Semiconductor turnover device

Abstract

The utility model discloses a semiconductor turnover device, and belongs to the field of semiconductor production equipment. The turnover device comprises a linear power mechanism, a rotary power mechanism, a telescopic shaft and a clamping jaw, the telescopic shaft is rotatably installed on the linear power mechanism, the rotary power mechanism is arranged on the telescopic shaft in a sleeving mode, the clamping jaw is installed on the telescopic shaft, and the linear power mechanism is used for driving the telescopic shaft to linearly move, so that the telescopic shaft drives the clamping jaw to linearly move. The rotary power mechanism is used for driving the telescopic shaft to rotate, so that the telescopic shaft drives the clamping jaw to rotate, and the clamping jaw is used for clamping semiconductor products. According to the utility model, the clamping jaw can take materials from the material box and then turn over the products, and the material taking and turning work of the semiconductor products can be completed only by arranging the turning device on one side of the material box, so that the problem that the air cylinder, the moving mechanism and the turning mechanism need to be respectively arranged on two sides of the material box to work cooperatively in the prior art is solved; and the space utilization rate is low.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor manufacturing equipment, specifically a semiconductor flipping device. Background Technology

[0002] In existing technologies, semiconductor products are typically placed in a material box layer by layer. When double-sided operation is required on the products in the material box, cylinders are usually installed on one side of the material box, and a moving mechanism and a flipping mechanism are installed on the other side. The cylinders push the products in the material box onto the moving mechanism, and then the moving mechanism and the flipping mechanism are used in conjunction with the corresponding equipment to perform double-sided operation on the products. This technical solution requires cylinders, moving mechanisms and flipping mechanisms to be installed on both sides of the material box to complete the semiconductor picking and flipping work, which has the problem of low space utilization. Utility Model Content

[0003] The purpose of this utility model is to provide a semiconductor flipping device that can pick up materials from a material box using grippers and then flip the products. The device only needs to be set on one side of the material box to complete the picking and flipping of semiconductor products. This solves the problem of low space utilization in the prior art, which requires cylinders, moving mechanisms and flipping mechanisms to be set on both sides of the material box to complete the semiconductor flipping work.

[0004] The technical solution of this utility model is as follows: a semiconductor flipping device includes: a linear power mechanism, a rotary power mechanism, a telescopic shaft, and a gripper.

[0005] The telescopic shaft is rotatably mounted on the linear power mechanism, the rotary power mechanism is sleeved on the telescopic shaft, and the gripper is mounted on the telescopic shaft.

[0006] The linear power mechanism is used to drive the telescopic shaft to move linearly, so that the telescopic shaft drives the gripper to move linearly.

[0007] The rotary power mechanism is used to drive the telescopic shaft to rotate, which in turn drives the gripper to rotate.

[0008] The grippers are used to hold semiconductor products.

[0009] In a further embodiment, the semiconductor flipping device further includes a product track.

[0010] The product track is mounted on a rotary power mechanism, and the product track is provided with a track groove.

[0011] The gripper is positioned between two product tracks and is used to drive the semiconductor product into the track groove. It enables the rotary power mechanism to rotate the semiconductor product through the product track and track groove, thereby reducing the extension length of the gripper.

[0012] In a further embodiment, the semiconductor flipping device further includes a track opening mechanism.

[0013] The track opening mechanism is mounted on the rotary power mechanism, and the two product tracks are mounted on the track opening mechanism.

[0014] The track opening mechanism is used to increase the distance between the two product tracks, enabling the product to move linearly with the telescopic shaft without being inserted into the track groove, thereby improving the product movement efficiency.

[0015] In a further embodiment, the track opening mechanism includes: a transverse guide rail, a vertical roller, an elastic element, a longitudinal power source, and an inclined block.

