Adhesive layer thickness control device

Abstract

The utility model relates to an adhesive layer thickness control device which comprises a glass substrate, and at least one surface of the glass substrate is provided with a conductive film layer. A gluing system, an electric field system, an induction system, a thickness detection system and a curing system are arranged on the base, and the gluing system at least comprises a dispensing head; the electric field system at least comprises an electric field generating device, the sensing system at least comprises a flexible mold, and a plurality of pressure sensors and a plurality of displacement sensors are arranged on a bottom plate of the flexible mold; the thickness detection system at least comprises a laser thickness gauge, and the laser thickness gauge is arranged close to the induction system; the curing system at least comprises an ultraviolet curing lamp; the controller is electrically connected with the glue dispensing head, the electric field generating device, the pressure sensor, the displacement sensor and the laser thickness gauge, the glue layer microstructure is effectively optimized, the quality and performance of glued glass are improved, the glue layer thickness control precision is high, and the gluing requirements of glass substrates of various shapes can be met.

Description

Technical Field

[0001] This utility model relates to the field of adhesive technology, and in particular to an adhesive layer thickness control device. Background Technology

[0002] Traditional glass bonding processes rely heavily on macroscopic physical quantities for controlling adhesive layer thickness, such as simple control of adhesive application amount and pressure adjustment. However, as glass products develop towards higher precision and performance, especially in fields like optical glass bonding and bonding of glass components for high-end electronic devices, existing technologies are insufficient to meet the demands. Conventional adhesive application methods are susceptible to variations in adhesive viscosity and limitations in the precision of the application equipment, leading to uneven adhesive layer thickness. Furthermore, the bonding process lacks effective control over the molecular distribution at the microscopic level, failing to fundamentally guarantee the accuracy and stability of the adhesive layer thickness. Utility Model Content

[0003] In view of the problems existing in the prior art, this utility model provides an adhesive layer thickness control device, which effectively solves the problems of uneven adhesive layer thickness and lack of effective control over the molecular distribution at the micro level, thus failing to fundamentally guarantee the accuracy and stability of adhesive layer thickness.

[0004] The technical solution of this utility model is as follows:

[0005] A device for controlling adhesive layer thickness, characterized in that it comprises:

[0006] A glass substrate, wherein at least one surface of the glass substrate is provided with a conductive film layer;

[0007] The base includes an adhesive application system, an electric field system, a sensing system, a thickness detection system, and a curing system. The adhesive application system includes at least a dispensing head for applying an adhesive layer to a glass substrate. The electric field system includes at least an electric field generator for applying an electric field between the dispensing head and the conductive film layer. The sensing system includes at least a flexible mold, with multiple pressure sensors and multiple displacement sensors on its base plate for placing the adhesive-coated glass substrate on the mold base plate. The thickness detection system includes at least a laser thickness gauge, located near the sensing system, for measuring the adhesive layer thickness. The curing system includes at least an ultraviolet curing lamp for drying and curing the adhesive layer.

[0008] The controller is electrically connected to the dispensing head, electric field generator, pressure sensor, displacement sensor, and laser thickness gauge.

[0009] As a preferred technical solution, the conductive film layer is an indium tin oxide layer with a thickness of 5-10 nm.

[0010] As a preferred technical solution, the electric field applied between the dispensing head and the conductive film layer is an alternating electric field with a frequency of 1-10kHz and a voltage of 50-200V.

[0011] As a preferred technical solution, the dispensing head is cylindrical or conical.

[0012] As a preferred technical solution, the number of dispensing heads is at least one.

[0013] As a preferred technical solution, the glue application system also includes a glue storage tank and a volumetric metering pump. The glue dispensing head is fixedly connected to the volumetric metering pump, and the glue storage tank is fixedly connected to the volumetric metering pump.

[0014] As a preferred technical solution, the base also includes at least one frame, which together with the base forms a U-shape, with the dispensing head, laser thickness gauge, and UV curing lamp arranged side by side on the top of the frame.

[0015] As a preferred technical solution, the number of frames is one or three, and the frames are U-shaped frames.

[0016] As a preferred technical solution, a storage board is also included, which is located within the frame and is positioned opposite to the laser thickness gauge and the ultraviolet curing lamp.

[0017] As a preferred technical solution, multiple pressure sensors and multiple displacement sensors are integrated on the base plate of the flexible mold, and the multiple pressure sensors and multiple displacement sensors are arranged alternately at equal intervals.

[0018] As a preferred technical solution, the shape of the flexible mold is the same as the shape of the glass substrate.

