Polishing and dust removing device

Abstract

The utility model belongs to the technical field of crystalline silicon body machining, and particularly relates to a polishing and dust removing device which comprises a base, a supporting column is fixedly installed on the back face of the base, a lifting assembly is installed in the supporting column, a fixing plate is arranged on the front face of the supporting column, and a polishing assembly is installed at the bottom of the fixing plate. The device comprises a base, a placing disc is mounted at the top of the base, a placing opening is formed in the top of the placing disc, a placing assembly is mounted in the placing opening, a circular sliding groove is formed in the top of the placing disc, and a connecting assembly is mounted in the circular sliding groove. When the grinding disc moves to the top of a wafer to be attached, at the moment, an inserting column at the bottom of a connecting disc is inserted into an inserting opening in the top of a connecting sleeve, and a driving motor drives the connecting disc and a grinding disc to rotate, so that the inserting column is inserted into the inserting opening to drive grinding columns rotationally mounted in the three connecting sleeves to rotate; the grinding disc and the grinding column can grind the outer surface and the side edge chamfer of the wafer at the same time.

Description

Technical Field

[0001] This utility model belongs to the field of silicon crystal processing technology, specifically a grinding and dust removal device. Background Technology

[0002] Crystalline silicon includes monocrystalline silicon and polycrystalline silicon. After monocrystalline silicon is produced and formed, the monocrystalline pillars need to be cut into wafers. The surface of the cut wafers needs to be polished. Surface polishing of monocrystalline wafers is a key process in precision processing fields such as semiconductor manufacturing and optoelectronic devices. By removing the surface damage layer and controlling the thickness accuracy and surface flatness, a high-quality substrate is provided for subsequent photolithography, epitaxy, bonding and other processes.

[0003] When polishing wafers, the outer surface of the wafer needs to be polished smooth by a polishing disc, and the sides of the wafer also need to be chamfered to prevent chipping. However, rotating the polishing disc can only polish the outer surface of the wafer. The wafer also needs to be transferred to a side chamfering device for side chamfering. It is not possible to polish the side chamfers and the outer surface of the wafer at the same time, which reduces the efficiency of wafer polishing.

[0004] Therefore, a grinding dust removal device is proposed to address the above problems. Utility Model Content

[0005] In order to overcome the shortcomings of the existing technology and address the problems of existing equipment, this utility model proposes a grinding and dust removal device.

[0006] The technical solution adopted by this utility model to solve its technical problem is a grinding and dust removal device, including a base, a support column fixedly installed on the back of the base, a lifting component installed inside the support column, a fixed plate provided on the front of the support column, the lifting component being used to drive the fixed plate to move its position, a grinding component installed at the bottom of the fixed plate, a placement plate installed on the top of the base, a placement opening provided on the top of the placement plate, a placement component installed inside the placement opening, a circular groove provided on the top of the placement plate, and a connecting component installed inside the circular groove;

[0007] The grinding assembly includes a sleeve hole opened on the top of the fixed plate, a fixed ring sleeved inside the sleeve hole, a drive motor mounted on the top of the fixed ring, a connecting plate mounted through the output shaft of the drive motor, a mating sleeve fixedly mounted on the bottom of the connecting plate, a grinding disc mounted inside the mating sleeve, and a plug-in post fixedly mounted on the bottom of the mating sleeve.

[0008] The connecting assembly includes a sliding column slidably installed inside a circular groove, a connecting sleeve fixedly installed on the top of the sliding column, a grinding column rotatably installed inside the connecting sleeve, and an insertion interface opened on the top of the connecting sleeve.

[0009] Preferably, the insertion post is positioned directly above the insertion interface, and three grinding posts are provided, which are arranged in a circumferential array inside the circular groove.

[0010] Preferably, the lifting assembly includes a slide rail formed on the front of the support column, a lead screw is rotatably mounted inside the slide rail, a moving block is threadedly connected to the outer surface of the lead screw, a stepper motor is mounted on the top of the lead screw through the top of the slide rail, and the moving block is fixedly mounted on the back of the fixed plate.

[0011] Preferably, the placement assembly includes a placement plate installed inside the placement port. The interior of the placement plate is configured as a hollow structure. A hole is opened at the top of the placement plate, and a vacuum nozzle is installed at the top of the hole. An air inlet is opened at the bottom of the placement plate, and an air inlet pipe is installed at the bottom of the air inlet.

