Wafer jacking device

Abstract

The utility model provides a wafer jacking device which comprises a lead screw motor which comprises a motor body, a lead screw connected to the motor body and a stop piece in threaded fit with the lead screw. And the jacking assembly comprises a jacking structure connected to the stop piece, the jacking structure has a preset jacking height range, and the jacking structure moves up and down in the vertical direction. The screw rod motor converts rotation motion of the motor into linear motion, and the jacking structure is driven to move up and down through up-down movement of the stop piece, so that the jacking structure flexibly reaches the preset jacking height, and accurate adjustment of the jacking height is achieved; through cooperation of the lead screw motor and the jacking structure, the defects that in a traditional air cylinder jacking mode, the jacking height is fixed, and the multi-height requirement process cannot be met are overcome, and the problems that in an electric cylinder jacking mode, the cost of an electric cylinder is high, and the overall cost configuration of the jacking device is increased are solved.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment technology, and more particularly to a wafer lifting device. Background Technology

[0002] In semiconductor manufacturing processes, wafers are placed on electrostatic chucks and processed in a processing chamber. When wafer transfer is required, a lifting device lifts the wafer electrostatically attached to the chuck, separating it from the chuck. At this point, a transfer robot extends into the processing chamber, grips the wafer, and transfers it from the processing chamber to the next processing stage.

[0003] Currently, there are two main lifting methods: pneumatic cylinder lifting and electric cylinder lifting. Pneumatic cylinders are simple in structure and inexpensive, meeting the needs of most lifting scenarios and having a wide range of applications. However, pneumatic cylinder lifting also has certain limitations. For example, there is no acceleration process during lifting, and the instantaneous thrust is too large, which can easily cause wafer cracking damage. Additionally, the lifting height of a pneumatic cylinder is relatively fixed, which to some extent limits the flexibility of the lifting device in the processing technology. Electric cylinders, on the other hand, can precisely adjust the lifting height through an electronic control system, offering higher precision positioning compared to pneumatic cylinders. However, electric cylinders are relatively more expensive, which increases the overall configuration cost of the device.

[0004] In summary, how to provide a lifting device that combines the advantages of the two methods mentioned above is a technical problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0005] To address the technical problems existing in the prior art, this application provides a wafer lifting device that utilizes the cooperation of a lead screw motor and a lifting structure to enable the lifting structure to reach a preset lifting height, thereby achieving precise adjustment of the lifting height and overcoming the limitations of fixed lifting height of pneumatic cylinders and high cost of electric cylinders.

[0006] Based on this, the technical solution adopted in this application is:

[0007] A wafer lifting device, comprising:

[0008] A lead screw motor includes a motor body, a lead screw connected to the motor body, and a stop component that is threadedly engaged with the lead screw;

[0009] A lifting assembly includes a lifting structure connected to the stop member, wherein the lifting structure has a preset lifting height range and the lifting structure moves up and down in the vertical direction.

[0010] Preferably, the lifting structure includes an extension connection and a support portion, wherein one end of the extension connection is connected to the stop member and the other end is connected to the support portion.

[0011] Preferably, the supporting part includes a supporting surface and a pin assembly disposed on the supporting surface, the pin assembly including a pin and a cap disposed at the end of the pin away from the supporting surface.

[0012] Preferably, the lifting assembly further includes a connecting structure, which includes a first plate and a second plate that are vertically connected. The first plate is sleeved on the outer wall of the stop member through a connecting hole, and the end of the second plate away from the first plate is connected to the lifting structure.

[0013] Preferably, the wafer lifting device further includes:

[0014] The sliding assembly includes vertically arranged slide rails disposed on the outer wall of the motor body, and a slide table slidably connected to the slide rails, wherein the side of the slide table away from the slide rails is connected to the lifting assembly.

[0015] Preferably, the wafer lifting device further includes:

[0016] The mounting structure has one end connected to the side of the second plate near the lifting structure and is locked at the connection between the second plate and the lifting structure, and the other end connected to the slide table.

[0017] Preferably, the wafer lifting device further includes:

[0018] The limiting structure has one end connected to the side of the motor body where the lead screw is located, and the other end extending toward the surface where the slide rail is located to form a limiting part for blocking the slide table.

