Pin bending device with stable structure for processing MOS (Metal Oxide Semiconductor) tube

Abstract

The utility model relates to the technical field of MOS (Metal Oxide Semiconductor) tube processing, in particular to a pin bending device with a stable structure for MOS tube processing, and solves the problem that the bending quality is reduced due to the fact that an MOS tube is easy to shake left and right when being subjected to a pin bending force in the prior art. A pin bending device with a stable structure for MOS tube processing comprises a bending box, a containing cavity is formed in the top of the bending box, a fixing assembly is arranged in the containing cavity, and the fixing assembly comprises a limiting sliding groove, a bidirectional lead screw, a movable sliding groove, a limiting sliding block, a fixing plate, a supporting sliding block, a buffering pad, a transmission disc and a handle. The limiting sliding groove is formed in the inner wall of the bottom of the containing cavity, and the two-way lead screw is rotationally connected into the limiting sliding groove. The two-way lead screw rotates to drive the fixing plates and the buffering pads on the two sides to clamp and fix the MOS tube in the middle, the safety and stability of placement of the MOS tube can be effectively improved, and the MOS tube is prevented from deviating in the bending operation process.

Description

Technical Field

[0001] This utility model relates to the field of MOS transistor processing technology, and in particular to a pin bending device for processing MOS transistors with a stable structure. Background Technology

[0002] A MOSFET, or metal-oxide-semiconductor field-effect transistor, is a commonly used semiconductor device that uses a structure composed of metal, oxide, and semiconductor materials to control the flow of current. During manufacturing, bending the leads allows the MOSFET to fit more tightly onto the circuit board, reducing its footprint and facilitating assembly processes such as soldering. This ensures reliable electrical connections between the MOSFET and other components on the circuit board, thereby guaranteeing the normal operation of the entire electronic device.

[0003] Chinese Patent Publication No. CN216065300U discloses a MOSFET pin bending device, comprising a fixing block and a clamping plate. A bending disc is fixedly mounted on the front surface of the fixing block, and the upper surface of the bending disc is printed with graduations. Rubber pads are adhered to the lower surfaces of both the fixing block and the bending disc. A fixing plate is movably mounted on the lower surface of the clamping plate, and a connecting post is fixedly mounted on the upper surface of the clamping plate. A column is fixedly mounted on the upper end of the connecting post, and a limit block is fixedly mounted on the upper end of the column. A bending rod is movably connected to the outer surface of the column. This utility model improves the precision of the bending device, allowing direct control of the bending angle through precise graduations, making it more accurate and avoiding subsequent use issues caused by precision problems. It also improves the fixing effect of the bending device, enabling effective and rapid fixing of MOSFETs, avoiding cumbersome fixing steps that affect the user experience, and is therefore practical.

[0004] While existing devices can directly control the bending angle through precise scales, making them more accurate, they mainly rely on a spring and a fixing plate to apply downward pressure to the MOSFET during the fixing process. This causes the MOSFET to easily slide to the left or right when subjected to bending force, resulting in a decrease in the bending quality of the pins. Utility Model Content

[0005] The purpose of this invention is to provide a pin bending device for processing MOS transistors with a stable structure, which solves the problem in the prior art that MOS transistors are prone to swaying left and right when subjected to pin bending force, resulting in a reduction in bending quality.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A pin bending device for processing MOS transistors with a stable structure includes a bending box. A placement cavity is formed at the top of the bending box. A fixing assembly is disposed inside the placement cavity. The fixing assembly includes a limiting slide groove, a bidirectional lead screw, a movable slide groove, a limiting slider, a fixing plate, a supporting slider, a buffer pad, a transmission disk, and a handle. The limiting slide groove is formed on the bottom inner wall of the placement cavity. The bidirectional lead screw is rotatably connected to the inside of the limiting slide groove. The movable slide grooves are symmetrically distributed on the bottom inner wall of the placement cavity. The limiting sliders are symmetrically distributed and slidably connected to the inside of the limiting slide groove. The fixing plate is fixedly connected to the top of the limiting slider. The supporting sliders are symmetrically distributed and fixedly connected to the bottom of the fixing plate. The buffer pad is fixedly connected to one side of the fixing plates opposite each other. The transmission disk is rotatably connected to the right side of the bending box. The handle is rotatably connected to the end of the transmission disk away from the bending box.