[0012] Furthermore, the placement plate is designed as a hollow structure, which can be connected through an air inlet pipe, holes, and a vacuum nozzle.

[0013] Preferably, the bottom of the inner wall of the circular chute is provided with a through hole, the bottom of the inner wall of the through hole extends to the bottom of the placement tray, and a collection box is installed at the bottom of the placement tray.

[0014] Furthermore, a collection box is installed at the bottom of the through hole to collect debris, and the collection box can be removed to process the collected debris.

[0015] Preferably, a control box is mounted on the front of the base, and the control box is used to control the start and stop of the drive motor and the stepper motor.

[0016] The beneficial effects of this utility model are:

[0017] 1. In this utility model, after the wafer is adsorbed and fixed on the top of the vacuum nozzle, the stepper motor works, driving the lead screw to rotate. The moving block drives the fixing plate to move downward, moving the grinding disc to the top of the wafer to fit together. At this time, the insertion post at the bottom of the connecting plate is inserted into the insertion interface at the top of the connecting sleeve. The drive motor drives the connecting plate and the grinding disc to rotate, so that the insertion post inserts into the insertion interface and drives the grinding posts installed inside the three connecting sleeves to rotate. This allows the grinding disc and grinding posts to simultaneously grind the outer surface and chamfer the side of the wafer, improving the grinding efficiency of the wafer.

[0018] 2. In this utility model, when the debris generated during the grinding of the wafer falls from the top of the wafer into the interior of the circular groove, the sliding column rotates inside the circular groove, which can push the debris that has fallen into the circular groove into the through hole and into the interior of the collection box, thereby achieving the effect of collecting and processing the debris. When the grinding column rotates along the side of the wafer, it can also reduce the situation where debris escapes into the air and forms dust, thereby achieving the effect of dust removal. Attached Figure Description

[0019] The accompanying drawings, which are included to provide a further understanding of the present invention and form part of this application, illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the present invention and do not constitute an undue limitation thereof. In the drawings:

[0020] Figure 1 This is a schematic diagram of the overall three-dimensional structure of this utility model;

[0021] Figure 2 This is a schematic diagram of the grinding component structure of this utility model;

[0022] Figure 3 This is a schematic diagram of the placement tray structure of this utility model;

[0023] Figure 4 For the present utility model Figure 3 Enlarged structural diagram at point A in the middle;

[0024] Figure 5 This is a schematic diagram of the placement plate structure of this utility model;

[0025] Figure 6 For the present utility model Figure 5 Enlarged structural diagram at point B.

[0026] Legend:

[0027] In the diagram: 1. Base; 11. Placement tray; 12. Placement opening; 13. Placement component; 101. Placement plate; 102. Hole; 103. Vacuum nozzle; 104. Air inlet pipe; 2. Support column; 21. Lifting component; 201. Slide rail; 202. Lead screw; 203. Moving block; 204. Stepper motor; 3. Fixing plate; 31. Grinding component; 301. Fixing ring; 302. Drive motor; 303. Connecting plate; 304. Docking sleeve; 305. Grinding disc; 306. Insertion column; 4. Circular slide groove; 41. Connecting component; 401. Sliding column; 402. Connecting sleeve; 403. Grinding column; 404. Insertion interface; 5. Through hole; 51. Collection box; 6. Control box. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0029] Please see Figures 1-6 As shown, a grinding and dust removal device includes a base 1, a support column 2 fixedly mounted on the back of the base 1, a lifting assembly 21 installed inside the support column 2, a fixing plate 3 provided on the front of the support column 2, the lifting assembly 21 used to move the fixing plate 3, a grinding assembly 31 installed at the bottom of the fixing plate 3, a placement tray 11 installed on the top of the base 1, a placement opening 12 opened on the top of the placement tray 11, a placement assembly 13 installed inside the placement opening 12, a circular groove 4 opened on the top of the placement tray 11, and a connecting assembly 41 installed inside the circular groove 4. A control box 6 is installed on the front of the base 1, the control box 6 used to control the start and stop of the drive motor 302 and the stepper motor 204.

