External hanging type liquid cooling structure of server

Abstract

The utility model discloses an externally-hung liquid cooling structure of a server, which comprises a server box, a cold plate module, an externally-hung case, a header and a relay module, and is characterized in that the cold plate module is mounted in the server box; the plug-in case is connected to the server box, and the plug-in case is communicated with the server box; the header is mounted in the external case and is communicated with the cold plate module; the beneficial effects of the liquid cooling system are that the header is installed in the external case, the relay module is installed on the external case, and the relay module is communicated with the header module, so that main parts of the liquid cooling system are prevented from interfering with electrical elements in the server. Meanwhile, in the installation process, the risk that electrical elements in the server are damaged due to bumping and the like is reduced, the installation safety and stability are improved, in addition, the pipe arrangement forms are various, and the pipe arrangement forms cannot be limited by the internal structure of the server and can only be installed on one side or cannot be installed at all.

Description

Technical Field

[0001] This utility model relates to the field of server heat dissipation, specifically to an external liquid cooling structure for servers. Background Technology

[0002] In today's era of digital information explosion, the demand for data storage, processing, and transmission is growing exponentially. Data centers, as the core processing and storage hubs for massive amounts of data, are constantly expanding in scale, with a dramatic increase in the number of internal servers. Liquid cooling technology, as a highly efficient heat dissipation solution, is gradually gaining attention.

[0003] Chinese utility model patent CN216486343U discloses a liquid-cooled server, including a server body, a power supply, a water distributor, and a pipe assembly. The server body includes at least two computing units, each computing unit including a computing chip and a first liquid-cooled heat sink for cooling the computing chip. The first liquid-cooled heat sink includes a first liquid inlet and a first liquid outlet. The power supply includes an electronic control board and a second liquid-cooled heat sink for cooling the electronic control board. The water distributor is installed on the server body, and at least two first liquid inlets or at least two first liquid outlets are connected to the water distributor through the pipe assembly.

[0004] The aforementioned technologies have the following drawbacks: the first liquid cooling radiator, the second liquid cooling radiator, and the water distributor are all installed inside the server, which may interfere with the electrical components inside the server. Moreover, during the installation process, the electrical components inside the server may be damaged due to bumps or other reasons. Utility Model Content

[0005] The purpose of this invention is to overcome the above-mentioned technical deficiencies and propose an external liquid cooling structure for servers, thereby solving the technical problem that liquid cooling systems in the prior art are prone to interference with electrical components inside the server.

[0006] To achieve the above technical objectives, the present invention provides an external liquid cooling structure for servers, including a server chassis;

[0007] A cold plate module, which is installed inside the server chassis;

[0008] An external chassis is connected to a server chassis and is in communication with the server chassis.

[0009] A manifold, which is installed inside an external chassis and is connected to a cold plate module; and...

[0010] A relay module is installed on an external chassis and is connected to a manifold module.

[0011] In some embodiments, the manifold includes a liquid collecting pipe, a first pipe body, a second pipe body, a third pipe body, a liquid distributing pipe, a fourth pipe body, a fifth pipe body, and a sixth pipe body. Both the liquid collecting pipe and the liquid distributing pipe can be detachably connected to an external chassis. The liquid collecting pipe is connected to the cold plate module through the first and second pipe bodies, the liquid collecting pipe is connected to the relay module through the third pipe body, the liquid distributing pipe is connected to the cold plate module through the fourth and fifth pipe bodies, and the liquid distributing pipe is connected to the relay module through the sixth pipe body.

[0012] In some embodiments, the relay module includes a liquid collecting relay and a liquid distributing relay, both of which can be detachably connected to an external chassis. The liquid collecting pipe is connected to the liquid collecting relay through a third pipe body, and the liquid distributing pipe is connected to the liquid distributing relay through a sixth pipe body.

[0013] In some embodiments, the server chassis includes a server chassis body and a server chassis cover, wherein the server chassis cover is detachably connected to the top of the server chassis body.

[0014] In some embodiments, the cold plate module includes a central processing unit (CPU) cold plate and an image processor (IP) cold plate. The CPU cold plate is located on the CPU side inside the server chassis, and the IIP cold plate is located on the IIP side inside the server chassis. The liquid collection pipe is connected to the CPU cold plate through a first pipe body, the liquid collection pipe is connected to the IIP cold plate through a second pipe body, the liquid distribution pipe is connected to the CPU cold plate through a fourth pipe body, and the liquid distribution pipe is connected to the IIP cold plate through a fifth pipe body.