[0019] The beneficial effects achieved by the technical solution adopted in this utility model are as follows:

[0020] This application provides an adhesive layer thickness control device. A conductive film layer is disposed on a glass substrate, and an electric field system is used in the device to generate an electric field. The device mainly includes an adhesive coating system, an electric field system, a sensing system, a thickness detection system, and a curing system. The adhesive coating system mainly includes a dispensing head, an adhesive storage tank, and a volumetric metering pump to provide a quantitative adhesive layer to the glass substrate. The electric field system mainly includes an electric field generator to provide an electric field to the glass substrate to regulate the arrangement of adhesive molecules in the adhesive layer. The sensing system consists of multiple pressure sensors and multiple displacement sensors set on a flexible mold, as well as a laser thickness gauge in the detection system, to adjust the adhesive layer thickness. Finally, the adhesive layer is cured by the curing system. This device effectively optimizes the microstructure of the adhesive layer, improves the quality and performance of the laminated glass, and has high accuracy in controlling the adhesive layer thickness. The pressure sensors and multiple displacement sensors set on the flexible mold, combined with the electric field system, can adapt to the bonding needs of glass substrates of various shapes, effectively expanding the application range of glass bonding technology. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below, forming part of this utility model. The illustrative embodiments of this utility model and their descriptions explain this utility model and do not constitute an improper limitation of this utility model. In the accompanying drawings:

[0022] Figure 1 This is a schematic diagram of the adhesive layer thickness control device disclosed in this embodiment;

[0023] Explanation of reference numerals in the attached figures:

[0024] Base 10; First frame 11; Second frame 12; Third frame 13; Shelf 14; Dispensing head 20; Glue storage tank 21; Volumetric metering pump 22; Electric field generating device 23; Electric field control module 24; Flexible mold 25; Laser thickness gauge 26; Ultraviolet curing lamp 27; DC current heating device 28; Controller 29. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of this utility model will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. In the description of this utility model, it should be noted that the term "or" is generally used to include the meaning of "and / or," unless otherwise expressly stated otherwise.

[0026] In the description of this utility model, it should be understood that terms such as "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, terms such as "connected" and "linked" should be interpreted broadly. For example, it can refer to a fixed connection, a detachable connection, or an integral connection; it can refer to a mechanical connection or an electrical connection; it can refer to a direct connection or an indirect connection through a medium. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0027] Furthermore, those skilled in the art should understand that in the disclosure of this utility model, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the above terms should not be construed as limitations on this utility model.

[0028] Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0029] Example

[0030] according to Figure 1 This embodiment provides an adhesive layer thickness control device, comprising:

[0031] A glass substrate, wherein at least one surface of the glass substrate is provided with a conductive film layer;

[0032] The base 10 is equipped with an adhesive application system, an electric field system, a sensing system, a thickness detection system, and a curing system. The adhesive application system includes at least a dispensing head 20 for applying an adhesive layer to a glass substrate. The electric field system includes at least an electric field generator 23 for applying an electric field between the dispensing head 20 and the conductive film layer. The sensing system includes at least a flexible mold 25, with multiple pressure sensors and multiple displacement sensors on its base plate for placing the adhesive-coated glass substrate on the base plate. The thickness detection system includes at least a laser thickness gauge 26, which is located near the sensing system for measuring the adhesive layer thickness. The curing system includes at least an ultraviolet curing lamp 27 for drying and curing the adhesive layer.

[0033] The controller 29 is electrically connected to the dispensing head 20, the electric field generating device 23, the pressure sensor, the displacement sensor, and the laser thickness gauge 26.

[0034] The adhesive layer thickness control device provided in this application has a conductive film layer on the glass substrate and an electric field system in the device to generate an electric field. The device mainly includes an adhesive coating system, an electric field system, a sensing system, a thickness detection system, and a curing system. The adhesive coating system mainly includes a dispensing head 20, an adhesive storage tank 21, and a volumetric metering pump 22 to provide a quantitative adhesive layer to the glass substrate. The electric field system mainly includes an electric field generating device 23 to provide an electric field to the glass substrate to regulate the arrangement of adhesive molecules in the adhesive layer. The sensing system consists of multiple pressure sensors and multiple displacement sensors set on a flexible mold 25, as well as a laser thickness gauge 26 in the detection system to adjust the adhesive layer thickness. Finally, the adhesive layer is cured by the curing system. This device effectively optimizes the microstructure of the adhesive layer, improves the quality and performance of the laminated glass, and has high accuracy in controlling the adhesive layer thickness. The pressure sensors and multiple displacement sensors set on the flexible mold 25, combined with the electric field system, can adapt to the bonding needs of glass substrates of various shapes, effectively expanding the application range of glass bonding technology.

[0035] Preferably, the conductive film layer is an indium tin oxide layer with a thickness of 5-10 nm.

