Hardware machining jig structure

Abstract

The utility model discloses a hardware machining jig structure. The hardware machining jig structure comprises a base, a base, an upper buffering cushion, a lower buffering cushion and a heat dissipation assembly. The upper buffer cushion is arranged at the lower end of the base, the base is provided with a groove, the lower buffer cushion is arranged at the upper end of the base, and the upper buffer cushion is connected with the contact; the heat dissipation assembly comprises a heat dissipation pipe, a liquid conveying device and a liquid storage tank, the heat dissipation pipe is of a coiled pipe structure, the heat dissipation pipe is arranged between the upper buffering cushion and the lower buffering cushion, the heat dissipation pipe is provided with a heat dissipation channel with a water inlet and a water outlet, and the liquid conveying device and the liquid storage tank are connected to the water inlet and the water outlet respectively; thus, through the design of all the parts, the radiating pipe is arranged between the upper buffering cushion and the lower buffering cushion, so that the influences such as vibration generated by the radiating pipe during workpiece machining are reduced, the use stability of the radiating pipe is guaranteed, the service life of the jig is prolonged, the use requirement of a user is met, practicability is high, and the application range is wide.

Description

Technical Field

[0001] This utility model relates to the field of jigs, and in particular to a jig structure for processing hardware parts. Background Technology

[0002] Currently, jigs are a broad category of tools used in woodworking, metalworking, fitter work, machinery, electrical control, and other handicrafts. They are primarily used to assist in controlling position or movement (or both). Jigs can be divided into three categories: process assembly jigs, project testing jigs, and circuit board testing jigs. Process assembly jigs include assembly jigs, welding jigs, disassembly jigs, dispensing jigs, irradiation jigs, adjustment jigs, and shearing jigs. Project testing jigs include life testing jigs, packaging testing jigs, environmental testing jigs, optical testing jigs, shielding testing jigs, sound insulation testing jigs, and so on. Circuit board testing jigs mainly include ICT testing jigs, FCT functional jigs, SMT reflow jigs, BGA testing jigs, and so on.

[0003] Existing machining fixtures for hardware parts processing incorporate internal heat dissipation pipes. A water pump supplies coolant into these pipes, allowing the workpiece's heat to be absorbed by the coolant and dissipated. However, these fixtures suffer from poor structural design. Vibrations generated during hardware processing can transfer these vibrations to the heat dissipation pipes, causing damage and necessitating replacement of the entire fixture. This increases production costs, fails to meet user needs, and has a limited applicability.

[0004] Therefore, a new technical solution needs to be researched to address the above problems. Utility Model Content

[0005] In view of this, the present invention addresses the deficiencies of the existing technology and its main purpose is to provide a hardware processing fixture structure. It utilizes a heat dissipation pipe placed between the upper and lower buffer pads to reduce the impact of vibration generated by the heat dissipation pipe during workpiece processing, thereby ensuring the stability of the heat dissipation pipe and improving the service life of the fixture. It meets the user's needs and has a wide range of applications.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A hardware processing fixture structure includes a base, a base, an upper buffer pad, a lower buffer pad, and a heat dissipation assembly; wherein: the base is disposed above the base, the upper buffer pad is disposed at the lower end of the base, the upper end of the base is provided with a groove for placing workpieces, the lower buffer pad is disposed at the upper end of the base, and the lower end of the upper buffer pad is in contact with the upper end of the lower buffer pad; the heat dissipation assembly includes a heat dissipation pipe, a liquid delivery device, and a liquid storage tank, the heat dissipation pipe has a serpentine structure, the heat dissipation pipe is disposed between the upper and lower buffer pads, the heat dissipation pipe has a heat dissipation channel with an inlet and an outlet, and the liquid delivery device and the liquid storage tank are respectively connected to the inlet and the outlet.

[0008] As a preferred embodiment, both the lower end of the upper buffer pad and the upper end of the lower buffer pad are provided with connecting grooves for contacting and positioning with the heat dissipation pipe.

[0009] As a preferred embodiment, the connecting groove is provided with contact protrusions, and a plurality of contact protrusions are provided and evenly arranged on the inner wall surface of the connecting groove.

[0010] As a preferred embodiment, heat sinks are provided inside both the upper and lower buffer pads.

[0011] As a preferred embodiment, the heat sink is a graphene heat sink.

[0012] As a preferred embodiment, a thermally conductive layer is provided between the upper buffer pad and the base.

[0013] As a preferred embodiment, the thermally conductive layer is one of thermally conductive silicone, thermally conductive grease, or thermally conductive potting compound.

[0014] As a preferred embodiment, both the upper and lower buffer pads are provided with reinforcing ribs inside.

