Wafer ultrasonic high-frequency cleaning equipment

Abstract

The utility model relates to the technical field of wafer cleaning, and discloses wafer ultrasonic high-frequency cleaning equipment. According to the device, a plurality of groups of wafers are placed in the wafer basket, then the electric push rod extends to drive the connecting rod, the I-shaped bracket and the limiting plate to move upwards, so that the wafer basket is convenient to place, and then the wafer basket is located at the height suitable for cleaning in the ultrasonic cleaning pool through the contraction of the electric push rod; according to the wafer cleaning device, the wafer is cleaned through a double cleaning mode of ultrasonic waves and the spraying assembly, meanwhile, the situation that local cleaning of the wafer is not in place in the cleaning process is avoided through reciprocating movement of the reciprocating type electric push rod, and the cleaning effect and quality are further improved.

Description

A wafer ultrasonic high-frequency cleaning device Technical Field

[0001] This utility model relates to the field of wafer cleaning technology, and in particular to a wafer ultrasonic high-frequency cleaning device. Background Technology

[0002] In the semiconductor manufacturing process, it is necessary to remove contaminants from the wafer surface. Therefore, ultrasonic technology removes contaminants such as organic matter, particles, metallic impurities, and oxide layers while maintaining the surface properties of the wafer.

[0003] Chinese Patent Publication No. CN222198138U discloses an ultrasonic cleaning device for wafers, comprising an ultrasonic cleaning body with a placement plate, a rotating rod, and a first bevel gear installed inside. The wafer is placed on the placement plate, and the rotating rod is turned to rotate, driving the first bevel gear to rotate. The first bevel gear meshes with a second bevel gear, which in turn drives a screw to rotate. A movable block then moves threadedly on the screw surface, pushing a connecting block to move. Simultaneously, the movable block slides upwards inside the placement plate, pushing a support rod to slide. The support rod then pushes a support block out of the placement plate. The support block at the top of the placement plate increases the support point during placement, reducing the contact area between the wafer and the placement plate, making ultrasonic cleaning faster and improving cleaning efficiency.

[0004] Regarding the above and existing related technologies, the inventors believe that the following defects often exist: the above structure can only adjust the contact area between the wafer and the placement plate, which makes it easy for cleaning dead corners to appear during the wafer cleaning process. In addition, its adjustment method is relatively complicated and cannot meet the requirements for more efficient cleaning. Summary of the Invention

[0005] The technical problem to be solved by this invention is that the existing technology has the disadvantage of poor cleaning effect and efficiency on wafers. To address this, we propose a wafer ultrasonic high-frequency cleaning device.

[0006] To achieve the above objectives, this application adopts the following technical solution: a wafer ultrasonic high-frequency cleaning device, comprising: an ultrasonic cleaning tank and a mounting frame, wherein a spray assembly is provided on the inner wall of the ultrasonic cleaning tank, a carrier assembly for transferring wafers is provided inside the ultrasonic cleaning tank, and a control panel is provided on the outer surface of the ultrasonic cleaning tank via a support frame. By combining ultrasonic waves and spraying, as well as the movement effect of the carrier assembly, the cleaning effect and quality are improved.

[0007] The supporting components include a connecting frame fixedly installed on the outer surface of the ultrasonic cleaning tank, and a reciprocating electric push rod fixedly installed inside the upper surface of the connecting frame. A moving block is fixedly installed at the telescopic end of the reciprocating electric push rod, and an electric push rod is provided on the upper surface of the moving block. A connecting rod is fixedly installed at the telescopic end of the electric push rod, and an I-shaped bracket is provided at the bottom of the connecting rod. A limit plate is welded to the upper surface of the I-shaped bracket, and a wafer basket is embedded in the upper surface of the limit plate and the interior of the I-shaped bracket. A filter screen is detachably installed at the bottom of the I-shaped bracket. By placing multiple sets of wafers in the wafer basket, and then extending the electric push rod, the connecting rod, the I-shaped bracket, and the limit plate are moved upward, thus facilitating the placement of the wafer basket. Then, by retracting the electric push rod, the wafer basket is positioned at a suitable cleaning height in the ultrasonic cleaning tank. The reciprocating movement of the electric push rod prevents the wafers from being partially cleaned during the cleaning process, further improving the cleaning effect and quality.

