Semiconductor constant-temperature tank with external sensor

Abstract

The utility model relates to the technical field of constant-temperature tanks, and discloses an external sensor semiconductor constant-temperature tank which comprises a shell, the shell is placed on the ground, and an air duct support is installed at the bottom end in a shell cavity; the tank body is fixedly installed at the top end of the air duct support, the outer wall of the tank body is sleeved with a heat preservation layer, a visual window is formed in the outer wall of the heat preservation layer, and a semiconductor chilling plate is fixedly installed at the bottom end of the tank body; the heat dissipation assembly comprises a heat dissipation device, a heat dissipation fan and a protective net; a temperature controller is fixedly installed in the shell cavity and is in electric signal connection with a temperature measuring sensor. The temperature controller is fixedly installed in the shell, the temperature controller is in electric signal connection with the temperature measurement sensor, a user can place the temperature measurement sensor at a wanted position according to own needs, the user can effectively monitor the temperature of the required position during use, a correction value does not need to be further obtained through a long-time experiment, and the user experience is improved. The accuracy of the temperature is ensured, and a large amount of time cost is saved.

Description

An external sensor semiconductor thermostatic container Technical Field

[0001] This utility model relates to the field of thermostatic tank technology, and in particular to a semiconductor thermostatic tank with an external sensor. Background Technology

[0002] A typical thermostatic tank includes an outer shell, a fan, a heat sink, a thermostatic cooling chip, a thermostatic tank body, and an insulation layer. The main function of a thermostatic tank is to maintain a constant temperature inside the tank, thereby keeping the solutions, medicines, etc., inside the tank at the temperature point required by the customer.

[0003] For example, utility model application CN202420495501.0 discloses a semiconductor variable temperature tank, including a variable temperature tank body, a control module, a semiconductor cooling device, a heat dissipation component, a travel micro switch, and a temperature measuring component. The variable temperature tank body includes a bottom frame, an outer cover, and an inner barrel. The bottom frame is installed at the bottom of the outer cover, and the inner barrel is installed inside the outer cover. A travel micro switch is installed on the side wall of the inner barrel, and a semiconductor cooling device is installed on the outer side of the inner barrel. The cold end face of the semiconductor cooling device is in contact with the inner barrel, and the hot end face of the semiconductor cooling device is in contact with the heat dissipation component. A temperature measuring component is installed on the bottom surface of the inner barrel.

[0004] As time changes, so does the temperature. The lack of circulation of the solution and medicine inside the tank leads to significant temperature differences. Traditional temperature sensors for thermostatic tanks are either built into the tank or protrude from the bottom, which differs from the temperature point required by the user and requires extensive testing for calibration.

[0005] This application improves upon existing technology by proposing an external sensor semiconductor thermostatic container to solve the problems mentioned in the background art. Summary of the Invention

[0006] To address the shortcomings of existing technologies, this invention provides an external sensor semiconductor thermostatic container, which solves the problems mentioned in the background section.

[0007] To achieve the above objectives, this utility model is implemented through the following technical solution:

[0008] An external sensor semiconductor thermostatic container includes an outer shell placed on the ground, with a duct support installed at the bottom of the outer shell cavity; a container body fixedly installed on the top of the duct support, with an insulation layer covering the outer wall of the container body and a viewing window on the outer wall of the insulation layer, and a semiconductor cooling chip fixedly installed at the bottom of the container body; a heat dissipation assembly including a radiator, a cooling fan, and a protective mesh, with the radiator fixedly installed at the bottom of the duct support, the cooling fan fixedly installed on both sides of the radiator, and a base plate fixedly installed at the bottom of the duct support, with the radiator located between the duct support and the base plate; and a temperature controller fixedly installed inside the outer shell cavity, with the temperature controller electrically connected to a temperature sensor.

[0009] According to the external sensor semiconductor constant temperature tank, a switching power supply and a relay are fixedly installed inside the outer shell cavity, a switch is embedded in the front end of the outer shell, and a power socket and a serial port are embedded in the rear end of the outer shell.