[0008] Preferably, the inner wall of the rear part of the placement cavity is provided with a placement groove, and the rear end of the bending box is fixedly connected to a placement platform, and the top of the placement platform is provided with a bending groove.

[0009] Preferably, the top of the bending box is provided with a bending assembly, which includes a support rod, a support plate, a rubber pad, a helical spring, a rotating cover, and a bending rod. The support rod is movably installed on the top of the bending box and extends through the interior of the placement slot. The support plate is fixedly connected to the lower end of the support rod.

[0010] Preferably, the rubber pad is fixedly connected to the lower end of the support plate, the helical spring is sleeved on the outside of the support rod, the rotating cover is rotatably connected to the top of the support rod, and the bending rod is fixedly installed at the lower end of the rotating cover.

[0011] Preferably, the inside of the bending groove is provided with a scale, a rubber pad one is fixedly installed at the bottom of the bending box, and a rubber pad two is fixedly connected to the bottom of the placement platform.

[0012] Preferably, the limiting slider is adapted to the limiting slide groove and is threadedly connected to the bidirectional lead screw, and the supporting slider is adapted to the moving slide groove.

[0013] This utility model has the following beneficial effects:

[0014] This invention uses the rotation of a bidirectional lead screw to clamp and fix the MOS transistor in the middle by the fixing plates and buffer pads on both sides, which can effectively improve the safety and stability of the MOS transistor placement and prevent the MOS transistor from shifting during the bending process.

[0015] This invention allows the support plate and rubber pad to descend by lowering the support rod, thereby pressing and fixing the pins. Then, rotating the rotating cover allows the bending rod to bend the MOSFET pins, effectively improving the convenience and safety of bending the MOSFET pins. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the overall three-dimensional front view structure of this utility model;

[0018] Figure 2 This is a side-view perspective structural diagram of the bending box component of this utility model.

[0019] Figure 3 This is a three-dimensional structural diagram of a partial component of the fixing assembly of this utility model;

[0020] Figure 4 This is a schematic diagram of the overall three-dimensional side view of the present invention;

[0021] Figure 5 This is an exploded three-dimensional structural diagram of a partial component of the bending assembly of this utility model.

[0022] In the diagram: 1. Bending box; 2. Placement cavity; 3. Fixing component; 4. Placement slot; 5. Placement platform; 6. Bending slot; 7. Bending component; 8. Scale; 9. Rubber pad one; 10. Rubber pad two; 301. Limiting slide; 302. Two-way lead screw; 303. Moving slide; 304. Limiting slider; 305. Fixing plate; 306. Support slider; 307. Buffer pad; 308. Transmission plate; 309. Handle; 701. Support rod; 702. Support plate; 703. Rubber pad three; 704. Helical spring; 705. Rotating cover; 706. Bending rod. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0024] Reference Figure 1-5A pin bending device for processing MOS transistors with a stable structure includes a bending box 1. The top of the bending box 1 has a placement cavity 2. Inside the placement cavity 2 is a fixing assembly 3. The fixing assembly 3 includes a limiting slide groove 301, a bidirectional lead screw 302, a moving slide groove 303, a limiting slider 304, a fixing plate 305, a supporting slider 306, a buffer pad 307, a transmission disk 308, and a handle 309. The limiting slide groove 301 is formed on the bottom inner wall of the placement cavity 2. The bidirectional lead screw 302 is rotatably connected to the limiting slide groove 301. Inside, the movable slide grooves 303 are symmetrically distributed and opened on the bottom inner wall of the placement cavity 2. The limiting sliders 304 are symmetrically distributed and slidably connected inside the limiting slide grooves 301. The fixing plate 305 is fixedly connected to the top of the limiting sliders 304. The supporting sliders 306 are symmetrically distributed and fixedly connected to the bottom of the fixing plate 305. The buffer pads 307 are fixedly connected to the opposite side between the fixing plates 305. The transmission disc 308 is rotatably connected to the right side of the bending box 1. The handle 309 is rotatably connected to the end of the transmission disc 308 away from the bending box 1.