[0016] The transverse guide rail is mounted on the rotary power mechanism, the product track is mounted on the transverse guide rail, the vertical roller is mounted on the product track, the longitudinal power source is located on the side of the rotary power mechanism, the inclined block is mounted on the longitudinal power source, the inclined block has a ramp structure, the ramp structure of the inclined block and the vertical roller can be separably coupled, and the longitudinal power source drives the two product tracks to move in opposite directions through the coupling of the inclined block and the vertical roller.

[0017] One end of the elastic element is connected to the rotary power mechanism, and the other end is connected to the product track. The elastic element is used to drive the two product tracks to move in opposite directions. The inclined block's ramp structure and the vertical roller can be separated and cooperated with each other to prevent the rotary power mechanism and the longitudinal power source from interfering with each other. This allows the rotary power mechanism to avoid driving the longitudinal power source to rotate, reducing the rotational load and improving rotational stability.

[0018] In a further embodiment, the semiconductor flipping device further includes a width limiting member, which is detachably mounted on the rotational power mechanism. The width limiting member is disposed between two product tracks and is used to limit the distance between the two product tracks. By replacing the width limiting member with a different size, the distance between the two product tracks can be adapted to products of different sizes, thus avoiding damage to the products.

[0019] In a further embodiment, the longitudinal power source includes a longitudinal cylinder and a longitudinal guide rail, and the inclined block is mounted on the longitudinal cylinder and the longitudinal guide rail.

[0020] In a further embodiment, the semiconductor flipping device further includes: a roller frame and transverse rollers, the roller frame being mounted on a telescopic shaft, the transverse rollers being mounted on the roller frame, two sets of transverse rollers being disposed on both sides of the product track, the sidewalls of the two sets of transverse rollers being connected to the product track, and the cantilever length of the telescopic shaft being reduced by the two sets of transverse rollers.

[0021] In a further embodiment, the linear power mechanism includes a linear power source and a first bearing housing.

[0022] The first bearing housing is mounted on the linear power source, and the telescopic shaft is mounted on the first bearing housing, allowing the telescopic shaft to be rotatably mounted on the linear power mechanism via the first bearing housing.

[0023] In a further embodiment, the linear power source includes one of an electric cylinder, a lead screw mechanism, a gear and rack mechanism, and a linear motor.

[0024] In a further embodiment, the rotary power mechanism includes: a second bearing housing, a rotary power source, and a rotary sleeve.

[0025] The rotating electric power source and the rotating sleeve are mounted on the second bearing housing, and the rotating power source and the rotating sleeve are connected.

[0026] The rotating sleeve is fitted onto the telescopic shaft. The outer wall of the telescopic shaft and the inner wall of the rotating sleeve are provided with mutually cooperating side planes. Through the cooperation of the rotating sleeve and the telescopic shaft, the rotating sleeve drives the telescopic shaft to rotate while the telescopic shaft can move in a straight line.

[0027] The beneficial effects of this utility model are as follows: This application uses a telescopic shaft that is rotatably mounted on a linear power mechanism, and a rotary power mechanism that is sleeved on the telescopic shaft. This allows the linear power mechanism and the rotary power mechanism to drive the telescopic shaft to move linearly and rotate without interfering with each other. This enables the grippers to pick up materials from the material box and then flip the product. Only a flipping device needs to be set on one side of the material box to complete the picking and flipping of semiconductor products. This solves the problem of low space utilization caused by the existing technology which requires cylinders, moving mechanisms and flipping mechanisms to be set on both sides of the material box. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of an embodiment of the present invention where the flipping device is disposed on one side of the material box.

[0029] Figure 2 This is a schematic diagram of the internal structure of the rotary power mechanism of this utility model.

[0030] Figure 3 This is a schematic diagram of the track opening mechanism of this utility model.

