Gantry type automatic electroplating device

Abstract

The utility model provides a gantry type electroplating automatic device which comprises a base, an electroplating pool is formed in the base, guide rails are fixedly mounted on the left side and the right side of the upper surface of the base, sliding blocks are slidably connected to the exteriors of the guide rails, and a gantry frame is fixedly mounted on the upper surfaces of the two sliding blocks; a hydraulic rod is fixedly mounted on the upper side surface of the portal frame, a connecting plate is fixedly mounted at the lower end of the hydraulic rod, and a filtering mechanism is arranged in the electroplating tank. Through the use of the filtering mechanism, impurities such as particulate matters and chemical reaction residues can be effectively intercepted and removed, and the purity of electroplating liquid and the stability of the electroplating process are improved, so that high quality, high uniformity and consistency of an electroplated layer are ensured, surface flaws are reduced, the service life of the electroplating liquid is prolonged, and the production cost is reduced. The replacement cost is reduced; meanwhile, the filtering mechanism is easy to disassemble and clean, the maintenance work is simplified, and the overall electroplating efficiency is improved.

Description

A gantry-type automatic electroplating device Technical Field

[0001] This utility model relates to the field of electroplating, and more specifically, to a gantry-type automatic electroplating device. Background Technology

[0002] Electroplating is an important surface treatment technology that utilizes the principle of electrolysis. In a salt solution containing the metal to be plated, the substrate metal acts as the cathode, and electrolysis causes the cations of the desired metal to deposit on the surface of the substrate metal, forming a coating. This process can alter the properties or dimensions of the substrate surface, enhance the metal's corrosion resistance, increase hardness, prevent wear, and improve conductivity, smoothness, heat resistance, and surface aesthetics.

[0003] The prior art disclosed in patent publication (announcement) number CN220284273U is a fully automatic gantry-type electroplating equipment, including an electroplating tank, with collection boxes on both sides of the electroplating tank, a limit frame on the upper end of the electroplating tank and the left collection box, a sliding groove in the middle of the limit frame, a feeding component movably connected inside the sliding groove, a cylinder fixedly connected to the lower right end of the feeding component, an output shaft inside the lower end of the cylinder, and a fixing plate fixedly connected to the lower end of the output shaft.

[0004] The aforementioned patent document discloses a fully automatic gantry electroplating equipment. While it solves the problem of needing to start and stop the device to remove the workpiece after processing, thus extending the workpiece processing time and reducing electroplating efficiency in mass production, its shortcomings are:

[0005] During the electroplating process, various impurities inevitably arise due to the recycling of the electroplating solution and the chemical reactions. Over time, these impurities accumulate, making it inconvenient to filter and collect them when the electroplating solution needs to be replaced or recycled. Furthermore, the flow of the electroplating solution and the air bubbles generated during electroplating often cause slight shaking of the workpiece. This shaking can affect the electroplating quality, disrupting the uniformity and consistency of the electroplated layer, leading to surface defects or uneven thickness. It may also cause impurities in the electroplating solution to deposit on the workpiece surface, further reducing the electroplating effect.

[0006] Therefore, we have made improvements to this and proposed a gantry-type automatic electroplating device. Summary of the Invention

[0007] To address the shortcomings of existing technologies, this utility model provides a gantry-type automatic electroplating device, which solves the problems mentioned in the background art.

[0008] To achieve the above-mentioned objectives, this utility model provides the following technical solution:

[0009] A gantry-type automatic electroplating device is used to solve the above problems.

[0010] The application is as follows:

[0011] The device includes a base, an electroplating tank inside the base, and guide rails fixedly installed on both the left and right sides of the upper surface of the base. Sliding blocks are slidably connected to the outside of the guide rails, and a gantry frame is fixedly installed on the upper surface of the two sliding blocks. A hydraulic rod is fixedly installed on the upper surface of the gantry frame, and a connecting plate is fixedly installed at the lower end of the hydraulic rod. A hook is fixedly installed on the lower surface of the connecting plate. A filtration mechanism is provided inside the electroplating tank, and a support mechanism is provided on the upper side of the filtration mechanism.

[0012] The filtration mechanism includes two fixing bars, which are respectively fixedly installed on the inner walls of both sides of the electroplating tank. A fixing frame is provided on the upper side of the fixing bar, and a filter screen is fixedly installed inside the fixing frame.

