Wafer conveying device for multi-size wafers
By designing support components and transfer components for multi-size wafer transfer devices, the compatibility problem of wafer cassettes of different sizes was solved, enabling precise positioning of wafers during the transfer process and accurate detection by testing equipment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- WUHAN JINGLI ELECTRONICS TECH
- Filing Date
- 2025-06-06
- Publication Date
- 2026-04-24
AI Technical Summary
Existing wafer transfer devices are incompatible with wafer cassettes and wafers of different sizes, making it impossible to share them. Furthermore, the wafer position cannot be accurately calibrated during the transfer process, affecting the accuracy of the testing equipment.
A multi-size wafer transfer device was designed, comprising a support assembly and a transfer assembly. The support assembly consists of a housing, a support plate, a sliding plate, and a movable plate. The transfer assembly includes a robotic arm and an edge finder. By sliding the sliding plate and calibrating the position of the edge finder, compatibility and precise positioning of wafer cassettes of different sizes are achieved, ensuring accurate gripping and transfer by the robotic arm.
It achieves compatibility with wafer cassettes of different sizes, ensuring accurate positioning of wafers during transport and guaranteeing precise gripping and inspection of wafers in testing equipment.
Smart Images
Figure CN224165099U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of wafer testing, specifically relating to a wafer transfer device for multiple sizes. Background Technology
[0002] As semiconductor manufacturing processes continue to advance to smaller nodes, the requirements for wafer cleanliness and production efficiency are also increasing. Wafer transfer devices, acting as a bridge between the automated material handling system and inspection equipment in wafer fabs, play a crucial role in ensuring the cleanliness and efficiency of wafer transport.
[0003] Currently, in automated material handling systems, wafers are mainly carried and transported through wafer cassettes. However, the sizes of wafer cassettes vary significantly depending on the wafer size (e.g., 8-inch wafer cassettes and 12-inch wafer cassettes). Existing wafer transfer devices can only accommodate wafer cassettes of specific sizes and their corresponding wafers, and cannot achieve shared compatibility. Utility Model Content
[0004] In view of the above-mentioned defects or improvement needs of the existing technology, this utility model provides a wafer transfer device for multiple sizes. Its purpose is to not only be compatible with wafer cassettes and wafer transport of different sizes, so as to achieve common use, but also to accurately calibrate the wafer position during the transfer process, so as to ensure that the wafer is accurately picked up and transferred to the testing equipment.
[0005] To achieve the above objectives, this utility model provides a wafer transfer device for multiple sizes, the wafer transfer device including a support assembly and a transfer assembly;
[0006] The support assembly includes a housing, a support plate, a sliding plate, and a movable plate. The support plate is disposed on the outer wall of the housing, and the housing has an operating port. The sliding plate is slidably arranged on the support plate in a direction toward or away from the operating port. The movable plate is detachably mounted on the sliding plate. The sliding plate and the movable plate are used to support and position wafer cassettes of different sizes, respectively.
[0007] The wafer transfer assembly includes a robotic arm and an edge finder. The edge finder is located inside the housing. The robotic arm is used to transfer wafers from the wafer cassette to the edge finder, transfer wafers from the edge finder to the inspection equipment, and transfer wafers from the inspection equipment to the corresponding wafer cassette. The edge finder is used to move the wafer in the X and Y directions after detecting the outline center of the wafer.
[0008] Optionally, the slide plate is fitted with a plurality of spaced positioning pins, each positioning pin being used to insert into a corresponding positioning hole on the movable plate or into a positioning hole on the slide plate corresponding to a wafer cassette.
[0009] Optionally, the movable plate has a plurality of spaced positioning blocks, which are used to clamp and position the corresponding wafer cassettes on the movable plate.
[0010] Optionally, the wafer transfer device further includes a scanning component located inside the housing. The scanning component includes a first scanning terminal, a first support, and a first linear module. The first linear module is located on the first support and is used to drive the first scanning terminal to move toward and away from the edge finder. The first scanning terminal is used to scan the first surface of the wafer on the edge finder.
[0011] Optionally, the scanning component further includes a second scanning terminal, which is used to scan the second surface of the wafer on the robotic arm when transferring the wafer from the wafer cassette to the edge finder.
[0012] Optionally, the wafer transfer device further includes an imaging component located inside the housing. The imaging component includes a second support, a second linear module, and a camera. The second linear module is located on the second support and is used to drive the camera head to move toward and away from the edge finder. The camera is used to take pictures of the chips on the wafers on the edge finder.
