Clamp for pressing substrate

Abstract

The utility model relates to the technical field of electronics, in particular to a clamp for pressing a substrate. The substrate comprises a bonding area and an invalid area outside the bonding area, and the bonding area is used for placing an electronic device. The clamp comprises a clamp body; the bulge is arranged on the clamp body and corresponds to the invalid area; and when the substrate is pressed by the clamp, the clamp is not in contact with the bonding area, and the bulge is in contact with the ineffective area. According to the clamp provided by the embodiment of the invention, the flatness of the substrate during fixation can be improved, so that the precision degree of a bonding assembly process is improved.

Description

Technical Field

[0001] This specification relates to the field of electronic technology, and in particular to a clamp for pressing substrates. Background Technology

[0002] The substrate serves as the carrier for electronic devices. In bonding assembly processes, electronic devices are precisely picked up and placed onto the bonding area on the substrate for bonding assembly. For example, in bonding assembly processes, bare dies are precisely picked up and placed onto the bonding area on the substrate. A bare die is a chip that has not been packaged. Utility Model Content

[0003] To pick up electronic devices and place them into the bonding area of ​​a substrate, the substrate needs to be fixed. In related technologies, vacuum adsorption can be used to fix the substrate. For example, a vacuum adsorption device can be used to adsorb the bottom surface of the substrate, and the negative pressure generated by the vacuum adsorption fixes the substrate onto the bonding assembly equipment. After fixing the substrate using vacuum adsorption, electronic devices can be picked up with high precision into the bonding area on the front side of the substrate. The inventors have discovered that due to the material properties of the substrate (such as flexibility and thermal deformation), vacuum adsorption is difficult to completely adhere to the bottom surface of the substrate, and the substrate is prone to local deformation or warping. This affects the flatness of the substrate on the bonding assembly equipment, thus affecting the accuracy of the bonding assembly process. In particular, when the substrate is a flexible substrate, local warping is more likely to occur, further affecting the flatness of the substrate.

[0004] To address the aforementioned technical problems or other similar issues, this specification provides a fixture for pressing substrates to improve the flatness of the substrates during the bonding assembly process, thereby improving the accuracy of the bonding assembly process.

[0005] This specification provides a fixture for pressing a substrate, the substrate including a bonding region and an invalid region other than the bonding region, the bonding region being used to place electronic devices; the fixture includes:

[0006] Fixture body;

[0007] The protrusions provided on the fixture body correspond to the invalid area; when the fixture presses the substrate, the fixture does not contact the bonding area, but the protrusions contact the invalid area.

[0008] In some embodiments, the protrusion extends beyond the bottom and side surfaces of the clamp body;

[0009] When the clamp presses the substrate, the bottom surface of the clamp body does not contact the invalid area.

[0010] In some embodiments, the protrusion is fixedly disposed on the bottom surface of the clamp body.

[0011] In some embodiments, the protrusion is movably disposed on the bottom surface of the clamp body;

[0012] The protrusion moves in a direction parallel to the side of the clamp body.

[0013] In some embodiments, the protrusion extends beyond the side of the clamp body;

[0014] The bottom surface of the protrusion is on the same plane as the bottom surface of the clamp body.

[0015] In some embodiments, the number of protrusions is multiple, and the bottom surfaces of the multiple protrusions are on the same plane.

[0016] In some embodiments, the substrate includes one or more rows of bonding regions;

[0017] The invalid region includes the region between adjacent bonded regions within a row of bonded regions;

[0018] The spacing between adjacent protrusions matches the spacing between adjacent bonding regions within a row of bonding regions.

[0019] In some embodiments, the inner surface of the protrusion forms a guide ramp.

[0020] In some embodiments, the direction of inclination of the guide ramp from bottom to top forms an acute angle with the direction of movement of the clamp relative to the substrate.

[0021] In some embodiments, the substrate includes a flexible substrate.