[0013] As a preferred technical solution of this application, the fixing frame is externally bonded with a sealing strip, and the fixing frame is tightly engaged with the electroplating tank through the external sealing strip.

[0014] As a preferred technical solution of this application, pressure strips are provided on the upper sides of both sides of the fixing frame, and several mounting holes are opened on the surface of the pressure strips and the surface of the fixing frame, and screws are connected to the internal threads of the mounting holes.

[0015] As a preferred technical solution of this application, the support mechanism includes a fixed rod, which is disposed inside the electroplating tank. Mounting plates are fixedly installed on both ends of the fixed rod, and sliding cylinders are slidably connected to the outside of both ends of the mounting plates. Support rods are hinged to the tops of the two sliding cylinders, and mounting frames are hinged to the tops of the support rods. Wire mesh is fixedly installed inside the mounting frames.

[0016] As a preferred technical solution of this application, springs are sleeved on the outside of both ends of the fixing rod, and the springs are fixedly installed between the slide cylinder and the mounting plate.

[0017] As a preferred technical solution of this application, the mounting plate is fixedly connected to the inner wall of the electroplating tank by bolts.

[0018] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0019] In the scheme of this application:

[0020] 1. The use of a filtration mechanism can effectively intercept and remove impurities such as particulate matter and chemical reaction residues, improving the purity of the electroplating solution and the stability of the electroplating process. This not only ensures the high quality, high uniformity and consistency of the electroplated layer and reduces surface defects, but also extends the service life of the electroplating solution and reduces replacement costs. At the same time, the filtration mechanism is designed to be easy to disassemble and clean, simplifying maintenance and improving overall electroplating efficiency.

[0021] 2. With the use of the support mechanism, when the workpiece is lowered into the electroplating solution, it will come into contact with the wire mesh and be slowly lowered. The wire mesh can provide support and reduce the shaking of the workpiece. This effectively solves the problem of workpiece shaking caused by the flow of electroplating solution and air bubbles during the electroplating process, ensuring uniform deposition of the electroplating layer, avoiding surface defects and uneven thickness, and improving the overall quality and consistency of electroplating. Attached Figure Description

[0022] Figure 1 is a three-dimensional structural schematic diagram of the gantry-type automatic electroplating device provided in this application;

[0023] Figure 2 is a three-dimensional structural diagram of the gantry-type automatic electroplating device provided in this application;

[0024] Figure 3 is a three-dimensional structural schematic diagram of the filtration mechanism of the gantry-type automatic electroplating device provided in this application;

[0025] Figure 4 is a structural schematic diagram of the cross-section of the support mechanism of the gantry-type automatic electroplating device provided in this application.

[0026] The image shows:

[0027] 1. Base; 2. Electroplating tank; 3. Guide rail; 4. Slider; 5. Gantry frame; 6. Hydraulic rod; 7. Connecting plate; 8. Hook; 9. Filtering mechanism; 901. Fixing strip; 902. Fixing frame; 903. Filter screen; 904. Sealing strip; 905. Pressure strip; 906. Mounting hole; 907. Screw; 10. Support mechanism; 1001. Fixing rod; 1002. Mounting plate; 1003. Slide cylinder; 1004. Support rod; 1005. Mounting frame; 1006. Wire mesh; 1007. Spring; 1008. Bolt. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described examples are only some embodiments of this utility model, and not all embodiments.

[0029] Therefore, the following detailed description of the embodiments of this utility model is not intended to limit the scope of the claimed utility model, but merely to illustrate some embodiments of the utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.

[0030] It should be noted that, unless otherwise specified, the embodiments and features and technical solutions in the present invention can be combined with each other.

