Power module and plastic package device

Abstract

The utility model relates to the semiconductor technology, in particular to a power module and a plastic package device. A power module comprises a power module body (1). The power module body (1) comprises a plastic package shell (11) and metal pins (12) extending out of the plastic package shell (11). A metal heat dissipation surface (13) is arranged at the top of the plastic package shell (11); and a creepage enhancement unit (14) is arranged on the plastic package shell (11) between the metal radiating surface (13) and the metal pins (12). According to the surface-mounted power module with insulation enhancement and top surface heat radiation, the insulation capability between the module and the radiator can be enhanced so as to meet the application requirements of customers for improving the voltage grade of products, and meanwhile, the connection mode of the power module of the type and the radiator is also optimized.

Description

Technical Field

[0001] This utility model relates to semiconductor technology, and more particularly to a power module and a plastic-encapsulated device. Background Technology

[0002] With the development of third-generation semiconductors, the power density of power modules is constantly increasing, and users have higher requirements for the cost, ease of installation and application, and flexibility of power modules. For example, some surface-mount power module customers typically mount the heat dissipation surface as the bottom surface to the PCB circuit board or heat sink for heat dissipation. However, in order to achieve more flexible layout optimization and higher power density, customers may want to use high-power-density power modules and want to be able to solder the power modules directly to the PCB, with heat dissipation achieved by placing an additional heat sink on the top surface of the module.

[0003] However, to achieve sufficient heat dissipation, existing top-heat-dissipating SMT packages often require the top heatsink surface to be connected to an external heatsink via a thermal interface material (TIM). The weight of the heatsink and the thermal expansion effect can cause the TIM to be squeezed out during the manufacturing process or during customer service, thus affecting the module's thermal resistance. Furthermore, current processes struggle to precisely control the thickness of the TIM. Excessively thick TIM directly increases the power module's thermal resistance, while excessively thin TIM may result in gaps and air bubbles, leading to insufficient thermal contact and also affecting the overall thermal resistance of the package. This results in uncontrolled thermal resistance throughout the package.

[0004] Furthermore, as package sizes continue to shrink, the creepage distance between the bottom pins and the back electrode of the power module is further reduced. At the same time, the increasing voltage levels and current output capabilities of power semiconductor devices further increase the probability of creepage breakdown. Therefore, the problem of excessively short creepage distance on the package surface has become a major factor limiting the application of this packaging technology.

[0005] As described in prior art CN202111323132.4, a package (100) for mounting on a mounting base (102) includes a carrier (106), an electronic component (108) mounted on the carrier (106), a lead (110) electrically coupled to the electronic component (108) and to be electrically coupled to the mounting base (102), and a linear spacer (112) for defining a distance relative to the carrier (106). Utility Model Content

[0006] This invention addresses the problems of excessively short creepage distance on the packaging surface and poor uniformity of thermal grease thickness in existing technologies by providing a power module and a plastic-encapsulated device.

[0007] To solve the above-mentioned technical problems, the present invention provides a solution through the following technical method:

[0008] A power module includes a power module body, the power module body including a plastic encapsulation housing and metal pins extending from the plastic encapsulation housing; a metal heat dissipation surface is provided on the top of the plastic encapsulation housing; and a creepage enhancement unit is provided on the plastic encapsulation housing between the metal heat dissipation surface and the metal pins.

[0009] Preferably, the creepage enhancement unit includes at least one set of stepped units on the plastic-encapsulated housing.

[0010] Preferably, the creepage enhancement unit includes at least one set of slotted units on the top surface of the metal heat dissipation surface.

[0011] Preferably, the creepage enhancement unit includes a side-grooved unit and a raised unit in the plastic-encapsulated housing.

[0012] Preferably, the creepage enhancement unit includes a metal pin-wrapped unit.

[0013] Preferably, the top periphery of the metal heat dissipation surface of the power module body is provided with a sealing ring groove for placing the sealing ring. A pre-reserved groove for the sealing ring is provided on the periphery of the top heat dissipation surface of the metal heat dissipation surface. If the interface material between the power module and the heat sink is thermal grease, the sealing ring can be installed into the pre-reserved groove of the power module. The portion of the sealing ring protruding above the heat dissipation surface ensures the thickness of the thermal grease and prevents thermal grease overflow.

[0014] Preferably, the side protrusion unit of the plastic-encapsulated housing is an inverted triangular protrusion unit.

