Automatic preparation system for silicon wafer cutting fluid

Abstract

The utility model relates to the technical field of silicon wafer processing equipment, and discloses an automatic preparation system for silicon wafer cutting fluid, which comprises a plurality of raw material barrels, a plurality of transfer barrels, a stirring barrel and a pure water barrel. The plurality of raw material barrels are communicated with the plurality of stirring barrels in a one-to-one correspondence manner, and a first liquid pumping system is arranged between each raw material barrel and each transfer barrel. Each transfer barrel is arranged on a first weighbridge, the plurality of transfer barrels are communicated with the stirring barrel, a second liquid pumping system is arranged between the transfer barrels and the stirring barrel, and the stirring barrel is arranged on a second weighbridge. The pure water barrel is communicated with the stirring barrel, and a third liquid pumping system is arranged between the pure water barrel and the stirring barrel. The first liquid pumping system, the second liquid pumping system and the third liquid pumping system are all controlled by the electric control system, and the first weighbridge and the second weighbridge are both electrically connected with the electric control system. According to the automatic preparation system for the silicon wafer cutting fluid, the preparation efficiency and quality of the silicon wafer cutting fluid can be improved, so that the cutting quality of the silicon wafer is improved.

Description

An automated silicon wafer cutting fluid preparation system Technical Field

[0001] This utility model relates to the field of silicon wafer processing equipment technology, specifically to an automatic silicon wafer cutting fluid preparation system. Background Technology

[0002] After monocrystalline or polycrystalline silicon is pulled into ingots, it needs to be slit into wafers before it can be used for subsequent processing. During the wafer slicing process, a cutting fluid is sprayed to reduce the temperature of the cutting tools and the friction between the tools and the silicon ingots. Currently, the silicon wafer slicing fluid is prepared manually by pouring raw materials one by one into a transfer tank for weighing, then adding them one by one to a mixing tank, and finally stirring in the mixing tank before adding pure water with the appropriate pH value. This method is inefficient, and weighing different raw material solutions in the same transfer tank may lead to inaccurate weighing due to residues of other solutions. This results in significant errors in the proportions of the components in the prepared cutting fluid compared to the required proportions, leading to inconsistent quality of the prepared cutting fluid and affecting the quality of silicon wafer slicing. Summary of the Invention

[0003] In order to overcome the shortcomings of the existing technology, the purpose of this utility model is to provide an automatic silicon wafer cutting fluid preparation system that can automatically weigh the weight of each raw material solution and automatically and accurately prepare a high-quality cutting fluid according to a preset formula, thereby improving the preparation quality of silicon wafer cutting fluid and improving the cutting quality of silicon wafers.

[0004] To solve the above problems, the technical solution adopted by this utility model is as follows: An automatic silicon wafer cutting fluid preparation system includes multiple raw material tanks, multiple transfer tanks, a stirring tank, and a pure water tank. The multiple raw material tanks are connected to the multiple stirring tanks in a one-to-one correspondence. A first liquid extraction system is provided between each raw material tank and each transfer tank. Each transfer tank is mounted on a first weighing platform. The multiple transfer tanks are all connected to the stirring tank. A second liquid extraction system is provided between the transfer tanks and the stirring tank. The stirring tank is mounted on a second weighing platform. The pure water tank is connected to the stirring tank. A third liquid extraction system is provided between the pure water tank and the stirring tank. The first, second, and third liquid extraction systems are all controlled by an electronic control system. The first and second weighing platforms are both electrically connected to the electronic control system.

[0005] Compared to existing technologies, the advantages of this invention are as follows: each raw material tank is equipped with a corresponding transfer tank, and each transfer tank is mounted on a first weighing scale. When preparing the cutting fluid, the solution from the raw material tank is first drawn into the corresponding transfer tank via a first extraction system, and the weight of the solution in the transfer tank is measured using the first weighing scale until the required weight is reached. Then, the solution in the transfer tank is drawn into a mixing tank for stirring and mixing. This cutting fluid preparation system can automatically move the solution using both the first and second extraction systems, automatically preparing the cutting fluid according to the formula, thus improving the efficiency of cutting fluid preparation. Simultaneously, the transfer tanks for each component are not mixed, avoiding residues of other components that could affect the weighing results, improving the accuracy of the prepared cutting fluid ratio, and ultimately improving the quality of the cutting fluid and the cutting quality of the silicon wafers.

[0006] In the aforementioned automatic silicon wafer cutting fluid preparation system, each of the raw material barrels is equipped with a camera or barcode scanner on one side, and the camera or barcode scanner is electrically connected to the electronic control system.

[0007] In the aforementioned automatic silicon wafer cutting fluid preparation system, each of the raw material tanks is equipped with an alarm on one side, and the alarm is electrically connected to the electrical control system.

[0008] The aforementioned automatic silicon wafer cutting fluid preparation system includes a first pumping system comprising a pump valve connected in series on the connecting pipeline between the corresponding transfer tank and the raw material tank.

