Sealing electroplating carrier for diamond grinding disc

Abstract

The utility model relates to the field of electroplating equipment, in particular to a sealed electroplating carrier for a diamond grinding disc, which comprises a mounting substrate, a first sealing gasket, a middle plate, a second sealing gasket and a cover plate which are sequentially arranged from bottom to top, a conductive disc is installed on the installation substrate, the first sealing gasket and the middle plate are wrapped outside the conductive disc in a sleeving mode, open holes are formed in the second sealing gasket and the cover plate, and the diameter of the open holes is smaller than that of the conductive disc. Compared with the prior art, in the technical scheme, during electroplating operation, due to the special sealing design of the second sealing gasket and the cover plate, electroplating liquid can only act on the designated hole opening area of the diamond grinding disc, and the electroplated area is greatly reduced under the condition of the same current intensity. And when the electric quantity is fixed, the plated area is reduced, the electroplating efficiency of unit area is remarkably improved, the production period is shortened, and the production cost is reduced.

Description

A diamond grinding disc sealed electroplating carrier Technical Field

[0001] This utility model relates to the field of electroplating equipment, specifically to a sealed electroplating carrier for a diamond grinding disc. Background Technology

[0002] Diamond grinding discs, with their high hardness and wear resistance, have become indispensable processing tools in fields such as semiconductors, optical glass, and precision ceramics. Electroplating, as an important means of improving the performance of diamond grinding discs, enhances their bonding strength, cutting performance, and service life by depositing a specific metal layer onto the surface of the disc.

[0003] However, traditional diamond grinding disc electroplating methods have many technical bottlenecks. On the one hand, the large plating area during the electroplating process results in low plating efficiency per unit area under the same current intensity, prolonging the production cycle and increasing production costs. On the other hand, non-plating areas are prone to contact with the electroplating solution, causing contamination of the solution, which not only affects product quality but also requires frequent replacement of the electroplating solution, further increasing the environmental and economic costs of production. Summary of the Invention

[0004] In view of the above, the purpose of this utility model is to provide a diamond grinding disc sealing electroplating carrier to address the problems of the prior art.

[0005] This solution provides a diamond grinding disc sealing electroplating carrier, comprising, from bottom to top, a mounting base, a first sealing gasket, an intermediate plate, a second sealing gasket, and a cover plate; a conductive disc is mounted on the mounting base, the first sealing gasket and the intermediate plate are fitted over the conductive disc, and the second sealing gasket and the cover plate have openings with a diameter smaller than that of the conductive disc.

[0006] Furthermore, the conductive disk has several threaded holes, and the mounting base plate has several corresponding mounting holes that correspond to the threaded holes. The conductive disk is fixed by fastening screws that pass through the mounting holes and threaded holes.

[0007] Furthermore, a third sealing gasket is provided between the mounting base plate and the conductive pad for sealing.

[0008] Compared to existing technologies, in this proposed solution, due to the special sealing design of the second sealing gasket and cover plate, the electroplating solution can only act on the designated opening area of ​​the diamond grinding disc during the electroplating process, significantly reducing the plated area under the same current intensity. With a fixed amount of electricity, the reduced plated area significantly improves the electroplating efficiency per unit area, shortens the production cycle, and reduces production costs. Attached Figure Description

[0009] Figure 1 is a three-dimensional structural diagram of this application;

[0010] Figure 2 is an exploded view of the structure of this application;

[0011] Figures 3 and 4 are schematic diagrams of the assembly structure of the conductive disk of this application from different perspectives;

[0012] Reference numerals: 1. Mounting base plate; 2. First sealing gasket; 3. Intermediate plate; 4. Second sealing gasket; 5. Cover plate; 6. Conductive disk; 7. Third sealing gasket; 8. Stud. Detailed Implementation

[0013] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0014] Referring to Figures 1 to 4, a diamond grinding disc sealing electroplating carrier is composed of a mounting base plate 1, a first sealing gasket 2, an intermediate plate 3, a second sealing gasket 4, and a cover plate 5 stacked sequentially from bottom to top.

[0015] In terms of structural composition, the mounting base 1 serves as the basic support component of the entire carrier, on which the conductive disk 6 is fixedly mounted. The conductive disk 6 has 17 pre-drilled threaded holes corresponding to 17 3.2mm mounting holes pre-drilled on the mounting base 1. During installation, M3 fastening screws are used to secure the conductive lines to the mounting base 1 and the conductive disk 6. A third sealing gasket 7 is provided between the mounting base 1 and the conductive disk 6 for sealing. Studs 8 are provided on the conductive disk 6 to ensure a tighter fixation of the diamond grinding disc. The first sealing gasket 2 and the intermediate plate 3 fit tightly together, forming a ring around the outside of the conductive disk 6; both have receiving holes adapted to the outer diameter of the conductive disk 6. The second sealing gasket 4 and the cover plate 5 have openings of a specific size. The diameter of the opening is 4 mm smaller than the diameter of the conductive disk 6. This ensures that when the diamond grinding disk is placed stably on the conductive disk 6, the second sealing gasket 4 can be tightly pressed against the edge of the conductive disk 6 by applying uniform pressure to the cover plate 5, forming a sealing structure. This ensures that only the upper surface of the opening area of ​​the diamond grinding disk is in full contact with the electroplating solution, effectively isolating other non-plating areas.

[0016] From a working principle perspective, during electroplating, the diamond grinding disc is placed on the conductive plate 6. Due to the special sealing design of the second sealing gasket 4 and the cover plate 5, the electroplating solution can only act on the designated opening area of ​​the diamond grinding disc. Under the same current intensity conditions, compared with traditional electroplating methods, this carrier significantly reduces the plating area. With a fixed amount of electricity, the reduced plating area significantly improves the electroplating efficiency per unit area.

[0017] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A sealed electroplating carrier for a diamond grinding disc, characterized in that: The assembly includes, from bottom to top, a mounting base (1), a first sealing gasket (2), an intermediate plate (3), a second sealing gasket (4), and a cover plate (5); a conductive disk (6) is mounted on the mounting base (1), the first sealing gasket (2) and the intermediate plate (3) are fitted over the conductive disk (6), and the second sealing gasket (4) and the cover plate (5) are provided with openings, the diameter of which is smaller than the diameter of the conductive disk (6).

2. The diamond grinding disc sealing electroplating carrier according to claim 1, characterized in that: The conductive disk (6) has several threaded holes, and the mounting base plate (1) has several corresponding mounting holes that correspond to the threaded holes. The conductive disk (6) is fixed by fastening screws passing through the mounting holes and connecting to the threaded holes to fix the mounting base plate (1) and the conductive disk (6).

3. A sealed electroplating fixture for diamond lapping discs according to claim 2, wherein: A third sealing gasket (7) is provided between the mounting base plate (1) and the conductive disk (6) for sealing.

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