[0031] The attached figures are labeled as follows: linear power mechanism 1, linear power source 11, first bearing seat 12, rotary power mechanism 2, second bearing seat 21, rotary power source 22, rotary sleeve 23, telescopic shaft 3, gripper 4, product track 5, track opening mechanism 6, transverse guide rail 61, vertical roller 62, elastic element 63, longitudinal power source 64, inclined block 65, roller frame 7, transverse roller 71, material box 8, width limiting element 9. Detailed Implementation

[0032] In the following description, numerous specific details are set forth in order to provide a more thorough understanding of the present invention. However, it will be apparent to those skilled in the art that the present invention can be practiced without one or more of these details. In other instances, certain technical features well-known in the art have not been described in order to avoid confusion with the present invention.

[0033] This application discloses a semiconductor flipping device, which is installed in semiconductor processing equipment such as semiconductor lead bending and shaping equipment. Its components, such as motors, cylinders, and sensors, are connected to the control devices such as PLCs of the semiconductor processing equipment. The control devices control the coordinated operation of each component of the flipping device. The flipping device can pick up materials from the material box through grippers and then flip the products. The flipping device only needs to be set on one side of the material box to complete the flipping of semiconductor products. This solves the problem of low space utilization in the prior art, which requires cylinders, moving mechanisms, and flipping mechanisms to be set on both sides of the material box to complete the flipping of semiconductors.

[0034] like Figure 1 The semiconductor flipping device shown is located on one side of the material box 8. The semiconductor flipping device includes: a linear power mechanism 1, a rotary power mechanism 2, a telescopic shaft 3, and a gripper 4.

[0035] The telescopic shaft 3 is rotatably mounted on the linear power mechanism 1, the rotary power mechanism 2 is sleeved on the telescopic shaft 3, and the gripper 4 is mounted on the telescopic shaft 3.

[0036] The linear power mechanism 1 is used to drive the telescopic shaft 3 to move linearly, so that the telescopic shaft 3 drives the gripper 4 to move linearly.

[0037] The rotary power mechanism 2 is used to drive the telescopic shaft 3 to rotate, so that the telescopic shaft 3 drives the gripper 4 to rotate.

[0038] Gripper 4 is used to hold semiconductor products, such as Figure 1-3 The gripper 4 shown is a gripper cylinder that clamps the semiconductor product from the thickness direction.

[0039] like Figure 1 and 3 The semiconductor flipping device shown also includes: product track 5.

[0040] Product track 5 is installed on rotary power mechanism 2, and product track 5 is provided with track groove.

[0041] The gripper 4 is positioned between two product tracks 5 and is used to drive the semiconductor product into the track slot.

[0042] like Figure 1 and 3 The semiconductor flipping device shown also includes: a track opening mechanism 6.

[0043] The track opening mechanism 6 is installed on the rotary power mechanism 2, and the two product tracks 5 are installed on the track opening mechanism 6.

[0044] The track opening mechanism 6 is used to increase the distance between the two product tracks 5.

[0045] like Figure 3 The track opening mechanism 6 shown includes: a transverse guide rail 61, a vertical roller 62, an elastic element 63, a longitudinal power source 64, and an inclined block 65.

[0046] A transverse guide rail 61 is installed on the rotary power mechanism 2, a product track 5 is installed on the transverse guide rail 61, a vertical roller 62 is installed on the product track 5, a longitudinal power source 64 is located on the side of the rotary power mechanism 2, and an inclined block 65 is installed on the longitudinal power source 64. The inclined block 65 has a ramp structure, and the ramp structure of the inclined block 65 can be separated and engaged with the vertical roller 62. The longitudinal power source 64 drives the two product tracks 5 to move in opposite directions through the engagement of the inclined block 65 and the vertical roller 62.

[0047] One end of the elastic element 63 is connected to the rotary power mechanism 2, and the other end is connected to the product track 5. The elastic element 63 is used to drive the two product tracks 5 to move in opposite directions, such as... Figure 3 The elastic element 63 shown consists of four springs, which are respectively located on the upper and lower sides of the two product tracks 5. The two ends of the springs are connected to the rotating sleeve 23 of the rotating power mechanism 2 and the product track 5, respectively.