[0009] The aforementioned automatic silicon wafer cutting fluid preparation system includes a second extraction system comprising a first extraction pump and multiple first controllable valves. The connecting pipeline between the multiple transfer tanks and the stirring tank includes a confluence pipeline and multiple branch pipelines. One end of each branch pipeline is connected to one of the multiple transfer tanks, and the other end of each branch pipeline is connected to the confluence pipeline, which is connected to the stirring tank. The first extraction pump is connected in series to the confluence pipeline, and the first controllable valve is connected in series to the corresponding branch pipeline.

[0010] The aforementioned automatic silicon wafer cutting fluid preparation system includes a third extraction system comprising a second extraction pump and a second controllable valve, both of which are connected in series in the connecting pipeline between the stirring tank and the pure water tank.

[0011] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments. Attached Figure Description

[0012] Figure 1 is a three-dimensional structural schematic diagram of the automatic silicon wafer cutting fluid preparation system according to an embodiment of the present invention.

[0013] Explanation of icon numbers:

[0014] 100 Raw material tank, 200 Transfer tank, 210 First weighbridge, 300 Mixing tank, 310 Second weighbridge, 400 Pure water tank, 500 First liquid extraction system, 510 Pump and valve, 600 Second liquid extraction system, 610 First liquid extraction pump, 620 First controllable valve, 630 Main controllable valve, 700 Third liquid extraction system, 710 Second liquid extraction pump, 720 Second controllable valve. Detailed Implementation

[0015] The embodiments of this utility model are described in detail below. Referring to FIG1, an embodiment of this utility model provides an automatic silicon wafer cutting fluid preparation system, including multiple raw material tanks 100, multiple transfer tanks 200, a stirring tank 300, and a pure water tank 400. The multiple raw material tanks 100 and the multiple stirring tanks 300 are connected in a one-to-one correspondence. A first liquid extraction system 500 is provided between each raw material tank 100 and each transfer tank 200. Each transfer tank 200 is mounted on a first weighing scale 210. The multiple transfer tanks 200 are all connected to the stirring tank 300. A second liquid extraction system 600 is provided between the transfer tanks 200 and the stirring tank 300. The stirring tank 300 is mounted on a second weighing scale 310. The pure water tank 400 is connected to the mixing tank 300. A third liquid extraction system 700 is provided between the pure water tank 400 and the mixing tank 300. The first liquid extraction system 500, the second liquid extraction system 600 and the third liquid extraction system 700 are all controlled by the electrical control system. The first weighbridge 210 and the second weighbridge 310 are both electrically connected to the electrical control system.

[0016] The automatic silicon wafer cutting fluid preparation system operates as follows: First, the first extraction system 500 extracts the raw material solution from the raw material tank 100 into the corresponding transfer tank 200 until the weight of the solution in the transfer tank 200 reaches the required weight in the formula. Then, the second extraction system 600 collects the solution from the transfer tank 200 into the mixing tank 300, where the various solutions are stirred and mixed. After mixing, the third extraction system 700 extracts an appropriate amount of pure water with the correct pH level into the mixing tank 300 until the weight of the solution in the mixing tank 300 reaches the weight set in the formula. Then, the mixing tank 300 stirs the solution inside again. After stirring, the required silicon wafer cutting fluid is obtained. This automated silicon wafer cutting fluid preparation system automatically transfers the chemical solution and pure water through a first extraction system 500, a second extraction system 600, and a third extraction system 700. It automatically weighs each raw material and the mixed cutting fluid using a first weighing scale 210 and a second weighing scale 310, thus precisely controlling the proportions of each component in the cutting fluid to closely match the designed formula. Furthermore, because each raw material solution is weighed through an independent transfer tank 200, it avoids inaccurate weighing due to residue from different solutions during mixing, which could lead to significant errors in the proportions of the components in the prepared cutting fluid and result in poor quality cutting fluid. By using this automated silicon wafer cutting fluid preparation system, the efficiency and quality of the preparation can be improved, thereby increasing the quality of the cut silicon wafers.

[0017] Referring to Figure 1, in this embodiment, the electrical control system is housed in an electrical control box, and both the first weighbridge 210 and the second weighbridge 310 are electronic scales. It is understood that the first liquid extraction system 500, the second liquid extraction system 600, and the third liquid extraction system 700 can be composed of pumps and valves. In this embodiment, the first liquid extraction system 500 includes multiple pump valves 510, each pump valve 510 being connected in series to the connecting pipeline between the corresponding raw material tank 100 and the transfer tank 200. The connecting pipeline between the transfer tank 200 and the mixing tank 300 includes a confluence pipeline and multiple branch pipelines. One end of each branch pipeline is connected to one of the multiple transfer tanks 200, and the other ends of the branch pipelines converge at the confluence pipeline, which is connected to the mixing tank 300. The second extraction system 600 includes multiple first controllable valves 620 and a first extraction pump 610. The multiple first controllable valves 620 are connected in series on multiple branch pipelines, and the first extraction pump 610 is connected in series on the confluence pipeline. The first extraction pump 610 operates continuously. When the weight of the raw material liquid in the transfer tank 200 obtained by the first weighbridge 210 reaches the required amount in the formula, the corresponding first controllable valve 620 is opened, allowing the liquid in the transfer tank 200 to be pumped into the mixing tank 300. It is understood that in some embodiments, one extraction pump may be installed on each branch pipeline. The third extraction system 700 includes a second extraction pump 710 and a second controllable valve 720. Both the second extraction pump 710 and the second controllable valve 720 are connected in series on the connecting pipeline between the mixing tank 300 and the pure water tank 400. Referring to Figure 1, in this embodiment, a main controllable valve 630 is also provided on the confluence pipeline. When all the raw material liquid enters the mixing tank 300 in the correct amount, the main controllable valve 630 can be closed to prevent the liquid from flowing back into the branch pipeline and the transfer tank 200 during the mixing process.