[0019] Preferably, the wafer lifting device further includes:

[0020] The detection component includes an origin sensor and a position sensor disposed on the side wall of the motor body, wherein the origin sensor is located below the position sensor along the height direction of the motor body.

[0021] Preferably, the detection component further includes a sensing element disposed on the side wall of the mounting structure for triggering the origin sensor and the positioning sensor.

[0022] According to the specific embodiments provided in this application, the following technical effects are disclosed:

[0023] This application provides a wafer lifting device, comprising: a lead screw motor, including a motor body, a lead screw connected to the motor body, and a stop component threadedly engaged with the lead screw; and a lifting assembly, including a lifting structure connected to the stop component, wherein the lifting structure has a preset lifting height range and moves vertically up and down. The lead screw motor converts the rotational motion of the motor into linear motion, and drives the lifting structure to move up and down through the up and down movement of the stop component, allowing the lifting structure to flexibly reach the preset lifting height, thus achieving precise adjustment of the lifting height. By utilizing the cooperation of the lead screw motor and the lifting structure, not only is the fixed lifting height of the traditional cylinder lifting method unable to meet the needs of processes requiring multiple heights overcome, but the high cost of the electric cylinder in the electric cylinder lifting method, which increases the overall cost of the lifting device, is also solved. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is one of the overall schematic diagrams of the wafer lifting device provided in the embodiments of this application;

[0026] Figure 2 This is the second overall schematic diagram of the wafer lifting device provided in the embodiments of this application;

[0027] Figure 3 This is a top view schematic diagram of the wafer lifting device provided in the embodiments of this application;

[0028] Figure 4 This is an exploded schematic diagram of the wafer lifting device provided in the embodiments of this application;

[0029] Figure 5 This is a schematic diagram of the lifting assembly provided in an embodiment of this application;

[0030] Figure 6 This is an installation diagram of the lead screw motor, sliding assembly, detection assembly, and limiting structure provided in the embodiments of this application;

[0031] Figure 7 This is an exploded view of the lead screw motor, sliding assembly, detection assembly, and limiting structure provided in the embodiments of this application.

[0032] Reference numerals: 10, Motor body; 11, Lead screw; 12, Stop; 20, Lifting structure; 30, Connecting structure; 40, Slide rail; 41, Slide table; 50, Mounting structure; 60, Limiting structure; 70, Origin sensor; 71, Position sensor; 72, Sensing element; 100, Motor; 110, Mounting base; 200, Extension connection part; 210, Bearing part; 300, Connecting hole; 600, Limiting part; 2100, Ejector pin; 2101, Protruding structure; 2110, Top cap; 2111, Hemispherical structure; 2120, Ejector pin seat; 2121, Ejector screw hole. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0034] As described in the background section, current lifting methods mainly include pneumatic cylinder lifting and electric cylinder lifting. Pneumatic cylinders are simple in structure and inexpensive, meeting the needs of most lifting scenarios and having a wide range of applications. However, pneumatic cylinder lifting also has certain limitations. For example, there is no acceleration process during cylinder lifting, and the instantaneous thrust is too large, which can easily cause wafer cracking damage. Additionally, the lifting height of a pneumatic cylinder is relatively fixed, which to some extent limits the flexibility of the lifting device in the processing technology. Electric cylinders, through an electronic control system, can precisely adjust the lifting height, offering higher precision positioning compared to pneumatic cylinders. However, electric cylinders are relatively more expensive, which increases the overall configuration cost of the device to some extent.

[0035] Based on this, this application provides a wafer lifting device, which aims to solve the technical problems of high cost and fixed lifting height of existing lifting devices.

[0036] refer to Figures 1 to 7 A wafer lifting device generally includes: a lead screw motor, as a driving component, connected to the lifting structure 20, used to synchronously drive the lifting structure 20 to move up and down using the stop member 12, so that the lifting structure reaches a preset lifting height; the lifting structure 20 includes a support part 210, on which a pin assembly is provided for lifting the wafer when the lifting structure 20 reaches the preset lifting height; a sliding assembly for allowing the lifting structure 20 to slide up and down along the outer wall surface of the lead screw motor; and a detection assembly for detecting the moving position of the lifting structure 20.