[0022] The technical solution of this specification embodiment uses a fixture to fix the substrate by pressing down, which avoids the inability of vacuum adsorption to completely adhere to the bottom surface of the substrate, thus preventing any impact on the flatness of the substrate during the bonding assembly process. Furthermore, the substrate includes a bonding area and an invalid area outside the bonding area; the bonding area is used to place electronic devices. Protrusions are provided on the fixture body, corresponding to the invalid areas on the substrate. When the fixture fixes the substrate by pressing down, the protrusions contact the invalid areas, while the fixture does not contact the bonding area. Therefore, it is possible to press down on the substrate while avoiding the bonding area, thereby preventing interference with the bonding assembly of the substrate, such as avoiding interference with electronic devices within the bonding area or the adhesive applied after dispensing within the bonding area.

[0023] The embodiments of this specification are disclosed in detail with reference to the following description and accompanying drawings, indicating how the principles of these embodiments can be applied. It should be understood that the scope of the embodiments described herein is not limited thereto. Within the spirit and scope of the appended claims, the embodiments of this specification include many changes, modifications, and equivalents. Attached Figure Description

[0024] The accompanying drawings, which form part of this specification, are used to provide a further understanding of the embodiments thereof and illustrate the implementation methods described herein, together with the textual description, to explain the technical principles of the embodiments thereof. Obviously, the drawings described below are merely some embodiments of this specification, and those skilled in the art can obtain other implementation methods based on these drawings without creative effort. In the drawings:

[0025] Figure 1 This is a top view of the fixture in the embodiments of this specification;

[0026] Figure 2 This is a schematic diagram of the bottom surface of the fixture in the embodiments of this specification;

[0027] Figure 3 This is a partially enlarged schematic diagram of the protrusion in the embodiments of this specification;

[0028] Figure 4 This is a schematic diagram of the clamp pressing substrate in the embodiments of this specification. Detailed Implementation

[0029] The technical solutions in the embodiments of this specification will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this specification, and not all embodiments. The specific embodiments described herein are only used to explain this disclosure, and not to limit this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure are within the scope of protection of this disclosure. In addition, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations.

[0030] This specification provides a fixture for pressing substrates. The fixture is used to fix a substrate by pressing it down during electronic device assembly processes. The pressing can be understood as applying pressure to bring the fixture and the substrate into contact, thereby fixing the substrate.

[0031] In some embodiments, please refer to Figure 1 , Figure 2 ,Figure 3 and Figure 4 Substrate 2 can be a printed circuit board or other base. Substrate 2 is used to support electronic devices, such as bare dies. A bare die is a chip that has not been packaged. Bare dies can include MEMS (Micro-Electro-Mechanical System) bare dies. Substrate 2 can include flexible substrates and rigid substrates. Flexible substrates, also known as soft substrates, can be bent. Rigid substrates are difficult to bend. Substrate 2 can include multiple bonding regions 21. Bonding regions 21 are areas used to place electronic devices to achieve the mounting of electronic devices. Areas on substrate 2 other than bonding regions 21 are invalid regions 22. Invalid regions 22 are not used to place electronic devices.

[0032] Multiple bonding regions 21 are arranged in an array on the substrate 2. The substrate 2 may have one or more rows of bonding regions. Each row of bonding regions may include multiple bonding regions 21. Within each row of bonding regions, there may be gaps between adjacent bonding regions 21. The gaps between adjacent bonding regions 21 may form invalid regions 22. Within each row of bonding regions, the gaps between adjacent bonding regions 21 may be the same or different. The spacing between two adjacent rows of bonding regions can be flexibly set according to actual needs.

[0033] In some embodiments, during the bonding assembly process, the fixture 1 can fix the substrate 2 by pressing. The substrate 2 can be placed on the bonding assembly equipment (such as a transfer track). The fixture 1 can be positioned on a pressing device. The pressing device moves towards the substrate 2, causing the fixture 1 to contact the substrate 2, thereby pressing the substrate 2 firmly onto the bonding assembly equipment. After fixing the substrate 2 by pressing, adhesive can be applied to the bonding area 21 of the substrate 2; electronic devices can be placed in the bonded area 21 after adhesive application, thereby setting the electronic devices on the substrate 2. After setting the electronic devices on the bonding area 21 of the substrate 2, wire bonding can be performed on the electronic devices on the substrate 2 to achieve electrical connection.