[0018] It is understood that the first controllable valve 620 and the second controllable valve 720 can be solenoid valves or electrically controlled flow valves, etc. The pump valve 510, the first controllable valve 620, the first liquid pump 610, the second controllable valve 720 and the second liquid pump 710 are all electrically connected to the electrical control system.

[0019] In some embodiments, to prevent the connection between the raw material tank 100 containing the wrong raw material solution and the transfer tank 200 due to human error, a camera or barcode scanner is installed on one side of each raw material tank 100. Both the camera and barcode scanner are electrically connected to the electronic control system. The camera and barcode scanner can obtain information about the raw material solution inside the raw material tank 100 by photographing the form on the raw material tank 100 or scanning the QR code or barcode on the form, thereby determining whether the raw material solution in the raw material tank 100 is the correct solution. An alarm is also installed on one side of each raw material tank 100. The alarm is electrically connected to the electronic control system. When it is detected that the solution in the raw material tank 100 is incorrect, the electronic control system controls the alarm to emit an audible or visual alarm, reminding the operator to replace the raw material tank 100 with the correct solution.

[0020] It is understandable that the mixing tank 300 is equipped with a mixing mechanism, which is driven by a mixing motor and can use a mixing paddle or the like.

[0021] It should be noted that in the description of this utility model, any descriptions of orientation, such as up, down, front, back, left, right, etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed or operated in a specific orientation, and should not be construed as a limitation of this utility model.

[0022] In the description of this utility model, "several" means one or more, "more than" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. If "first" or "second" is mentioned, it is only for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0023] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0024] The above embodiments are merely preferred embodiments of this utility model and should not be construed as limiting the scope of protection of this utility model. Any non-substantial changes and substitutions made by those skilled in the art based on this utility model shall fall within the scope of protection claimed by this utility model.

Claims

1. A silicon wafer dicing liquid automatic preparation system, characterized by, The system includes multiple raw material tanks (100), multiple transfer tanks (200), a mixing tank (300), and a pure water tank (400). Each of the raw material tanks (100) is connected to one of the mixing tanks (300). A first liquid extraction system (500) is provided between each raw material tank (100) and each transfer tank (200). Each transfer tank (200) is mounted on a first weighbridge (210). All transfer tanks (200) are connected to the mixing tank (300). A second liquid extraction system (600) is provided between the first liquid extraction system (500), the second liquid extraction system (600) is provided on the second weighbridge (310), the pure water tank (400) is connected to the stirring tank (300), and a third liquid extraction system (700) is provided between the pure water tank (400) and the stirring tank (300). The first liquid extraction system (500), the second liquid extraction system (600) and the third liquid extraction system (700) are all controlled by an electrical control system. The first weighbridge (210) and the second weighbridge (310) are both electrically connected to the electrical control system.

2. The automatic preparation system of a silicon wafer cutting fluid according to claim 1, wherein Each of the raw material barrels (100) is equipped with a camera or barcode scanner on one side, and the camera or barcode scanner is electrically connected to the electronic control system.

3. The automatic silicon wafer cutting fluid preparation system according to claim 2, characterized in that, An alarm is provided on one side of each of the raw material barrels (100), and the alarm is electrically connected to the electronic control system.

4. The automatic silicon wafer cutting fluid preparation system according to claim 1, characterized in that, The first liquid extraction system (500) includes a pump valve (510), which is connected in series to the connecting pipeline between the corresponding transfer tank (200) and the raw material tank (100).

5. The automatic silicon wafer cutting fluid preparation system according to claim 1, characterized in that, The second liquid extraction system (600) includes a first liquid extraction pump (610) and multiple first controllable valves (620). The connecting pipeline between the multiple transfer tanks (200) and the stirring tank (300) includes a confluence pipeline and multiple branch pipelines. One end of the multiple branch pipelines is connected to each of the multiple transfer tanks (200) in a one-to-one correspondence. The other end of the multiple branch pipelines is connected to the confluence pipeline. The confluence pipeline is connected to the stirring tank (300). The first liquid extraction pump (610) is connected in series to the confluence pipeline. The first controllable valve (620) is connected in series to the corresponding branch pipeline.

6. The automatic silicon wafer cutting fluid preparation system according to claim 1, characterized in that, The third liquid extraction system (700) includes a second liquid extraction pump (710) and a second controllable valve (720), both of which are connected in series in the connecting pipeline between the stirring tank (300) and the pure water tank (400).

Images