[0036] In practice, after deep cleaning the glass substrate, a conductive film layer with a thickness of 5-10 nm is deposited on its surface using atomic layer deposition technology. The conductive film layer is preferably an indium tin oxide (ITO) layer as an electric field conductive film layer. This layer can ensure the conductivity of the glass substrate surface without affecting the optical and mechanical properties of the glass itself. In a preferred embodiment, based on the above, low-temperature plasma treatment technology can also be used to activate the surface of the glass substrate to enhance the adhesion of subsequent adhesives.

[0037] Preferably, the electric field applied between the dispensing head 20 and the conductive film layer is an alternating electric field with a frequency of 1-10kHz and a voltage of 50-200V.

[0038] Preferably, the base 10 also includes a frame, which together with the base 10 form a U-shape, and the dispensing head 20, the laser thickness gauge 26, and the ultraviolet curing lamp 27 are arranged side by side on the top of the frame.

[0039] according to Figure 1 The adhesive layer thickness control device provided in this embodiment includes a base 10, on which an electric field system, an adhesive application system, a sensing system, a thickness detection system, and a curing system are provided. These systems are divided into three parts: the first part consists of the adhesive application system, the electric field system, and the sensing system; the second part consists of the thickness detection system; and the third part consists of the curing system. To facilitate the implementation of the components in each system, it is preferable to provide a frame on the base 10. One or three frames can be provided, but three are preferred for easy functional differentiation and implementation. In this embodiment, three frames are described, namely, the first frame 11, the second frame 12, and the third frame 13.

[0040] The adhesive application system mainly includes an adhesive storage tank 21, a volumetric metering pump 22, and a dispensing head 20. The dispensing head 20 is placed on top of the first frame 11 with its outlet facing the base 10. The glass substrate is placed at the bottom of the first frame 11, which is the base plate of the flexible mold 25, with the outlet of the dispensing head 20 facing the base 10. The adhesive in the adhesive storage tank 21 is delivered to the volumetric metering pump 22, which controls the adhesive to be delivered to the dispensing head 20 in a quantitative and constant-speed manner. The dispensing head 20 then drips the adhesive onto the glass substrate. This setup can achieve adhesive application precision at the micron or even sub-micron level. The electric field system mainly includes an electric field generating device 23 and an electric field control module 24. The positive terminal of the electric field generating device 23 is connected to the dispensing head 20 and is used to apply an electric field between the dispensing head 20 and the glass substrate. The electric field control module 24 can precisely control the electric field parameters. In this embodiment, the dispensing head 20 adopts a special design, and different nozzles can be replaced according to the shape of the glass substrate. Preferably, the dispensing head 20 is cylindrical or conical, or a 3D-printed custom nozzle can be used for irregularly shaped glass substrates, or other shapes are also possible. No specific limitation is made here, so that the adhesive coating system combined with the electric field system can uniformly disperse the adhesive on the glass substrate under the action of the electric field. In a preferred embodiment, the electric field applied between the dispensing head 20 and the conductive film layer is an alternating electric field with a frequency of 1-10kHz and a voltage of 50-200V. Under the assistance of the electric field, the adhesive can be uniformly coated on the glass substrate at a uniform speed.

[0041] Furthermore, the number of dispensing heads 20 is at least one, preferably multiple, arranged in a matrix on the top of the first frame 11 and corresponding to the glass substrate, effectively shortening the dispensing time and improving bonding efficiency. The sensing system includes at least a flexible mold 25, and the bottom plate of the flexible mold 25 is provided with multiple pressure sensors and multiple displacement sensors. The flexible mold 25 is placed at the bottom of the first frame 11. Preferably, the multiple pressure sensors and multiple displacement sensors are integrated on the bottom plate of the flexible mold 25, and the multiple pressure sensors and multiple displacement sensors are arranged alternately at equal intervals to form a sensor array. The glass substrate is placed on the bottom plate of the flexible mold 25. After the adhesive is applied, the sensor array at the bottom of the glass substrate can collect a large amount of data in real time and transmit the measured results to the controller 29. The controller 29 drives the electric field system to accurately control the adhesive layer according to the sensor array data. If there is too much adhesive in a certain area, the electric field system causes local micro-deformation of the adhesive layer surface, squeezing out the excess adhesive and adjusting the adhesive layer thickness.

[0042] Preferably, it also includes a shelf 14, which is disposed within the frame and is positioned opposite to the laser thickness gauge 26 and the ultraviolet curing lamp 27.

[0043] Furthermore, a second frame 12 is provided on the base 10 adjacent to the first frame 11. The second frame 12 is used to install a thickness detection system. The thickness detection system includes at least a laser thickness gauge 26, which is set on the top of the second frame 12. The laser thickness gauge 26 can detect the thickness of the adhesive layer with nanometer-level precision and transmit the measured results to the controller 29 for analysis and processing. The controller 29 performs all-round real-time control of the adhesive application system, the sensing system and the curing system based on the analysis results.