[0034] The aforementioned pressing device may include a pressing machine, etc. For example, the clamp body 11 may be provided with mounting holes. The clamp 1 can be mounted on the pressing device through the mounting holes. Of course, other methods can also be used to mount the clamp 1 on the pressing device.

[0035] In some embodiments, please refer to Figure 1 , Figure 2 , Figure 3 and Figure 4The fixture 1 may include a fixture body 11 and a protrusion 12. The protrusion 12 may be disposed on the fixture body 11. The protrusion 12 may correspond to an invalid region 22 on the substrate 2, for example, it may correspond to an invalid region 22 formed by the gap between adjacent bonding regions 21 in each row of bonding regions. When the fixture 1 presses down on the substrate 2, the protrusion 12 contacts the invalid region 22, and the fixture 1 (such as the fixture body 11 and the protrusion 12) does not contact the bonding region 21. This non-contact can be understood as a certain gap between the bottom surface 111 of the fixture body 11 and the bottom surface 121 of the protrusion 12 and the substrate 2.

[0036] The fixture 1 fixes the substrate 2 by pressing down, which avoids the inability of vacuum adsorption to fully adhere to the bottom surface of the substrate 2, thus affecting the flatness of the substrate 2 during the bonding assembly process. This improves the flatness of the substrate 2 during fixing in the bonding assembly process, thereby improving the accuracy of the bonding assembly process. Furthermore, a protrusion 12 is provided on the fixture body 11, corresponding to the ineffective area 22 on the substrate 2. When the fixture 1 presses down to fix the substrate 2, the protrusion 12 contacts the ineffective area 22, and the fixture 1 (such as the fixture body 11 and the protrusion 12) does not contact the bonding area 21. Therefore, the substrate 2 can be pressed down while avoiding the bonding area 21 on the substrate 2, thereby avoiding interference with the bonding assembly of the substrate 2, such as avoiding interference with electronic components within the bonding area 21 or the adhesive applied after dispensing within the bonding area 21.

[0037] The fixture body 11 and the protrusion 12 can be made of metal materials such as aluminum alloy, or they can be made of engineering plastics.

[0038] The fixture body 11 can be rectangular or other shapes. The height of the fixture body 11 is less than its length and width, making the fixture body 11 thinner. This avoids interference with electronic devices on the substrate 2 during the bonding assembly process.

[0039] The protrusion 12, also known as a bump or clamping component, is used to contact the ineffective area 22 when the substrate 2 is pressed down.

[0040] In some embodiments, the protrusion 12 may protrude beyond the bottom surface 111 and the side surface of the clamp body 11. For example, the protrusion 12 may extend from the bottom surface 111 in a direction away from the bottom surface 111, thereby exceeding the bottom surface 111; the protrusion 12 may also extend in a direction away from the side surface of the clamp body 11, thereby exceeding the side surface of the clamp body 11, forming a finger-like protrusion. The bottom surface 111 is the surface on the clamp body 11 used for contacting the substrate 2, and the side surface is the surface on the clamp body 11 perpendicular to the substrate 2.

[0041] The protrusion 12 can extend from the bottom surface 111 in a direction away from the bottom surface 111, thus exceeding the bottom surface 111. Therefore, when the clamp 1 presses the substrate 2, the bottom surface 121 of the protrusion 12 contacts the ineffective region 22 on the substrate 2, while the bottom surface 111 of the clamp body 11 does not contact the ineffective region 22 or the bonding region 21. In this way, the clamp 1 can press down on the substrate 2 solely through the contact between the protrusion 12 and the ineffective region 22. When the clamp 1 presses down on the substrate 2, there is a certain gap between the bottom surface 111 of the clamp body 11 and the substrate 2, thereby avoiding interference with electronic devices already placed on the substrate 2 and above the surface of the substrate 2, improving safety.