[0013] Optionally, the number of the support plate, the slide plate, the movable plate, and the operating port are all two, and the two support plates are arranged in parallel and spaced apart.
[0014] Optionally, an outer cover is hinged to the outer wall of the housing. The outer cover is used to form a covering space with the movable plate. The covering space is used to accommodate the corresponding wafer cassette, and the covering space is connected to the operating port.
[0015] Optionally, the support plate is provided with a driving component, the output end of which is connected to the slide plate to drive the slide plate to slide.
[0016] Optionally, an air filter unit is provided on the top of the housing, which is used to filter the air entering and exiting the housing.
[0017] The aforementioned improved technical features can be combined with each other as long as they do not conflict with each other.
[0018] In summary, the beneficial effects of the above-described technical solutions conceived by this utility model compared with the prior art include:
[0019] In the wafer transfer device for multiple sizes provided in this embodiment of the invention, when transferring large-size wafer cassettes, the large-size wafer cassette is first placed on a sliding plate and positioned. Then, the sliding plate is driven to slide on the support plate. When the sliding plate slides to the position of the operating port, the robotic arm sequentially grabs wafers of various sizes. Each wafer is first transferred to an edge finder, and the edge finder rotates the wafer so that the corresponding sensor on the edge finder detects and determines the center position of the wafer, and then moves the wafer to correct its position (i.e., adjust the wafer position), ensuring high accuracy when the robotic arm grabs again. This ensures accurate grabbing and transfer to the testing equipment, thereby ensuring accurate chip testing by the testing equipment. Finally, after the testing equipment completes the testing of the wafer, the robotic arm returns the wafer to the large-size wafer cassette. The sliding reset slide plate is then slid to remove the large-size wafer cassette.
[0020] When transferring wafers from small-sized wafer cassettes, firstly, a movable plate is placed on the slide plate, and then the small-sized wafer cassette is placed on and positioned on the movable plate. Next, the slide plate is driven to slide on the support plate. When the slide plate moves the movable plate to the operating port position, the robotic arm sequentially picks up each small-sized wafer. Each wafer is first transferred to the edge finder, which also adjusts the wafer position to ensure high precision when the robotic arm picks it up again. Finally, after the inspection equipment completes the wafer inspection, the robotic arm returns the wafer to the small-sized wafer cassette. The small-sized wafer cassette is then removed by sliding the reset slide plate.
[0021] In other words, the wafer transfer device for multiple sizes provided by this utility model embodiment can not only be compatible with wafer cassettes and wafer transport of different sizes, enabling shared use, but also accurately calibrate the wafer position during the transfer process to ensure accurate gripping and transfer to the testing equipment. Attached Figure Description
[0022] Figure 1 This is a schematic diagram of the structure of a wafer transfer device for multiple sizes provided in an embodiment of the present invention;
[0023] Figure 2 This is a partial structural schematic diagram of the support component provided in an embodiment of the present utility model;
[0024] Figure 3 This is a schematic diagram of the structure of the chip transfer assembly provided in this embodiment of the utility model;
[0025] Figure 4 yes Figure 3 A magnified view of a portion of the image;
[0026] Figure 5 This is a schematic diagram of the structure of the skateboard provided in an embodiment of this utility model.
[0027] In all the accompanying drawings, the same reference numerals denote the same technical features, specifically:
[0028] 1. Housing; 11. Operating port; 12. Outer cover; 13. Air filter unit; 14. Display screen; 2. Support plate; 3. Slide plate; 31. Positioning pin; 32. Position sensor; 33. Rotary cylinder; 4. Movable plate; 41. Positioning block; 5. Robotic arm; 6. Edge finder; 7. Barcode scanning assembly; 71. First scanning dock; 72. First bracket; 73. First linear module; 74. Second scanning dock; 8. Photo taking assembly; 81. Second bracket; 82. Second linear module; 83. Camera; 100. 8-inch wafer cassette. Detailed Implementation
[0029] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only for explaining the present utility model and are not intended to limit the present utility model. Furthermore, the technical features involved in the various embodiments of the present utility model described below can be combined with each other as long as they do not conflict with each other.
[0030] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.
[0031] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0032] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.
