Semiconductor cutting adhesion-reducing film with positioning mark
By introducing positioning marks and a combined positioning mechanism into the semiconductor cutting anti-adhesion film, the problem of shaking of the anti-adhesion film during the cutting process is solved, and a more stable cutting effect is achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- NANTONG LIMENG NEW MATERIAL TECH CO LTD
- Filing Date
- 2025-05-20
- Publication Date
- 2026-05-01
AI Technical Summary
During the cutting process of semiconductor anti-adhesion films, the flexibility of the anti-adhesion film leads to unstable positioning, which affects the cutting quality.
A semiconductor cutting anti-adhesion film with positioning marks is used. The anti-adhesion film is initially positioned and pressed by a combination of positioning mechanism, second electric cylinder, U-shaped plate and rubber plate, and then cut by the movement of the cutter.
It improves the stability and cutting quality of the anti-adhesion membrane, avoids shaking during the cutting process, and ensures the flatness after cutting.
Smart Images
Figure CN224183203U_ABST
Abstract
Description
A semiconductor dicing anti-adhesion film with positioning marks Technical Field
[0001] This utility model relates to the field of semiconductor anti-adhesion film cutting technology, specifically a semiconductor cutting anti-adhesion film with positioning marks. Background Technology
[0002] Semiconductors are materials whose conductivity at room temperature is between that of conductors and insulators. After semiconductors are manufactured, an anti-adhesion film is applied to their surface to protect them. The anti-adhesion film needs to be cut before it is applied, which requires the use of a cutting mechanism.
[0003] Currently, when cutting anti-adhesion films, the cutting width varies depending on the type of semiconductor, thus requiring positioning treatment during cutting. However, after positioning, the anti-adhesion film is relatively soft and may wobble during cutting, resulting in uneven cuts and reduced quality. Summary of the Invention
[0004] To address the aforementioned problems, the purpose of this invention is to provide a semiconductor cutting anti-adhesion film with positioning marks, thereby resolving the issues raised in the background art.
[0005] To achieve the above objectives, this utility model proposes a semiconductor cutting anti-adhesion film with positioning marks, including a cutting table, a cutting groove on the top of the cutting table, and two fixing plates installed on the top of the cutting table;
[0006] The top of the cutting table is provided with a positioning mechanism, which includes a slide groove, a slider, a scale, a first electric cylinder, and a positioning baffle. The first electric cylinder is fixedly installed on the top of the cutting table, and the output shaft of the first electric cylinder is fixedly installed with the positioning baffle. A scale flush with the positioning baffle is fixedly installed on the top of the cutting table. The top of the cutting table has a slide groove, and the inner wall of the slide groove is slidably connected to a slider fixed to the positioning baffle.
[0007] In one example, a linear slide rail is fixedly mounted on the top of the two fixed plates, and a mounting plate is fixedly mounted on one side of the moving block of the linear slide rail.
[0008] In one example, a cylinder is fixedly mounted on the top of the mounting plate, and a movable rod that is inserted and connected to the mounting plate is fixedly mounted on the output shaft of the cylinder.
[0009] In one example, a cutter is fixedly mounted at the bottom end of the movable rod, and the cutter is adapted to the cutter groove.
[0010] In one example, a second electric cylinder is fixedly mounted on one side of one of the fixed plates, and a U-shaped plate is fixedly mounted on the output shaft of the second electric cylinder. Both sides of the U-shaped plate are slidably connected to the two fixed plates.
[0011] In one example, a rubber plate is fixedly installed at the bottom of the U-shaped plate.
[0012] The semiconductor cutting anti-adhesion film with positioning marks proposed in this utility model can bring the following beneficial effects:
[0013] 1. The semiconductor cutting anti-adhesion film with positioning marks uses a positioning mechanism, a second electric cylinder, a U-shaped plate and a rubber plate. The positioning baffle in the positioning mechanism initially positions the anti-adhesion film, and then the second electric cylinder is activated to drive the U-shaped plate to descend, which in turn drives the rubber plate to descend, thereby pressing and stabilizing the anti-adhesion film, which facilitates better subsequent cutting.
[0014] 2. This semiconductor cutting anti-adhesion film with positioning marks is driven by a cylinder to move a movable plate and lower the cutter. When the cutter is lowered into the cutter groove, the linear slide rail is activated and can move the mounting plate, which in turn moves the cutter, thereby cutting the anti-adhesion film after positioning and pressing. Attached Figure Description
[0015] The accompanying drawings, which are included to provide a further understanding of the present invention and constitute a part of this invention, illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the present invention and do not constitute an undue limitation thereof. In the drawings:
[0016] Figure 1 is a schematic diagram of the structure of this utility model;
[0017] Figure 2 is a schematic diagram of the mounting plate structure of this utility model;
[0018] Figure 3 is a schematic diagram of the U-shaped plate structure of this utility model.
[0019] In the diagram: 1. Cutting table; 2. Fixed plate; 3. Linear slide rail; 4. Mounting plate; 5. Cylinder; 6. Movable rod; 7. Cutting blade; 8. Blade groove; 9. Positioning baffle; 10. First electric cylinder; 11. Scale; 12. Slider; 13. Slide groove; 14. U-shaped plate; 15. Rubber plate; 16. Second electric cylinder. Detailed Implementation
[0020] To more clearly illustrate the overall concept of this utility model, a detailed description will be provided below with reference to the accompanying drawings.
[0021] As shown in Figures 1 to 3, an embodiment of this utility model proposes a semiconductor cutting anti-adhesion film with positioning marks, including a cutting table 1, a cutting groove 8 on the top of the cutting table 1, and two fixing plates 2 installed on the top of the cutting table 1.