[0048] like Figure 3 The longitudinal power source 64 shown includes: a longitudinal cylinder and a longitudinal guide rail, with a wedge block 65 mounted on the longitudinal cylinder and the longitudinal guide rail, as shown. Figure 3 The diagram shows four inclined blocks 65, four vertical rollers 62, and two sets of longitudinal power sources 64. The four vertical rollers 62 are respectively arranged on the upper and lower sides of the two product tracks 5. The inclined blocks 65 and the vertical rollers 62 are positioned to cooperate. In other embodiments, the longitudinal power source 64 may include one of the following: an electric cylinder, a lead screw mechanism, a gear and rack mechanism, and a linear motor.

[0049] like Figure 3 The semiconductor flipping device shown also includes: a width limiting member 9, which is detachably mounted on the rotary power mechanism 2. The width limiting member 9 is disposed between two product tracks 5 and is used to limit the distance between the two product tracks 5, such as... Figure 3 The two ends of the width limiting member 9 are connected to the adjacent sides of the two product tracks 5 to limit the distance between the two product tracks 5. One end of the spring is installed on the width limiting member 9, so that the spring is installed on the rotary power mechanism 2 through the width limiting member 9.

[0050] like Figure 2The semiconductor flipping device shown also includes: a roller frame 7 and a transverse roller 71. The roller frame 7 is mounted on the telescopic shaft 3, and the transverse roller 71 is mounted on the roller frame 7. The two sets of transverse rollers 71 are arranged on the upper and lower sides of the product track 5, so that the side walls of the two sets of transverse rollers 71 are connected to the product track 5.

[0051] In this embodiment, the linear power mechanism 1 includes a linear power source 11 and a first bearing housing 12.

[0052] The first bearing housing 12 is mounted on the linear power source 11, and the telescopic shaft 3 is mounted on the first bearing housing 12.

[0053] like Figure 1 The linear power source 11 shown is located on one side of the rotary power mechanism 2, and the first bearing seat 12 is mounted on the side of the linear power source 11 near the rotary power mechanism 2 via a bracket.

[0054] The linear power source 11 includes one of the following: an electric cylinder, a lead screw mechanism, a gear and rack mechanism, and a linear motor.

[0055] like Figure 2 The rotating power mechanism 2 shown includes: a second bearing housing 21, a rotating power source 22, and a rotating sleeve 23.

[0056] The rotating electric power source and the rotating sleeve 23 are mounted on the second bearing housing 21, and the rotating power source 22 and the rotating sleeve 23 are connected.

[0057] The rotating sleeve 23 is fitted onto the telescopic shaft 3, and the outer wall of the telescopic shaft 3 and the inner wall of the rotating sleeve 23 are provided with mutually cooperating side planes.

[0058] In the above embodiments, the rotary power source 22 includes one of a transmission belt mechanism and a gear transmission mechanism.

[0059] Instructions for use: When the semiconductor processing equipment's cartridge 8 moves to... Figure 1 When the flipping device is in one position, the linear power mechanism 1 drives the telescopic shaft 3 to move linearly, so that the telescopic shaft 3 drives the gripper 4 to move linearly into the material box 8, so that the gripper 4 can pick up the semiconductor product in the material box 8. The longitudinal power source 64 of the track opening mechanism 6, through the cooperation of the inclined block 65 and the vertical roller 62, makes the two product tracks 5 move in opposite directions, increasing the distance between the two product tracks 5.

[0060] Then, the linear power mechanism 1 drives the telescopic shaft 3 to move linearly, which in turn drives the gripper 4 to move linearly. After the discharge box 8 is moved a preset distance, the inclined block 65 of the track opening mechanism 6 separates from the vertical roller 62. The elastic element 63 drives the two product tracks 5 to move in opposite directions. During this process, the semiconductor product is inserted into the track groove of the product track 5.

[0061] Then the rotating power mechanism 2 drives the telescopic shaft 3 and the product track 5 to rotate, which in turn drives the gripper 4 to rotate.