[0015] As a preferred embodiment, the base is provided with support columns at its four lower corners for connection and positioning with the equipment.

[0016] Compared with the prior art, this utility model has obvious advantages and beneficial effects. Specifically, as can be seen from the above technical solution, it mainly uses the design of each component to place the heat dissipation pipe between the upper buffer pad and the lower buffer pad to reduce the impact of vibration generated by the heat dissipation pipe during workpiece processing, thus ensuring the stability of the heat dissipation pipe and improving the service life of the fixture, meeting the user's needs, and is highly practical and widely applicable.

[0017] Secondly, the connection groove is designed to facilitate contact and positioning between the heat dissipation pipe and the upper and lower buffer pads. Combined with the contact protrusions, this further reduces the impact on the heat dissipation pipe during workpiece processing, thereby improving the stability and usability of the heat dissipation pipe on the fixture. At the same time, the heat sink design improves the heat dissipation of the workpiece, thus ensuring the processing quality of the workpiece.

[0018] Furthermore, the heat-conducting layer facilitates the transfer of heat from the workpiece to the heat dissipation pipe, thereby ensuring the heat dissipation effect of the fixture and thus guaranteeing the processing quality of the workpiece. At the same time, the reinforcing ribs improve the overall structural strength of the fixture, thereby ensuring the stability of the heat dissipation pipe within the fixture. Additionally, the support columns facilitate the support and positioning of the fixture on the equipment, making it highly practical.

[0019] To more clearly illustrate the structural features and effects of this utility model, the following detailed description of this utility model is provided in conjunction with the accompanying drawings and specific embodiments. Attached Figure Description

[0020] Figure 1 This is a cross-sectional view of an embodiment of the present utility model;

[0021] Figure 2 yes Figure 1 A magnified view of a portion of location A shown.

[0022] Explanation of reference numerals in the attached diagram:

[0023] 11. Base 111. Groove

[0024] 112. Positioning part 12. Base

[0025] 121. Support column; 122. Magnetic connector

[0026] 13. Upper cushioning pad 14. Lower cushioning pad

[0027] 151. Heat pipe; 16. Connecting slot

[0028] 161. Contact protrusion; 17. Heat sink

[0029] 18. Thermal conductive layer 19. Reinforcing ribs. Detailed Implementation

[0030] Please refer to Figures 1 to 2 As shown, it illustrates the specific structure of an embodiment of the present invention.

[0031] A hardware processing fixture structure includes a base 11, a base 12, an upper buffer pad 13, a lower buffer pad 14, and a heat dissipation assembly; wherein:

[0032] The base 11 is disposed above the base 12, the upper buffer pad 13 is disposed at the lower end of the base 11, the upper end of the base 11 is provided with a groove 111 for placing the workpiece, the groove 111 is provided with a positioning part 112, the lower buffer pad 14 is disposed at the upper end of the base 12, and the lower end of the upper buffer pad 13 is in contact with the upper end of the lower buffer pad 14.

[0033] The heat dissipation assembly includes a heat dissipation pipe 151, an infusion device (not shown in the figure), and a storage tank (not shown in the figure). The heat dissipation pipe 151 has a serpentine structure and is disposed between the upper buffer pad 13 and the lower buffer pad 14. The heat dissipation pipe 151 has heat dissipation channels with an inlet and an outlet. The infusion device and the storage tank are respectively connected to the inlet and outlet, and are interconnected by a connecting pipe. In this way, through the design of each component, the heat dissipation pipe is placed between the upper and lower buffer pads to reduce the impact of vibration generated by the heat dissipation pipe during workpiece processing, ensuring the stability of the heat dissipation pipe in use, thereby improving the service life of the fixture, meeting the user's needs, and having strong practicality and wide applicability.

[0034] Furthermore, the lower end of the upper buffer pad 13 and the upper end of the lower buffer pad 14 are both provided with connecting grooves 16 for contact and positioning with the heat sink. The connecting grooves 16 are provided with contact protrusions 161, and several contact protrusions 161 are provided and evenly arranged on the inner wall surface of the connecting grooves 16. Preferably, heat sinks 17 are provided inside the upper buffer pad 13 and the lower buffer pad 14. The heat sinks 17 are graphene heat sinks. In this way, the connecting grooves facilitate contact and positioning between the heat sink and the upper and lower buffer pads. Combined with the contact protrusions, the impact on the heat sink during workpiece processing is further reduced, thereby improving the stability and usability of the heat sink on the fixture. At the same time, the heat sinks improve the heat dissipation of the workpiece, thereby ensuring the processing quality of the workpiece.