[0015] In some embodiments, the external chassis includes an external chassis body and an external chassis cover. The external chassis cover is detachably connected to the top of the external chassis body, and the liquid collection pipe and the liquid distribution pipe are both detachably connected to the external chassis body.

[0016] In some embodiments, the external enclosure is detachably connected to the server enclosure cover.

[0017] In some embodiments, the server chassis cover further includes a communication port, which is located on the server chassis cover and inside an external chassis, wherein the external chassis is larger than the communication port.

[0018] In some embodiments, the external case cover includes a cover body and a plurality of cover edges, the plurality of cover edges being arranged around the periphery of the cover body and the plurality of cover edges being used to abut against the outer wall of the external case body.

[0019] In some embodiments, the external chassis further includes a fixing component, the fixing component includes a bolt, the cover edge is provided with a through hole, the external chassis is provided with a screw hole, the bolt passes through the through hole, and the bolt is threaded into the screw hole.

[0020] Compared with the prior art, the beneficial effects of this utility model include:

[0021] 1. By installing the manifold inside the external chassis and the relay module on the external chassis, interference between the main components of the liquid cooling system and the electrical components inside the server is avoided. At the same time, during installation, the risk of damage to the electrical components inside the server due to impacts or other reasons is reduced, improving the safety and stability of the installation.

[0022] 2. The relay module is installed on the external chassis, and there are various ways to run the conduit. It is not limited by the internal structure of the server to be installed on one side or cannot be installed at all. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the overall structure of the liquid cooling structure provided by this utility model;

[0024] Figure 2 This is a first-view overall structural cross-sectional view of the liquid cooling structure provided by this utility model;

[0025] Figure 3 This is a second-view overall structural cross-sectional view of the liquid cooling structure provided by this utility model.

[0026] Explanation of reference numerals in the attached figures:

[0027] 1. Server chassis; 11. Server chassis body; 12. Server chassis cover; 2. Cold plate module; 21. Central processing unit cold plate; 22. Image processor cold plate; 3. External chassis; 31. External chassis body; 32. External chassis cover; 321. Cover body; 322. Cover edge; 33. Connecting port; 34. Fixing component; 341. Bolt; 4. Manifold; 41. Liquid collection pipe; 42. First pipe body; 43. Second pipe body; 44. Third pipe body; 45. Distributor pipe; 46. Fourth pipe body; 47. Fifth pipe body; 48. Sixth pipe body; 5. Relay module; 51. Liquid collection repeater; 52. Distributor repeater. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this utility model and are not intended to limit this utility model.

[0029] This utility model provides an external liquid cooling structure for a server, the structure of which is as follows: Figure 1 - Figure 3 As shown, it includes server chassis 1, cold plate module 2, external chassis 3, manifold 4, and relay module 5.

[0030] The cold plate module 2 is installed inside the server chassis 1.

[0031] The external chassis 3 is connected to the server chassis 1, and the external chassis 3 is connected to the server chassis 1.

[0032] The manifold 4 is installed inside the external chassis 3 and is connected to the cold plate module 2.

[0033] The relay module 5 is installed on the external chassis 3, and the relay module 5 is connected to the manifold 4 module.

[0034] During operation, the server's internal electrical components generate a significant amount of heat. The cold plate module 2, installed inside the server chassis 1, is in close contact with these heat-generating components. Coolant flows inside the cold plate module 2, absorbing the heat generated by the electrical components through heat conduction, thus lowering their temperature and ensuring stable operation. After absorbing heat, the internal coolant temperature rises. Since the cold plate module 2 is connected to the manifold 4, the heated coolant flows into the manifold 4 installed inside the external chassis 3. The manifold 4 collects and distributes the coolant. The relay module 5 connects to external cooling equipment. After flowing from the manifold 4 into the relay module 5, the coolant is then transported to the external cooling equipment for dissipation. After cooling, the coolant temperature decreases, and it flows back to the cold plate module 2 through the relay module 5 and the manifold 4, forming a complete coolant circulation loop.

