Flexible anti-bending Schottky diode

Abstract

The utility model discloses a flexible anti-bending Schottky diode, which comprises an SBD chip, a packaging substrate, a pin positioning frame, a flexible anti-bending tube, a first pin and a second pin, the pin positioning frame comprises a connecting plate, a first positioning sleeve and a second positioning sleeve, the connecting plate is embedded in the bottom of the packaging substrate, the first positioning sleeve is embedded in the first positioning sleeve, and the second positioning sleeve is embedded in the second positioning sleeve. The first positioning sleeve and the second positioning sleeve are arranged at the two ends of the connecting plate and extend downwards from the packaging base body to the position below the packaging base body, one end of the first pin is connected with the positive electrode of the SBD chip, the other end of the first pin penetrates through the first positioning sleeve and then extends downwards, one end of the second pin is connected with the negative electrode of the SBD chip, and the other end of the second pin penetrates through the second positioning sleeve. One end of the pin positioning frame extends downwards after penetrating through the first positioning sleeve, the other end of the pin positioning frame extends downwards after penetrating through the second positioning sleeve, the flexible anti-bending pipe is arranged at the bottoms of the first positioning sleeve and the second positioning sleeve, anti-bending protection of the first pin and the second pin is carried out, the stability of the first pin and the second pin in the packaging base body injection molding process is improved, and the first pin and the second pin are prevented from being broken from the pin positioning frame in the bending process.

Description

Technical Field

[0001] This utility model relates to the field of Schottky diodes, and more particularly to a flexible, bend-resistant Schottky diode. Background Technology

[0002] In the production process of Schottky diodes, ceramic or plastic materials are required for the insulating encapsulation and protection of the chip. To reduce the production cost of Schottky diodes, insulating plastic is typically used for injection molding of the SBD chip, as injection molding offers high production efficiency.

[0003] After injection molding, the Schottky diode needs to expose its leads. Because the leads are relatively small, the injection molding impact can easily cause deformation of the leads during the packaging process.

[0004] Furthermore, during the use of Schottky diodes, the exposed leads need to be bent to facilitate soldering onto the circuit board. Since the leads are in rigid contact with the package structure, improper bending can easily cause breakage at the point where the leads exit the package structure, rendering the Schottky diode unusable. Therefore, improvements are needed. Utility Model Content

[0005] The purpose of this invention is to provide a flexible, bend-resistant Schottky diode that improves the stability of the leads during the packaging process and reduces the risk of breakage of the leads at the point of exit from the packaging structure during bending.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] A flexible, bend-resistant Schottky diode includes: an SBD chip, a package substrate, a pin positioning frame, a flexible bend-resistant tube, a first pin, and a second pin. The SBD chip is disposed in the package substrate. The pin positioning frame includes a connecting plate, a first positioning sleeve, and a second positioning sleeve. The connecting plate is embedded in the bottom of the package substrate. The first and second positioning sleeves are disposed at both ends of the connecting plate and extend downward from the package substrate to below the package substrate. One end of the first pin is connected to the positive terminal of the SBD chip, and the other end extends downward through the first positioning sleeve. One end of the second pin is connected to the negative terminal of the SBD chip, and the other end extends downward through the second positioning sleeve. The flexible bend-resistant tube is disposed at the bottom of the first and second positioning sleeves to provide bend-resistant protection for the first and second pins.

[0008] The first and second positioning sleeves have annular grooves recessed at the bottom of their outer circles, and the flexible anti-bending tube has a rib at its top that engages with the annular grooves.

[0009] The flexible anti-bending tube and the rib adopt an integrated flexible insulating plastic structure.

[0010] The positive electrode of the SBD chip is provided with a first conductive adhesive layer that is connected to the end of the first pin.

[0011] The negative electrode of the SBD chip is provided with a second conductive adhesive layer that is connected to the end of the second pin.

[0012] The connecting plate, the first positioning sleeve, and the second positioning sleeve are made of an integrated rigid insulating plastic structure.

[0013] The first positioning sleeve is provided with a first socket corresponding to the first pin, and the second positioning sleeve is provided with a second socket corresponding to the second pin.

[0014] The beneficial effects of this utility model are as follows: A flexible, bend-resistant Schottky diode uses a pin positioning bracket to position the first and second pins in the package substrate, improving the stability of the first and second pins during the injection molding process of the package substrate. It also uses a flexible bend-resistant tube to provide flexible bend protection for the first and second pins, reducing the problem of breakage of the first and second pins from the pin positioning bracket during bending. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of this utility model;

[0016] Figure 2 yes Figure 1 A schematic diagram of the structure of the flexible anti-bending tube after disassembly (the lower parts of the first and second pins are broken off). Detailed Implementation

[0017] The following is combined with Figures 1 to 2 The technical solution of this utility model will be further illustrated through specific embodiments.

[0018] like Figure 1 The flexible, bend-resistant Schottky diode shown includes: an SBD chip 2, a package substrate 1, a pin positioning frame 4, a flexible bend-resistant tube 6, a first pin 7, and a second pin 8. The SBD chip 2 is disposed in the package substrate 1, and the package substrate 1 encapsulates and protects the SBD chip 2 by injection molding.