[0031] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0032] In the description of this utility model, it should be noted that the terms "upper" and "lower," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use, or the orientation or positional relationship commonly understood by those skilled in the art. These terms are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this utility model. In addition, the terms "first" and "second," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0033] To address the technical problems in the background section, the following gantry-type automatic electroplating device is provided:

[0034] Referring to Figures 1-4, the present invention provides a gantry-type automatic electroplating device, comprising a base 1, an electroplating tank 2 inside the base 1, and guide rails 3 fixedly installed on both the left and right sides of the upper surface of the base 1. Sliding blocks 4 are slidably connected to the outside of the guide rails 3, and gantry frames 5 are fixedly installed on the upper surfaces of the two sliding blocks 4. Hydraulic rods 6 are fixedly installed on the upper surface of the gantry frames 5, and a connecting plate 7 is fixedly installed at the lower end of the hydraulic rods 6. A hook 8 is fixedly installed on the lower surface of the connecting plate 7. A filtration mechanism 9 is provided inside the electroplating tank 2, and a support mechanism 10 is provided on the upper side of the filtration mechanism 9. The filtration mechanism 9 includes two fixing bars 901, which are respectively fixedly installed on the inner walls of both sides of the electroplating tank 2. A fixing frame 902 is provided on the upper side of the fixing bars 901, and a filter screen 903 is fixedly installed inside the fixing frame 902.

[0035] In this embodiment: guide rails 3 are fixedly installed on both the left and right sides of the upper surface of the base 1. The sliders 4 slidably connected on the guide rails 3 support the gantry frame 5, allowing it to move smoothly above the electroplating tank 2. A hydraulic rod 6 is fixed to the top of the gantry frame 5, and the lower end of the hydraulic rod 6 is connected to a connecting plate 7. The hooks 8 on the lower surface of the connecting plate 7 are used to suspend the workpiece to be electroplated. A filter mechanism 9 is set inside the electroplating tank 2. A fixed frame 902 is supported by two fixed bars 901. The filter screen 903 installed inside the fixed frame 902 can effectively filter impurities in the electroplating solution and ensure the electroplating quality. A support mechanism 10 is also provided above the filter mechanism 9 to provide stable support for the workpiece during the electroplating process, reduce shaking, and further improve the electroplating effect.

[0036] Referring to Figures 2 and 3, based on the above embodiments, in order to enable the installation of the fixing frame 902, this embodiment provides the following design:

[0037] In a preferred embodiment, a sealing strip 904 is adhesively connected to the outside of the fixing frame 902, and the fixing frame 902 is tightly engaged with the electroplating tank 2 through the external sealing strip 904.

[0038] In this embodiment: by bonding a sealing strip 904 to the outside of the fixing frame 902, the fixing frame 902 can form a tight interlocking connection with the inner wall of the electroplating tank 2 through the external sealing strip 904, which effectively prevents leakage of the electroplating solution during the filtration process, thereby ensuring the stability of the electroplating operation and the quality of the electroplating solution.

[0039] Referring to Figure 3, based on the above embodiment, in order to fix the fixing frame 902, this embodiment provides the following design:

[0040] In a preferred embodiment, pressure strips 905 are provided on the upper sides of both sides of the fixing frame 902, and a plurality of mounting holes 906 are provided on the surface of the pressure strips 905 and the surface of the fixing frame 902, and screws 907 are threaded into the mounting holes 906.

[0041] In this embodiment, pressure strips 905 are added to the upper sides of both sides of the fixing frame 902. Several corresponding mounting holes 906 are opened on the surface of the pressure strips 905 and the fixing frame 902. Through the mounting holes 906, screws 907 can be used for threaded connection, thereby firmly fixing the pressure strips 905 to the fixing frame 902 and indirectly firmly installing the fixing frame 902 in the corresponding position of the electroplating tank 2.

[0042] Referring to Figures 2 and 4, based on the above embodiments, in order to support the workpiece and reduce the sloshing of the electroplating solution, this embodiment provides the following design:

[0043] In a preferred embodiment, the support mechanism 10 includes a fixed rod 1001, which is disposed inside the electroplating tank 2. Mounting plates 1002 are fixedly mounted on both ends of the fixed rod 1001, and sliding cylinders 1003 are slidably connected to the outer sides of both ends of the mounting plates 1002. Support rods 1004 are hingedly connected to the tops of the two sliding cylinders 1003, and mounting frames 1005 are hingedly connected to the top of the support rods 1004. A wire mesh 1006 is fixedly mounted inside the mounting frame 1005.

[0044] In this embodiment: when the workpiece is placed into the electroplating solution, the bottom of the workpiece will contact the wire mesh 1006 inside the mounting frame 1005. As the mounting frame 1005 moves downward, the support rod 1004 will rotate. The other end of the support rod 1004 will drive the sliding cylinder 1003, which is hinged to the surface, to slide outward on the surface of the fixed rod 1001.