[0035] Furthermore, a thermally conductive layer 18 is provided between the upper buffer pad 13 and the base 11. The thermally conductive layer 18 is one of thermally conductive silicone, thermally conductive grease, or thermally conductive potting compound. In this embodiment, reinforcing ribs 19 are provided inside both the upper buffer pad 13 and the lower buffer pad 14. Several reinforcing ribs 19 are provided and arranged at intervals along the width direction of the corresponding buffer pads. The reinforcing ribs 19 are located in the direction away from the heat sink 17 and away from the heat sink 151. Thus, the provision of the thermally conductive layer facilitates the heat transfer of the workpiece to the heat sink, thereby ensuring the heat dissipation effect of the fixture and thus ensuring the processing quality of the workpiece. At the same time, the provision of the reinforcing ribs improves the overall structural strength of the fixture, thereby ensuring the stability of the heat sink within the fixture.

[0036] Furthermore, the base 12 has four support columns 121 at its lower corners for connection with the equipment for support and positioning. The lower end of the support column 121 is provided with a magnetic suction component 122. Thus, the support column is provided to facilitate the support and positioning of the fixture on the equipment. At the same time, the magnetic suction component is used to magnetically connect and fix the fixture to the equipment, which helps to improve the firmness of the fixture on the equipment, thereby ensuring the stability of the fixture in use and making it highly practical.

[0037] The key design feature of this utility model is that, through the design of each component, a heat dissipation pipe is placed between the upper and lower buffer pads to reduce the impact of vibrations generated by the heat dissipation pipe during workpiece processing, thereby ensuring the stability of the heat dissipation pipe and improving the service life of the fixture. It meets the user's needs, is highly practical, and has a wide range of applications.

[0038] Secondly, the connection groove is designed to facilitate contact and positioning between the heat dissipation pipe and the upper and lower buffer pads. Combined with the contact protrusions, this further reduces the impact on the heat dissipation pipe during workpiece processing, thereby improving the stability and usability of the heat dissipation pipe on the fixture. At the same time, the heat sink design improves the heat dissipation of the workpiece, thus ensuring the processing quality of the workpiece.

[0039] Furthermore, the heat-conducting layer facilitates the transfer of heat from the workpiece to the heat dissipation pipe, thereby ensuring the heat dissipation effect of the fixture and thus guaranteeing the processing quality of the workpiece. At the same time, the reinforcing ribs improve the overall structural strength of the fixture, thereby ensuring the stability of the heat dissipation pipe within the fixture. Additionally, the support columns facilitate the support and positioning of the fixture on the equipment, making it highly practical.

[0040] The above description is merely a preferred embodiment of the present utility model and does not constitute any limitation on the technical scope of the present utility model. Therefore, any minor modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model shall still fall within the scope of the technical solution of the present utility model.

Claims

1. A hardware processing fixture structure, characterized in that: The device includes a base, a base, an upper buffer pad, a lower buffer pad, and a heat dissipation assembly. The base is positioned above the base, the upper buffer pad is positioned at the lower end of the base, and the upper end of the base has a groove for placing workpieces. The lower buffer pad is positioned at the upper end of the base, and the lower end of the upper buffer pad is in contact with the upper end of the lower buffer pad. The heat dissipation assembly includes a heat dissipation pipe, a liquid delivery device, and a liquid storage tank. The heat dissipation pipe has a serpentine structure and is positioned between the upper and lower buffer pads. The heat dissipation pipe has a heat dissipation channel with an inlet and an outlet. The liquid delivery device and the liquid storage tank are respectively connected to the inlet and outlet.

2. The hardware processing fixture structure according to claim 1, characterized in that: The lower end of the upper buffer pad and the upper end of the lower buffer pad are both provided with connecting grooves for contacting and positioning with the heat dissipation pipe.

3. The hardware processing fixture structure according to claim 2, characterized in that: The connecting groove is provided with contact protrusions, and a number of contact protrusions are provided and evenly arranged on the inner wall surface of the connecting groove.

4. The hardware processing fixture structure according to claim 1, characterized in that: Heat sinks are provided inside both the upper and lower buffer pads.

5. The hardware processing fixture structure according to claim 4, characterized in that: The heat sink is a graphene heat sink.

6. The hardware processing fixture structure according to claim 1, characterized in that: A heat-conducting layer is provided between the upper buffer pad and the base.

7. The hardware processing fixture structure according to claim 6, characterized in that: The thermally conductive layer is one of thermally conductive silicone, thermally conductive grease, or thermally conductive potting compound.

8. The hardware processing fixture structure according to claim 1, characterized in that: Both the upper and lower buffer pads are equipped with reinforcing ribs inside.

9. The hardware processing fixture structure according to claim 1, characterized in that: The base has support columns at its four lower corners for connection and positioning with the equipment.

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