[0025] The buffer pad 307 has an inclined surface on the opposite side to accommodate MOSFETs of different heights. One end of the bidirectional lead screw 302 passes through the limiting slide groove 301 and is fixedly connected to the transmission disk 308. The installation of the buffer pad 307 not only increases the friction with the MOSFET, but also protects the MOSFET. The setting of the fixing component 3 allows the handle 309 to rotate by shaking it, which in turn rotates the transmission disk 308. The rotation of the transmission disk 308 drives the bidirectional lead screw 302 to rotate. Since the limiting slider 304 is matched with the limiting slide groove 301 and the limiting slider 304 is threadedly connected to the bidirectional lead screw 302, the limiting sliders 304 on both sides can move relative to each other. Then, the limiting sliders 304 drive the fixing plate 305 and the buffer pad 307 to clamp and fix the MOSFET located inside the placement cavity 2. This invention utilizes the rotation of the bidirectional lead screw 302 to drive the fixing plates 305 and buffer pads 307 on both sides to clamp and fix the MOS transistor in the middle, which can effectively improve the safety and stability of the MOS transistor placement and prevent the MOS transistor from shifting during the bending process.

[0026] Furthermore, a placement groove 4 is provided on the inner wall of the rear part of the placement cavity 2, and a placement platform 5 is fixedly connected to the rear end of the bending box 1. A bending groove 6 is provided on the top of the placement platform 5.

[0027] The pins of the MOSFET can be inserted into the bending groove 6 through the placement groove 4.

[0028] Furthermore, a bending assembly 7 is provided on the top of the bending box 1. The bending assembly 7 includes a support rod 701, a support plate 702, a rubber pad 703, a coil spring 704, a rotating cover 705, and a bending rod 706. The support rod 701 is movably installed on the top of the bending box 1 and extends through the interior of the placement slot 4. The support plate 702 is fixedly connected to the lower end of the support rod 701.

[0029] Rubber pad 703 is fixedly connected to the lower end of support plate 702, helical spring 704 is sleeved on the outside of support rod 701, rotating cover 705 is rotatably connected to the top of support rod 701, and bending rod 706 is fixedly installed at the lower end of rotating cover 705.

[0030] The lower end of the helical spring 704 is fixedly connected to the top of the bending box 1. The support plate 702 and the rubber pad 703 are located inside the placement slot 4. The bending assembly 7 is set up so that pressing the rotating cover 705 will drive the support plate 702 and the bending rod 706 to descend respectively. During the descent, the support plate 702 can simultaneously drive the rubber pad 703 to fix the pins of the MOSFET. After the bending rod 706 descends, it can position one side of the pins of the MOSFET. Then, rotating the rotating cover 705 will drive the bending rod 706 to rotate, thereby bending the pins of the MOSFET. After that, the rotating cover 705 is released, and the spring force of the helical spring 704 will drive the rotating cover 705 to rise. Then, the operator can rotate the rotating cover 705 to a certain angle and press it again to bend the other pins of the MOSFET. In this invention, the support rod 701 lowers, which in turn lowers the support plate 702 and the rubber pad 703, thereby pressing and fixing the pin. Then, by rotating the rotating cover 705, the MOSFET pin can be bent by the bending rod 706, which effectively improves the convenience and safety of bending the MOSFET pin.

[0031] Furthermore, the inside of the bending groove 6 is provided with a scale 8, the bottom of the bending box 1 is fixedly installed with a rubber pad 9, and the bottom of the placement platform 5 is fixedly connected with a rubber pad 10.

[0032] The setting of scale 8 makes it convenient for staff to observe the bending angle of the MOS tube pins. The installation of rubber pad 9 and rubber pad 10 can increase the friction between the device and the placement surface, thereby improving the safety and stability of the placement.

[0033] Furthermore, the limiting slider 304 is adapted to the limiting slide groove 301 and is threadedly connected to the bidirectional lead screw 302, and the supporting slider 306 is adapted to the moving slide groove 303.

[0034] In summary:

[0035] In use, the MOS transistor to be processed is first placed in the middle of the placement cavity 2, and the pins of the MOS transistor pass through the placement groove 4 and enter the bending groove 6.