[0045] In a preferred embodiment, springs 1007 are fitted on the outside of both ends of the fixing rod 1001, and the springs 1007 are fixedly installed between the slide cylinder 1003 and the mounting plate 1002.

[0046] In this embodiment: as the slide cylinder 1003 slides outward, it compresses the spring 1007 on the surface, causing the spring 1007 to deform. The elastic force of the spring 1007 can buffer the support rod 1004 and the mounting frame 1005, providing stable support for the bottom of the workpiece and buffering the workpiece to prevent the electroplating solution from sloshing.

[0047] In a preferred embodiment, the mounting plate 1002 is fixedly connected to the inner wall of the electroplating tank 2 by bolts 1008.

[0048] In this embodiment, the mounting plate 1002 is fixedly connected to the inner wall of the electroplating tank 2 by bolts 1008, which ensures the stability of the mounting plate 1002 in the electroplating tank 2 and provides a convenient way to disassemble and assemble, making it easy to maintain or replace the filter mechanism 9 and the support mechanism 10 when needed.

[0049] The above is the entire working process of the device, and all contents not described in detail in this specification are existing technologies known to those skilled in the art.

[0050] The above embodiments are only used to illustrate the present utility model and are not intended to limit the technical solutions described in the present utility model. Although the present utility model has been described in detail with reference to the above embodiments, the present utility model is not limited to the specific embodiments described above. Therefore, any modifications or equivalent substitutions to the present utility model, and all technical solutions and improvements that do not depart from the spirit and scope of the utility model, are covered within the scope of the claims of the present utility model.

Claims

1. A gantry-type automatic electroplating device, comprising a base (1), characterized in that: The base (1) has an electroplating tank (2) inside, and guide rails (3) are fixedly installed on the left and right sides of the upper surface of the base (1). The guide rails (3) are slidably connected to the outside of the sliders (4), and gantry frames (5) are fixedly installed on the upper surface of the two sliders (4). Hydraulic rods (6) are fixedly installed on the upper surface of the gantry frames (5), and connecting plates (7) are fixedly installed at the lower end of the hydraulic rods (6). Hooks (8) are fixedly installed on the lower surface of the connecting plates (7). A filter mechanism (9) is provided inside the electroplating tank (2), and a support mechanism (10) is provided on the upper side of the filter mechanism (9). The filter mechanism (9) includes a fixing strip (901), and there are two fixing strips (901). The two fixing strips (901) are fixedly installed on the inner walls of the two sides of the electroplating tank (2). A fixing frame (902) is provided on the upper side of the fixing strip (901), and a filter screen (903) is fixedly installed inside the fixing frame (902).

2. The gantry-type automatic electroplating device according to claim 1, characterized in that: The fixing frame (902) is externally bonded with a sealing strip (904), and the fixing frame (902) is tightly engaged with the electroplating tank (2) through the external sealing strip (904).

3. The gantry-type automatic electroplating device according to claim 1, characterized in that: The upper sides of both sides of the fixed frame (902) are provided with pressure strips (905), and the surfaces of the pressure strips (905) and the fixed frame (902) are provided with a number of mounting holes (906), and screws (907) are threaded into the mounting holes (906).

4. The gantry-type automatic electroplating device according to claim 1, characterized in that: The support mechanism (10) includes a fixed rod (1001), which is located inside the electroplating tank (2). Mounting plates (1002) are fixedly installed on both ends of the fixed rod (1001), and sliding cylinders (1003) are slidably connected to the outside of both ends of the mounting plates (1002). Support rods (1004) are hinged to the top of the two sliding cylinders (1003), and mounting frames (1005) are hinged to the top of the support rods (1004). Wire mesh (1006) is fixedly installed inside the mounting frames (1005).

5. The gantry-type automatic electroplating device according to claim 4, characterized in that: Springs (1007) are fitted on the outside of both ends of the fixing rod (1001), and the springs (1007) are fixedly installed between the slide cylinder (1003) and the mounting plate (1002).

6. The gantry-type automatic electroplating device according to claim 4, characterized in that: The mounting plate (1002) is fixedly connected to the inner wall of the electroplating tank (2) by bolts (1008).

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