Magnetic adsorption device for improving cutting quality of photovoltaic silicon wafer

Abstract

The utility model relates to the technical field of photovoltaic silicon wafers, and discloses a magnetic adsorption device for improving the cutting quality of photovoltaic silicon wafers, which comprises a wire cutting machine main body, a transmission wheel is arranged on the wire cutting machine main body, a cutting wire is sleeved on the transmission wheel, a bearing table is arranged in the wire cutting machine main body, and a magnetic adsorption device is arranged on the bearing table. The wire cutting machine comprises a wire cutting machine body, a bearing table is arranged on the wire cutting machine body, a water guide groove matched with the bearing table is formed in the end, close to the bearing table, of the wire cutting machine body, and two detachable magnetic rods are symmetrically and rotationally arranged in the water guide groove. Meanwhile, through the detachable design of the magnetic rod and the connecting rod, a worker can take out the magnetic rod from the interior of the water guide groove more conveniently, and the problem that due to the fact that the chippings are flushed in a water flushing mode, part of the chippings are splashed along with the water flow, the chippings cannot be washed out easily is solved. And meanwhile, repeated use of water flow is affected.

Description

A magnetic adsorption device for improving the cutting quality of photovoltaic silicon wafers Technical Field

[0001] This utility model application relates to the field of photovoltaic silicon wafer technology, specifically a magnetic adsorption device for improving the cutting quality of photovoltaic silicon wafers. Background Technology

[0002] Photovoltaic silicon wafers are the core substrate of solar cells. They are usually made of high-purity polycrystalline silicon or monocrystalline silicon and are processed into thin sheets through cutting, polishing and other processes. They are used to absorb sunlight and convert it into electrical energy. According to the crystal structure, they can be divided into monocrystalline silicon wafers and polycrystalline silicon wafers. The surface of silicon wafers is treated with texturing, doping and other processes to enhance light absorption and conductivity. Their performance directly affects the conversion efficiency and reliability of photovoltaic modules. As a key intermediate product in the photovoltaic industry chain, the technological progress of silicon wafers continues to drive down the cost of solar power generation and help the development of clean energy.

[0003] Currently, photovoltaic silicon wafers are often cut by carrying diamonds with steel wires. This cutting method easily generates debris. The current solution is to use water to cool the silicon wafer during cutting and wash away the debris. However, some debris will splash with the water flow. At the same time, these debris are often mixed in with the water during recycling, affecting the reuse of the water. Summary of the Invention

[0004] To address the issue that rinsing debris with water causes some debris to splash with the water flow, thus affecting the reuse of the water, this invention provides a magnetic adsorption device to improve the cutting quality of photovoltaic silicon wafers, thereby solving the aforementioned problems.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A magnetic adsorption device for improving the cutting quality of photovoltaic silicon wafers includes a wire cutting machine body, a transmission wheel on the wire cutting machine body, a cutting wire sleeved on the transmission wheel, a support platform inside the wire cutting machine body, a water inlet groove that cooperates with the support platform at one end of the wire cutting machine body, two detachable magnetic rods symmetrically rotatably arranged inside the water inlet groove, a connecting rod engaged at one end of each magnetic rod, a pulley fixed at the end of the connecting rod away from the magnetic rod, the two pulleys being connected by a transmission belt, and a servo motor fixed at the rear end of the wire cutting machine body, the output end of the servo motor being fixedly connected to one of the pulleys.

[0007] Furthermore, a first limiting plate is engaged at one end of the magnetic rod, and the first limiting plate is fixedly connected to the main body of the wire cutting machine by bolts.

[0008] Furthermore, a second limiting plate is engaged at the end of the magnetic rod away from the first limiting plate, and the second limiting plate is fixedly connected to the wire cutting machine body by bolts.

[0009] Furthermore, a square slot is provided at one end of the magnetic rod near the connecting rod, and a locking block with the same shape as the slot of the magnetic rod is fixed at one end of the connecting rod near the magnetic rod.