[0030] Furthermore, by installing a placement tray 11 on the base 1, the placement component 13 can be installed into the placement opening 12 on the top of the placement tray 11 for placing and fixing the wafer in position. At the same time, the lifting component 21 is installed inside the support column 2. The lifting component 21 can move up and down inside the support column 2, allowing the grinding component 31 to move up and down on the top of the placement tray 11 with the help of the lifting component 21. After the grinding component 31 is moved to the appropriate position, it can dock with the connecting component 41 to grind the outer surface and sides of the wafer placed on top of the placement component 13. A control box 6 is installed on the front of the base 1 to control the start and stop of the drive motor 302 and stepper motor 204 of the grinding component 31 and the lifting component 21. The drive motor 302 can precisely rotate the grinding disk 305 for grinding through the control box 6, and the stepper motor 204 can be controlled by the control box 6 to move the grinding disk 305 to the top of the wafer for grinding.

[0031] First, considering how the polishing assembly 31 and the connecting assembly 41 polish the outer surface and sides of the wafer, the following is presented: Figure 2 , Figure 5 and Figure 6The specific structure of the grinding component 31 and the connecting component 41 is disclosed. The grinding component 31 includes a sleeve hole opened on the top of the fixed plate 3. A fixing ring 301 is sleeved inside the sleeve hole. A drive motor 302 is installed on the top of the fixing ring 301. A connecting plate 303 is installed through the fixed ring 301. A mating sleeve 304 is fixedly installed at the bottom of the connecting plate 303. A grinding disc 305 is installed inside the mating sleeve 304. A plug-in post 306 is fixedly installed at the bottom of the mating sleeve 304.

[0032] The connecting component 41 includes a sliding column 401 that is slidably installed inside the circular slide groove 4. A connecting sleeve 402 is fixedly installed on the top of the sliding column 401. A grinding column 403 is rotatably installed inside the connecting sleeve 402. An insertion interface 404 is provided on the top of the connecting sleeve 402.

[0033] The insertion post 306 is located directly above the insertion interface 404, and there are three grinding posts 403, which are arranged in a circular array inside the circular groove 4.

[0034] Furthermore, a drive motor 302 is installed on the top of the fixed plate 3. A fixing ring 301 is sleeved on the outer surface of the output shaft of the drive motor 302, so that the fixing ring 301 fits into the sleeve hole opened on the top of the fixed plate 3. Thus, the output shaft of the drive motor 302 can pass through to the bottom of the fixed plate 3 and connect to the connecting plate 303. The mating sleeve 304 is fixedly installed on the bottom of the connecting plate 303, so that the mating sleeve 304 can install the grinding disc 305. The diameter of the connecting plate 303 is larger than the diameter of the mating sleeve 304, so that the insertion post 306 can be fixedly installed on the bottom of the connecting plate 303. The bottom of the insertion post 306 is at a lower horizontal position than the horizontal position of the grinding disc 305. The sliding post 401 is slidably installed inside the circular groove 4 and rotates circumferentially, thereby rotating the grinding post 403. The grinding column 403 is installed inside the connecting sleeve 402. The bottom of the connecting sleeve 402 is fixedly installed on the top of the sliding column 401. The grinding column 403 can rotate inside the circular groove 4 with the help of the sliding column 401. When the lifting component 21 drives the drive motor 302 and the grinding disc 305 to move downward, when the grinding disc 305 moves to the top of the wafer on the top of the placement component 13, the insertion column 306 is also inserted into the insertion interface 404 opened on the top of the connecting sleeve 402. Then, when the drive motor 302 is powered on and starts to drive the grinding disc 305 and the connecting disc 303 to rotate, the insertion column 306 also drives the connecting sleeve 402 and the grinding column 403 to rotate together. This allows the grinding disc 305 and the grinding column 403 to simultaneously grind the outer surface of the wafer and the chamfer on the side, improving the grinding efficiency of the wafer.

[0035] It should be noted that there are three grinding pillars 403 and three connecting sleeves 402. Similarly, three insertion pillars 306 are installed at the bottom of the connecting plate 303. These can connect the three connecting sleeves 402 and the grinding pillars 403, causing the three grinding pillars 403 to rotate. The three grinding pillars 403 are installed inside the connecting sleeves 402 in an inclined manner, which can be adapted to the chamfer angle of the wafer side grinding. The wafer side is chamfered and ground by rotating.