[0035] In this invention, the manifold 4 is installed inside the external chassis 3, and the relay module 5 is installed on the external chassis 3, thus avoiding interference between the main components of the liquid cooling system and the electrical components inside the server. Simultaneously, during installation, the risk of damage to the electrical components inside the server due to impacts or other reasons is reduced, improving the safety and stability of the installation.

[0036] To achieve coolant collection and distribution, please refer to... Figure 3 In a preferred embodiment, the manifold 4 includes a liquid collecting pipe 41, a first pipe body 42, a second pipe body 43, a third pipe body 44, a liquid distributing pipe 45, a fourth pipe body 46, a fifth pipe body 47, and a sixth pipe body 48. The liquid collecting pipe 41 and the liquid distributing pipe 45 can be detachably connected to the external chassis 3. The liquid collecting pipe 41 is connected to the cold plate module 2 through the first pipe body 42 and the second pipe body 43. The liquid collecting pipe 41 is connected to the relay module 5 through the third pipe body 44. The liquid distributing pipe 45 is connected to the cold plate module 2 through the fourth pipe body 46 and the fifth pipe body 47. The liquid distributing pipe 45 is connected to the relay module 5 through the sixth pipe body 48.

[0037] In operation, the first pipe 42 connects the cold plate module 2 to the liquid collector 41, allowing the heated coolant to flow into the liquid collector 41 through the first pipe 42. The second pipe 43 connects the cold plate module 2 to the liquid collector 41, allowing the high-temperature coolant to flow into the liquid collector 41 through the second pipe 43. After collecting the high-temperature coolant from the cold plate module 2, the liquid collector 41 transports this coolant to the relay module 5 through the third pipe 44. The relay module 5 acts as a transfer and regulation unit. The cooled coolant, after heat dissipation treatment, flows back to the distributor 45 through the sixth pipe 48. The fourth pipe 46 connects the distributor 45 to the cold plate module 2, and the fifth pipe 47 connects the distributor 45 to the cold plate module 2. The distributor 45, through the fourth pipe 46 and the fifth pipe 47, delivers the cooled coolant to the cold plate module 2, where it absorbs the heat generated by the processor again, completing a full coolant cycle.

[0038] To achieve coolant circulation, please refer to... Figure 2 In a preferred embodiment, the relay module 5 includes a liquid collecting relay 51 and a liquid distributing relay 52. ​​Both the liquid collecting relay 51 and the liquid distributing relay 52 can be detachably connected to the external housing 31. The liquid collecting pipe 41 is connected to the liquid collecting relay 51 through a third pipe 44, and the liquid distributing pipe 45 is connected to the liquid distributing relay 52 through a sixth pipe 48.

[0039] During operation, after the collecting pipe 41 collects the high-temperature coolant from the cold plate module 2 inside the server chassis 11, this coolant flows into the collecting repeater 51 through the third pipe 44. The low-temperature coolant, cooled by the heat dissipation equipment, flows into the distributing repeater 52 through a pipe. The distributing pipe 45 is connected to the distributing repeater 52 through the sixth pipe 48, allowing the low-temperature coolant to enter the distributing repeater 52 through the sixth pipe 48. This ensures that the coolant can circulate continuously and stably throughout the liquid cooling system, providing effective heat dissipation for the cold plate module 2.

[0040] To improve assembly and maintenance efficiency, please refer to Figure 1 In a preferred embodiment, the server chassis 1 includes a server chassis body 11 and a server chassis cover 12, wherein the server chassis cover 12 is detachably connected to the top of the server chassis body 11.

[0041] When in use, the removable design of the server chassis cover 12 facilitates the installation of internal electrical components and improves assembly efficiency.

[0042] To improve efficiency, please refer to Figure 3In a preferred embodiment, the cold plate module 2 includes a central processing unit (CPU) cold plate 21 and an image processor (IP) cold plate 22. The CPU cold plate 21 is located on the CPU side inside the server chassis 11, and the IIP cold plate 22 is located on the IIP side inside the server chassis 11. The liquid collection pipe 41 is connected to the CPU cold plate 21 through a first pipe body 42 and to the IIP cold plate 22 through a second pipe body 43. The liquid distribution pipe 45 is connected to the CPU cold plate 21 through a fourth pipe body 46 and to the IIP cold plate 22 through a fifth pipe body 47.