[0062] When the width of the semiconductor product changes and the spacing between the two product tracks 5 needs to be adjusted, the width limiting component 9, whose size matches the width of the semiconductor product, is replaced to achieve the spacing adjustment between the two product tracks 5.

[0063] As described above, although the present invention has been shown and described with reference to specific preferred embodiments, it should not be construed as limiting the present invention itself. Various changes in form and detail may be made to the present invention without departing from the spirit and scope of the appended claims.

Claims

1. A semiconductor switching device, characterized in that, include: Linear power mechanism, rotary power mechanism, telescopic shaft and gripper; The telescopic shaft is rotatably mounted on the linear power mechanism, the rotary power mechanism is sleeved on the telescopic shaft, and the gripper is mounted on the telescopic shaft; The linear power mechanism is used to drive the telescopic shaft to move linearly, so that the telescopic shaft drives the gripper to move linearly. The rotary power mechanism is used to drive the telescopic shaft to rotate, so that the telescopic shaft drives the gripper to rotate; The grippers are used to hold semiconductor products.

2. The semiconductor switching device according to claim 1, characterized in that, Also includes: Product track; The product track is mounted on a rotary power mechanism, and the product track is provided with a track groove; The gripper is positioned between two product tracks and is used to drive the semiconductor product into the track slot.

3. The semiconductor switching device according to claim 2, characterized in that, Also includes: Track opening mechanism; The track opening mechanism is mounted on the rotary power mechanism, and the two product tracks are mounted on the track opening mechanism; The track opening mechanism is used to increase the distance between the two product tracks.

4. The semiconductor switching device according to claim 3, characterized in that, The track opening mechanism includes: a transverse guide rail, a vertical roller, an elastic element, a longitudinal power source, and an inclined block; The transverse guide rail is installed on the rotary power mechanism, the product track is installed on the transverse guide rail, the vertical roller is installed on the product track, the longitudinal power source is located on the side of the rotary power mechanism, the inclined block is installed on the longitudinal power source, the inclined block has a ramp structure, the ramp structure of the inclined block and the vertical roller can be separably coupled, and the longitudinal power source drives the two product tracks to move in opposite directions through the coupling of the inclined block and the vertical roller; One end of the elastic element is connected to a rotary power mechanism, and the other end is connected to a product track. The elastic element is used to drive the two product tracks to move in opposite directions.

5. The semiconductor switching device according to claim 4, characterized in that, The longitudinal power source includes a longitudinal cylinder and a longitudinal guide rail, and the inclined block is mounted on the longitudinal cylinder and the longitudinal guide rail.

6. The semiconductor switching device according to claim 3, characterized in that, Also includes: A width limiting component is detachably installed on the rotary power mechanism and disposed between two product tracks. The width limiting component is used to limit the distance between the two product tracks.

7. The semiconductor switching device according to claim 2, characterized in that, Also includes: The roller frame and the transverse rollers are provided. The roller frame is mounted on the telescopic shaft, and the transverse rollers are mounted on the roller frame. The two sets of transverse rollers are arranged on both sides of the product track, and the side walls of the two sets of transverse rollers are connected to the product track.

8. The semiconductor switching device according to claim 1, characterized in that, The linear power mechanism includes: a linear power source and a first bearing housing; The first bearing housing is mounted on the linear power source, and the telescopic shaft is mounted on the first bearing housing.

9. The semiconductor switching device according to claim 8, characterized in that, The linear power source includes one of the following: an electric cylinder, a lead screw mechanism, a gear and rack mechanism, and a linear motor.

10. A semiconductor switching device according to claim 1, characterized in that, The rotary power mechanism includes: a second bearing housing, a rotary power source, and a rotating sleeve; The rotating electric power source and the rotating sleeve are mounted on the second bearing housing, and the rotating power source and the rotating sleeve are connected. The rotating sleeve is fitted onto the telescopic shaft, and the outer wall of the telescopic shaft and the inner wall of the rotating sleeve are provided with mutually cooperating side planes.

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