[0015] To address the aforementioned technical problems, this utility model also provides a plastic-encapsulated device, including the aforementioned power module.

[0016] This utility model, by adopting the above technical solution, has the following significant technical effects:

[0017] This invention utilizes a surface-mount power module with enhanced insulation and top-side heat dissipation. This module enhances the insulation between the module and the heat sink to meet customers' application requirements for increasing product voltage levels. Furthermore, the connection method between this type of power module and the heat sink has been optimized.

[0018] This utility model's power module provides customers with a more convenient, flexible, reliable, and efficient heat dissipation solution for installation and heat dissipation design. Specifically, it includes a module design with a pre-drilled groove for a sealing ring. The sealing ring optimizes the heat dissipation and reliability of thermal grease-based heat dissipation modules, while eliminating the sealing ring allows for welding or sintering connections between the module and the heat sink. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the power module body structure of Embodiment 1 of this utility model;

[0020] Figure 2 This is a schematic diagram of the power module structure of Embodiment 1 of this utility model;

[0021] Figure 3 This is a schematic diagram of the creepage enhancement unit structure in Embodiment 1 of this utility model;

[0022] Figure 4 This is a schematic diagram of the creepage enhancement unit structure in Embodiment 2 of this utility model;

[0023] Figure 5 This is a schematic diagram of the creepage enhancement unit structure in Embodiment 3 of this utility model;

[0024] Figure 6 This is a schematic diagram of the creepage enhancement unit structure in Embodiment 4 of this utility model;

[0025] Figure 7 This is a schematic diagram of the power module structure in Embodiment 5 of this utility model;

[0026] Figure 8 This is a schematic diagram of the structure of embodiment 8 of this utility model;

[0027] Figure 9 This is a structural schematic diagram of Embodiment 9 of this utility model.

[0028] The parts referred to by the numbers in the attached diagram are as follows: 1—Power module body, 11—Plastic housing, 12—Metal pins, 13—Metal heat dissipation surface, 131—Sealing ring groove, 14—Creep current enhancement unit, 141—Step unit, 142—Slotted unit, 143—Side slotted unit, 144—Protruding unit, 145—Wrapped unit. Detailed Implementation

[0029] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments.

[0030] Example 1

[0031] A power module, in Figure 1 The middle part includes the power module body 1. Figure 2 The power module body 1 includes a plastic encapsulated housing 11 and metal pins 12 extending from the plastic encapsulated housing 11; a metal heat dissipation surface 13 is provided on the top of the plastic encapsulated housing 11; and a creepage enhancement unit 14 is provided on the plastic encapsulated housing 11 between the metal heat dissipation surface 13 and the metal pins 12. Figure 3 The creepage enhancement unit 14 includes at least one set of stepped units 141 on the plastic-encapsulated housing 11.

[0032] Example 2

[0033] Based on Example 1, this example provides a power module in which... Figure 1 The middle part includes the power module body 1. Figure 2 The power module body 1 includes a plastic encapsulated housing 11 and metal pins 12 extending from the plastic encapsulated housing 11; a metal heat dissipation surface 13 is provided on the top of the plastic encapsulated housing 11; and a creepage enhancement unit 14 is provided on the plastic encapsulated housing 11 between the metal heat dissipation surface 13 and the metal pins 12. Figure 4 In the middle, the creepage enhancement unit 14 includes at least one set of slotted units 142 on the top surface of the metal heat dissipation surface 13.

[0034] Example 3

[0035] Based on Example 1, this example provides a power module in which... Figure 1 The middle part includes the power module body 1. Figure 2 The power module body 1 includes a plastic encapsulated housing 11 and metal pins 12 extending from the plastic encapsulated housing 11; a metal heat dissipation surface 13 is provided on the top of the plastic encapsulated housing 11; and a creepage enhancement unit 14 is provided on the plastic encapsulated housing 11 between the metal heat dissipation surface 13 and the metal pins 12. Figure 5 In the middle, the creepage enhancement unit 14 includes a side slotted unit 143 and a raised unit 144 of the plastic-encapsulated housing 11.