[0010] According to the external sensor semiconductor thermostatic tank, the switching power supply is electrically connected to the relay and the semiconductor cooling chip, and the temperature controller is electrically connected to the semiconductor cooling chip.

[0011] According to the external sensor semiconductor thermostatic container, the heat sink is located below the semiconductor cooling chip and is used to dissipate heat from the semiconductor cooling chip.

[0012] This utility model provides an external sensor semiconductor thermostatic container, which has the following advantages: By fixing a temperature controller inside the outer shell, and connecting the temperature controller to a temperature sensor via an electrical signal, the user can place the temperature sensor in the desired position according to their needs. When using the container, the user can effectively monitor the temperature at the desired location without needing to undergo further long-term experiments to obtain correction values, thus ensuring temperature accuracy and saving a significant amount of time and costs. Attached Figure Description

[0013] Figure 1 is a schematic diagram of the external sensor semiconductor thermostatic container of this utility model;

[0014] Figure 2 is a schematic diagram of the internal structure of the outer shell cavity of an external sensor semiconductor thermostatic container according to the present invention;

[0015] Figure 3 is a schematic diagram of the connection relationship between the tank body, radiator, and cooling fan of an external sensor semiconductor constant temperature tank according to this utility model.

[0016] Figure 4 is a schematic diagram of the connection between the tank body and the semiconductor cooling chip of an external sensor semiconductor thermostatic tank according to this utility model.

[0017] Legend:

[0018] 10. Outer shell; 11. Viewing window; 12. Tank body; 14. Insulation layer; 15. Air duct support; 16. Radiator; 17. Cooling fan; 18. Protective net; 19. Switching power supply; 20. Relay; 21. Power socket; 22. Serial port; 23. Temperature controller; 24. Switch; 25. Semiconductor cooling chip. Detailed Implementation

[0019] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0020] Please refer to Figures 1-4. This utility model is an external sensor semiconductor thermostatic container, including an outer shell 10, which is placed on the ground, and an air duct support 15 is installed at the bottom of the cavity of the outer shell 10; a container body 12, which is fixedly installed at the top of the air duct support 15, and an insulation layer 14 is provided on the outer wall of the container body 12. A viewing window 11 is opened on the outer wall of the insulation layer 14, and a semiconductor cooling chip 25 is fixedly installed at the bottom of the container body 12; a heat dissipation assembly, which includes a radiator 16, a cooling fan 17, and a protective net 18. The radiator 16 is fixedly installed at the bottom of the air duct support 15, and the cooling fan 17 is fixedly installed on both sides of the radiator 16. A base plate is fixedly installed at the bottom of the air duct support 15, and the radiator 16 is located between the air duct support 15 and the base plate; a temperature controller 23 is fixedly installed in the cavity of the outer shell 10, and the temperature controller 23 is electrically connected to a temperature sensor.

[0021] It should be noted that: by setting an air duct support 15 inside the cavity of the outer shell 10, the radiator 16 is fixedly installed at the bottom of the air duct support 15, the cooling fan 17 is fixedly installed on both sides of the radiator 16, a base plate is fixedly installed at the bottom of the air duct support 15, the radiator 16 is located between the air duct support 15 and the base plate, and the air dissipates heat from the radiator 16 through the cooling fan 17. A viewing window 11 is opened on the outer wall of the insulation layer 14 for easy observation.

[0022] Specifically, existing technologies monitor the temperature at the bottom of the cavity of the tank 12 using a temperature control probe. However, the temperature changes over time, and the lack of circulation of the solution and medicine inside the tank 12 leads to significant temperature differences. This requires extensive testing to obtain a correction value. This application addresses this by fixing a temperature controller 23 inside the outer casing 10. The temperature controller 23 is electrically connected to a temperature sensor, allowing users to place the temperature sensor in their desired location. During use, users can effectively monitor the temperature at the required location without needing further extensive testing to obtain a correction value. This ensures temperature accuracy and saves considerable time.