[0033] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0034] Example:
[0035] Figure 1 This is a schematic diagram of a multi-size wafer transfer device provided by an embodiment of the present invention, as shown below. Figure 1 As shown, the wafer transfer device includes a support assembly and a transfer assembly. The support assembly includes a housing 1, a support plate 2, a sliding plate 3, and a movable plate 4.
[0036] Figure 2 This is a partial structural schematic diagram of the support component provided in an embodiment of the present invention, as shown below. Figure 2 As shown, the support plate 2 is set on the outer wall of the box 1. The box 1 has an operation port 11. The slide plate 3 is slidably arranged on the support plate 2 in the direction toward or away from the operation port 11. The movable plate 4 is detachably installed on the slide plate 3. The slide plate 3 and the movable plate 4 are used to support and position wafer cassettes of different sizes, respectively.
[0037] Figure 3 This is a schematic diagram of the structure of the chip transfer assembly provided in this embodiment of the utility model. Figure 4 yes Figure 3 A magnified view of the part, combined with Figure 3 and Figure 4As shown, the wafer transfer assembly includes a robotic arm 5 and an edge finder 6. The edge finder 6 is located inside the housing 1. The robotic arm 5 is used to transfer wafers from the wafer cassette to the edge finder 6, transfer wafers from the edge finder 6 to the inspection equipment, and transfer wafers from the inspection equipment to the corresponding wafer cassette. The edge finder 6 is used to move the wafer in the X and Y directions after checking the outline center of the wafer.
[0038] For the wafer transfer device for multiple sizes provided in this embodiment of the utility model, when transferring large-size wafer cassettes, firstly, the large-size wafer cassette is placed on the slide plate 3 and positioned. Then, the slide plate 3 is driven to slide on the support plate 2. When the slide plate 3 slides to the position of the operation port 11, the robot arm 5 sequentially grabs the wafers of each size. Each wafer is first transferred to the edge finder 6, and the edge finder 6 rotates the wafer so that the corresponding sensor on the edge finder 6 detects and determines the center position of the wafer, and then moves the wafer to correct the wafer position (i.e., adjust the wafer position), ensuring high accuracy when the robot arm 5 grabs again, thus ensuring accurate grabbing and transfer to the testing equipment, thereby ensuring that the testing equipment can accurately test the chip. Finally, after the testing equipment completes the testing of the wafer, the robot arm 5 returns the wafer to the large-size wafer cassette. The slide plate 3 is slid back to reset, and the large-size wafer cassette is removed.
[0039] When transferring wafers from small-sized wafer cassettes, firstly, a movable plate 4 is placed on the slide plate 3, and then the small-sized wafer cassette is placed on and positioned on the movable plate 4. Next, the slide plate 3 is driven to slide on the support plate 2. When the slide plate 3 drives the movable plate 4 to the position of the operating port 11, the robotic arm 5 sequentially picks up each small-sized wafer. Each wafer is first transferred to the edge finder 6, which also adjusts the wafer position to ensure high precision when the robotic arm 5 picks up the wafer again. Finally, after the inspection equipment completes the inspection of the wafer, the robotic arm 5 returns the wafer to the small-sized wafer cassette. The slide plate 3 is then slid back to its original position to remove the small-sized wafer cassette.
[0040] In other words, the wafer transfer device for multiple sizes provided by this utility model embodiment can not only be compatible with wafer cassettes and wafer transport of different sizes, enabling shared use, but also accurately calibrate the wafer position during the transfer process to ensure accurate gripping and transfer to the testing equipment.
[0041] For example, the edge finder 6 has an adsorption stage through which the wafer is adsorbed.
[0042] It should be noted that the wafers are inserted layer by layer into the wafer cassette with large gaps, resulting in significant errors. Therefore, precise positioning is required before transfer to the testing equipment. In this embodiment, the edge finder 6 is used to achieve precise wafer positioning. The edge finder 6 rotates the wafer in the θ direction to accurately determine the center position of the wafer and then performs corresponding corrections in the X and Y directions. This is a conventional technique in the field and will not be elaborated upon here.
[0043] In addition, the testing equipment can be installed inside the enclosure 1 or on the other side of the enclosure 1.
[0044] It is easy to understand that by sliding the slide plate 3, a large gap can be maintained between the material box and the operation port 11 before loading, which increases the convenience of loading and unloading.
[0045] For example, the slide plate 3 is used to support a 12-inch wafer cassette, and the movable plate 4 is used to support an 8-inch wafer cassette 100. That is to say, different structural components can be used to support wafer cassettes of corresponding sizes, thereby achieving the positioning of wafer cassettes and wafers of different sizes and achieving compatibility.
