Missed milling prevention cover die for PCB (Printed Circuit Board)

Abstract

The utility model discloses a miss-routing prevention cover die for a PCB. The miss-routing prevention cover die comprises a cover die substrate; the cover die cavity is formed in the cover die base plate, the cover die cavity is used for allowing a PCB to be placed in, and the cover die cavity is matched with the PCB; and the taking and placing groove is formed in the cover die base plate and is close to the cover die cavity. After board milling is finished, the PCB formed by board milling is detected through the cover die substrate, the PCB to be detected is placed in the cover die cavity, goodness of fit detection is carried out, if the PCB is a good PCB, the PCB can be completely matched with the template, detection is passed, and if the PCB is not matched with the template, board milling is not in place, the PCB is a defective PCB, and board milling needs to be carried out again. The taking and placing groove is arranged close to the cover die cavity and communicated with the cover die cavity, when the good PCB is completely matched with the cover die cavity, the good PCB can still be dug out through the taking and placing groove, and the situation that the good PCB is difficult to take out after being placed into the cover die cavity is avoided. Through the steps, the PCB can be stably detected, defective PCBs can be detected out, the detection accuracy is high, and the workload required by detection is reduced.

Description

Technical Field

[0001] This application relates to the field of drainage tube fixing, and in particular to a PCB anti-leakage soldering mold. Background Technology

[0002] Routing refers to the process of cutting a PCB (Printed Circuit Board) using a CNC milling cutter according to a preset program to form a frame, slots, and other structures to meet final assembly requirements. During the PCB forming process, short cutters or equipment failures often result in incomplete PCB routing. If the routing continues after changing cutters, some circuit board positions may not be properly routed, leading to defective products.

[0003] In terms of related technology, defective PCBs that appear during the routing process are usually identified through visual inspection. However, manual visual inspection is labor-intensive and has poor stability, which may result in some defective products not being detected and flowing into customers or subsequent processes, causing economic losses.

[0004] Therefore, it is necessary to propose a die for preventing missing PCBs, which makes it easier to detect defective PCBs. This has become an important technical problem that urgently needs to be solved. Utility Model Content

[0005] This application provides a die for preventing missing PCBs during the routing process, which aims to solve the problem that in the prior art, defective PCBs that appear during routing are generally removed by visual inspection. However, manual visual inspection is labor-intensive and has poor stability, which may lead to some defective products not being detected and flowing into customers or subsequent processes, causing economic losses.

[0006] To achieve the above objectives, this application proposes a PCB anti-leakage soldering mold, comprising: a mold base plate; a mold cavity, which is formed on the mold base plate and is used for inserting the PCB and is adapted to the PCB; and a pick-and-place slot, which is disposed on the mold base plate and adjacent to the mold cavity.

[0007] In some embodiments, two pick-and-place slots are provided, which are located on the lateral sides of the mold cavity and are connected to the mold cavity.

[0008] In some embodiments, it also includes:

[0009] The guide section is located at the top of the mold cavity.

[0010] In some embodiments, four pick-and-place slots are provided, with two pick-and-place slots located on the lateral sides of the mold cavity and two pick-and-place slots located on the longitudinal sides of the mold cavity, and the pick-and-place slots are connected to the mold cavity.

[0011] In some embodiments, it also includes:

[0012] Finger hole, the finger hole is provided on the mold base plate, the finger hole penetrates the mold base plate, and the finger hole is at least partially located in the mold cavity.

[0013] In some embodiments, it also includes:

[0014] The first arc-shaped portion is provided on the mold base plate;

[0015] The second arc-shaped section is provided in the pick-and-place slot.

[0016] This application proposes a PCB anti-missing routing mold, comprising: a mold base plate; a mold cavity, formed on the mold base plate and used for inserting the PCB, the mold cavity being adapted to fit the PCB; and a pick-and-place slot, disposed on the mold base plate and adjacent to the mold cavity. After routing, the PCB formed by routing is inspected through the mold base plate. The PCB to be inspected is placed into the mold cavity for a fit test. If it is a good PCB, it will fit the mold perfectly and pass the test. If it does not fit, it indicates that the routing is not in place, and it is a defective PCB that needs to be re-routed. The pick-and-place slot is adjacent to and connected to the mold cavity. Even when a good PCB fits perfectly with the mold cavity, it can still be removed through the pick-and-place slot, preventing the good PCB from being difficult to remove after being placed in the mold cavity. Through the above steps, PCBs can be reliably inspected, defective PCBs can be detected, the inspection accuracy is high, and the workload required for inspection is reduced. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein:

[0018] Figure 1 This is a three-dimensional structural diagram of a PCB anti-leakage solder mask according to an embodiment of this application;

[0019] Figure 2 This is a magnified view of part A in section 1;

[0020] Figure 3 This is a front view of a PCB anti-leakage solder mask according to an embodiment of this application;

[0021] Figure 4 This is a three-dimensional structural schematic diagram of another PCB anti-leakage solder mask according to one embodiment of this application;

[0022] Figure 5This is a three-dimensional structural diagram of a PCB anti-leakage soldering mold according to another embodiment of this application.

