Semiconductor silicon wafer grinding and cleaning device

Abstract

The utility model relates to the technical field of silicon wafer cleaning, in particular to a semiconductor silicon wafer grinding and cleaning device which comprises a cleaning frame and a cleaning box, and the cleaning box is installed at the inner bottom of the cleaning frame. A supporting plate fixed in the cleaning frame is arranged above the cleaning box, a plurality of cleaning openings penetrating up and down are formed in the supporting plate, clamping plates are arranged on the two sides in the cleaning openings, and elastic reset assemblies are arranged on the outer sides of the clamping plates; the top in the cleaning frame is rotationally connected with a shaft tube which rotates downwards and penetrates through the middle of the supporting plate; according to the utility model, the silicon wafer in each cleaning port is helped to rotatably spray cleaning liquid and clean, the upper and lower surfaces of the silicon wafer are simultaneously washed without turning over the silicon wafer, the cleaning efficiency is better improved, and the upper and lower surfaces of the silicon wafer are simultaneously swept and cleaned by combining the rotating soft cotton brush, so that the silicon wafer is more cleanly cleaned, and the cleaning efficiency is improved. And the subsequent use effect of the silicon wafer is ensured.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer cleaning technology, and in particular to a semiconductor silicon wafer grinding and cleaning device. Background Technology

[0002] Silicon wafers play a crucial role in many fields. They are an important material for manufacturing integrated circuits and are one of the cornerstones of China's "chip" infrastructure and new infrastructure. The raw material is silicon, and the wafer is the silicon chip used to make silicon semiconductor circuits. After the silicon wafer is ground and processed, dust remains on its surface, so it needs to be cleaned.

[0003] In existing technologies, air is generally blown onto the surface of silicon wafers to remove impurities. However, some impurities cannot be effectively blown away, and these impurities remain on the surface of the silicon wafer, which will affect subsequent use. Moreover, it is generally possible to clean only one side of the silicon wafer, and after cleaning one side, the silicon wafer is flipped over to clean the other side, resulting in low cleaning efficiency. Utility Model Content

[0004] This invention provides a semiconductor silicon wafer grinding and cleaning device, which facilitates the thorough cleaning of silicon wafers and has high cleaning efficiency.

[0005] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0006] A semiconductor silicon wafer grinding and cleaning device includes a cleaning rack and a cleaning box, wherein the cleaning box is installed at the bottom of the cleaning rack;

[0007] The cleaning box is provided with a support plate fixed inside the cleaning rack. The support plate has several vertically penetrating cleaning openings. Clamping plates are provided on both sides of each cleaning opening, and elastic reset components are provided on the outer side of each clamping plate.

[0008] The cleaning rack has a rotating shaft tube that rotates downwards and passes through the middle of the support plate. The upper and lower parts of the support plate are provided with cleaning tubes on the left and right sides that communicate with the shaft tube. The inner side of each cleaning tube is connected to a soft brush and several nozzles. Each nozzle is connected to an adjacent cleaning tube. A rotation drive assembly is provided outside the shaft tube.

[0009] Furthermore, rubber pads are connected to the inner sides of the clamps.

[0010] Furthermore, each of the elastic reset components includes a push rod, a sliding block, and a spring. The push rod is fixed to the outside of the clamping plate. Both sides of the inner wall of the cleaning port are provided with shrinkage grooves. The sliding blocks are slidably connected in the shrinkage grooves, and the ends of the push rods are connected to one side of the adjacent sliding blocks. One end of the spring is connected to the inner side wall of the shrinkage groove, and the other end of the spring is connected to the other side of the adjacent sliding block.

[0011] Furthermore, a water pump is connected to the upper end of the cleaning box, and the shaft tube is rotatably connected to and communicates with the water pump.

[0012] Furthermore, a liquid filling pipe is connected to the upper end of the cleaning box.

[0013] Furthermore, the rotary drive assembly includes a motor, a main gear, and a secondary gear. The motor is fixed to the top of the cleaning rack, the main gear is connected to the power end of the motor, and the secondary gear is fixedly sleeved around the shaft tube, and the secondary gear meshes with the main gear.

[0014] Furthermore, the inner side of the limiting block is inclined, and the inclined surface of the limiting block matches the inclined surface of the inclined tooth.

[0015] The beneficial effects of this utility model are:

[0016] 1. The elasticity of the elastic reset component facilitates the clamping plate to quickly clamp and install the silicon wafer in the cleaning port, and exposes the top and bottom surfaces of the silicon wafer in the cleaning port. Since multiple cleaning ports are provided, multiple silicon wafers can be installed on the support plate for cleaning, which helps to improve cleaning efficiency.