[0046] In this embodiment, there are two support plates 2, two slide plates 3, two movable plates 4, and two operation ports 11. The two support plates 2 are arranged in parallel and spaced apart, thereby improving the wafer transfer efficiency and avoiding waiting.
[0047] In addition, an outer cover 12 is hinged to the outer wall of the housing 1. The outer cover 12 is used to form a covering space with the movable plate 4. The covering space is used to accommodate the corresponding wafer cassette (8-inch wafer cassette 100), and the covering space is connected to the operation port 11.
[0048] It is easy to understand that the 8-inch wafer cassette 100 has openings on both sides. The outer cover 12 can seal one side (the other side opening is aligned with the operation port 11), reducing dust contamination of the wafer.
[0049] For example, a drive component (not shown) is provided on the support plate 2, and the output end of the drive component is connected to the slide plate 3 for transmission to drive the slide plate 3 to slide. This drive component can drive the slide plate 3 to slide, thereby improving efficiency. The drive component can be a cylinder or a linear module.
[0050] Figure 5 This is a schematic diagram of the structure of the skateboard provided in this embodiment of the utility model, combined with... Figure 2 and Figure 5 As shown, the slide plate 3 is fitted with a plurality of spaced positioning pins 31, each positioning pin 31 being inserted into a corresponding positioning hole on the movable plate 4 or into a corresponding positioning hole on the slide plate 3 for the corresponding wafer cassette (i.e., 12-inch wafer cassette).
[0051] In the above embodiments, the positioning pin 31 can not only position the movable plate 4, but also position the wafer cassette of the corresponding size.
[0052] For example, the bottom of the 12-inch wafer cassette and the bottom of the movable plate 4 both have multiple spaced positioning holes, and the positioning of the movable plate 4 or the 12-inch wafer cassette is achieved by the cooperation of the positioning holes and positioning pins.
[0053] For example, the slide plate 3 is also provided with a rotary cylinder 33, which is used to press down the bottom of the 12-inch wafer cassette or the bottom of the movable plate 4 to prevent movement during the sliding process.
[0054] Furthermore, the movable plate 4 has multiple positioning blocks 41 arranged at intervals. The multiple positioning blocks 41 are used to clamp the corresponding wafer cassettes on the positioning movable plate 4, thereby achieving precise positioning of the 8-inch wafer cassette 100 through the positioning blocks 41.
[0055] It should be noted that in other embodiments of this utility model, the positioning of the movable plate 4, the 12-inch wafer cassette, and the 8-inch wafer cassette 100 can also be achieved by means of clamps, grooves, or scale lines.
[0056] In this embodiment, the wafer transfer device further includes a scanning component 7, which is located inside the housing 1. The scanning component 7 includes a first scanning terminal 71, a first support 72, and a first linear module 73. The first linear module 73 is located on the first support 72 and is used to drive the first scanning terminal 71 to move toward and away from the edge finder 6. The first scanning terminal 71 is used to scan the first surface of the wafer on the edge finder 6.
[0057] In the above embodiment, the first linear module 73 can drive the first scanning terminal 71 to move, thereby enabling QR code scanning on the front of wafers of different sizes to determine whether each wafer has completed the transfer and subsequent testing.
[0058] For example, the first linear module 73 and the first sweeping dock 71 are both located above the adsorption table.
[0059] Furthermore, the scanning component 7 also includes a second scanning terminal 74, which is used to scan the second surface of the wafer on the robot arm 5 when transferring the wafer from the wafer cassette to the edge finder 6. That is, the robot arm 5 moves the wafer to the area corresponding to the second scanning terminal 74 during the wafer movement, so that the second scanning terminal 74 completes the scanning of the back of the wafer (the QR code of some wafers is located on the back).
[0060] In other words, this barcode scanning component 7 is not only compatible with scanning wafers of different sizes, but also compatible with scanning the front and back of the wafer.
[0061] In addition, the wafer transfer device also includes an image taking component 8, which is located inside the housing 1. The image taking component 8 includes a second support 81, a second linear module 82 and a camera 83. The second linear module 82 is located on the second support 81 and is used to drive the camera 83 to move towards and away from the edge finder 6. The camera 83 is used to take pictures of the chips on the wafer on the edge finder 6.