[0037] The wafer lifting device will be analyzed in detail below with reference to the accompanying drawings. Figures 1 to 7The wafer lifting device includes: a lead screw motor, including a motor body 10, a lead screw 11 connected to the motor body 10, and a stop 12 threadedly engaged with the lead screw 11; and a lifting assembly, including a lifting structure 20 connected to the stop 12, wherein the lifting structure 20 has a preset lifting height range and moves up and down in the vertical direction.

[0038] The principle of the lead screw motor is to convert the rotational motion of the motor into linear motion through the lead screw 11. When the motor rotates, the lead screw 11 connected to the motor output shaft also rotates. The lead screw 11 has a helical thread, and the stop 12 is a component that is threadedly engaged with the lead screw 11. When the motor rotates forward or reverse, the lead screw 11 will rotate in the first direction or the second direction, causing the stop 12 to move up or down along the axial direction of the lead screw 11, where the first direction and the second direction are opposite. In this way, by utilizing the cooperation of the lead screw motor and the lifting structure 20, the lifting structure 20 can move up and down with the stop 12, allowing the lifting structure 20 to flexibly reach the preset lifting height, realizing precise adjustment of the lifting height. It should be noted that the lifting structure 20 has a preset lifting height range, the minimum value of which is greater than zero, and the maximum value is less than the maximum length of the lead screw 11. On the other hand, the lead screw motor combines the advantages of pneumatic cylinders and electric cylinders. It not only makes up for the shortcomings of the traditional pneumatic cylinder lifting method, which has a fixed lifting height and cannot meet the process requirements of multiple heights, but also solves the problem of high cost of electric cylinders and increased overall cost of the lifting device in the electric cylinder lifting method.

[0039] In one specific embodiment, the stop 12 is a nut, which is initially rotatably mounted on the end of the lead screw 11.

[0040] Preferably, reference Figures 1 to 5 The lifting structure 20 includes an extension connection 200 and a support part 210. One end of the extension connection 200 is connected to the stop member 12, and the other end is connected to the support part 210.

[0041] In a specific embodiment, such as Figures 1 to 5 As shown, the relative positions of the lifting structure 20 and the lead screw motor were arranged by comprehensively considering the height of the mounting platform, the wafer picking height of the transfer robot, and the later stacking height of the wafers. The overall length direction of the lifting structure 20 is perpendicular to the axial direction of the lead screw 11. When the stop 12 moves up and down along the lead screw 11, the lifting structure 20 moves up and down synchronously with the stop 12 in the vertical direction of the lead screw 11. This makes full use of the vertical space and avoids occupying too much space in the axial direction of the lead screw 11, thereby saving space for module installation, improving space utilization, and enabling the wafer lifting device to achieve the lifting function in a limited space, meeting the requirements for compact equipment layout in application scenarios.

[0042] In a specific embodiment, such as Figures 1 to 5 As shown, the extension connection 200 is rectangular, and the support portion 210 is circular. The extension connection 200 is used to transmit the power applied by the motor body 10, so that the support portion 210 has sufficient power to lift the wafer adsorbed on the electrostatic chuck. In addition, a strip-shaped hollow structure is formed in the middle of the extension connection 200, and a circular hollow structure is formed in the middle of the support portion 210. In this way, while ensuring stable power transmission, some unnecessary solid materials are removed to form a hollow structure, thereby reducing the overall weight of the lifting structure 20. This not only reduces the energy consumption required by the screw motor to drive the lifting structure 20 to move, but also reduces the adverse effects of the excessive weight of the lifting structure 20 on the lifting accuracy and stability, making the lifting structure 20 move more easily and flexibly.

[0043] Preferably, reference Figures 1 to 5 The support portion 210 includes a support surface and a pin assembly disposed on the support surface. The pin assembly includes a pin 2100 and a cap 2110 disposed at the end of the pin 2100 away from the support surface.

[0044] In a specific embodiment, such as Figures 1 to 5 As shown, the ejector pin 2100 has a preset length and extends in a direction perpendicular to the bearing surface. The bearing portion 210 is located below the wafer and moves toward the wafer. When the bearing portion 210 reaches the preset lifting height, the ejector pin 2100 contacts the wafer through the top cap 2110 to separate the wafer from the electrostatic chuck.