[0044] Furthermore, the curing system includes at least a UV curing lamp 27. The UV curing lamp 27 is placed on top of the third frame 13, while the glass substrate is placed at the bottom of the third frame 13. The UV curing lamp 27 then cures the bonded adhesive layer. In a preferred embodiment, a DC current heating device 28 is configured in the curing system. During the curing process of the UV curing lamp 27, the DC current heating device 28 is simultaneously driven. Preferably, the DC current heating device 28 applies a 5V DC electric field. During the curing process, a weak DC electric field is continuously applied, promoting further orderly polymerization of adhesive molecules, optimizing the microstructure of the adhesive layer, improving the stability and bonding strength of the adhesive layer, and extending the product's service life. In a preferred embodiment, a placement plate 14 is provided at the bottom of the second frame 12 and the third frame 13. The length of the placement plate 14 is greater than the overall length of the second frame 12 to the third frame 13. In this case, the glass substrate after the adhesive layer is applied is first placed on the placement plate 14 within the second frame 12. The placement plate 14 can be manually moved to facilitate its transfer from the second frame 12 to the third frame 13.

[0045] Furthermore, the first frame 11, the second frame 12, and the third frame 13 are all preferably U-shaped frames, forming a U-shape with the base 10. The first frame 11, the second frame 12, and the third frame 13 have the same interval between each pair, or the interval between each pair can be set to be the same or different according to actual needs, without specific limitations here.

[0046] Furthermore, the shape of the flexible mold 25 is preferably the same as that of the glass substrate to improve the measurement data accuracy of the sensing system and the thickness detection system. For example, the flexible mold 25 can be adjusted according to the shape of the glass substrate, which is rectangular or other shapes. No specific limitation is made here.

[0047] The above provides a detailed description of an adhesive layer thickness control device according to an embodiment of this application. Specific examples have been used to illustrate the principle and implementation of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core idea of ​​this application. At the same time, for those skilled in the art, there will be changes in the specific implementation and application scope based on the idea of ​​this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A device for controlling adhesive layer thickness, characterized in that, include: A glass substrate, wherein at least one surface of the glass substrate is provided with a conductive film layer; The base includes an adhesive coating system, an electric field system, a sensing system, a thickness detection system, and a curing system. The adhesive coating system includes at least a dispensing head for applying an adhesive layer to the glass substrate. The electric field system includes at least an electric field generator for applying an electric field between the dispensing head and the conductive film layer. The sensing system includes at least a flexible mold, with multiple pressure sensors and multiple displacement sensors on the base plate of the flexible mold for placing the adhesive-coated glass substrate on the base plate of the flexible mold. The thickness detection system includes at least a laser thickness gauge, positioned adjacent to the sensing system, for measuring the thickness of the adhesive layer. The curing system includes at least an ultraviolet curing lamp for drying and curing the adhesive layer. The controller is electrically connected to the dispensing head, the electric field generating device, the pressure sensor, the displacement sensor, and the laser thickness gauge.

2. The adhesive layer thickness control device according to claim 1, characterized in that, The conductive film layer is an indium tin oxide layer, and the thickness of the indium tin oxide layer is 5-10 nm.

3. The adhesive layer thickness control device according to claim 2, characterized in that, The electric field applied between the dispensing head and the conductive film layer is an alternating electric field with a frequency of 1-10kHz and a voltage of 50-200V.

4. The adhesive layer thickness control device according to claim 3, characterized in that, The dispensing head is cylindrical or conical.

5. The adhesive layer thickness control device according to claim 4, characterized in that, The number of dispensing heads is at least one.

6. The adhesive layer thickness control device according to claim 5, characterized in that, The adhesive application system also includes an adhesive storage tank and a volumetric metering pump. The dispensing head is fixedly connected to the volumetric metering pump, and the adhesive storage tank is fixedly connected to the volumetric metering pump.

7. The adhesive layer thickness control device according to claim 1, characterized in that, The base also includes at least one frame, which together with the base forms a U-shape, and the dispensing head, the laser thickness gauge, and the ultraviolet curing lamp are arranged side by side on the top of the frame.

8. The adhesive layer thickness control device according to claim 7, characterized in that, It also includes a shelf, which is located within the frame and is positioned opposite to the laser thickness gauge and the ultraviolet curing lamp.

9. The adhesive layer thickness control device according to claim 1, characterized in that, Multiple pressure sensors and multiple displacement sensors are integrated on the base plate of the flexible mold, and the multiple pressure sensors and multiple displacement sensors are arranged alternately at equal intervals.

10. The adhesive layer thickness control device according to claim 9, characterized in that, The flexible mold has the same shape as the glass substrate.

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