[0008] Preferably, the upper surface of the connecting frame is symmetrically provided with reciprocating electric push rods, moving blocks, electric push rods and connecting rods. Both sets of reciprocating electric push rods and both sets of electric push rods are equipped with electromagnetic synchronizers. Each set of electromagnetic synchronizers is connected to the control panel signal, making the wafer movement process more stable.

[0009] Preferably, the spray assembly includes a water pump fixedly installed inside the mounting frame. One end of the water pump is connected to an external cleaning water tank. A spray pipe is installed at one end of the water pump through a connecting pipe. The outer surface of the spray pipe is fixed to the inner wall of the ultrasonic cleaning tank by a bracket. Spray nozzles are evenly distributed on the outer surface of the spray pipe. The cleaning water in the cleaning water tank is sprayed out from the spray nozzles through the connecting pipe and the spray pipe, thereby improving the cleaning effect on the wafer.

[0010] Preferably, a liquid level sensor is installed on the inner wall of the ultrasonic cleaning tank, and a drain pipe is installed through the inside of the ultrasonic cleaning tank. A solenoid valve is installed inside the drain pipe. Both the liquid level sensor and the solenoid valve are connected to the control panel. The liquid level sensor can prevent water from overflowing, and the control panel controls the opening of the solenoid valve, so that excess water is discharged from the drain pipe.

[0011] Preferably, an ultrasonic generator is installed inside the mounting frame, and an ultrasonic transducer assembly is installed below the inner wall of the ultrasonic cleaning tank. The ultrasonic generator is electrically connected to the ultrasonic transducer assembly, and the ultrasonic generator is signal-connected to the control panel. When the ultrasonic generator is started, the ultrasonic transducer assembly converts the electrical signal into ultrasonic vibration, thereby generating a cavitation effect in the cleaning fluid, which can clean the wafer.

[0012] Preferably, the inner wall of the ultrasonic cleaning tank is equipped with an electric heating rod and a temperature sensor. The electric heating rod is electrically connected to an external power source, and both the electric heating rod and the temperature sensor are connected to the control panel to heat the cleaning solution and maintain it at a suitable temperature, thereby enhancing the activity of the cleaning solution.

[0013] The technical effects and advantages of this utility model are as follows:

[0014] In this invention, the device places multiple wafers in a wafer basket, and then the extension of an electric push rod moves the connecting rod, I-shaped bracket, and limiting plate upward, facilitating the placement of the wafer basket. The retraction of the electric push rod positions the wafer basket at a suitable cleaning height within the ultrasonic cleaning tank. The wafers are then cleaned using a dual cleaning method combining ultrasonic waves and a spray system. Simultaneously, the reciprocating movement of the electric push rod prevents incomplete cleaning of certain areas of the wafers during the cleaning process, further improving the cleaning effect and quality. Attached Figure Description

[0015] The disclosure of this utility model is illustrated with reference to the accompanying drawings. It should be understood that the drawings are for illustrative purposes only and are not intended to limit the scope of protection of this utility model. In the drawings, the same reference numerals are used to refer to the same parts:

[0016] Figure 1 is a schematic diagram of the overall structure of this utility model;

[0017] Figure 2 is a schematic diagram of the overall structure of this utility model.

[0018] Figure 3 is a schematic diagram of the overall structure of this utility model.

[0019] Figure 4 is a schematic diagram of the internal structure of the ultrasonic cleaning tank of this utility model.

[0020] Legend: 1. Ultrasonic cleaning tank; 2. Mounting frame; 3. Spray assembly; 31. Water pump; 32. Spray pipe; 321. Bracket; 33. Nozzle; 4. Load-bearing assembly; 41. Connecting frame; 42. Reciprocating electric push rod; 43. Moving block; 44. Electric push rod; 45. Connecting rod; 46. I-beam bracket; 47. Limiting plate; 48. Wafer basket; 49. Filter screen; 5. Control panel; 51. Support frame; 6. Liquid level sensor; 61. Drain pipe; 7. Ultrasonic generator; 71. Ultrasonic transducer assembly; 8. Electric heating rod; 81. Temperature sensor. Detailed Implementation

[0021] It is readily understood that, based on the technical solution of this utility model, those skilled in the art can propose various interchangeable structural methods and implementations without altering the essential spirit of this utility model. Therefore, the following detailed embodiments and accompanying drawings are merely illustrative descriptions of the technical solution of this utility model and should not be considered as the entirety of this utility model or as limitations or restrictions on the technical solution of this utility model.