[0036] Then, by cranking the handle 309, the handle 309 drives the transmission plate 308 to rotate. At the same time, the rotation of the transmission plate 308 drives the bidirectional lead screw 302 to rotate. Then, due to the matching of the limiting slider 304 and the limiting groove 301, and the threaded connection between the limiting slider 304 and the bidirectional lead screw 302, the limiting sliders 304 on both sides can be driven to move relative to each other. Then, the limiting sliders 304 drive the fixing plate 305 and the buffer pad 307 to clamp and fix the MOS tube located inside the placement cavity 2.

[0037] Next, by pressing the rotating cover 705, the support plate 702 and the bending rod 706 are lowered respectively. During the descent, the support plate 702 can simultaneously drive the rubber pad 703 to fix the pins of the MOSFET. After the bending rod 706 is lowered, it can position one side of the pins of the MOSFET. Then, the rotating cover 705 is rotated, which causes the bending rod 706 to rotate, thereby bending the pins of the MOSFET. After that, the rotating cover 705 is released, and the rotation spring 704 causes the rotating cover 705 to rise. Then, the operator rotates the rotating cover 705 to a certain angle and presses it again to bend the other pins of the MOSFET.

[0038] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A pin bending device for MOS transistor processing with a stable structure, comprising a bending box (1), characterized in that, The top of the bending box (1) has a placement cavity (2), and a fixing assembly (3) is provided inside the placement cavity (2). The fixing assembly (3) includes a limiting slide groove (301), a bidirectional lead screw (302), a moving slide groove (303), a limiting slider (304), a fixing plate (305), a supporting slider (306), a buffer pad (307), a transmission disc (308), and a handle (309). The limiting slide groove (301) is located on the bottom inner wall of the placement cavity (2). The bidirectional lead screw (302) is rotatably connected to the inside of the limiting slide groove (301). The moving slide groove (303) The limiting sliders (304) are symmetrically distributed and slidably connected inside the limiting groove (301). The fixing plate (305) is fixedly connected to the top of the limiting slider (304). The supporting sliders (306) are symmetrically distributed and fixedly connected to the bottom of the fixing plate (305). The buffer pad (307) is fixedly connected to the opposite side between the fixing plates (305). The transmission disc (308) is rotatably connected to the right side of the bending box (1). The handle (309) is rotatably connected to the end of the transmission disc (308) away from the bending box (1).

2. The pin bending device for MOS tube processing with stable structure according to claim 1, characterized in that, The inner wall of the rear part of the placement cavity (2) is provided with a placement groove (4), and the rear end of the bending box (1) is fixedly connected to a placement platform (5), and the top of the placement platform (5) is provided with a bending groove (6).

3. The pin bending device for processing a MOS transistor with a stable structure according to claim 2, characterized in that, The top of the bending box (1) is provided with a bending assembly (7), which includes a support rod (701), a support plate (702), a rubber pad (703), a spiral spring (704), a rotating cover (705), and a bending rod (706). The support rod (701) is movably installed on the top of the bending box (1) and extends through the interior of the placement slot (4). The support plate (702) is fixedly connected to the lower end of the support rod (701).

4. The pin bending device for processing a MOS transistor with a stable structure according to claim 3, characterized in that, The rubber pad (703) is fixedly connected to the lower end of the support plate (702), the helical spring (704) is sleeved on the outside of the support rod (701), the rotating cover (705) is rotatably connected to the top of the support rod (701), and the bending rod (706) is fixedly installed on the lower end of the rotating cover (705).

5. The pin bending device for processing a MOS transistor with a stable structure according to claim 2, characterized in that, The bending groove (6) has a scale (8) inside, the bottom of the bending box (1) is fixedly installed with a rubber pad (9), and the bottom of the placement platform (5) is fixedly connected with a rubber pad (10).

6. The pin bending device for processing a MOS transistor with a stable structure according to claim 1, characterized in that, The limiting slider (304) is adapted to the limiting slide groove (301) and is threadedly connected to the bidirectional lead screw (302). The supporting slider (306) is adapted to the moving slide groove (303).

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