[0062] In the above embodiment, the camera 83 can be moved by the second linear module 82, thereby enabling the taking of pictures of wafers of different sizes, determining the orientation and position of the chips on each wafer, and facilitating subsequent image stitching in the inspection equipment.
[0063] For example, the slide plate 3 has multiple positioning sensors 32. The positioning sensors 32 identify the 12-inch wafer cassette or the 8-inch wafer cassette 100 when it is squeezed by the wafer cassette or the movable plate 4. The positioning sensors 32 then transmit the signal to the controller, which controls the first linear module 73 and the second linear module 82 to achieve scanning and photographing of wafers of different sizes.
[0064] In this embodiment, an air filter unit 13 is provided on the top of the housing 1, which is used to filter the air entering and exiting the housing 1. In addition, an ionizer bar is also provided on the top of the housing 1 to eliminate static electricity.
[0065] For example, the enclosure 1 is also equipped with a light grating and a four-color alarm light for safety protection. A display screen 14 is also installed on the outside of the enclosure 1 to display the acquired wafer parameters. In addition, a CCD monitor is installed inside the enclosure 1 to monitor the interior of the enclosure 1.
[0066] Those skilled in the art will readily understand that the above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.
Claims
1. A wafer transfer device for multiple sizes, characterized in that, The wafer transfer device includes a support assembly and a transfer assembly; The support assembly includes a housing, a support plate, a sliding plate, and a movable plate. The support plate is disposed on the outer wall of the housing, and the housing has an operating port. The sliding plate is slidably arranged on the support plate in a direction toward or away from the operating port. The movable plate is detachably mounted on the sliding plate. The sliding plate and the movable plate are used to support and position wafer cassettes of different sizes, respectively. The wafer transfer assembly includes a robotic arm and an edge finder. The edge finder is located inside the housing. The robotic arm is used to transfer wafers from the wafer cassette to the edge finder, transfer wafers from the edge finder to the inspection equipment, and transfer wafers from the inspection equipment to the corresponding wafer cassette. The edge finder is used to move the wafer in the X and Y directions after detecting the outline center of the wafer.
2. The wafer transfer device for multiple sizes according to claim 1, characterized in that, The slide plate is fitted with a plurality of spaced positioning pins, each of which is used to be inserted into a corresponding positioning hole on the movable plate or into a corresponding positioning hole on the slide plate corresponding to a wafer cassette.
3. A wafer transfer device for multiple sizes according to claim 2, characterized in that, The movable plate has multiple positioning blocks arranged at intervals, and the multiple positioning blocks are used to clamp and position the corresponding wafer cassettes on the movable plate.
4. A wafer transfer device for multiple sizes according to claim 1, characterized in that, The wafer transfer device further includes a barcode scanning component located inside the housing. The barcode scanning component includes a first scanning terminal, a first support, and a first linear module. The first linear module is located on the first support and is used to drive the first scanning terminal to move toward and away from the edge finder. The first scanning terminal is used to scan the first surface of the wafer on the edge finder.
5. A wafer transfer device for multiple sizes according to claim 4, characterized in that, The scanning component also includes a second scanning terminal, which is used to scan the second surface of the wafer on the robotic arm when transferring the wafer from the wafer cassette to the edge finder.
6. A wafer transfer device for multiple sizes according to claim 1, characterized in that, The wafer transfer device further includes an imaging component located inside the housing. The imaging component includes a second support, a second linear module, and a camera. The second linear module is located on the second support and is used to drive the camera head to move toward and away from the edge finder. The camera is used to take pictures of the chips on the wafers on the edge finder.
7. A wafer transfer device for multiple sizes according to claim 1, characterized in that, The number of the support plate, the slide plate, the movable plate, and the operating port are all two, and the two support plates are arranged in parallel and spaced apart.
8. A wafer transfer device for multiple sizes according to any one of claims 1-7, characterized in that, An outer cover is hinged to the outer wall of the housing. The outer cover is used to form a covering space with the movable plate. The covering space is used to accommodate the corresponding wafer cassette, and the covering space is connected to the operating port.
9. A wafer transfer device for multiple sizes according to any one of claims 1-7, characterized in that, The support plate is provided with a driving component, and the output end of the driving component is connected to the slide plate to drive the slide plate to slide.
10. A wafer transfer device for multiple sizes according to any one of claims 1-7, characterized in that, An air filtration unit is installed on the top of the enclosure, which is used to filter the air entering and exiting the enclosure.