[0022] Referring to Figure 1, this utility model provides a technical solution: a wafer ultrasonic high-frequency cleaning device, including: an ultrasonic cleaning tank 1 and a mounting frame 2, which are used to store other equipment and clean wafers respectively. The inner wall of the ultrasonic cleaning tank 1 is provided with a spray assembly 3 to improve the cleaning effect. The interior of the ultrasonic cleaning tank 1 is provided with a carrier assembly 4 for transferring wafers, which not only facilitates the placement and removal of wafers, but also improves the cleaning effect. The outer surface of the ultrasonic cleaning tank 1 is provided with a control panel 5 via a support frame 51 for easy unified control.

[0023] Referring to Figures 1-4, in this embodiment: the carrier component 4 can realize the transfer of wafers. By placing multiple sets of wafers in the wafer basket 48, and then by extending the electric push rod 44, the connecting rod 45, the I-shaped bracket 46 and the limiting plate 47 are moved upward, which facilitates the placement of the wafer basket 48. Then, by retracting the electric push rod 44, the wafer basket 48 is positioned at a suitable cleaning height in the ultrasonic cleaning tank 1. At the same time, by reciprocating the electric push rod 42, the wafers are prevented from being partially cleaned during the cleaning process, which further improves the cleaning effect and quality. In addition, impurities can be left on the filter screen 49 for easy cleaning later.

[0024] The upper surface of the connecting frame 41 is symmetrically provided with a reciprocating electric push rod 42, a moving block 43, an electric push rod 44 and a connecting rod 45, all of which are kept in sync by an electromagnetic synchronizer. The electromagnetic synchronizer receives signals from the control panel 5 to ensure that they work together.

[0025] The water pump 31 of the spray assembly 3 draws cleaning fluid from the external cleaning water tank and delivers it to the spray pipe 32 through the connecting pipe. The fluid is then sprayed out through the evenly distributed nozzles 33, thereby further cleaning the wafers in the ultrasonic cleaning tank 1. In conjunction with the ultrasonic cleaning of the ultrasonic cleaning tank 1 itself, the overall cleaning quality is further improved.

[0026] The liquid level in the ultrasonic cleaning tank 1 is detected by the liquid level sensor 6, and the signal is transmitted to the control panel 5. When the liquid level is too high or too low, the control panel 5 controls the solenoid valve in the drain pipe 61 to open or close, thereby realizing automatic adjustment of the liquid level.

[0027] The control panel 5 controls the ultrasonic generator 7 inside the mounting bracket 2 to generate a high-frequency electrical signal, which is transmitted to the ultrasonic transducer group 71 below the inner wall of the ultrasonic cleaning tank 1. The transducer group 71 then converts the electrical signal into ultrasonic vibration, causing the cleaning fluid to produce a cavitation effect, thereby cleaning the wafer.

[0028] The control panel 5 sets the appropriate cleaning temperature according to the cleaning solution and controls the start of the electric heating rod 8 to heat the cleaning solution in the ultrasonic cleaning tank 1. The temperature sensor 81 detects the temperature of the cleaning solution and transmits the signal to the control panel 5 to ensure that the temperature of the cleaning solution is stable.