[0042] The protrusion 12 can also extend away from the side of the fixture body 11, thus extending beyond the side of the fixture body 11 to form a finger-like protrusion. Therefore, the protrusion 12 can contact the ineffective region 22 between adjacent bonding regions 21, thereby avoiding the bonding region 21. Furthermore, this allows the operator to visually perceive the position of the protrusion 12 on the substrate 2 from a top-down view.

[0043] The height of protrusion 12 exceeding the bottom surface 111 (e.g.) Figure 4 The height of the protrusion 12 beyond the bottom surface 111 (e.g., H) can be set according to the size of the electronic device. Figure 4 The height of the protrusion 12 (H) can be greater than the height of the electronic device. This avoids interference with the electronic devices already placed on the substrate 2, improving safety. The protrusion 12 extends beyond the side length (e.g., Figure 4 The L in the figure can be set according to the size of the bonding area 21. The length of the protrusion 12 extending beyond the side (e.g.) Figure 4 The L in the text can be smaller than the width of the bonding region 21.

[0044] In some embodiments, the protrusion 12 may be vertically protruding from the bottom surface 111 of the clamp body 11; and may extend from the clamp body 11 in a direction away from the side of the clamp body 11, thereby extending beyond the side of the clamp body 11 to form a finger-shaped protrusion.

[0045] Optionally, the protrusion 12 can be fixedly disposed on the bottom surface 111 of the clamp body 11. This can improve the stability of the protrusion 12.

[0046] For example, the protrusion 12 can be integrally formed with the clamp body 11, thereby being fixedly disposed on the bottom surface 111 of the clamp body 11.

[0047] Optionally, the protrusion 12 can also be movably disposed on the bottom surface 111 of the fixture body 11. The moving direction of the protrusion 12 can be parallel to the side surface of the fixture body 11. In this way, the protrusion 12 can move in a direction parallel to the side surface. Considering that the protrusion 12 corresponds to the invalid region 22 on the substrate 2, the gap between adjacent bonding regions 21 on substrates of different specifications is different. By moving the protrusion 12, the protrusion 12 can adapt to substrates of different specifications, thereby corresponding to the invalid region 22 on substrates of different specifications.

[0048] For example, a straight groove can be provided on the bottom surface 111 of the fixture body 11. The extension direction of the straight groove is parallel to the side surface of the fixture body 11. The straight groove includes, but is not limited to, T-slots, dovetail slots, rectangular slots, etc. A slider is provided on the protrusion 12. The slider can be set in the straight groove. Through the interaction between the slider and the straight groove, the protrusion 12 can move on the bottom surface 111 of the fixture body 11. A locking bolt can also be provided on the slider. When the locking bolt is loosened, the protrusion 12 can move on the bottom surface 111 of the fixture body 11. When the locking bolt is tightened, the protrusion 12 remains fixed. This allows the protrusion 12 to be fixed at any position in the straight groove. When using the fixture 1 to press the substrate 2, the position of the protrusion 12 on the bottom surface 111 of the fixture body 11 can be adjusted according to the gap between adjacent bonding areas 21 on the substrate 2 so that the protrusion 12 corresponds to the invalid area 22.

[0049] In some embodiments, the number of protrusions 12 can be multiple. The bottom surfaces 121 of the multiple protrusions 12 can be on the same plane. Thus, when the fixture 1 presses down on the substrate 2, the multiple ineffective areas 22 on the substrate 2 that are in contact with the multiple protrusions 12 can be on the same plane, thereby improving the flatness of the substrate 2 during fixation and thus improving the accuracy of the bonding assembly process.

[0050] The aforementioned protrusions 12 can be located on the same side of the clamp body 11, thereby forming a row of protrusions 12.

[0051] The aforementioned multiple invalid regions 22 can be formed by the gaps between multiple pairs of adjacent bonded regions 21 within a row of bonded regions.