[0022] The top of the cutting table 1 is provided with a positioning mechanism, which includes a slide groove 13, a slider 12, a scale 11, a first electric cylinder 10, and a positioning baffle 9. The first electric cylinder 10 is fixedly installed on the top of the cutting table 1, and the positioning baffle 9 is fixedly installed on the output shaft of the first electric cylinder 10. The scale 11, which is flush with the positioning baffle 9, is fixedly installed on the top of the cutting table 1. The top of the cutting table 1 is provided with a slide groove 13, and the inner wall of the slide groove 13 is slidably connected to the slider 12, which is fixed to the positioning baffle 9.
[0023] Specifically, linear slide rails 3 are fixedly installed on the top of the two fixed plates 2, and mounting plates 4 are fixedly installed on one side of the moving block of the linear slide rails 3. The moving block is moved by the linear slide rails 3, which in turn moves the mounting plates 4.
[0024] Specifically, a cylinder 5 is fixedly installed on the top of the mounting plate 4, and a movable rod 6 that is inserted and connected to the mounting plate 4 is fixedly installed on the output shaft of the cylinder 5. The cylinder 5 drives the movable rod 6 to move, which in turn drives the cutter 7 to move.
[0025] Specifically, a cutter 7 is fixedly installed at the bottom of the movable rod 6, and the cutter 7 is adapted to the cutter groove 8, so as to cut the anti-adhesion film through the cutter 7.
[0026] Specifically, a second electric cylinder 16 is fixedly installed on one side of one of the fixed plates 2, and a U-shaped plate 14 is fixedly installed on the output shaft of the second electric cylinder 16. Both sides of the U-shaped plate 14 are slidably connected to the two fixed plates 2, and the U-shaped plate 14 is driven to move downward by the second electric cylinder 16.
[0027] Specifically, a rubber plate 15 is fixedly installed at the bottom of the U-shaped plate 14. The rubber plate 15 presses the anti-adhesion film on the cutting table 1 to facilitate subsequent cutting.
[0028] Working Principle: The various embodiments in this specification are described in a progressive manner. When positioning the anti-adhesion film is required between different embodiments, the first electric cylinder 10 is activated to move the positioning baffle 9. At this time, the position of the positioning baffle 9 and the scale 11 are observed, and the anti-adhesion film to be cut is positioned. When the positioned anti-adhesion film needs to be cut, the cylinder 5 drives the movable rod 6 to move, and drives the cutter 7 to move downward. When the cutter 7 moves into the cutter groove 8, the linear slide rail 3 is activated to move the moving block and the mounting plate 4, which will move the cutter 7 and cut the positioned anti-adhesion film. Before cutting, the second electric cylinder 16 is activated to move the U-shaped plate 14 downward and the rubber plate 15 downward. At this time, the positioned anti-adhesion film to be cut can be pressed and stabilized to prevent it from shaking during cutting, thereby reducing the quality of the cut. The rubber plate 15 presses it down, which facilitates better cutting later.
[0029] For similar or identical parts, please refer to each other. Each embodiment focuses on describing the differences from other embodiments. In particular, for system embodiments, since they are basically similar to method embodiments, the description is relatively simple, and relevant parts can be referred to the description of the method embodiments.
[0030] The above description is merely an embodiment of this utility model and is not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principle of this utility model should be included within the scope of the claims of this utility model.
Claims
1. A semiconductor cutting anti-adhesion film with positioning marks, comprising a cutting table (1), wherein a cutting groove (8) is formed on the top of the cutting table (1), and two fixing plates (2) are mounted on the top of the cutting table (1); characterized in that: The top of the cutting table (1) is provided with a positioning mechanism, which includes a slide groove (13), a slider (12), a scale (11), a first electric cylinder (10), and a positioning baffle (9). The top of the cutting table (1) is fixedly installed with the first electric cylinder (10), and the output shaft of the first electric cylinder (10) is fixedly installed with the positioning baffle (9). The top of the cutting table (1) is fixedly installed with a scale (11) that is flush with the positioning baffle (9). The top of the cutting table (1) is provided with a slide groove (13), and the inner wall of the slide groove (13) is slidably connected with a slider (12) that is fixed to the positioning baffle (9).
2. The semiconductor cutting anti-adhesion film with positioning marks according to claim 1, characterized in that: A linear slide rail (3) is fixedly installed on the top of the two fixed plates (2), and an mounting plate (4) is fixedly installed on one side of the moving block of the linear slide rail (3).
3. The semiconductor cutting anti-adhesion film with positioning marks according to claim 2, characterized in that: A cylinder (5) is fixedly installed on the top of the mounting plate (4), and a movable rod (6) that is inserted and connected to the mounting plate (4) is fixedly installed on the output shaft of the cylinder (5).
4. The semiconductor cutting anti-adhesion film with positioning marks according to claim 3, characterized in that: A cutter (7) is fixedly installed at the bottom end of the movable rod (6), and the cutter (7) is adapted to the cutter groove (8).
5. A semiconductor cutting anti-adhesion film with positioning marks according to claim 1, characterized in that: A second electric cylinder (16) is fixedly installed on one side of one of the fixed plates (2), and a U-shaped plate (14) is fixedly installed on the output shaft of the second electric cylinder (16). Both sides of the U-shaped plate (14) are slidably connected to the two fixed plates (2).
6. A semiconductor cutting anti-adhesion film with positioning marks according to claim 5, characterized in that: A rubber plate (15) is fixedly installed at the bottom of the U-shaped plate (14).