[0043] In operation, the CPU cold plate 21 and the GPU cold plate 22 are respectively attached to the sides of the CPU and GPU, precisely capturing the high heat generated by the processors. Compared to traditional integrated cooling, this one-to-one layout significantly shortens the heat transfer path and effectively reduces thermal resistance. The first tube 42 connects the CPU cold plate 21 to the collector tube 41, allowing the heated coolant to flow into the collector tube 41 through the first tube 42. The second tube 43 connects the GPU cold plate 22 to the collector tube 41, allowing the high-temperature coolant to flow into the collector tube 41 through the second tube 43. After collecting the high-temperature coolant from the CPU cold plate 21 and GPU cold plate 22, the collector tube 41 transports this coolant to the relay module 5 through the third tube 44. The relay module 5 acts as a transfer and regulation unit. The cooled coolant, after heat dissipation treatment, flows back to the distributor tube 45 through the sixth tube 48. The fourth tube 46 connects the distribution tube 45 to the central processing unit's cold plate 21, and the fifth tube 47 connects the distribution tube 45 to the image processor's cold plate 22. The distribution tube 45, through the fourth tube 46 and the fifth tube 47, delivers the low-temperature coolant to the central processing unit's cold plate 21 and the image processor's cold plate 22 respectively, to absorb the heat generated by the processor again, completing a full coolant cycle.

[0044] For ease of inspection, please refer to Figure 1 In a preferred embodiment, the external chassis 3 includes an external chassis 31 and an external chassis cover 32. The external chassis cover 32 is detachably connected to the top of the external chassis 31, and the liquid collection pipe 41 and the liquid distribution pipe 45 are both detachably connected to the external chassis 31.

[0045] When in use, the outer cover 32 can be opened quickly, allowing maintenance personnel to quickly locate the problem for easy installation and maintenance.

[0046] To improve the strength between the external enclosure 31 and the server chassis cover 12, please refer to... Figure 1 In a preferred embodiment, the external enclosure 31 is detachably connected to the server enclosure cover 12.

[0047] When in use, the bolts and lock nuts work together to provide a reliable and tight connection, firmly fixing the external enclosure 31 to the server enclosure cover 12. This ensures that even if the server is subjected to external forces such as vibration or impact during operation, the server enclosure cover 12 will not easily loosen or fall off, thus guaranteeing the airtightness of the server enclosure 31 and the stability of the overall structure.

[0048] To further improve heat dissipation, please refer to... Figure 2 In a preferred embodiment, the server chassis cover 12 further includes a communication port 33, which is located on the server chassis cover 12 and inside the external enclosure 31, which is larger than the communication port 33.

[0049] When in use, the connection port 33 creates a direct passage between the internal cooling plate module 2 of the server chassis 1 and the internal manifold 4 of the external chassis 31, ensuring smooth circulation of coolant and improving heat dissipation.

[0050] To improve the stability between the external cover 32 and the external enclosure 31, please refer to... Figure 1 In a preferred embodiment, the outer box cover 32 includes a cover body 321 and a plurality of cover edges 322, the plurality of cover edges 322 being arranged around the periphery of the cover body 321, and the plurality of cover edges 322 being used to abut against the outer wall of the outer box body 31.

[0051] During use, the cover edge 322 abuts against the outer wall of the external enclosure 31, reinforcing the connection between the cover and the enclosure. This ensures a tighter fit between the cover and the enclosure, reducing the possibility of the cover loosening due to vibration or other reasons. During server operation, the server itself generates some vibration; a stable cover connection ensures that the external enclosure 3 remains closed, maintaining good heat dissipation and protection performance.

[0052] To achieve a secure connection between the external cover 32 and the external housing 31, please refer to... Figure 1 In a preferred embodiment, the external chassis 3 further includes a fixing component 34, the fixing component 34 including a bolt 341, a through hole on the cover edge 322, a screw hole on the external chassis 31, the bolt 341 passing through the through hole, and the bolt 341 being threaded into the screw hole.

[0053] When installing the outer cover 32, first, accurately align the through hole on the cover edge 322 with the screw hole on the outer casing 31. After aligning the through hole and screw hole, pass the bolt 341 through the through hole and screw it into the screw hole. During tightening, the head of the bolt 341 will press against the cover edge 322, making the cover edge 322 tightly abut against the outer wall of the outer casing 31, thereby achieving a firm connection between the outer cover 32 and the outer casing 31.