[0052] As an example, multiple protrusions 12 may be provided only on one side of the bottom surface 111 of the fixture body 11.

[0053] As another example, multiple protrusions 12 can be provided on opposite sides of the bottom surface 111 of the clamp body 11. This increases the contact area between the clamp 1 and the substrate 2 when pressed down, thereby further improving the flatness of the substrate 2 when fixed.

[0054] In some embodiments, the spacing between the protrusions 12 can be matched with the arrangement of the bonding regions 21 on the substrate 2. When the fixture 1 presses down on the substrate 2, the protrusions 12 can come into contact with the ineffective regions 22 formed by the gaps between the bonding regions 21.

[0055] A row of protrusions 12 on the fixture body 11 matches a row of bonding areas on the substrate 2. The spacing between adjacent protrusions 12 can match the gap between adjacent bonding areas 21 within the row of bonding areas. Thus, when the substrate 2 is pressed down, a protrusion 12 can contact the ineffective area 22 between a pair of adjacent bonding areas 21 within the row of bonding areas 21, avoiding the bonding areas.

[0056] In some embodiments, the inner surface of each protrusion 12 can be a guide ramp 122. The inner surface is the side of the protrusion 12 facing the interior of the clamp body 11. The inclined direction of the guide ramp 122 from bottom to top forms an acute angle with the direction of movement of the clamp 1 relative to the substrate 2. In this way, when the clamp 1 moves relative to the substrate 2, the protrusion 12 will not interfere with (e.g., hook) the local warping of the substrate 2. For example, the length of the bottom surface 121 of the protrusion 12 is less than the length of the corresponding top surface, so that the inner surface can form the guide ramp 122.

[0057] The guide ramp 122 is used to guide the local warping on the substrate 2 to pass safely through the clamp 1 when the substrate 2 moves relative to the clamp 1, so that the protrusion 12 will not hook onto the local warping of the substrate 2 and thus damage the substrate 2.

[0058] Figure 4 The direction of the middle arrow indicates the direction of movement of clamp 1 relative to substrate 2 when clamp 1 is stationary and substrate 2 is moving. For example, if substrate 2 moves to the left, clamp 1 can move to the right relative to substrate 2.

[0059] For example, the substrate 2 may have multiple rows of bonding regions. Each row of bonding regions may include multiple bonding regions 21. Within a row of bonding regions, the area between adjacent bonding regions 21 forms an invalid region 22. In the bonding assembly process, when it is necessary to apply adhesive or place electronic devices in a certain row of bonding regions, a jig 1 can be placed on the substrate 2 to press down on that row of bonding regions. Pressing down on the row of bonding regions by the jig 1 may mean that when the jig 1 presses down on the substrate 2, the protrusion 12 on the jig body 11 contacts the invalid region 22 between adjacent bonding regions 21 within that row of bonding regions. Adhesive can be applied to that row of bonding regions; electronic devices can be placed within the bonded regions 21 after adhesive application. Then the jig 1 can be lifted to release the substrate 2. The substrate 2 can be moved to press down on another adjacent row of bonding regions. ​For example, substrate 2 can be moved to the left, allowing clamp 1 to move to the right relative to substrate 2. Then, adhesive can be applied to the other row of bonding areas; electronic devices can be placed within the adhesive-applied bonding areas 21. This process is repeated until all bonding areas 21 on the substrate contain electronic devices. When clamp 1 is lifted, substrate 2 may warp locally due to the material of the substrate 2. By setting the inner surface of protrusion 12 as a guide slope 122, protrusion 12 will not interfere with (e.g., hook) local warping on substrate 2 when clamp 1 moves relative to substrate 2, thus improving safety.

[0060] Of course, the protrusion can also be provided on the fixture body in other ways. Another embodiment is described below. The protrusion can extend beyond the side of the fixture body. The bottom surface of the protrusion is on the same plane as the bottom surface of the fixture body. Therefore, when the fixture presses the substrate, the protrusion can contact the ineffective area, and the bottom surface of the fixture body can also contact the ineffective area. This increases the overall contact area between the fixture and the substrate, thereby improving the flatness of the substrate during fixation. Furthermore, this makes it easier for operators to visually perceive the position of the protrusion on the substrate from a top-down view.