[0019] The pin positioning frame 4 includes a connecting plate 43, a first positioning sleeve 41 and a second positioning sleeve 42. The connecting plate 43 is embedded in the bottom of the packaging substrate 1, and the connection and fixation with the connecting plate 43 are achieved by injection molding of the packaging substrate 1.

[0020] The first positioning sleeve 41 and the second positioning sleeve 42 are disposed at both ends of the connecting plate 43 and extend downward from the encapsulation substrate 1 to below the encapsulation substrate 1, resulting in a stable structure. In this embodiment, the connecting plate 43, the first positioning sleeve 41, and the second positioning sleeve 42 adopt an integrated rigid insulating plastic structure, which can be placed in the injection mold of the encapsulation substrate 1, providing good impact resistance and preventing deformation.

[0021] In this embodiment, one end of the first pin 7 is connected to the positive electrode of the SBD chip 2, and the other end extends downward through the first positioning sleeve 41. A first conductive adhesive layer 3 is provided on the positive electrode of the SBD chip 2, which is connected to the end of the first pin 7, resulting in a stable connection structure. The first positioning sleeve 41 is provided with a first insertion hole 45 corresponding to the first pin 7, which facilitates the insertion and positioning of the first pin 7 and improves the stability of the first pin 7 during the injection molding process of the packaging substrate 1.

[0022] One end of the second pin 8 is connected to the negative terminal of the SBD chip 2, and the other end extends downward after passing through the second positioning sleeve 42. A second conductive adhesive layer 5 is provided on the negative terminal of the SBD chip 2, which is connected to the end of the second pin 8, facilitating assembly. The second positioning sleeve 42 is provided with a second insertion hole 44 corresponding to the second pin 8, which facilitates the insertion and positioning of the second pin 8 and improves the stability of the second pin 8 during the injection molding process of the packaging substrate 1.

[0023] The flexible anti-bending tube 6 is placed at the bottom of the first positioning sleeve 41 and the second positioning sleeve 42 to provide anti-bending protection for the first pin 7 and the second pin 8, such as... Figure 1 As shown, the first pin 7 and the second pin 8 extend downwards after passing through the flexible bending tube 6.

[0024] like Figure 2 As shown, the bottom of the outer circumference of the first positioning sleeve 41 and the second positioning sleeve 42 is recessed with an annular groove 46, and the top of the flexible anti-bending tube 6 is provided with a protruding rib 61 that engages with the annular groove 46, facilitating the installation and removal of the flexible anti-bending tube 6. In this embodiment, the flexible anti-bending tube 6 and the protruding rib 61 adopt an integrated flexible insulating plastic structure to provide flexible anti-bending protection for the first pin 7 and the second pin 8, reducing the problem of breakage of the first pin 7 and the second pin 8 from the first positioning sleeve 41 and the second positioning sleeve 42 during bending. The breakage point is preferably located below the flexible anti-bending tube 6, so that the flexible anti-bending tube 6 can be removed and the tube can still be used, avoiding the scrapping of the Schottky diode due to bending.

[0025] The above description is only a preferred embodiment of this utility model. For those skilled in the art, there will be changes in the specific implementation method and application scope based on the idea of ​​this utility model. The content of this specification should not be construed as a limitation of this utility model.

Claims

1. A flexible, bend-resistant Schottky diode, characterized in that, include: The package includes an SBD chip, a package substrate, a pin positioning frame, a flexible anti-bending tube, a first pin, and a second pin. The SBD chip is disposed in the package substrate. The pin positioning frame includes a connecting plate, a first positioning sleeve, and a second positioning sleeve. The connecting plate is embedded in the bottom of the package substrate. The first and second positioning sleeves are located at both ends of the connecting plate and extend downward from the package substrate to below the package substrate. One end of the first pin is connected to the positive terminal of the SBD chip, and the other end extends downward through the first positioning sleeve. One end of the second pin is connected to the negative terminal of the SBD chip, and the other end extends downward through the second positioning sleeve. The flexible anti-bending tube is located at the bottom of the first and second positioning sleeves to provide anti-bending protection for the first and second pins.

2. The flexible, bend-resistant Schottky diode according to claim 1, characterized in that, The bottom of the outer circle of the first and second positioning sleeves is provided with an annular groove, and the top of the flexible anti-bending tube is provided with a rib that can be inserted into the annular groove.

3. The flexible, bend-resistant Schottky diode according to claim 2, characterized in that, The flexible anti-bending tube and the rib adopt an integrated flexible insulating plastic structure.

4. The flexible, bend-resistant Schottky diode according to claim 1, characterized in that, The positive electrode of the SBD chip is provided with a first conductive adhesive layer that is connected to the end of the first pin.

5. The flexible, bend-resistant Schottky diode according to claim 1, characterized in that, The negative electrode of the SBD chip is provided with a second conductive adhesive layer that is connected to the end of the second pin.

6. The flexible, bend-resistant Schottky diode according to claim 1, characterized in that, The connecting plate, the first positioning sleeve, and the second positioning sleeve adopt an integrated rigid insulating plastic structure.

7. The flexible, bend-resistant Schottky diode according to claim 1, characterized in that, The first positioning sleeve is provided with a first socket corresponding to the first pin, and the second positioning sleeve is provided with a second socket corresponding to the second pin.

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