[0045] In a specific embodiment, such as Figure 4 As shown, the end of the ejector pin 2100 away from the bearing surface has a protruding structure 2101, and the interior of the top cap 2110 has a recessed structure (not shown in the figure). The protruding structure 2101 and the recessed structure engage to mount the top cap 2110 onto the ejector pin 2100. The top of the top cap 2110 also has a hemispherical structure 2111 to reduce the contact area when it comes into contact with the wafer and avoid damage to the wafer.

[0046] In a specific embodiment, such as Figures 1 to 5 As shown, there are three ejector pins 2100, which are arranged around the circular hollow structure of the support part 210. The projection line of the three ejector pins 2100 on the support surface forms an equilateral triangle to improve the support stability when the wafer is pressed and lifted.

[0047] In a specific embodiment, such as Figures 1 to 5 As shown, the ejector assembly also includes an ejector seat 2120 and an ejector screw hole 2121 thereon. The ejector pin 2100 is mounted on the ejector seat 2120. The ejector pin 2100 is disassembled or installed by inserting a needle into and pressing against the ejector screw hole 2121.

[0048] Preferably, reference Figures 1 to 5 The lifting assembly also includes a connecting structure 30, one end of which is fitted onto the outer wall of the stop member 12 through a connecting hole 300, and the other end is connected to the extension connecting part 200.

[0049] In a specific embodiment, such as Figures 1 to 5 As shown, the connecting structure 30 is formed by a horizontal first plate and a vertical second plate connected vertically. The first plate has a connecting hole 300 and fits against the top surface of the motor body 10. The second plate fits against the front wall of the motor body 10. This allows the connecting structure 30 to perfectly fit the shape of the motor body 10, avoiding the waste of space in the lower part of the lifting structure 20 caused by the direct connection between the lead screw 11 and the lifting structure 20, and improving the space utilization rate inside the wafer lifting device.

[0050] Preferably, reference Figures 1 to 7 The wafer lifting device also includes a sliding assembly, including a slide rail 40 arranged vertically on the outer wall of the motor body 10, and a slide table 41 slidably connected to the slide rail 40, with the side of the slide table 41 away from the slide rail 40 connected to the lifting assembly.

[0051] In one specific embodiment, sub-connecting structures extend from both ends of the second plate of the connecting structure 30, and the slide table 41 is connected to the sub-connecting structures. Thus, during device operation, the connecting structure 30 can both move the lifting structure 20 up and down along the lead screw 11 with the aid of the stop member 12, and slide smoothly along the slide rail 40 via the slide table 41. Although the lifting structure 20 has already achieved precise movement in coordination with the connecting structure 30 and the lead screw motor, the addition of the sliding component further ensures the stability of the movement of the lifting structure 20, ensuring the accuracy and reliability of the lifting action.

[0052] In a specific embodiment, such as Figure 1 , Figure 4 and Figure 6 As shown, there are two slide rails 40, which are symmetrically arranged on both sides of the outer wall of the motor body 10 to improve the balance of the lifting structure 20 when it slides.

[0053] Preferably, reference Figures 1 to 5 The wafer lifting device also includes: a mounting structure 50, one end of which is connected to the side of the connecting structure 30 near the extension connecting part 200 and is locked at the connection between the connecting structure 30 and the extension connecting part 200, and the other end is connected to the slide table 41.

[0054] In a specific embodiment, such as Figures 1 to 5As shown, the mounting structure 50 is a cuboid plate with a middle end and a first end and a second end opposite to the middle end. The middle end is connected to the second plate of the connecting structure 30. The first end and the second end are respectively connected to the slides 41 located on both sides of the outer wall of the motor body 10. The mounting structure 50 is also fixed to the connection between the second plate of the connecting structure 30 and the extension connection 200 by bolts. In this way, the mounting structure 50 not only ensures that the connecting structure 30 can move smoothly along the slide rail 40, but also enhances the connection strength between the connecting structure 30 and the extension connection 200, and improves the stability of the screw motor transmission process.

