Experimental device for low-temperature germination rate of corn

Abstract

The utility model relates to an experimental device, in particular to a corn low-temperature germination rate experimental device, which comprises a box body, a cover plate, a metal plate, heat preservation sleeves, a semiconductor chilling plate and a heat dissipation system, the interior of the box body is divided into a left cavity and a right cavity which are equal in volume, and one heat preservation sleeve is placed in each cavity in the box body. Mounting grooves are formed in the protruding ends of the heat preservation sleeves, a metal plate is embedded in the heat preservation sleeves, sixteen evenly-distributed containing cavities are formed in the metal plate, semiconductor chilling plates are installed in the mounting grooves of the heat preservation sleeves, the inner sides of the semiconductor chilling plates are tightly attached to the metal plate, and heat dissipation systems are arranged on the outer sides of the four communicating grooves in the box body. The top of the box body is covered with a cover plate. According to the utility model, the semiconductor chilling plate is adopted to quickly cool the metal plate, so that the experimental device generates a low-temperature environment; the heat dissipation system is used for leading out heat generated during working of the semiconductor chilling plate, and the refrigeration effect is improved; the thermal insulation sleeve provides a thermal insulation function for the experimental device and maintains the stability of a low-temperature environment.

Description

A corn low-temperature germination rate experimental device Technical Field

[0001] This utility model relates to an experimental device, and more particularly to an experimental device for low-temperature germination rate of corn. Background Technology

[0002] As a globally important food, feed, and industrial raw material crop, maize's germination rate directly affects its yield and quality. However, low-temperature stress significantly inhibits seed germination, leading to uneven emergence, especially in early spring sowing or high-latitude regions. Therefore, studying the low-temperature germination characteristics of maize varieties and screening for cold-resistant germplasm resources is of great significance for breeding and agricultural production. Traditional maize germination rate experiments are mostly conducted at a constant temperature of 25℃, which is insufficient to reflect the true germination characteristics under low-temperature stress. To address this issue, research institutions use large-scale incubator temperature control devices to conduct low-temperature germination experiments. While this can achieve temperature control to some extent, it suffers from problems such as large equipment size, inconvenient operation, high cost, and poor flexibility. Therefore, developing a dedicated low-temperature germination rate experimental device is of great significance for variety selection and cultivation optimization. Summary of the Invention

[0003] (1) Technical problems to be solved

[0004] In order to overcome the shortcomings of traditional corn germination rate experimental devices, which cannot conduct low-temperature germination rate experiments at room temperature, and the lack of flexibility and convenience of large incubator temperature control devices, this utility model aims to provide a flexible and convenient corn low-temperature germination rate experimental device.

[0005] (2) Technical solution

[0006] To address the aforementioned technical problems, this utility model provides a corn low-temperature germination rate experimental device, comprising a box body, a cover plate, a metal plate, an insulation sleeve, a semiconductor cooling chip, a temperature sensor, an experimental box, and a heat dissipation system. The box body is internally divided into two equal-volume cavities. Connecting slots are provided on the left and right sides and the left and right sides of the rear of the box body. Each cavity within the box body contains an insulation sleeve with two protruding ends located on adjacent sides. Each protruding end of the insulation sleeve has an installation slot aligned with the connecting slot on the box body. A metal plate is embedded inside the insulation sleeve, and sixteen evenly distributed placement cavities are provided on the metal plate. Each placement cavity on the metal plate contains an experimental box. A semiconductor cooling chip is installed in the installation slot of the insulation sleeve, with the inner side of the semiconductor cooling chip tightly attached to the metal plate. A heat dissipation system is provided on the outer sides of the four connecting slots on the box body. The top of the box body is covered by a cover plate. Temperature sensors are installed on the left and right sides of the front of the box body, with the sensing ends of the temperature sensors penetrating the box body and extending into the two cavities.

[0007] Preferably, the heat dissipation system includes heat dissipation fins, a fan, and fixing rods. Each of the four connecting slots on the housing is equipped with a set of heat dissipation fins. The inner side of each heat dissipation fin is in close contact with a semiconductor cooling chip. The outer side of each of the four sets of heat dissipation fins is in close contact with a fan. The four fixing rods pass through the mounting holes at the four corners of the fan and fasten the fan to the outside of the housing.

[0008] Preferably, it also includes hinges, and the box body and the rear side of the cover are hinged together by two hinges.