[0017] 2. By setting a rotating cleaning nozzle, it is convenient to spray cleaning fluid onto the silicon wafers in each cleaning port and clean them. It is also convenient to rinse the top and bottom of the silicon wafers at the same time without flipping the silicon wafers, which greatly improves the cleaning efficiency. In addition, the rotating soft brush sweeps and cleans the top and bottom of the silicon wafers at the same time, which helps to clean the silicon wafers more thoroughly, thereby ensuring the subsequent use effect of the silicon wafers. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0019] Figure 2 This is a partially enlarged structural diagram of part A of the present invention;

[0020] Figure 3 This is a schematic diagram of the clamping plate structure of this utility model;

[0021] Figure 4 This is a schematic diagram of the overall external structure of this utility model.

[0022] Explanation of reference numerals in the attached figures:

[0023] 1. Cleaning rack; 2. Cleaning box; 3. Support plate; 4. Cleaning port; 5. Clamping plate; 6. Shrinkage groove; 7. Push rod; 8. Sliding block; 9. Spring; 10. Water pump; 11. Shaft tube; 12. Cleaning tube; 13. Nozzle; 14. Soft brush; 15. Motor; 16. Main gear; 17. Secondary gear; 18. Rubber pad; 19. Liquid filling tube. Detailed Implementation

[0024] To facilitate understanding by those skilled in the art, the present invention will be further described below with reference to embodiments and accompanying drawings. The content mentioned in the embodiments is not intended to limit the present invention.

[0025] like Figure 1 , 2 As shown in Figure 4, this embodiment includes a cleaning rack 1 and a cleaning box 2. The cleaning box 2 is installed at the bottom of the cleaning rack 1. A support plate 3 fixed inside the cleaning rack 1 is provided above the cleaning box 2. The support plate 3 has several vertically penetrating cleaning openings 4. Clamping plates 5 are provided on both sides of the cleaning openings 4. Elastic reset components are provided on the outer side of the clamping plates 5. Each elastic reset component includes a push rod 7, a sliding block 8, and a spring 9. The push rod 7 is fixed to the outer side of the clamping plate 5. Shrinkage grooves 6 are provided on both sides of the inner wall of the cleaning opening 4. The sliding blocks 8 are slidably connected to the shrinkage grooves 6, and the ends of the push rods 7 are connected to one side of the adjacent sliding blocks 8. One end of the spring 9 is connected to the inner side wall of the shrinkage groove 6, and the other end of the spring 9 is connected to the other side of the adjacent sliding block 8.

[0026] When cleaning the polished silicon wafers using this cleaning device, the silicon wafers are placed into the cleaning port 4. During this process, by pushing the clamping plate 5, the push rod 7 and the sliding block 8 are slid into the shrinkage groove 6. The sliding block 8 compresses the spring 9, and the spring 9 moves the silicon wafer between the two clamping plates 5. After the clamping plates 5 are released, the spring force of the spring 9 drives the sliding block 8, the push rod 7 and the clamping plate 5 to reset until the clamping plate 5 clamps the silicon wafer. This facilitates the quick and convenient clamping and installation of the silicon wafers in the cleaning port 4 for cleaning, and exposes the top and bottom surfaces of the silicon wafers in the cleaning port 4. Since multiple cleaning ports 4 are provided, multiple silicon wafers can be installed on the support plate 3 for cleaning, which helps to improve cleaning efficiency.

[0027] like Figure 3 As shown in this embodiment, rubber pads 18 are connected to the inner sides of the clamping plates 5.

[0028] By providing a rubber pad 18 on the inner side of the clamping plate 5, and the rubber pad 18 being made of elastic rubber, the clamping plate 5 can buffer the silicon wafer when clamping it, thus reducing the damage to the silicon wafer.

[0029] like Figure 1-2As shown, in this embodiment, the top of the cleaning frame 1 is rotatably connected to a shaft tube 11 that rotates downward and passes through the middle of the support plate 3. The left and right sides of the upper and lower parts of the support plate 3 are provided with cleaning tubes 12 that communicate with the shaft tube 11. The inner side of each cleaning tube 12 is connected to a soft brush 14 and several nozzles 13. Each nozzle 13 is connected to an adjacent cleaning tube 12. A rotary drive assembly is provided outside the shaft tube 11. A water pump 10 is connected to the upper end of the cleaning box 2. The shaft tube 11 is rotatably connected to and communicates with the water pump 10. The cleaning ports 4 are aligned vertically with the adjacent nozzles 13 in the upper and lower parts. The rotary drive assembly includes a motor 15, a main gear 16, and a secondary gear 17. The motor 15 is fixed to the top of the cleaning frame 1. The main gear 16 is connected to the power end of the motor 15. The secondary gear 17 is fixedly sleeved around the shaft tube 11 and meshes with the main gear 16.