[0036] Secondly, considering the issue of how to drive the drive motor 302 and the grinding disc 305 to move up and down, the following is presented: Figure 1 The specific structure of the lifting assembly 21 is disclosed. The lifting assembly 21 includes a slide rail 201 opened on the front of the support column 2. A lead screw 202 is rotatably installed inside the slide rail 201. A moving block 203 is threadedly connected to the outer surface of the lead screw 202. A stepper motor 204 is installed through the top of the lead screw 202 and through the top of the slide rail 201. The moving block 203 is fixedly installed on the back of the fixed plate 3.

[0037] Furthermore, a slide rail 201 is opened on the front of the support column 2, and the lead screw 202 is rotatably installed inside the slide rail 201. The stepper motor 204 is installed on the top of the support column 2. The output shaft of the stepper motor 204 can pass through the interior of the support column 2 and connect to the interior of the lead screw 202. The control box 6 controls the stepper motor 204 to work, driving the moving block 203 on the outer surface of the lead screw 202 to move up and down. In turn, the moving block 203 can drive the fixed plate 3, the drive motor 302 and the grinding disc 305 to move up and down.

[0038] Furthermore, considering the issue of how the wafer is adsorbed and fixed to the top of the placement tray 11, the following is presented: Figure 3 and Figure 4 The specific structure of the placement component 13 is disclosed. The placement component 13 includes a placement plate 101 installed inside the placement port 12. The interior of the placement plate 101 is set as a hollow structure. A hole 102 is opened at the top of the placement plate 101. A vacuum nozzle 103 is installed at the top of the hole 102. An air inlet is opened at the bottom of the placement plate 101. An air inlet pipe 104 is installed at the bottom of the air inlet.

[0039] Furthermore, the placement plate 101 is installed into the placement opening 12 at the top of the placement tray 11. The interior of the placement plate 101 is hollow, allowing the hole 102 at the top of the placement plate 101 to connect with the air inlet at the bottom of the placement plate 101. Multiple vacuum nozzles 103 are then installed into the multiple holes 102 at the top of the placement plate 101. One end of the air inlet pipe 104 is connected to the air inlet, and the other end of the air inlet pipe 104 can be connected to a vacuum pump, allowing the vacuum pump to start. Air is extracted from the vacuum nozzle 103, and the wafer is placed on top of the vacuum nozzle 103. After the air is extracted from the vacuum nozzle 103, the wafer can be adsorbed and fixed onto the vacuum nozzle 103. When the vacuum pump introduces air, the wafer can be removed from the vacuum nozzle 103, thus achieving the effect of adsorbing and fixing the wafer onto the top of the placement plate 101. The wafer is then positioned directly below the polishing disc 305. The polishing disc 305 moves downward to polish the outer surface of the wafer.

[0040] Finally, considering the issue of how to remove the debris generated during wafer polishing, the following is presented: Figure 3 and Figure 4 A through hole 5 is provided at the bottom of the inner wall of the circular chute 4. The bottom of the inner wall of the through hole 5 extends to the bottom of the placement tray 11, and a collection box 51 is installed at the bottom of the placement tray 11.

[0041] Furthermore, a through hole 5 is made at the bottom of the inner wall of the circular groove 4, extending to the bottom of the placement tray 11. When the grinding disc 305 grinds the wafer, the debris generated falls into the interior of the circular groove 4. The sliding column 401 rotates inside the circular groove 4, which can push the debris into the through hole 5 and flow into the collection box 51, thereby achieving the effect of collecting and processing the debris generated during grinding. In addition, the three grinding columns 403 rotate on the side of the wafer, which can effectively reduce the situation of debris floating and generating dust.