[0023] It is worth noting that the temperature controller 23 and the temperature sensor are existing technologies known to those skilled in the art, and will not be described in detail here.

[0024] As shown in Figure 1-2, a switching power supply 19 and a relay 20 are fixedly installed inside the cavity of the housing 10. A switch 24 is embedded in the front end of the housing 10, and a power socket 21 and a serial port 22 are embedded in the rear end of the housing 10. The switching power supply 19 is electrically connected to the relay 20 and the thermoelectric cooler 25, and the thermostat 23 is electrically connected to the thermoelectric cooler 25.

[0025] Specifically, a switch 24 is embedded in the front end of the housing 10. The switch 24 is electrically connected to the switching power supply 19. The switch 24 controls the working state of the switching power supply 19. The switching power supply 19 is electrically connected to the relay 20 and the thermoelectric cooler 25. The switching power supply 19 supplies power to the thermoelectric cooler 25.

[0026] As shown in Figure 3-4, the heat sink 16 is located below the thermoelectric cooler 25 and is used to dissipate heat from the thermoelectric cooler 25.

[0027] Specifically, by setting the heat sink 16 below the thermoelectric cooler 25 to dissipate heat from the thermoelectric cooler 25, and by setting cooling fans 17 on both sides of the heat sink 16, the heat dissipation efficiency can be improved.

[0028] The specific working principle of this utility model of an external sensor semiconductor thermostatic tank is as follows: A duct support 15 is set inside the cavity of the outer shell 10. A heat sink 16 is fixedly installed at the bottom of the duct support 15, and a cooling fan 17 is fixedly installed on both sides of the heat sink 16. A base plate is fixedly installed at the bottom of the duct support 15. The heat sink 16 is located between the duct support 15 and the base plate. Air is cooled by the cooling fan 17. A viewing window 11 is opened on the outer wall of the insulation layer 14. A temperature controller 23 is fixedly installed inside the outer shell 10. The temperature controller 23 is electrically connected to a temperature sensor. Users can place the temperature sensor in the desired position according to their needs. When using the device, users can effectively monitor the temperature at the required location without needing to obtain a correction value through long-term experiments. This ensures the accuracy of the temperature and saves a lot of time.

[0029] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.

Claims

1. An external sensor semiconductor thermostatic container, characterized in that, include: The outer shell (10) is placed on the ground, and a duct support (15) is installed at the bottom of the cavity of the outer shell (10); the tank (12) is fixedly installed on the top of the duct support (15), and the outer wall of the tank (12) is covered with a heat insulation layer (14), and a viewing window (11) is opened on the outer wall of the heat insulation layer (14). A semiconductor cooling chip (25) is fixedly installed at the bottom of the tank (12); the heat dissipation assembly includes a radiator (16), a cooling fan (17) and a protective net (18). The radiator (16) is fixedly installed at the bottom of the duct support (15), the cooling fan (17) is fixedly installed on both sides of the radiator (16), and a base plate is fixedly installed at the bottom of the duct support (15). The radiator (16) is located between the duct support (15) and the base plate; a temperature controller (23) is fixedly installed in the cavity of the outer shell (10), and the temperature controller (23) is electrically connected to a temperature sensor.

2. The external sensor semiconductor thermostatic container according to claim 1, characterized in that: A switching power supply (19) and a relay (20) are fixedly installed inside the cavity of the outer shell (10). A switch (24) is embedded in the front end of the outer shell (10), and a power socket (21) and a serial port (22) are embedded in the rear end of the outer shell (10).

3. The external sensor semiconductor thermostatic container according to claim 2, characterized in that: The switching power supply (19) is electrically connected to the relay (20) and the thermoelectric cooler (25), and the temperature controller (23) is electrically connected to the thermoelectric cooler (25).

4. The external sensor semiconductor thermostatic container according to claim 1, characterized in that: The heat sink (16) is located below the thermoelectric cooler (25) and is used to dissipate heat from the thermoelectric cooler (25).

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