[0009] Preferably, it also includes air ducts, with air ducts provided at both the upper and lower ends of each set of heat dissipation fins, and the air ducts are connected to the outside of the casing.

[0010] Preferably, it also includes a sealing strip, which is continuously arranged along the inner circumference of the cover plate and forms a sealing fit with the box body.

[0011] Preferably, it also includes an observation window, which is provided on the cover plate.

[0012] (3) Beneficial effects

[0013] 1. This utility model uses a semiconductor cooling chip to achieve rapid cooling of the metal plate, thereby creating a low-temperature environment in the experimental device, which is flexible and convenient; the use of a heat dissipation system allows the semiconductor cooling chip to dissipate the heat generated during operation, improving the cooling effect.

[0014] 2. This utility model uses an insulation jacket to provide insulation for the experimental device and maintain the stability of the low-temperature environment.

[0015] 3. This utility model uses hinges to connect the box body and the cover plate, which prevents the cover plate from shifting or slipping. Together with the sealing strip, it forms a sealed space, which helps to maintain a low temperature environment and improve the accuracy of experimental data.

[0016] 4. This utility model uses air ducts to direct airflow, which helps to improve the heat dissipation effect of the heat dissipation fins. Attached Figure Description

[0017] Figure 1 is a three-dimensional structural schematic diagram of this utility model.

[0018] Figure 2 is a three-dimensional structural schematic diagram of this utility model.

[0019] Figure 3 is a three-dimensional structural diagram of the metal plate, insulation sleeve, air duct and heat dissipation system of this utility model.

[0020] Figure 4 is a partial exploded structural diagram of this utility model.

[0021] The labels in the attached diagram are: 1-box body, 2-cover plate, 3-hinge, 4-metal plate, 5-insulation sleeve, 6-semiconductor cooling chip, 7-heat dissipation fins, 8-fan, 9-fixing rod, 10-air duct, 11-observation window, 12-temperature sensor, 13-sealing strip, 14-experiment box. Detailed Implementation

[0022] An experimental device for low-temperature germination rate of corn, as shown in Figures 1-4, includes a box 1, a cover plate 2, a metal plate 4, an insulation sleeve 5, a semiconductor cooling chip 6, a temperature sensor 12, an experimental box 14, and a heat dissipation system. The box 1 is internally divided into two equal-volume cavities. Connecting slots are provided on the left and right sides and the left and right sides at the rear of the box 1. Each cavity in the box 1 contains an insulation sleeve 5. The insulation sleeve 5 has two protruding ends located on adjacent sides. Each protruding end of the insulation sleeve 5 has an installation groove aligned with the connecting slot on the box 1. The insulation sleeve 5 is embedded inside the metal plate 4, which has sixteen evenly distributed placement cavities. Each placement cavity on the metal plate 4 contains an experimental box 1. 4. Each of the mounting slots of the insulation sleeve 5 is equipped with a semiconductor cooling chip 6. The inner side of the semiconductor cooling chip 6 is tightly attached to the metal plate 4. The outer sides of the four connecting slots on the housing 1 are equipped with a heat dissipation system, which includes heat dissipation fins 7, fans 8 and fixing rods 9. Each of the four connecting slots on the housing 1 is equipped with a set of heat dissipation fins 7. The inner side of the heat dissipation fins 7 is tightly attached to the semiconductor cooling chip 6. The outer sides of the four sets of heat dissipation fins 7 are tightly attached to the fans 8. The four fixing rods 9 pass through the mounting holes at the four corners of the fans 8 respectively, and fasten the fans 8 to the outside of the housing 1. The top of the housing 1 is covered with a cover plate 2. Temperature sensors 12 are installed on the left and right sides of the front of the housing 1. The detection end of the temperature sensor 12 passes through the housing 1 and extends into the two cavities.

[0023] When researchers need to conduct experiments on the low-temperature germination rate of corn, they first activate the semiconductor cooling chip 6 and the fan 8. Utilizing the cooling effect of the semiconductor cooling chip 6, the temperature of the two independent cavities inside the chamber 1 is precisely adjusted to the preset experimental temperature, which is flexible and convenient. The heat dissipation fins 7 conduct the heat generated by the semiconductor cooling chip 6 during operation, and the fan 8 promptly dissipates the heat conducted by the heat dissipation fins 7. The insulation sleeve 5 effectively maintains the temperature stability of the cavities inside the chamber 1. After opening the cover 2, the experimental box 14 containing the experimental corn seeds is placed in the placement cavity on the metal plate 4, ensuring that the experimental box 14 is in full contact with the metal plate 4. The cover 2 is then closed, and the temperature sensor 12 monitors and displays the actual temperature inside the cavities of the chamber 1 in real time, improving the accuracy of the experiment.