[0042] In summary, the working principle of this utility model is as follows:

[0043] During wafer polishing, the operator places the wafer on top of the vacuum nozzle 103 on the placement plate 101. At this time, the three polishing posts 403 are located on the outer surface of the placement plate 101, which can limit the placement position of the wafer and prevent it from shifting. The vacuum pump is started to suck air out of the vacuum nozzle 103, so that the wafer can be adsorbed and fixed on the top of the vacuum nozzle 103. The control box 6 controls the stepper motor 204 to work, driving the lead screw 202 to rotate. The moving block 203 drives the fixing plate 3 to move downward, moving the polishing disc 305 to the top of the wafer to fit. At this time, the insertion post 306 at the bottom of the connecting plate 303 is inserted into the insertion interface 404 at the top of the connecting sleeve 402. The control box 6 controls the drive motor 302 to work, thereby driving the connecting plate 303 and the polishing post 405 to move downward. The grinding disc 305 rotates, causing the insertion pin 306 to insert into the interface 404, which in turn drives the grinding pin 403, which is installed inside the three connecting sleeves 402, to rotate. The sliding pin 401, which is installed at the bottom of the three connecting sleeves 402, is slidably installed inside the circular groove 4 and rotates in a circular motion. This allows the grinding disc 305 and the grinding pin 403 to simultaneously grind the outer surface and chamfer the side of the wafer, improving the grinding efficiency of the wafer. The debris generated during the grinding of the wafer falls from the top of the wafer into the circular groove 4. The sliding pin 401 rotates inside the circular groove 4, pushing the debris that falls into the circular groove 4 into the through hole 5 and into the collection box 51, achieving the effect of collecting and processing the debris. When the grinding pin 403 rotates along the side of the wafer, it can reduce the amount of debris that escapes into the air and forms dust.

[0044] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0045] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.

Claims

1. A grinding and dust removal device, comprising a base (1), a support column (2) fixedly installed on the back of the base (1), a lifting assembly (21) installed inside the support column (2), a fixing plate (3) provided on the front of the support column (2), the lifting assembly (21) being used to move the fixing plate (3) to a different position, characterized in that: A grinding component (31) is installed at the bottom of the fixing plate (3), a placement plate (11) is installed at the top of the base (1), a placement opening (12) is opened at the top of the placement plate (11), a placement component (13) is installed inside the placement opening (12), a circular groove (4) is opened at the top of the placement plate (11), and a connecting component (41) is installed inside the circular groove (4). The grinding assembly (31) includes a sleeve hole opened on the top of the fixed plate (3), a fixed ring (301) is sleeved inside the sleeve hole, a drive motor (302) is installed on the top of the fixed ring (301), the output shaft of the drive motor (302) passes through the fixed ring (301) and a connecting plate (303) is installed thereon, a docking sleeve (304) is fixedly installed at the bottom of the connecting plate (303), a grinding disc (305) is installed inside the docking sleeve (304), and a plug-in post (306) is fixedly installed at the bottom of the docking sleeve (304). The connecting assembly (41) includes a sliding column (401) slidably installed inside a circular groove (4), a connecting sleeve (402) is fixedly installed on the top of the sliding column (401), a grinding column (403) is rotatably installed inside the connecting sleeve (402), and an insertion interface (404) is opened on the top of the connecting sleeve (402).

2. The grinding dust removal device according to claim 1, characterized in that: The insertion post (306) is located directly above the insertion interface (404), and there are three grinding posts (403). The three grinding posts (403) are arranged in a circular array inside the circular groove (4).

3. The grinding dust removal device according to claim 1, characterized in that: The lifting assembly (21) includes a slide rail (201) on the front of the support column (2), a lead screw (202) is rotatably installed inside the slide rail (201), a moving block (203) is threadedly connected to the outer surface of the lead screw (202), a stepper motor (204) is installed through the top of the lead screw (202) and the top of the slide rail (201), and the moving block (203) is fixedly installed on the back of the fixing plate (3).

4. The polishing dust removal device according to claim 1, characterized by: The placement assembly (13) includes a placement plate (101) installed inside the placement port (12). The interior of the placement plate (101) is hollow. A hole (102) is provided at the top of the placement plate (101). A vacuum nozzle (103) is installed at the top of the hole (102). An air inlet is provided at the bottom of the placement plate (101). An air inlet pipe (104) is installed at the bottom of the air inlet.

5. The polishing dust removal device according to claim 1, characterized in that: The bottom of the inner wall of the circular chute (4) is provided with a through hole (5), the bottom of the inner wall of the through hole (5) extends to the bottom of the placement tray (11), and a collection box (51) is installed at the bottom of the placement tray (11).

6. The polishing dust removal device according to claim 1, characterized by: A control box (6) is mounted on the front of the base (1), and the control box (6) is used to control the start and stop of the drive motor (302) and the stepper motor (204).

Images