[0061] In some embodiments, the protrusion may be provided on the side of the clamp body. The protrusion may extend from the side of the clamp body away from the cover side, thereby extending beyond the side of the clamp body to form a finger-like protrusion. The length of the protrusion extending beyond the side (i.e., the length of the extension) may be set according to the size of the bonding area. The length of the protrusion extending beyond the side may be less than the width of the bonding area.

[0062] Optionally, the protrusion can be fixedly mounted on the side of the clamp body. This improves the stability of the protrusion.

[0063] For example, the protrusion can be integrally formed with the fixture body, thereby achieving a fixed installation on the side of the fixture body.

[0064] Optionally, the protrusion can also be movably disposed on the side of the fixture body. The direction of movement of the protrusion is parallel to the side of the fixture body. In this way, the protrusion can move in a direction parallel to the side. Considering that the protrusion corresponds to the invalid area on the substrate, the gap between adjacent bonding areas on substrates of different specifications is different. By moving the protrusion, the protrusion can adapt to substrates of different specifications, thereby corresponding to the invalid areas on substrates of different specifications.

[0065] For example, a linear groove can be provided on the side of the fixture body. The extension direction of the linear groove is parallel to the side of the fixture body. The linear groove includes, but is not limited to, T-slots, dovetail slots, rectangular slots, etc. A slider is provided on the protrusion. The slider can be set within the linear groove. Through the interaction between the slider and the linear groove, the protrusion can move on the side of the fixture body. A locking bolt can be provided on the slider. When the locking bolt is loosened, the protrusion can move on the side of the fixture body. When the locking bolt is tightened, the protrusion can remain fixed. This allows the protrusion to be fixed at any position in the linear groove. When using the fixture to press the substrate, the position of the protrusion on the side of the fixture body can be adjusted according to the gap between adjacent bonding areas on the substrate so that the protrusion corresponds to the invalid area.

[0066] Optionally, the protrusions can also be disposed on the side of the fixture body via a height adjustment component. The height adjustment component is used to adjust the height of the protrusions in a direction perpendicular to the substrate to compensate for deviations in substrate thickness or surface unevenness, ensuring stable contact between each protrusion and the ineffective areas of the substrate. The height is the height of the protrusion relative to the substrate. The protrusions can be disposed on the height adjustment component, which can be disposed on the side of the fixture body.

[0067] For example, the adjusting component may include a spring, thereby enabling adaptive adjustment of the protrusion height.

[0068] In some embodiments, there can be multiple protrusions. The bottom surfaces of the multiple protrusions can be on the same plane. Thus, when the fixture presses down on the substrate, multiple ineffective areas on the substrate that come into contact with the multiple protrusions can be on the same plane, thereby improving the flatness of the substrate during fixation, and consequently improving the accuracy of the bonding assembly process.

[0069] The aforementioned protrusions can be located on the same side of the clamp body 11, thereby forming a row of protrusions.

[0070] The aforementioned invalid regions can be formed by gaps between adjacent bonded regions within a row of bonded regions.

[0071] In some embodiments, the spacing between the protrusions can be matched to the arrangement of bonding regions on the substrate. When the fixture presses down on the substrate, the protrusions can contact the ineffective areas formed by the gaps between the bonding regions.

[0072] A row of protrusions on the fixture body matches a row of bonding areas on the substrate. The spacing between adjacent protrusions matches the gap between adjacent bonding areas within the same row of bonding areas. Thus, when the substrate is pressed down, a protrusion can contact the ineffective area between a pair of adjacent bonding areas within the same row of bonding areas, avoiding the bonding areas.