[0030] After the silicon wafers are installed in the cleaning port 4, the cleaning fluid in the cleaning tank 2 is pumped by the water pump 10 to the shaft tube 11, cleaning tube 12 and nozzle 13. The nozzle 13 sprays the cleaning fluid onto the silicon wafers in the cleaning port 4 for rinsing. At the same time, the motor 15 drives the main gear 16, the secondary gear 17, the shaft tube 11, the cleaning tube 12, the nozzle 13 and the soft brush 14 to rotate together. Therefore, by setting the rotatable cleaning nozzle 13, it is convenient to spray the cleaning fluid onto each silicon wafer in the cleaning port 4 for cleaning. Since the top and bottom of the silicon wafer are exposed, it is convenient to rinse the top and bottom of the silicon wafer at the same time without flipping the silicon wafer, which improves the cleaning efficiency. In addition, the rotating soft brush 14 sweeps and cleans the top and bottom of the silicon wafer at the same time, which helps to clean the silicon wafer more thoroughly, thereby ensuring the subsequent use effect of the silicon wafer.

[0031] like Figure 2 As shown in this embodiment, the upper end of the cleaning tank 2 is connected to a liquid filling pipe 19.

[0032] The cleaning solution can be easily added to the cleaning tank 2 through the filling tube 19, thereby ensuring the cleaning solution level in the cleaning tank 2.

[0033] like Figure 2 As shown, in this embodiment, the push rods 7 are all fixed to the outside of the clamping plate 5, the inner walls of the cleaning port 4 are both provided with shrinkage grooves 6, the sliding blocks 8 are all slidably connected in the shrinkage grooves 6, and the ends of the push rods 7 are all connected to one side of the adjacent sliding block 8. One end of the spring 9 is connected to the inner wall of the shrinkage groove 6, and the other end of the spring 9 is connected to the other side of the adjacent sliding block 8.

[0034] Once the silicon wafer is cleaned, the clamping plate 5 holds the silicon wafer by the elastic force of the spring 9. Therefore, the silicon wafer can be easily pushed out of the cleaning port 4 by simply pushing it up or down, making it easy to remove the cleaned silicon wafer.

[0035] All technical features in this embodiment can be freely combined according to actual needs.

[0036] The above embodiments are preferred implementations of this utility model. In addition, other implementations are also included. Any obvious substitutions without departing from the concept of this technical solution are within the protection scope of this utility model.

Claims

1. A semiconductor silicon wafer grinding and cleaning device, comprising a cleaning rack (1) and a cleaning box (2), wherein the cleaning box (2) is installed at the bottom of the cleaning rack (1), characterized in that: The cleaning box (2) is provided with a support plate (3) fixed inside the cleaning rack (1) above it. The support plate (3) has several vertically penetrating cleaning openings (4). The cleaning openings (4) are provided with clamps (5) on both sides. The clamps (5) are provided with elastic reset components on the outside of each clamp. The cleaning rack (1) is rotatably connected to the top of the inner part of the support plate (3) and rotates downward through the middle part of the support plate (3). The upper and lower parts of the support plate (3) are provided with cleaning tubes (12) communicating with the shaft tube (11) on the left and right sides. The inner side of each cleaning tube (12) is connected with a soft brush (14) and several nozzles (13). Each nozzle (13) is connected to the adjacent cleaning tube (12). The shaft tube (11) is provided with a rotation drive assembly.

2. The semiconductor silicon wafer grinding and cleaning device as described in claim 1, characterized in that: The inner sides of the clamps (5) are all connected with rubber pads (18).

3. The semiconductor silicon wafer grinding and cleaning device as described in claim 1, characterized in that: Each elastic reset component includes a push rod (7), a sliding block (8), and a spring (9). The push rod (7) is fixed to the outside of the clamping plate (5). Both sides of the inner wall of the cleaning port (4) are provided with shrinkage grooves (6). The sliding blocks (8) are slidably connected in the shrinkage grooves (6), and the ends of the push rods (7) are connected to one side of the adjacent sliding blocks (8). One end of the spring (9) is connected to the inner side wall of the shrinkage groove (6), and the other end of the spring (9) is connected to the other side of the adjacent sliding block (8).

4. The semiconductor silicon wafer grinding and cleaning device as described in claim 1, characterized in that: The upper end of the cleaning box (2) is connected to a water pump (10), and the shaft tube (11) is rotatably connected to and communicates with the water pump (10).

5. The semiconductor silicon wafer grinding and cleaning device as described in claim 1, characterized in that: The upper end of the cleaning box (2) is connected to a liquid filling pipe (19).

6. The semiconductor silicon wafer grinding and cleaning device as described in claim 1, characterized in that: The rotary drive assembly includes a motor (15), a main gear (16) and a secondary gear (17). The motor (15) is fixed inside the top of the cleaning rack (1). The main gear (16) is connected to the power end of the motor (15). The secondary gear (17) is fixedly sleeved around the shaft tube (11) and meshes with the main gear (16).

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