[0036] Example 4

[0037] Based on Example 1, this embodiment provides a power module that, in... Figure 1 The middle part includes the power module body 1. Figure 2 The power module body 1 includes a plastic encapsulated housing 11 and metal pins 12 extending from the plastic encapsulated housing 11; a metal heat dissipation surface 13 is provided on the top of the plastic encapsulated housing 11; and a creepage enhancement unit 14 is provided on the plastic encapsulated housing 11 between the metal heat dissipation surface 13 and the metal pins 12. Figure 6 In this embodiment, unlike the above embodiment, the creepage enhancement unit 14 includes a wrapping unit 145 for the metal pins 12.

[0038] Example 5

[0039] Based on Example 1, this example provides a power module in which... Figure 1 The middle part includes the power module body 1. Figure 2 The power module body 1 includes a plastic encapsulated housing 11 and metal pins 12 extending from the plastic encapsulated housing 11; a metal heat dissipation surface 13 is provided on the top of the plastic encapsulated housing 11; and a creepage enhancement unit 14 is provided on the plastic encapsulated housing 11 between the metal heat dissipation surface 13 and the metal pins 12.

[0040] Figure 7In the power module body 1, a sealing ring groove 131 for placing a sealing ring is provided on the outer periphery of the top surface of the metal heat dissipation surface 13. A sealing ring reserved groove is provided on the outer periphery of the heat dissipation surface of the top surface of the metal heat dissipation surface 13. If the interface material between the power module and the heat sink is thermal grease, the sealing ring can be installed into the reserved groove of the power module. The part of the sealing ring that protrudes above the heat dissipation surface can ensure the thickness of the thermal grease and prevent the thermal grease from overflowing.

[0041] Example 6

[0042] Based on Example 1, this example provides a power module in which... Figure 1 The middle part includes the power module body 1. Figure 2 The power module body 1 includes a plastic encapsulated housing 11 and metal pins 12 extending from the plastic encapsulated housing 11; a metal heat dissipation surface 13 is provided on the top of the plastic encapsulated housing 11; and a creepage enhancement unit 14 is provided on the plastic encapsulated housing 11 between the metal heat dissipation surface 13 and the metal pins 12.

[0043] Example 7

[0044] Based on Example 1, this example provides a power module in which... Figure 1 The middle part includes the power module body 1. Figure 2 The power module body 1 includes a plastic-encapsulated housing 11 and metal leads 12 extending from the plastic-encapsulated housing 11; a metal heat dissipation surface 13 is provided on the top of the plastic-encapsulated housing 11; a creepage enhancement unit 14 is provided on the plastic-encapsulated housing 11 between the metal heat dissipation surface 13 and the metal leads 12. The side protrusion unit 144 of the plastic-encapsulated housing 11 is an inverted triangular protrusion unit 144.

[0045] Example 8

[0046] Based on the above embodiments, this embodiment is a plastic-encapsulated device.

[0047] Example 9

[0048] Based on the above embodiments, this embodiment provides a power module based on... Figure 8 In the middle, one metal pin can be reduced as needed.

[0049] Example 10

[0050] Based on the above embodiments, this embodiment provides a power module. Figure 9 In the process, the smallest metal terminal is combined with the larger terminal nearby as needed.

Claims

1. A power module, comprising a power module body (1), characterized in that, The power module body (1) includes a plastic encapsulated housing (11) and metal pins (12) extending from the plastic encapsulated housing (11); a metal heat dissipation surface (13) is provided on the top of the plastic encapsulated housing (11); a creepage enhancement unit (14) is provided on the plastic encapsulated housing (11) between the metal heat dissipation surface (13) and the metal pins (12); the creepage enhancement unit (14) includes at least one set of step units (141) on the plastic encapsulated housing (11); the creepage enhancement unit (14) includes a wrapping unit (145) for the metal pins (12); a sealing ring groove (131) for placing a sealing ring is provided on the outer periphery of the top surface of the metal heat dissipation surface (13) of the power module body (1).

2. A power module according to claim 1, characterized in that, The creepage enhancement unit (14) includes at least one set of slotted units (142) on the top surface of the metal heat dissipation surface (13).

3. A power module according to claim 1, characterized in that, The creepage enhancement unit (14) includes a side slotted unit (143) and a raised unit (144) of the plastic-encapsulated housing (11).

4. A power module according to claim 1, characterized in that, The side protrusion unit (144) of the plastic-encapsulated housing (11) is an inverted triangular protrusion unit (144).

5. A plastic-encapsulated device, characterized in that, Includes the power module described in any one of claims 1-4.

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