[0054] To better understand this utility model, the following is combined with... Figure 1 - Figure 3 The working principle of an external liquid cooling structure for servers, as described in this utility model, is explained in detail below: During server operation, the internal electrical components generate a large amount of heat. A cooling plate module 2 is installed inside the server chassis 1, in close contact with the heat-generating electrical components. Coolant flows inside the cooling plate module 2, absorbing the heat generated by the electrical components through heat conduction, thereby reducing the temperature of the electrical components and ensuring their normal and stable operation. After absorbing heat, the internal coolant temperature of the cooling plate module 2 increases. Since the cooling plate module 2 is connected to the manifold 4, the heated coolant flows into the manifold 4 installed inside the external chassis 3. The manifold 4 collects and distributes the coolant. A relay module 5 can be connected to external heat dissipation equipment. After flowing from the manifold 4 into the relay module 5, the coolant is transported to the external heat dissipation equipment for cooling. After cooling, the coolant temperature decreases, and it flows back to the cooling plate module 2 through the relay module 5 and the manifold 4, forming a complete coolant circulation loop.

[0055] The specific embodiments of this utility model described above do not constitute a limitation on the scope of protection of this utility model. Any other corresponding changes and modifications made based on the technical concept of this utility model should be included within the scope of protection of the claims of this utility model.

Claims

1. A server external liquid cooling structure, characterized in that, include: Server enclosure; A cold plate module, which is installed inside the server chassis; An external chassis is connected to a server chassis and is in communication with the server chassis. A manifold, which is installed inside an external chassis and is connected to a cold plate module; and... A relay module is installed on an external chassis and is connected to a manifold module.

2. The server external liquid cooling structure according to claim 1, characterized in that, The manifold includes a collection pipe, a first pipe body, a second pipe body, a third pipe body, a distribution pipe, a fourth pipe body, a fifth pipe body, and a sixth pipe body. Both the collection pipe and the distribution pipe can be detachably connected to an external chassis. The collection pipe is connected to the cold plate module through the first and second pipe bodies. The collection pipe is connected to the relay module through the third pipe body. The distribution pipe is connected to the cold plate module through the fourth and fifth pipe bodies. The distribution pipe is connected to the relay module through the sixth pipe body.

3. The server external liquid cooling structure according to claim 2, characterized in that, The relay module includes a liquid collecting relay and a liquid distributing relay. Both the liquid collecting relay and the liquid distributing relay can be detachably connected to an external chassis. The liquid collecting pipe is connected to the liquid collecting relay through a third pipe body, and the liquid distributing pipe is connected to the liquid distributing relay through a sixth pipe body.

4. The server external liquid cooling structure according to claim 2, characterized in that, The server chassis includes a server chassis body and a server chassis cover, and the server chassis cover is detachably connected to the top of the server chassis body.

5. The server external liquid cooling structure according to claim 4, characterized in that, The cold plate module includes a central processing unit (CPU) cold plate and an image processor (IP) cold plate. The CPU cold plate is located on the CPU side inside the server chassis, and the IIP cold plate is located on the IIP side inside the server chassis. The liquid collection pipe is connected to the CPU cold plate through a first pipe body, and to the IIP cold plate through a second pipe body. The liquid distribution pipe is connected to the CPU cold plate through a fourth pipe body, and to the IIP cold plate through a fifth pipe body.

6. The server external liquid cooling structure according to claim 4, characterized in that, The external chassis includes an external chassis body and an external chassis cover. The external chassis cover is detachably connected to the top of the external chassis body, and the liquid collection pipe and the liquid distribution pipe are both detachably connected to the external chassis body.

7. The server external liquid cooling structure according to claim 6, characterized in that, The external enclosure is detachably connected to the server enclosure cover.

8. The server external liquid cooling structure according to claim 6, characterized in that, The server chassis cover also includes a communication port, which is located on the server chassis cover and inside the external chassis. The external chassis is larger than the communication port.

9. The server external liquid cooling structure according to claim 6, characterized in that, The outer box cover includes a cover body and multiple cover edges, with the multiple cover edges arranged around the periphery of the cover body and used to abut against the outer wall of the outer box body.

10. The server external liquid cooling structure according to claim 9, characterized in that, The external chassis also includes a fixing component, which includes bolts. The cover edge is provided with a through hole, and the external chassis is provided with a screw hole. The bolt passes through the through hole and is threaded into the screw hole.

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