[0010] Furthermore, a cylinder is provided above the support platform, the top surface of the cylinder is fixedly connected to the main body of the wire cutting machine, and a clamping block is fixed to the output end of the cylinder.

[0011] Furthermore, a limiting groove is provided on the top surface of the support platform, and another limiting groove is provided at the end of the clamping block near the support platform.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] 1. In this utility model, magnetic rods are installed inside the water inlet tank, and two magnetic rods are driven to rotate by a servo motor, so that the magnetic rods can attract debris in the air and water flow. At the same time, the magnetic rods are detachable from the connecting rods, making it easier for workers to remove the magnetic rods from the water inlet tank. This solves the problem that some debris will splash with the water flow when washing debris by rinsing, which will affect the reuse of water flow.

[0014] 2. In this utility model, a cylinder is fixed at the bottom of the main body of the wire cutting machine, and a clamping block is fixed at the output end of the cylinder. At the same time, a limiting groove is opened on both the clamping block and the support platform, so that when the silicon rod is placed in the limiting groove, it is convenient to be continuously fixed by the clamping block. This avoids the problem that when the cutting wire cuts the silicon rod, the traditional fixing method is prone to the silicon rod moving due to the vibration generated during cutting, which affects the cutting quality. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 is a schematic diagram of the front-end three-dimensional structure according to an embodiment of this application;

[0017] Figure 2 is a three-dimensional schematic diagram of the rear-end structure in the embodiment shown in Figure 1;

[0018] Figure 3 is a three-dimensional schematic diagram of the fixing device structure in the embodiment shown in Figure 1;

[0019] Figure 4 is a three-dimensional structural diagram of the magnetic rod assembly in the embodiment shown in Figure 1.

[0020] The meanings of the reference numerals in the attached diagram are as follows: 1. Main body of the wire EDM machine; 2. Drive wheel; 3. Cutting wire; 4. Support platform; 5. Water channel; 6. Magnetic rod; 7. First limiting plate; 8. Connecting rod; 9. Pulley; 10. Drive belt; 11. Servo motor; 12. Second limiting plate; 13. Cylinder; 14. Clamping block; 15. Limiting groove. Detailed Implementation

[0021] To make the purpose, features, and advantages of this application more apparent and understandable, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0022] Referring to Figures 1, 2, 3, and 4, a magnetic adsorption device for improving the cutting quality of photovoltaic silicon wafers includes a wire cutting machine body 1, a transmission wheel 2 on the wire cutting machine body 1, a cutting wire 3 sleeved on the transmission wheel 2, a support platform 4 inside the wire cutting machine body 1, a water inlet trough 5 that cooperates with the support platform 4 at one end of the wire cutting machine body 1, two detachable magnetic rods 6 symmetrically rotated inside the water inlet trough 5, a connecting rod 8 being engaged at one end of each magnetic rod 6, a pulley 9 being fixed at the end of the connecting rod 8 away from the magnetic rod 6, the two pulleys 9 being connected by a transmission belt 10, and a servo motor 11 being fixed at the rear end of the wire cutting machine body 1, the output end of the servo motor 11 being fixedly connected to one of the pulleys 9, so that the magnetic rods 6 adsorb debris.

[0023] Specifically, a first limiting plate 7 is engaged at one end of the magnetic rod 6, and the first limiting plate 7 is fixedly connected to the wire cutting machine body 1 by bolts. A second limiting plate 12 is engaged at the end of the magnetic rod 6 away from the first limiting plate 7, and the second limiting plate 12 is fixedly connected to the wire cutting machine body 1 by bolts. A square slot is opened at the end of the magnetic rod 6 near the connecting rod 8, and a locking block with the same shape as the slot of the magnetic rod 6 is fixed at the end of the connecting rod 8 near the magnetic rod 6, so as to facilitate the staff to remove and clean the magnetic rod 6.

[0024] As an optimization scheme, as shown in Figures 1, 2, 3 and 4, a cylinder 13 is provided above the support platform 4. The top surface of the cylinder 13 is fixedly connected to the main body 1 of the wire cutting machine. A clamping block 14 is fixed at the output end of the cylinder 13 to facilitate clamping the silicon rod through the clamping block 14.