[0029] Working principle: Multiple wafers are placed in the wafer basket 48. The extension of the electric push rod 44 moves the connecting rod 45, the I-shaped bracket 46, and the limiting plate 47 upward, facilitating the placement of the wafer basket 48. The retraction of the electric push rod 44 positions the wafer basket 48 at a suitable cleaning height within the ultrasonic cleaning tank 1. Simultaneously, the reciprocating movement of the reciprocating electric push rod 42 prevents incomplete cleaning of certain areas during the cleaning process, further improving the cleaning effect and quality. In addition, impurities can be retained on the filter screen 49 for easy cleaning later. Since the upper surface of the connecting frame 41 is symmetrically equipped with the reciprocating electric push rod 42, the moving block 43, the electric push rod 44, and the connecting rod 45, all of which are synchronized by an electromagnetic synchronizer, the above movement process can be made more stable through the control panel 5. Simultaneously, the ultrasonic generator 7 inside the mounting bracket 2, controlled by the control panel 5, generates a high-frequency electrical signal, which is transmitted to the ultrasonic transducer group 71 located below the inner wall of the ultrasonic cleaning tank 1. This transducer then converts the electrical signal into ultrasonic vibrations, causing cavitation in the cleaning fluid, thereby cleaning the wafer. In conjunction with the water pump 31, cleaning fluid is drawn from an external cleaning tank and delivered through connecting pipes to the spray pipe 32 and nozzles 33 for spraying. This dual cleaning method improves the overall cleaning quality and efficiency. Furthermore, the control panel 5 can be set according to the appropriate cleaning temperature of the cleaning fluid, controlling the electric heating rod 8 to heat it. The temperature sensor 81 detects the cleaning fluid temperature and transmits the signal to the control panel 5, ensuring a stable cleaning fluid temperature and further enhancing the cleaning effect. Finally, the liquid level sensor 6 detects the liquid level in the ultrasonic cleaning tank 1 and transmits the signal to the control panel 5. When the liquid level is too high or too low, the control panel 5 controls the solenoid valve in the drain pipe 61 to open or close, automatically adjusting the liquid level and preventing cleaning water overflow.

[0030] The technical scope of this utility model is not limited to the content described above. Those skilled in the art can make various modifications and variations to the above embodiments without departing from the technical concept of this utility model, and all such modifications and variations should fall within the protection scope of this utility model.

Claims

1. A wafer ultrasonic high-frequency cleaning device, characterized in that: The device includes an ultrasonic cleaning tank and a mounting frame. The inner wall of the ultrasonic cleaning tank is equipped with a spray assembly, and the interior of the ultrasonic cleaning tank contains a carrier assembly for transferring wafers. The outer surface of the ultrasonic cleaning tank is equipped with a control panel via a support frame. The carrier assembly includes a connecting frame fixedly mounted on the outer surface of the ultrasonic cleaning tank, and a reciprocating electric push rod fixedly mounted inside the upper surface of the connecting frame. A moving block is fixedly mounted on the telescopic end of the reciprocating electric push rod, and an electric push rod is mounted on the upper surface of the moving block. A connecting rod is fixedly mounted on the telescopic end of the electric push rod, and an I-shaped bracket is mounted at the bottom of the connecting rod. A limit plate is welded to the upper surface of the I-shaped bracket, and a wafer basket is fitted into the upper surface of the limit plate and the interior of the I-shaped bracket. A filter screen is detachably mounted on the bottom of the I-shaped bracket.

2. The wafer ultrasonic high-frequency cleaning equipment according to claim 1, characterized in that: The upper surface of the connecting frame is symmetrically provided with reciprocating electric push rods, moving blocks, electric push rods and connecting rods. Both sets of reciprocating electric push rods and both sets of electric push rods are equipped with electromagnetic synchronizers inside. Each set of electromagnetic synchronizers is connected to the control panel signal.

3. The wafer ultrasonic high-frequency cleaning equipment according to claim 1, characterized in that: The spray assembly includes a water pump fixedly installed inside the mounting frame. One end of the water pump is connected to an external cleaning water tank. A spray pipe is installed at one end of the water pump through a connecting pipe. The outer surface of the spray pipe is fixed to the inner wall of the ultrasonic cleaning tank by a bracket. Spray nozzles are evenly distributed on the outer surface of the spray pipe.

4. The wafer ultrasonic high-frequency cleaning equipment according to claim 1, characterized in that: A liquid level sensor is installed on the inner wall of the ultrasonic cleaning tank. A drain pipe is installed through the interior of the ultrasonic cleaning tank, and a solenoid valve is installed inside the drain pipe. Both the liquid level sensor and the solenoid valve are connected to the control panel.

5. The wafer ultrasonic high-frequency cleaning equipment according to claim 1, characterized in that: An ultrasonic generator is installed inside the mounting bracket, and an ultrasonic transducer assembly is installed below the inner wall of the ultrasonic cleaning tank. The ultrasonic generator is electrically connected to the ultrasonic transducer assembly, and the ultrasonic generator is signal-connected to the control panel.

6. The wafer ultrasonic high-frequency cleaning equipment according to claim 1, characterized in that: The inner wall of the ultrasonic cleaning tank is equipped with an electric heating rod and a temperature sensor. The electric heating rod is electrically connected to an external power source, and both the electric heating rod and the temperature sensor are connected to the control panel for signal transmission.

Images