[0023] In the figure: 1. Mold base plate, 2. Pick-and-place groove, 3. Second arc-shaped part, 4. Mold cavity, 5. First arc-shaped part, 6. Positioning protrusion, 7. Guide part, 8. Finger hole. Detailed Implementation

[0024] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0025] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0026] It should also be noted that when a component is described as "fixed to" or "set on" another component, it can be directly on the other component or there may be an intervening component present. When a component is described as "connected to" another component, it can be directly connected to the other component or there may be an intervening component present.

[0027] Furthermore, the use of terms such as "first" and "second" in this application is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed in this application.

[0028] See Figure 1 and Figure 3 As shown, this application proposes a PCB anti-leakage soldering mold, including: a mold base plate 1; a mold cavity 4, which is formed on the mold base plate 1 and is used for inserting the PCB and is adapted to the PCB; and a pick-and-place slot 2, which is disposed on the mold base plate 1 and is disposed adjacent to the mold cavity 4.

[0029] The die-casting base plate 1 is the structural foundation of a die-casting mold for PCBs to prevent missing parts during routing. Other structures on the die-casting mold are directly or indirectly connected to the die-casting base plate 1. The die-casting cavity 4 is a cavity formed on the die-casting base plate 1. The die-casting cavity 4 is engraved based on a good PCB and has positioning protrusions 6 that fit the good PCB. When inspecting the PCB after routing, the PCB to be inspected is simply placed into the die-casting cavity 4 for a fit test. If it is a good PCB, it will fit the die perfectly and pass the test. If it does not fit, it indicates that the routing is not in place, and it is a defective PCB that needs to be re-routed. Since the die-casting cavity 4 is engraved based on a good PCB, it is difficult to remove the good PCB after it is placed in. The pick-and-place slot 2 is located adjacent to and connected to the die-casting cavity 4. Even when the good PCB fits the die-casting cavity 4 perfectly, the good PCB can still be removed through the pick-and-place slot 2.

[0030] Specifically, after the PCB is routerd, the routerd PCB is inspected using the die-casting substrate 1. The PCB to be inspected is placed into the die-casting cavity 4 for a fit test. If it is a good PCB, it will fit the template perfectly and pass the test. If it does not fit, it means the router is not in place and it is a defective PCB, which needs to be re-routed. The pick-and-place slot 2 is located adjacent to and connected to the die-casting cavity 4. Even when a good PCB fits perfectly into the die-casting cavity 4, it can still be removed using the pick-and-place slot 2, preventing the good PCB from being difficult to remove after being placed into the die-casting cavity 4. Through the above steps, PCBs can be reliably inspected, defective PCBs can be detected, the inspection accuracy is high, and the workload required for inspection is reduced.

[0031] The mold base plate 1 is made of aluminum. Aluminum plates have excellent machinability, which helps to reduce the processing difficulty of the mold cavity 4. Aluminum plates also have excellent corrosion resistance, which helps to extend the service life of the mold base plate 1.

[0032] See Figure 1 and Figure 3 As shown, in some embodiments, two pick-and-place slots 2 are provided, respectively located on the lateral sides of the mold cavity 4, and the pick-and-place slots 2 are connected to the mold cavity 4. The width direction of the mold cavity 4 is lateral, and the length direction is longitudinal. The pick-and-place slots 2 are provided to facilitate the picking and placing of the PCB to be tested. Specifically, by providing pick-and-place slots 2 on both lateral sides of the mold cavity 4, the PCB can be pried out from either side of the mold cavity 4, and the PCB to be tested can be clamped in or out by placing both hands in the two pick-and-place slots 2 respectively. This facilitates the picking and placing of the PCB to be tested.

[0033] See Figure 1 and Figure 2As shown, in some embodiments, a guide portion 7 is further included, which is disposed at the top of the mold cavity 4. The guide portion 7 facilitates the placement of the PCB to be tested into the mold cavity 4. Since the size of the mold cavity 4 is adapted to the PCB, it is necessary to align the PCB with the mold cavity 4 before placing the PCB into the mold cavity 4. When there is a slight deviation in the position between the PCB and the mold cavity 4, the guide portion 7 allows the misaligned PCB to slide into the mold cavity 4.