[0055] Preferably, reference Figures 1 to 7 The wafer lifting device also includes a limiting structure 60, one end of which is connected to the side of the motor body 10 where the lead screw 11 is connected, and the other end extends toward the surface of the slide rail 40 to form a limiting part 600 for blocking the slide table 41.

[0056] In a specific embodiment, such as Figure 1 and Figure 6 As shown, the limiting structure 60 is arranged in the direction close to the slide rail 40 so that the extended limiting part 600 abuts against the top of the slide rail 40. In this way, when the slide table 41 moves on the slide rail 40, the limiting part 600 effectively prevents the slide table 41 from running out of the maximum sliding range of the slide rail 40, thereby improving the reliability and safety of the wafer lifting device.

[0057] Preferably, reference Figures 1 to 7 The wafer lifting device also includes a detection component, including an origin sensor 70 and a position sensor 71 disposed on the side wall of the motor body 10, wherein the origin sensor 70 is located below the position sensor 71 along the height direction of the motor body 10; the detection component also includes a sensing element 72 disposed on the side wall of the mounting structure 50 for triggering the origin sensor 70 and the position sensor 71.

[0058] The inclusion of the origin sensor 70 and the position sensor 71 ensures that the starting and ending positions can be accurately sensed during the rising and falling of the lifting structure 20, thereby achieving precise control and detection of the lifting height and improving the automation level of the lifting process.

[0059] In one specific embodiment, both the origin sensor 70 and the position sensor 71 are laser sensors. The laser sensors have light paths. When the sensing element 72 moves between the laser sensors and cuts off the light path, the laser sensors are triggered.

[0060] In an optional embodiment, refer to Figure 4 and Figure 7The motor body 10 consists of a motor 100 and a mounting base 110. The mounting base 110 is sleeved on the motor 100. The sliding component, the limiting structure 60 and the detection component in the above embodiment can all be installed on the mounting base 110 so as to facilitate the quick disassembly and installation of the motor 100.

[0061] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0062] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0063] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A wafer lift device, comprising: The wafer lifting device includes: The lead screw motor includes a motor body (10), a lead screw (11) connected to the motor body (10), and a stop (12) threadedly engaged with the lead screw (11). The lifting assembly includes a lifting structure (20) connected to the stop (12), wherein the lifting structure (20) has a preset lifting height range, the lifting structure (20) moves up and down in the vertical direction, and the lifting structure (20) includes an extension connection (200) and a support part (210) connected to each other. The connecting structure (30) includes a first plate and a second plate that are vertically connected. The first plate is sleeved on the outer wall of the stop (12) through a connecting hole (300). The end of the second plate away from the first plate is connected to the extension connecting part (200). The first plate is attached to the top surface of the motor body (10), and the second plate is attached to the front wall of the motor body (10).

2. The wafer lift device of claim 1, wherein The wafer lifting device also includes: The sliding assembly includes a slide rail (40) arranged vertically on the outer wall of the motor body (10), and a slide table (41) slidably connected to the slide rail (40). The side of the slide table (41) away from the slide rail (40) is connected to the lifting assembly.

3. The wafer lift device of claim 2, wherein The wafer lifting device also includes: The mounting structure (50) has one end connected to the side of the second plate near the lifting structure (20) and is locked at the connection between the second plate and the lifting structure (20), and the other end connected to the slide (41).

4. The wafer lift device of claim 3, wherein The wafer lifting device also includes: The limiting structure (60) has one end connected to the side of the motor body (10) where the lead screw (11) is located, and the other end extends toward the side where the slide rail (40) is located to form a limiting part (600) for blocking the slide table (41).

5. The wafer lift device of claim 3, wherein The wafer lifting device also includes: The detection component includes an origin sensor (70) and a position sensor (71) disposed on the side wall of the motor body (10), wherein the origin sensor (70) is located below the position sensor (71) along the height direction of the motor body (10).

6. The wafer lift device of claim 5, wherein The detection component also includes a sensor (72) disposed on the side wall of the mounting structure (50) for triggering the origin sensor (70) and the position sensor (71).

7. The wafer lift device of claim 1, wherein The support portion (210) includes a support surface and a pin assembly disposed on the support surface. The pin assembly includes a pin (2100) and a cap (2110) disposed at the end of the pin (2100) away from the support surface.

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