[0073] In some embodiments, the outer surface of each protrusion can be a guide ramp. The outer surface is the side of the protrusion facing the outside of the fixture body. The inclination direction of the guide ramp from bottom to top forms an acute angle with the direction of movement of the fixture relative to the substrate. This prevents the protrusion from hooking (e.g., snagging) on ​​local warping of the substrate when the fixture moves relative to the substrate. The protrusion has a bottom surface and an opposing top surface. The extension length of the bottom surface relative to the side of the fixture body 1 is less than the extension length of the top surface relative to the side of the fixture body 1, allowing the outer surface to form a guide ramp.

[0074] For example, a substrate can have multiple rows of bonding regions. A row of bonding regions can include multiple bonding regions. Within a row of bonding regions, the area between adjacent bonding regions can form an ineffective region. In the bonding assembly process, when it is necessary to apply adhesive or place electronic devices in a certain row of bonding regions, a jig can be placed on the substrate to press down on that row of bonding regions. Pressing down on the row of bonding regions by the jig can mean that when the jig presses down on the substrate, the protrusions of the jig contact the ineffective region between adjacent bonding regions within that row of bonding regions. Adhesive can be applied to that row of bonding regions; electronic devices can be placed in the bonded regions after adhesive application. Then the jig can be lifted to release the substrate. The substrate can be moved to press down on another adjacent row of bonding regions. Adhesive can then be applied to that other row of bonding regions; electronic devices can be placed in the bonded regions after adhesive application. This process is repeated until electronic devices are placed in all bonding regions on the substrate. When lifting the jig, due to the material of the substrate, local warping may occur. By setting the outer surface of the protrusion as a guiding slope, the protrusion will not hook onto local warping on the substrate, thereby improving safety.

[0075] Those skilled in the art will understand that the descriptions of the various embodiments in this specification have different focuses, and parts not described in detail in a certain embodiment can be referred to in the relevant descriptions of other embodiments. Furthermore, it is understood that those skilled in the art, after reading this specification, can conceive of any combination of some or all of the embodiments listed in this specification without creative effort, and such combinations are also within the scope of disclosure and protection of this specification.

[0076] Although this specification has been described through embodiments, those skilled in the art will understand that the above embodiments are merely illustrative of the core ideas of this specification. Those skilled in the art will appreciate that many variations and modifications are possible with this specification. It is intended that the appended claims encompass these variations and modifications without departing from the spirit of this specification.

Claims

1. A clamp for pressing substrates, characterized in that, The substrate includes a bonding region and an invalid region outside the bonding region, the bonding region being used to place electronic devices; the fixture includes: Fixture body; The protrusions provided on the fixture body correspond to the invalid area; when the fixture presses the substrate, the fixture does not contact the bonding area, but the protrusions contact the invalid area.

2. The clamp according to claim 1, characterized in that, The protrusion extends from the bottom and side surfaces of the clamp body; When the clamp presses the substrate, the bottom surface of the clamp body does not contact the invalid area.

3. The clamp according to claim 2, characterized in that, The protrusion is fixedly disposed on the bottom surface of the clamp body.

4. The clamp according to claim 2, characterized in that, The protrusion is movably disposed on the bottom surface of the clamp body; The protrusion moves in a direction parallel to the side of the clamp body.

5. The clamp according to claim 1, characterized in that, The protrusion protrudes from the side of the clamp body; The bottom surface of the protrusion is on the same plane as the bottom surface of the clamp body.

6. The clamp according to claim 2 or 5, characterized in that, The number of protrusions is multiple, and the bottom surfaces of the multiple protrusions are on the same plane.

7. The clamp according to claim 6, characterized in that, The substrate includes one or more rows of bonding regions; The invalid region includes the region between adjacent bonding regions within each row of bonding regions; The spacing between adjacent protrusions matches the spacing between adjacent bonding regions within each row of bonding regions.

8. The clamp according to claim 1, characterized in that, The inner surface of the protrusion forms a guiding slope.

9. The clamp according to claim 8, characterized in that, The direction of inclination of the guide ramp from bottom to top forms an acute angle with the direction of movement of the clamp relative to the substrate.

10. The clamp according to claim 1, characterized in that, The substrate includes a flexible substrate.

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