[0034] The guide portion 7 can be an arc-shaped guide portion 7 or an inclined guide portion 7. In this embodiment, the guide portion 7 is preferably an arc-shaped guide portion 7.

[0035] See Figure 1 and Figure 4 As shown, in some embodiments, four pick-and-place slots 2 are provided. Two pick-and-place slots 2 are respectively located on the lateral sides of the mold cavity 4, and two pick-and-place slots 2 are respectively located on the longitudinal sides of the mold cavity 4. The pick-and-place slots 2 are connected to the mold cavity 4. Pick-and-place slots 2 are provided on all four sides of the mold cavity 4. The arrangement of multiple pick-and-place slots 2 is beneficial for picking and placing PCBs. In this embodiment, two adjacent pick-and-place slots 2 can be provided on any side of the mold cavity 4. The above arrangement of pick-and-place slots 2 is more conducive to picking and placing PCBs.

[0036] See Figure 1 and Figure 5 As shown, in some embodiments, it further includes: a finger hole 8, which is disposed on the mold base plate 1, penetrates the mold base plate 1, and is at least partially located within the mold cavity 4. Because the good PCB is adapted to the mold cavity 4, it is difficult to remove the good PCB after it is placed in the mold cavity 4. The finger hole 8 is a through hole and is partially located within the mold cavity 4. When removing the PCB, especially when removing a difficult-to-remove PCB, the mold base plate 1 can be flipped over, and the PCB can be pushed out through the finger hole 8.

[0037] In this embodiment, the finger hole 8 is located in the pick-and-place slot 2. When encountering a difficult-to-remove PCB, there is no need to flip the mold base plate 1. Simply insert the finger hole 8 into the pick-and-place slot 2 and push the PCB out by contacting the back of the PCB through the finger hole 8.

[0038] See Figure 1 and Figure 2 As shown, in some embodiments, it further includes: a first arc-shaped portion 5, the mold base plate 1 is provided with the first arc-shaped portion 5; and a second arc-shaped portion 3, the pick-and-place groove 2 is provided with the second arc-shaped portion 3. The provision of the first arc-shaped portion 5 and the second arc-shaped portion 3 helps to avoid the edges of the mold base plate 1 and the pick-and-place groove 2 from scratching people's hands. Due to the PCB inspection process, the workers' hands need to frequently come into contact with the mold base plate 1 and the pick-and-place groove 2. The provision of the first arc-shaped portion 5 and the second arc-shaped portion 3 helps to reduce the risk of scratches.

[0039] The above description is only a part or preferred embodiment of this application. Neither the text nor the drawings should limit the scope of protection of this application. All equivalent structural transformations made using the content of this application's specification and drawings under the overall concept of this application, or direct / indirect applications in other related technical fields, are included within the scope of protection of this application.

Claims

1. A die for preventing leakage of PCB solder balls, characterized in that, include: Mold base plate (1); A mold cavity (4) is formed on the mold substrate (1). The mold cavity (4) is used for inserting a PCB. The mold cavity (4) is adapted to the PCB. The pick-and-place slot (2) is disposed on the mold base plate (1) and is disposed adjacent to the mold cavity (4).

2. The PCB anti-leakage soldering mold according to claim 1, characterized in that, There are two pick-and-place slots (2), which are located on the lateral sides of the mold cavity (4) and are connected to the mold cavity (4).

3. The PCB anti-leakage soldering mold according to claim 1, characterized in that, Also includes: The guide part (7) is located at the top of the mold cavity (4).

4. The PCB anti-leakage soldering mold according to claim 2, characterized in that, The pick-and-place slots (2) are provided in four ways. Two of the pick-and-place slots (2) are located on the lateral sides of the mold cavity (4) and two of the pick-and-place slots (2) are located on the longitudinal sides of the mold cavity (4). The pick-and-place slots (2) are connected to the mold cavity (4).

5. A PCB anti-leakage soldering mold according to claim 1, characterized in that, Also includes: Finger hole (8) is provided on the mold base plate (1), the finger hole (8) penetrates the mold base plate (1), and the finger hole (8) is at least partially located in the mold cavity (4).

6. A PCB anti-leakage soldering mold according to claim 5, characterized in that, Also includes: The first arc-shaped portion (5) is provided on the mold base plate (1); The second arc-shaped part (3) is provided in the pick-and-place slot (2).

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