[0024] Referring to Figures 1, 2, and 4, the enclosure also includes hinges 3, air ducts 10, observation windows 11, and sealing strips 13. The rear side of the enclosure 1 and the cover 2 are hinged together by two hinges 3, which facilitates the placement and removal of the experimental boxes 14 by the experimenters, while preventing the cover 2 from shifting or slipping, and ensuring that the cover 2 is precisely aligned with the enclosure 1 when closed. Each set of heat dissipation fins 7 has air ducts 10 at both the top and bottom, which are connected to the outside of the enclosure 1. The air ducts 10 forcefully guide the airflow along the air ducts 10, eliminating the turbulence generated by the fan 8, which helps to improve the heat dissipation effect of the heat dissipation fins 7. The sealing strips 13 are continuously arranged circumferentially along the inner side of the cover 2 and form a sealed fit with the enclosure 1 to achieve an airtight connection between the enclosure 1 and the cover 2, ensuring a stable low-temperature environment and improving the accuracy of experimental data. The cover 2 is provided with an observation window 11, which allows the experimenters to periodically observe and record the germination status of the corn seeds in each experimental box 14, improving the convenience of the experiment.

Claims

1. A corn low-temperature germination rate experimental device, characterized in that, The device includes a housing (1), a cover plate (2), a metal plate (4), an insulation sleeve (5), a semiconductor cooling chip (6), a temperature sensor (12), an experimental box (14), and a heat dissipation system. The housing (1) is divided into two equal-volume cavities. There are connecting slots on the left and right sides and the left and right sides at the rear of the housing (1). Each cavity in the housing (1) contains an insulation sleeve (5). The insulation sleeve (5) has two protruding ends, which are located on adjacent sides of the insulation sleeve (5). Each protruding end of the insulation sleeve (5) has an installation slot, which is aligned with the connecting slot on the housing (1). The interior is embedded with a metal plate (4), and the metal plate (4) has sixteen evenly distributed placement cavities. Each placement cavity on the metal plate (4) contains an experimental box (14). The mounting slots of the insulation sleeve (5) are all equipped with semiconductor cooling chips (6). The inner side of the semiconductor cooling chip (6) is in close contact with the metal plate (4). The outer sides of the four connecting slots on the box body (1) are equipped with heat dissipation systems. The top of the box body (1) is covered with a cover plate (2). Temperature sensors (12) are installed on the left and right sides of the front of the box body (1). The detection end of the temperature sensor (12) penetrates the box body (1) and extends into the two cavities.

2. The experimental device for low-temperature germination rate of corn according to claim 1, characterized in that, The heat dissipation system includes heat dissipation fins (7), fans (8) and fixing rods (9). Each of the four connecting slots on the housing (1) is equipped with a set of heat dissipation fins (7). The inner side of each heat dissipation fin (7) is in close contact with a semiconductor cooling chip (6). The outer side of each of the four sets of heat dissipation fins (7) is in close contact with a fan (8). The four fixing rods (9) pass through the mounting holes at the four corners of the fan (8) to secure the fan (8) to the outside of the housing (1).

3. The corn low temperature germination rate experimental device according to claim 2, characterized in that, It also includes hinges (3), and the rear side of the box (1) and the cover plate (2) are hinged together by two hinges (3).

4. The corn low temperature germination rate experimental device according to claim 3, characterized in that, It also includes air ducts (10), and each set of heat dissipation fins (7) has air ducts (10) at both the upper and lower ends, and the air ducts (10) are connected to the outside of the box (1).

5. The experimental device for low-temperature germination rate of corn according to claim 4, characterized in that, It also includes a sealing strip (13), which is continuously arranged along the inner circumference of the cover plate (2) and forms a sealing fit with the box body (1).

6. The corn low temperature germination rate experimental device according to claim 4, characterized in that, It also includes an observation window (11), and the cover plate (2) is provided with an observation window (11).

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