wafers 8 can be rationally arranged within the limited wafer carrier cavity, optimizing the spatial layout. The fixing slots 2 on the inner wall of the wafer carrier box 1 utilize their own structure, eliminating the need for additional space to install support components, thus maximizing the usable space within the wafer carrier cavity. During batch heat treatment, a larger number of wafers 8 can be processed at once, further improving processing efficiency compared to traditional devices, meeting the needs of manufacturing enterprises for large-scale production, and helping to reduce the production cost per unit product.

[0045] Example 2

[0046] Compared to Example 1, combined with Figure 5 As shown, in this embodiment, the partition 3 is cross-shaped, and each end of the partition 3 is connected to the inner wall of the wafer carrier box 1. This arrangement not only serves to partition the wafers but also cleverly connects the entire wafer carrier cavity. During heat treatment, the hot airflow can form a wider and more orderly circulation path within the wafer carrier box 1 through these connected areas, ensuring that all parts of the wafer 8 receive consistent and sufficient heat during heat treatment, thus greatly improving the uniformity of heating.

[0047] Furthermore, the cross-shaped partition 3 also serves as a strong support inside the wafer carrier 1. Under high-temperature heat treatment conditions, the material of the wafer carrier 1 will generate stress due to thermal expansion and contraction. Ordinary structures are prone to deformation under this stress, affecting the placement accuracy and processing effect of the wafer 8. However, the cross-shaped partition 3 is tightly connected to the inner wall of the wafer carrier 1, forming a stable support frame. The wafer carrier 1 can also maintain a stable shape and structure, ensuring the positional accuracy of the fixing slot 2 and the support slot 5, and providing a reliable placement environment for the wafer 8.

[0048] Example 3

[0049] In this embodiment, combined with Figure 5 and Figure 6 As shown, heat dissipation holes 6 are opened on the top, bottom, left and right sides of the slide box 1. The heat dissipation holes 6 penetrate the slide box 1 along the side thickness. The heat dissipation holes 6 provide an additional flow channel for hot air, which accelerates the heat exchange process and reduces the overall weight of the slide device, thereby reducing the labor intensity of workers when moving the slide device.

[0050] Furthermore, the heat dissipation holes 6 located above and below the wafer carrier 1 are rectangular, while the heat dissipation holes 6 located to the left and right of the wafer carrier 1 are triangular. Multiple triangular heat dissipation holes 6 are arranged in a mixed configuration of upright and inverted placement. While ensuring good heat dissipation and ventilation performance, the triangular shape enhances the structural strength of the wafer carrier 1. During heat treatment, the wafer carrier 1 experiences stress due to thermal expansion and contraction; the material surrounding the triangular heat dissipation holes 6 better disperses this stress. Compared to heat dissipation holes 6 of other shapes, the triangular heat dissipation holes 6 reduce stress concentration on the sides of the wafer carrier 1 under the same stress. After high-temperature heat treatment, the wafer carrier 1 with triangular heat dissipation holes 6 exhibits less deformation. This not only ensures the stability of the wafer carrier 1 during long-term high-temperature operation, extending its service life and reducing maintenance and replacement costs, but also ensures the precise positioning of the fixing slot 2 and the support slot 5, providing a stable placement environment for the wafer 8 and guaranteeing the stability of the heat treatment process.

[0051] The above descriptions are merely embodiments of this utility model. Commonly known technical solutions and / or characteristics are not described in detail here. It should be noted that those skilled in the art can make various modifications and improvements without departing from the technical solution of this utility model. These modifications and improvements should also be considered within the scope of protection of this utility model, and will not affect the effectiveness of the implementation of this utility model or the practicality of the patent. The scope of protection claimed in this application should be determined by the content of its claims, and the specific embodiments described in the specification can be used to interpret the content of the claims.

Claims

1. A substrate carrier for heat treatment, characterized in that: The system includes a slide carrier box, which has a hollow interior forming a slide carrier cavity and an inlet. A support structure is fixed inside the slide carrier box, with multiple support grooves along its height. Multiple fixing grooves are located on the inner walls of the two vertical sides of the slide carrier box, each corresponding to a support groove. The fixing grooves are serrated, including a horizontally arranged bottom surface and an inclined surface. The inlet of the slide carrier box is located on the front and rear sides, and a partition perpendicular to the support structure is provided inside the slide carrier box. The partition is cross-shaped, with each end connected to the inner wall of the slide carrier box.

2. The substrate carrier device for heat treatment according to claim 1, characterized in that: The angle between the bottom surface and the inclined surface is in the range of 40°-60°.

3. The substrate carrier device for heat treatment according to claim 1, characterized in that: The bottom surface of the fixing groove is flush with the bottom surface of the supporting groove.

4. The substrate carrier device for heat treatment according to claim 1, characterized in that: The slide box has heat dissipation holes on all four sides, and the heat dissipation holes extend through the slide box along the thickness of the side.

5. A substrate carrier device for heat treatment according to claim 4, characterized in that: The heat dissipation holes located on the left and right sides of the substrate box are triangular in shape.

6. A substrate carrier device for heat treatment according to claim 5, characterized in that: The slide box is equipped with a handle on top.

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