[0025] Specifically, a limiting groove 15 is provided on the top surface of the support platform 4, and another limiting groove 15 is provided on the end of the clamping block 14 near the support platform 4 to prevent the silicon rod from moving during the cutting process.

[0026] Working principle: By placing the silicon rod inside the limiting groove 15, and then starting the cylinder 13, the cylinder 13 drives the clamping block 14 to move towards the silicon rod and clamp it. At this time, the main body 1 of the wire cutting machine is started to drive the transmission wheel 2 to rotate, which in turn drives the cutting wire 3 to move and cut the silicon rod. At the same time, the silicon rod is cooled and the debris is washed away by rinsing with water. At this time, the servo motor 11 is started, which drives the pulley 9 to rotate. The two pulleys 9 are connected by the transmission belt 10, which drives the connecting rod 8 to rotate. The connecting rod 8 drives the magnetic rod 6 to rotate, which attracts the water and splashed debris. After the main body 1 of the wire cutting machine has finished cutting, the bolts fixing the first limiting plate 7 and the second limiting plate 12 are released. The servo motor 11 is started to drive the connecting rod 8 to rotate to the specified angle, and the operator can then remove the magnetic rod 6 for cleaning.

[0027] It will be apparent to those skilled in the art that this application is not limited to the details of the exemplary embodiments described above, and that this application can be implemented in other specific forms without departing from the spirit or essential characteristics of this application. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this application is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of the equivalent elements of the claims are intended to be included within this application. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0028] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A magnetic adsorption device for improving the cutting quality of photovoltaic silicon wafers, comprising a wire cutting machine body (1), wherein a transmission wheel (2) is provided on the wire cutting machine body (1), a cutting wire (3) is sleeved on the transmission wheel (2), and a support platform (4) is provided inside the wire cutting machine body (1), characterized in that: The wire cutting machine body (1) has a water inlet (5) that cooperates with the support platform (4) at one end. The water inlet (5) has two detachable magnetic rods (6) symmetrically rotatably arranged inside. Each magnetic rod (6) has a connecting rod (8) that is engaged at one end. The end of the connecting rod (8) away from the magnetic rod (6) is fixed with a pulley (9). The two pulleys (9) are connected by a transmission belt (10). A servo motor (11) is fixed at the rear end of the wire cutting machine body (1). The output end of the servo motor (11) is fixedly connected to one of the pulleys (9).

2. The magnetic adsorption device for improving the cutting quality of photovoltaic silicon wafers according to claim 1, characterized in that: The magnetic rod (6) has a first limiting plate (7) engaged at one end, and the first limiting plate (7) is fixedly connected to the wire cutting machine body (1) by bolts.

3. The magnetic adsorption device for improving the cutting quality of photovoltaic silicon wafers according to claim 2, characterized in that: The magnetic rod (6) is engaged with a second limiting plate (12) at one end away from the first limiting plate (7), and the second limiting plate (12) is fixedly connected to the wire cutting machine body (1) by bolts.

4. The magnetic adsorption device for improving the cutting quality of photovoltaic silicon wafers according to claim 1, characterized in that: The magnetic rod (6) has a square slot at one end near the connecting rod (8), and a locking block with the same shape as the slot of the magnetic rod (6) is fixed at one end of the connecting rod (8) near the magnetic rod (6).

5. The magnetic adsorption device for improving the cutting quality of photovoltaic silicon wafers according to claim 1, characterized in that: A cylinder (13) is provided above the support platform (4). The top surface of the cylinder (13) is fixedly connected to the main body (1) of the wire cutting machine. A clamping block (14) is fixed at the output end of the cylinder (13).

6. The magnetic adsorption device for improving the cutting quality of photovoltaic silicon wafers according to claim 5, characterized in that: The support platform (4) has a limiting groove (15) on its top surface, and the clamping block (14) has another limiting groove (15) at one end near the support platform (4).

Images